Flexible limiting piece, wafer loader and wafer transmission device

Abstract

The utility model relates to the technical field of semiconductors, and provides a flexible limiting piece, a wafer loader and a wafer transmission device. The flexible limiting piece comprises a flexible body, the flexible body is filled with compressed inert gas with light molecular weight, and in a vacuum environment, the inert gas in the flexible body expands to enable the flexible body to extend; in the atmospheric pressure environment, the air pressure outside the flexible body is larger than the air pressure inside the flexible body, and the flexible body shrinks. When the flexible limiting piece is applied to the wafer transmission device, the flexible limiting piece not only can buffer the wafer, but also can stably limit the wafer, so that the wafer is prevented from shaking in the bearing groove, the wafer transmission device can conveniently transmit the wafer, and the risk that the wafer is scratched or even broken is avoided.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor, especially to a flexible limiting piece, wafer carrier and wafer transmission device. BACKGROUND

[0002] The wafer transmission device, such as the wafer carrier and the wafer carrier conveying box, is a container used for protecting, transporting and storing wafers in the semiconductor process, for protecting the wafers from external impact and avoiding the wafers from being contaminated and oxidized in the conveying process, thereby affecting the yield.

[0003] In the related art, the wafer transmission device has low-release plastic material wedge-shaped teeth distributed in the internal mirror image, and the wafers are placed in the tooth grooves between the adjacent two teeth, thereby being separated from the adjacent wafers. The width of the tooth groove is generally greater than the thickness of the wafer, so as to ensure that the wafer is smoothly placed in the tooth groove and there is enough space between the wafer and the groove wall of the tooth groove.

[0004] To improve the stability of the wafer in the transmission device, a plastic sheet or a solid pressing sheet structure is arranged at the position where the tooth groove contacts the wafer. Although the plastic sheet or the solid pressing sheet structure is arranged at the position where the tooth groove contacts the wafer, the stability of the wafer can be improved to a certain extent. However, when the wafer transmission device is opened or closed, the wafer is easily shaken, which causes the contact pressure between the wafer and the plastic sheet or the solid pressing sheet structure to be too large and the wafer to be broken. UTILITY MODEL CONTENTS

[0005] The utility model provides a wafer transmission device to solve the above technical defects in the prior art. When the flexible limiting piece is applied to the wafer transmission device, the flexible limiting piece not only can form a buffer for the wafer, but also can provide stable limiting for the wafer to prevent the wafer from shaking in the bearing groove, facilitate the wafer transmission device to convey the wafer, and avoid the wafer from being scratched or even broken.

[0006] The utility model also provides a wafer carrier.

[0007] The utility model also provides a wafer transmission device.

[0008] The utility model provides a flexible limiting piece, which comprises a flexible body, the inside of the flexible body is filled with compressed inert gas with light molecular weight, in a vacuum environment, the inert gas in the inside of the flexible body expands, so that the flexible body extends, and in an atmospheric pressure environment, the air pressure outside the flexible body is greater than the air pressure in the inside of the flexible body, and the flexible body shrinks.

[0009] The flexible limiting piece is characterized in that the flexible body is made of a gasbag structure of perfluorinated rubber.

[0010] The flexible limiting piece is characterized in that the thickness of the telescopic part gradually decreases from the position of the fixed part to the direction away from the fixed part.

[0011] The flexible limiting piece is characterized in that the connecting mode between the flexible body and the fixed base material comprises adhesive bonding.

[0012] The flexible limiting piece is characterized in that the flexible body is made of a gasbag structure of perfluorinated rubber.

[0013] The flexible limiting piece is characterized in that the inert gas comprises helium.

[0014] The flexible limiting piece is characterized in that the outer surface of the flexible body is provided with an antiskid layer.

[0015] The utility model provides a flexible limiting piece, including support casing and elastic telescopic body.

[0016] The support casing is provided with a limiting hole;

[0017] The elastic telescopic body is arranged in the inside of the support casing, the inside of the elastic telescopic body is filled with compressed inert gas with light molecular weight, in the vacuum environment, the inert gas in the inside of the elastic telescopic body expands, makes the elastic telescopic body from the limiting hole stretch out, in the atmospheric pressure environment, the air pressure of the outside of the elastic telescopic body is greater than the air pressure in the inside of the elastic telescopic body, and the elastic telescopic body contracts.

[0018] The utility model also provides a wafer carrier, including first carrier, second carrier and any one flexible limiting piece described in the article,

[0019] The first carrier and the second carrier are oppositely arranged and connected with each other, and a plurality of carrier grooves for placing wafers are arranged on the first carrier and the second carrier, and the flexible limiting pieces are arranged on the two groove walls opposite to each other of each carrier groove.

[0020] The utility model also provides a wafer conveying device, which comprises a shell assembly and the wafer carrier, and the wafer carrier is adapted to be mounted to the shell assembly.

