High-voltage non-inductive resistor
By employing a serpentine groove structure and alloy material design in high-voltage non-inductive resistors, the problems of inductive interference, stability, and heat dissipation of traditional resistors are solved, providing a high-precision high-voltage measurement solution suitable for complex high-voltage environments.
Patent Information
- Application Number
- CN202422682975.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-04
- Publication Date
- 2025-10-21
- Estimated Expiration
- 2034-11-04
AI Technical Summary
Traditional high-voltage resistors suffer from problems such as inductive interference, poor stability, high temperature sensitivity, heat dissipation difficulties, and insufficient accuracy, making them unable to meet the requirements of high-precision high-voltage measurement.
The columnar substrate with a serpentine groove structure, combined with specific alloy materials and end cap design, optimizes the uniform deposition and heat dissipation of the resistive film, reduces inductance, and improves stability and accuracy.
It achieves a high-voltage non-inductive resistor with low inductance, high precision, good stability and excellent heat dissipation performance. It is suitable for high-voltage and high-frequency environments, reduces electromagnetic interference, extends service life and reduces maintenance costs.
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Figure CN223462061U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to circuit breaker technical field especially, it relates to a kind of high-voltage non-inductive resistor. BACKGROUND
[0002] In modern power system and electronic measurement field, accurate measurement of high voltage is crucial. As a common high-voltage measurement method, one of the core components of the resistance-capacitance voltage divider sensor is the high-voltage non-inductive resistor.
[0003] Traditional resistors have many problems in high-voltage applications. Early ordinary resistors often have a large inductance value, which can generate an induced voltage in a high-voltage rapidly changing environment, interfering with the accuracy of the measurement results and failing to meet the needs of high-precision measurement.
[0004] In addition, when traditional resistors are subjected to high voltage, they may become unstable in performance due to factors such as partial discharge, temperature rise, and uneven electric field, and even be damaged. At the same time, their resistance temperature coefficient is large, and the resistance value is easily changed under different temperature environments, affecting the accuracy and stability of the voltage division.
[0005] In the development history of high-voltage non-inductive resistors for resistance voltage divider sensors, traditional resistors have the following significant problems and shortcomings:
[0006] Inductive interference: The inductance value of traditional resistors is high, and the generation of induced voltage under high-voltage rapidly changing conditions seriously affects the measurement accuracy, resulting in a significant reduction in the accuracy of the measurement results.
[0007] Poor stability: When subjected to high voltage, the resistor may experience partial discharge, rapid temperature rise, and uneven electric field distribution, making the resistance performance unstable, shortening the service life of the resistor, and increasing maintenance costs.
[0008] High temperature sensitivity: The temperature coefficient of the resistor is large, and changes in environmental temperature can cause significant fluctuations in the resistance value, affecting the precision and stability of the voltage division, especially in working environments with large temperature changes.
[0009] Heat dissipation problem: Some traditional high-voltage resistors have insufficient heat dissipation design, and the heat generated by long-term operation under high voltage cannot be dissipated in time, further exacerbating the deterioration and aging rate of the resistance performance.
[0010] Insufficient precision: The manufacturing process of early resistors is relatively rough, and the precision of the resistance value cannot meet the requirements of modern high-precision measurement, limiting the use of resistance voltage divider sensors in some demanding precision applications.
[0011] Uneven electric field distribution: due to imperfect structural design, the electric field distribution inside the resistor is uneven, which can easily lead to excessive local electric field strength and increase the risk of breakdown and failure.
[0012] With the continuous development of the power system and the increasing requirements of electronic measurement technology, higher requirements are put forward for the performance of high-voltage non-inductive resistors used in voltage division pressure sensors.
[0013] Therefore, there is an urgent need for a high-voltage non-inductive resistor with lower inductance, better heat dissipation performance, higher precision and stability to adapt to complex and variable high-voltage measurement environments. Invention content
[0014] The utility model discloses a high-voltage non-inductive resistor, solve the problem of traditional resistor inductance value is higher.