[0021] The flexible limiting piece provided by the utility model, by filling with compressed inert gas with light molecular weight in the inside of the flexible body, under vacuum environment, the inert gas in the inside of the flexible body expands, makes the flexible body extend, can provide stable flexible support for the wafer, under atmospheric pressure environment, the air pressure outside the flexible body is greater than the air pressure in the inside of the flexible body, the flexible body contracts, and it is convenient to take and place the wafer.

[0022] The wafer carrier and the wafer transmission device provided by the utility model embodiment, because they all comprise the flexible limiting piece described above, therefore, have all the advantages described above. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical scheme in the utility model or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or the prior art description, and obviously, the drawings in the following description are some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained according to these drawings without creative labor.

[0024] Figure 1 It is the structure exploded schematic view of the wafer transmission device provided by the utility model embodiment.

[0025] Figure 2 It is the structure schematic view of the wafer carrier in the wafer transmission device provided by the utility model embodiment.

[0026] Figure 3 It is the structure schematic view of the wafer carrier in the wafer transmission device provided by the utility model embodiment.

[0027] Figure 4 It is the sectional view of the wafer transmission device provided by the utility model embodiment.

[0028] Figure 5 It is the structure schematic view of the box body in the wafer transmission device provided by the utility model embodiment.

[0029] Figure 6 It is the structure schematic view of the cover body in the wafer transmission device provided by the utility model embodiment.

[0030] Figure 7 It is the structure schematic view of the first flexible limiting piece, the second flexible limiting piece, the third flexible limiting piece, the sealing air bag or the limiting air bag in the wafer transmission device provided by the utility model embodiment.

[0031] Figure 8 is Figure 7 is a sectional view along a front direction of the structural schematic diagram.

[0032] Figure 9 is Figure 8 is a sectional view along a side direction of the structural schematic diagram.

[0033] Figure 10 is Figure 7 is a principle diagram of a use state of the structure.

[0034] Figure 11 is a use state schematic diagram of a wafer conveying device (in an atmospheric pressure environment) provided by an embodiment of the utility model.

[0035] Figure 12 is a use state schematic diagram of a wafer conveying device (in a vacuum environment) provided by an embodiment of the utility model.

[0036] Figure 13 is a structural schematic diagram of another embodiment of a wafer conveying device provided by an embodiment of the utility model.

[0037] Figure 14 is Figure 13 is a structural schematic diagram of a box body in the wafer conveying device.

[0038] Figure 15 is Figure 13 is a structural schematic diagram of a cover body in the wafer conveying device.

[0039] Reference signs:

[0040] 10, shell assembly; 11, box body; 111, first limiting part; 112, first limiting tooth; 113, first limiting groove; 114, sealing groove; 115, first limiting rib; 116, second limiting rib; 12, cover body; 121, second limiting part; 122, second limiting tooth; 123, second limiting groove; 124, sealing protrusion; 125, first limiting strip; 126, second limiting strip; 127, handle; 13, accommodating cavity; 14, valve assembly;

[0041] 20, wafer carrier; 21, first carrier; 22, second carrier; 23, carrier tooth; 24, carrier groove;

[0042] 30, first flexible limiting part; 31, flexible body; 311, fixed part; 312, telescopic part; 313, anti-skid layer;

[0043] 40, second flexible limiting part; 50, third flexible limiting part; 60, sealing air bag; 70, limiting air bag;

[0044] 80, wafer;

[0045] P, atmospheric pressure environment; T, vacuum environment; H, inert gas. DETAILED DESCRIPTION

[0046] In order to make the purpose, technical scheme and advantages of the utility model more clear, the technical scheme in the utility model will be described clearly and completely below in combination with the drawings in the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the ordinary skilled in the art without making creative labor belong to the protection scope of the utility model.

[0047] In the description of the embodiments of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "connected", "connected" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected, it can be mechanically connected, or it can be electrically connected, it can be directly connected, or it can be indirectly connected through an intermediate medium. For the ordinary skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0048] In the embodiments of the present application, unless otherwise explicitly specified and limited, the first feature is "on" or "under" the second feature, which can be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature "above", "above" and "above" the second feature can be that the first feature is directly above or obliquely above the second feature, or it only means that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature can be that the first feature is directly below or obliquely below the second feature, or it only means that the horizontal height of the first feature is less than that of the second feature.

[0049] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" means that the specific features, structures, materials or characteristics described in combination with the embodiment or example are included in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, the skilled in the art can combine and combine the different embodiments or examples described in the present application and the features of the different embodiments or examples without contradiction.

[0050] Wafer is a silicon wafer used for making semiconductor chips, which is hard and brittle. The semiconductor chip manufacturing process is a complex and precise process, and the requirement for contaminants is extremely strict. The wafer needs to go through multiple process steps repeatedly, and the whole wafer production cycle is relatively long, which means that the wafer will be moved between different process tools or stored for rotation during the production process.