[0015] In order to solve the above-mentioned utility model purposes, the utility model provides a high-voltage non-inductive resistor, including the columnar substrate, the surface of columnar substrate forms the serpentine line groove, even deposition resistance film in the line groove, the both ends of resistance film are connected lead respectively, the both ends of columnar substrate are equipped with end cap respectively, and the end cap is connected with close lead respectively.
[0016] Optionally, the depth of the line groove is 0.2-0.4mm, and the width of the line groove is 1.1-1.3mm.
[0017] Optionally, the material of the columnar substrate includes ceramic.
[0018] Optionally, the material of the lead includes silver, copper or nickel-chromium alloy.
[0019] Optionally, the material of the resistance film includes manganese-copper alloy, nickel-chromium alloy, constantan alloy, iron-chromium-aluminum alloy, nickel-copper alloy, titanium alloy or metal glaze.
[0020] Optionally, the material of the resistance film includes the combination of manganese-copper alloy and nickel-copper alloy, the combination of constantan alloy and titanium alloy, and the combination of nickel-chromium alloy and iron-chromium-aluminum alloy.
[0021] Optionally, the resistance film is in a serpentine winding structure.
[0022] Optionally, an insulating layer is arranged on the resistance film.
[0023] Optionally, the end cap includes a nickel-plated copper cap, the both ends of the columnar substrate are a high-voltage end and a low-voltage end respectively, the end cap of the high-voltage end is provided with a hemispherical protrusion on the side away from the low-voltage end, the end cap of the low-voltage end is a plane on the side away from the high-voltage end, and a uniform embossed pattern is arranged on the plane.
[0024] Optionally, the high-voltage non-inductive resistor has a resistance range of 30M-300M, a temperature coefficient of ±25PPM / ℃, a resistance change range of ±0.15% under rated power for 1000 hours, and a working temperature range of -55℃-155℃.
[0025] Compared with the prior art, the high-voltage non-inductive resistor provided by the utility model has the advantages that the non-inductive winding structure is adopted to reduce inductance; the substrate is selected as a column, and the heat dissipation and electric field distribution are optimized in combination with the resistance shape and size; meanwhile, the end cap of the resistor can improve the heat dissipation efficiency and prevent the resistor from overheating. BRIEF DESCRIPTION OF DRAWINGS
[0026] Figure 1 is a high-voltage non-inductive resistor structure schematic diagram in the embodiment of the utility model;
[0027] Figure 2 is a columnar substrate front view in the embodiment of the utility model;
[0028] Figure 3 is a columnar substrate rear view in the embodiment of the utility model.
[0029] In the drawing, 1, columnar substrate; 11, wire slot; 2, high-voltage end; 3, low-voltage end. DETAILED DESCRIPTION
[0030] The utility model scheme will be described below in combination with the schematic diagram, wherein the preferred embodiment of the utility model is indicated, and it should be understood that the utility model described herein can be modified by the person skilled in the art, and the advantageous effects of the utility model can still be realized. Therefore, the following description should be understood as the extensive knowledge of the person skilled in the art, and not as the limitation of the utility model.
[0031] The serial numbers of components in this paper, such as "first", "second", etc., are only used to distinguish the described objects, and do not have any sequence or technical meaning. And the "connection", "coupling" in the present application includes direct and indirect connection (coupling) without special description. In the description of the utility model, it should be understood that the orientation or position relationship indicated by the terms "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like is based on the orientation or position relationship shown in the drawing, and is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, therefore it cannot be understood as a limitation of the utility model.
[0032] In the present utility model, unless otherwise expressly provided and limited, the first feature is "on" or "under" the second feature. The first and second features can be in direct contact or indirect contact through an intermediate medium. Moreover, the first feature can be directly above or obliquely above the second feature, or it can only mean that the horizontal height of the first feature is higher than that of the second feature. The first feature can be directly below or obliquely below the second feature, or it can only mean that the horizontal height of the first feature is lower than that of the second feature.
[0033] The utility model will be described in more detail by way of example with reference to the accompanying drawings in the following paragraphs. The advantages and features of the utility model will be more apparent according to the following description. It should be noted that the drawings are very simplified and use non-precise proportions, only for the purpose of facilitating and clearly assisting the description of the utility model embodiments.
[0034] The utility model discloses a high -voltage non -inductive resistor provides a kind of high -voltage non -inductive resistor, please refer to Figure 1 Including cylindrical substrate 1, the surface of the cylindrical substrate 1 is formed with serpentine wire slot 11, resistance film is uniformly deposited in the wire slot 11, the resistance film both ends are connected with lead respectively, the both ends of the cylindrical substrate 1 are equipped with end cap respectively, and the end cap is connected with the lead close to respectively.
[0035] In the embodiment, by forming serpentine wire slot 11 on cylindrical substrate 1, and uniformly depositing resistance film therein, it helps to reduce the inductance of resistor. The uniformly deposited resistance film in wire slot 11 means that the resistance value is uniformly distributed throughout the resistor, which can ensure that the resistance performance of the resistor at different parts is consistent, and improve its stability and reliability. The both ends of the cylindrical substrate 1 are equipped with end cap respectively, and the end cap is connected with the lead to enhance the mechanical stability of the resistor, to prevent connection failure caused by mechanical stress or vibration. Secondly, the uniform deposition of resistance film and the serpentine layout help to evenly distribute and dissipate heat, reduce the generation of hot spots, and thus improve the thermal stability and life of the resistor.
[0036] Please refer to Figure 2 Figure 3 Serpentine wire slot is formed around the surface of the cylindrical substrate 1 on the cylindrical substrate 1, Figure 2 Figure 3 The path and shape of wire slot 11 on the cylindrical substrate 1 are schematically represented.
[0037] The high-voltage non-inductive resistor provided by the utility model can adapt to different application requirements, such as high-voltage, high-frequency or pulse load environment, because it reduces the inductive effect while maintaining the stability of the resistance performance. In addition, due to the non-inductive characteristic of the resistor, it will not produce significant electromagnetic interference when working in the circuit, which is an important advantage for electronic devices that require low noise or electromagnetic compatibility. Therefore, the high-voltage non-inductive resistor provided by the embodiment can be applied to various high-voltage and high-frequency application environments.
[0038] Further, the depth of the wire slot 11 is 0.2-0.4mm, for example, it can be 0.21mm, 0.23mm, 0.24mm, 0.25mm, 0.27mm, 0.28mm, 0.29mm, 0.31mm, 0.33mm, 0.34mm, 0.35mm, 0.37mm, 0.38mm, 0.39mm.
[0039] In the embodiment, the depth of the wire slot 11 directly affects the thickness of the resistance film deposited therein, thereby affecting the resistance value. By precisely controlling the depth of the wire slot 11, the thickness of the resistance film can be more accurately controlled, and in turn the resistance value of the resistor can be accurately controlled. The appropriate depth of the wire slot 11 helps to improve the adhesion between the resistance film and the substrate, ensuring the stability of the resistance film under high voltage and high temperature environment. In addition, the depth of the wire slot 11 can affect the heat conduction performance of the resistor. And the appropriate depth can help to further optimize the non-inductive characteristic of the resistor. Further, by adjusting the depth of the wire slot 11, it provides the possibility to adapt to the specific requirements of the performance of the resistor in different application scenarios, for example, in high-voltage applications, a thicker resistance film is needed to withstand higher voltage.
[0040] Further, the width of the wire slot 11 is 1.1-1.3mm, for example, it can be 1.11mm, 1.13mm, 1.14mm, 1.15mm, 1.17mm, 1.18mm, 1.19mm, 1.2mm, 1.21mm, 1.23mm, 1.24mm, 1.25mm, 1.27mm, 1.28mm or 1.29mm, etc.
[0041] In the embodiment, the width of the wire slot 11 is 1.1-1.3mm, which ensures good contact between the resistance film and the substrate, while allowing sufficient space for the deposition of the resistance film. The appropriate width can reduce the overheating of the resistance film when current passes through, while also helping to improve the mechanical stability of the resistor.
[0042] Preferably, the width of the wire slot 11 in this embodiment is 1.2 mm, and the depth is 0.3 mm. By setting appropriate width and depth of the wire slot 11, uniform deposition of the resistive film is facilitated, thereby improving the stability and reliability of the resistance value. At the same time, the optimized size of the wire slot 11 helps to reduce the inductance of the resistor.
[0043] Further, the material of the columnar substrate 1 includes ceramic.
[0044] In this embodiment, the ceramic substrate can provide excellent electrical insulation, high thermal conductivity, and good mechanical strength, which is crucial for ensuring the stability and reliability of the resistor in high-voltage and high-temperature environments. The types of ceramic substrates include but are not limited to alumina, aluminum nitride, silicon nitride, etc. The manufacturing processes of ceramic substrates include high-temperature co-fired ceramic (HTCC), low-temperature co-fired ceramic (LTCC), direct bonded copper (DBC), active metal brazing (AMB), and direct plating copper (DPC), etc.
[0045] Further, the material of the lead includes silver, copper, or nickel-chromium alloy.
[0046] The end cap is provided on the end of the high-voltage non-inductive resistor. The end is the key part of the resistor connecting to the external circuit. The lead is the conductive path connecting the internal resistor of the high-voltage non-inductive resistor to the external end. In other specific examples, the material and cross-sectional area of the lead can need to be selected according to the power and current carrying capacity of the resistor to ensure stable operation under high current or high voltage.
[0047] In this embodiment, the end cap and the lead are fixed together by welding, crimping, or threaded connection, etc. to form an electrical circuit, which ensures that the resistor can work stably under high-voltage environment, and at the same time, it will not generate too much heat, avoiding the problem of overheating of the circuit. In addition, this connection also helps to ensure the non-inductive property of the resistor, which will not cause electromagnetic interference to the surrounding circuit, further ensuring the stability of the circuit.
[0048] Further, the material of the resistive film includes manganese-copper alloy, nickel-chromium alloy, constantan alloy, iron-chromium-aluminum alloy, nickel-copper alloy, titanium alloy, or metal glaze.
[0049] Further, the material of the resistive film includes a combination of manganese-copper alloy and nickel-copper alloy, a combination of constantan alloy and titanium alloy, and a combination of nickel-chromium alloy and iron-chromium-aluminum alloy to meet specific electrical performance requirements such as resistivity, temperature coefficient, corrosion resistance, etc.
[0050] In this embodiment, specific combinations of alloy materials are selected to prepare the resistive film to optimize the electrical performance and mechanical properties of the resistor. Each alloy has its unique attributes, and when they are used in combination, they can complement each other to meet specific application requirements.
[0051] In particular:
[0052] A combination of Manganin and Nichrome alloys:
[0053] Manganin has a low temperature coefficient and high resistivity; Nichrome provides good electrical conductivity and corrosion resistance, while being relatively low cost.
[0054] This combination offers excellent resistance stability and cost-effectiveness, suitable for applications requiring precise resistance values and long-term stability.
[0055] A combination of Constantan and Titanium alloys:
[0056] Constantan has a very low temperature coefficient of resistance, making it suitable for temperature compensation applications; Titanium has high strength, low density, and good corrosion resistance, which can improve the mechanical strength and durability of the resistance film.
[0057] This combination is suitable for applications that require resistance stability in extreme environments, such as high temperatures or corrosive environments.
[0058] A combination of Nichrome and Chromel alloys:
[0059] Nichrome has high resistivity and good high-temperature resistance, making it suitable for high-temperature environments; Chromel is also a high-temperature alloy with excellent oxidation resistance and corrosion resistance.
[0060] This combination can provide extremely high heat resistance and stability, suitable for high-temperature and high-pressure application environments.
[0061] In other specific examples, considering the working conditions of the resistor, the required resistance characteristics (such as resistivity, temperature coefficient), cost, and the feasibility of the manufacturing process, etc., through the combination of materials, a high-voltage non-inductive resistor that meets both electrical performance requirements and has good mechanical strength is manufactured.
[0062] Further, the resistance film is in a serpentine winding structure.
[0063] In this embodiment, by using a serpentine winding structure, the overall inductance value is reduced. In addition, the serpentine resistance film helps to distribute heat more evenly, and the serpentine resistance film has a larger contact area with the substrate, which can improve the mechanical stability of the resistance film and reduce the risk of damage due to mechanical vibration or impact.
[0064] In this embodiment, by controlling the composition, thickness, and winding process of the resistance material, the accuracy and stability of the resistance value are ensured.
[0065] Further, the resistance film is provided with an insulating layer, which is uniform, bubble-free and has sufficient insulation strength to withstand high pressure environment.
[0066] In the embodiment, the material of the insulating layer should have good insulation performance, chemical stability, temperature resistance and mechanical strength, and can be selected from epoxy resin or silicone rubber material.
[0067] Further, the end cap comprises a nickel-plated copper cap. The high-voltage end 2 of the columnar substrate 1 is provided with a hemispherical protrusion on the side away from the low-voltage end 3, and the end cap of the low-voltage end 3 is a flat surface on the side away from the high-voltage end 2, and is provided with a uniform embossed pattern on the flat surface.
[0068] In the embodiment, the nickel-plated copper cap provides good corrosion resistance and oxidation resistance through nickel plating, and the nickel layer can also enhance the wear resistance and hardness of the copper cap.
[0069] The end cap of the high-voltage end 2 is designed as a hemispherical protrusion, which helps to disperse stress and reduce the influence of high-voltage electric field on the end cap, thereby improving the voltage resistance performance of the resistor. The end cap of the low-voltage end 3 is designed as a flat surface with a uniform embossed pattern. The contact area between the end cap and the mounting surface is increased to improve the mechanical stability, and the embossed pattern can also be used as a visual identifier for easy identification and installation.
[0070] At the same time, the nickel-plated copper cap improves the heat dissipation efficiency of the resistor, and the heat dissipation area is large.
[0071] Further, the resistance range of the high-voltage non-inductive resistor is 30M-300M.
[0072] The resistance change range is ±0.15% under rated power for 1000 hours, and the resistance change (ΔR) does not exceed ±0.15% of the initial value when the resistor works under rated power for 1000 hours, which indicates that the resistor has a long service life and stability.
[0073] The working temperature range is -55℃-155℃, and in addition, the high-voltage non-inductive resistor provided by the utility model is a cylindrical body, which is not easy to crack at high and low temperatures.
[0074] The temperature coefficient is ±25PPM / ℃, and the temperature coefficient (Temperature Coefficient) refers to the rate of resistance change with temperature. The rate of resistance change with temperature of the high-voltage non-inductive resistor is very small, which helps to maintain the stability of the resistance value when the temperature changes.
[0075] In addition, in the embodiment, a preparation method of a high-voltage non-inductive resistor is also provided, which comprises the following steps:
[0076] Material preparation: Select a high-resistivity, low-temperature coefficient, and good high-voltage performance of the resistance material, such as manganese copper alloy, nickel-chromium alloy, constantan alloy, iron-chromium-aluminum alloy, nickel-copper alloy, titanium alloy or metal glaze.
[0077] Prepare a ceramic columnar insulating substrate.
[0078] Resistor film preparation: Use vacuum plating technology to uniformly deposit a resistor film on the outer surface of the ceramic columnar substrate.
[0079] By controlling the plating process parameters such as deposition rate, temperature and vacuum degree, etc., to ensure that the thickness and resistivity of the resistor film meet the design requirements.
[0080] Pattern design and etching: Use photolithography or laser etching, please refer to Figure 2 - Figure 3 Etch the resistor film into a specific serpentine pattern to reduce inductance and achieve zero inductance characteristics.
[0081] At the same time, reserve the area of the connecting electrode at both ends of the resistor film, and deposit metal electrodes such as silver or copper in the reserved electrode area through electroplating or sputtering process to ensure good electrical contact.
[0082] Packaging and insulation treatment: Use high-voltage resistant insulation materials such as epoxy resin or silicone rubber to package the resistor.
[0083] Test and calibration: Test the resistance value, inductance value, voltage resistance performance and temperature coefficient of the packaged high-voltage zero inductance resistor.
[0084] According to the test results, calibrate and adjust the resistor to meet the requirements of the resistance divider sensor.
[0085] The resistance range of the high-voltage zero inductance resistor provided by the utility model is: 30M~300M; resistance precision: ±0.25%; temperature coefficient: ±25PPM / ℃.
[0086] Lifetime: The resistor can work stably for 1000 hours under rated power, and the resistance change range (ΔR) is not more than ±0.15%. The resistor has good long-term stability, and the resistance value changes very little during long-term use.
[0087] Moisture resistance: The resistor is tested by method 106 in MIL-Std-202 standard, and the resistance change range (ΔR) is not more than ±0.25%R. The resistor can also maintain stable resistance value in humid environment.
[0088] Thermal shock performance: The resistor is tested by method 107, condition C in MIL-Std-202 standard, and the resistance variation range (AR) is not more than ±0.20%R. This shows that the resistor can withstand severe temperature changes and maintain the stability of the resistance value.
[0089] Operating temperature range: The operating temperature range of the resistor is -55℃ to 155℃. The resistor can work normally at extreme temperature and has good temperature adaptability.
[0090] In summary, the high-voltage non-inductive resistor provided by the utility model adopts non-inductive winding structure to reduce inductance, reduce the interference of inductance on voltage division measurement, and more accurately reflect the measured high-voltage value, thereby improving the measurement accuracy of the voltage division sensor; the substrate is columnar, and the heat dissipation and electric field distribution are optimized in combination with the resistance shape and size; meanwhile, the end cap of the resistor can improve the heat dissipation efficiency and prevent the resistor from overheating; the utility model controls the composition, thickness and winding process of the resistance material to ensure the accuracy and stability of the resistance value; under high-voltage environment, the resistor has stable performance, and the resistance value is not easily affected by environmental factors such as temperature and humidity, thereby ensuring the reliability and consistency of the voltage division measurement result, better adapting to high-voltage environment, providing stable voltage division support for the normal operation of the entire voltage division sensor system, and improving the overall performance of the system; the resistor has good heat dissipation performance and stable resistance characteristics, reduces damage of the resistor caused by overheating or performance change, prolongs the service life of the resistor, reduces maintenance cost, and is suitable for various high-voltage measurement scenes.
[0091] Obviously, those skilled in the art can make various modifications and variations to the utility model without departing from the spirit and scope of the utility model. Thus, if these modifications and variations of the utility model belong to the scope of the utility model claims and equivalent technologies, the utility model also intends to include these modifications and variations.
Claims
1. A high voltage non-inductive resistor, characterized by The application relates to a high-voltage non-inductive resistor, which comprises a columnar substrate, a serpentine wire groove formed on the surface of the columnar substrate, a resistance film uniformly deposited in the wire groove, lead wires connected to the two ends of the resistance film respectively, end caps arranged at the two ends of the columnar substrate respectively, and the end caps being connected to the lead wires close to the end caps respectively.
2. The high-voltage non-inductive resistor of claim 1, wherein, The depth of the wire groove is 0.2-0.4 mm, and the width of the wire groove is 1.1-1.3 mm.
3. The high-voltage non-inductive resistor of claim 1, wherein, The material of the columnar substrate comprises ceramic.
4. The high-voltage non-inductive resistor of claim 1, wherein, The resistance film is in a serpentine winding structure.
5. The high-voltage non-inductive resistor of claim 1, wherein, An insulating layer is arranged on the resistance film.
6. The high-voltage non-inductive resistor of claim 1, wherein, The end caps comprise nickel-plated copper caps, the two ends of the columnar substrate are high-voltage end and low-voltage end respectively, the end cap of the high-voltage end is provided with a hemispherical protrusion on the side far from the low-voltage end, the end cap of the low-voltage end is a plane on the side far from the high-voltage end, and a uniform embossed pattern is arranged on the plane.
7. The high-voltage non-inductive resistor of claim 1, wherein, The resistance value of the high-voltage non-inductive resistor ranges from 30M to 300M, the temperature coefficient is + / -25PPM / DEG C, the resistance change range is + / -0.15% under the rated power for 1000 hours, and the working temperature range is -55DEG C to 155DEG C.