[0051] The wafer transmission device, such as an open wafer carrier (CASSETTE) and a wafer carrier transfer box (POD), and a front opening wafer transmission box (FOUP), a front opening wafer delivery box (FOSB) integrating the carrier and the transfer box, the inside of the wafer carrier is provided with a wedge-shaped tooth piece, the wedge-shaped tooth pieces are mirror image distributed, the wafer is placed in the tooth groove between the adjacent two tooth pieces, so as to be separated from the adjacent wafer, the width of the tooth groove between the adjacent tooth pieces is wide enough to ensure that the wafer is smoothly put in, and the tooth piece is usually made of low-release plastic material, which is rigid and dimensionally stable. The wafer carrier carrying the wafer is placed in the inside of the wafer carrier transfer box for transportation and storage.

[0052] In order to prevent the wafer from being broken and scratched by colliding with the tooth piece, a hard limiting block is usually arranged in the inside of the wafer carrier transfer box to limit the displacement of the wafer carrier, a corresponding pressing piece structure is arranged at the position in contact with the wafer in the inside of the wafer carrier transfer box, the wafer is pressed to prevent it from moving in the tooth groove, and the pressing piece is usually made of soft plastic sheet or solid elastomer. In order to prevent the wafer from being contaminated and oxidized during storage, the wafer carrier transfer box is usually filled with protective nitrogen or vacuumized, and the wafer carrier transfer box is provided with a sealing rubber ring to ensure the air tightness.

[0053] When the wafer carrier is placed in the transfer box, the wafer carrier is easy to collide with and rub against the hard limiting block on the transfer box, causing the wafer to shake. The soft plastic sheet or solid elastomer pressing piece structure arranged at the position in contact with the wafer in the inside of the wafer carrier transfer box can drive the wafer to shake when the transfer box is closed and opened, and even the wafer is broken due to excessive pressing force; in order to prevent the wafer from being contaminated and oxidized during storage, the sealing rubber ring arranged on the wafer carrier transfer box is usually a solid or hollow rubber ring, which is in a passive compression structure form, and there are risks of air tightness reduction such as limit compression rupture and creep failure.

[0054] Figure 1 is a structure exploded view of a wafer transmission device provided by an embodiment of the present application. Figure 2 is a structure view of a wafer carrier in a wafer transmission device provided by an embodiment of the present application. Figure 3 is a structure view of a wafer carrier in a wafer transmission device provided by an embodiment of the present application.

[0055] Referring to Figures 1 to 3The utility model embodiment provides a kind of wafer transmission device, wafer transmission device can be moved by artificial, or be transported on ground transport car to and fro with each process equipment.Wafer transmission device includes shell assembly 10 and wafer carrier 20.

[0056] Shell assembly 10 includes box body 11 and cover body 12, cover body 12 is covered in box body 11, cover body 12 and box body 11 surround and set out accommodating cavity 13, the two sides of cover body 12 are oppositely provided with handle 127, facilitate taking and taking cover body 12, valve assembly 14 is equipped on box body 11, valve assembly 14 can include air pipe and air valve, air pipe penetrates the side wall of box body 11, air valve is arranged on air pipe, can be quickly opened or closed, air pipe is used to connect vacuumizing equipment, to carry out vacuumizing to accommodating cavity 13, or air pipe is used to connect air supply equipment, for supplying air to accommodating cavity 13.

[0057] Wafer carrier 20 is equipped in accommodating cavity 13, wafer carrier 20 includes oppositely arranged first carrier 21 and second carrier 22, first carrier 21 and second carrier 22 are connected with each other, first carrier 21 and second carrier 22 are correspondingly equipped with a plurality of carrying grooves 24 for placing wafer 80 on each, first flexible limiting piece 30 is arranged on the two slot walls opposite each carrying groove 24.When accommodating cavity 13 is maintained in vacuum environment T by valve assembly 14, first flexible limiting piece 30 expands and extends, can flexibly limit corresponding wafer 80, to avoid wafer 80 to shake in transmission process.

[0058] Wherein, the wedge-shaped carrying tooth 23 of low-release plastic material is arranged on the first carrier 21 and the second carrier 22 along the length direction and is spaced, the carrying groove 24 is formed between the two adjacent carrying teeth 23, the wafer 80 is located in the carrying groove 24 so as to be separated from the adjacent wafer 80, the groove width of the carrying groove 24 will have enough space to ensure that the wafer 80 is smoothly placed, on the two carrying teeth 23 forming the carrying groove 24, the first flexible limiting piece 30 is arranged on the two mirror image wedge-shaped surfaces facing the wafer 80, and the extension direction of the first flexible limiting piece 30 is perpendicular to the normal of the contact surface of the wafer 80, to determine the installation angle of the first flexible limiting piece 30.

[0059] Equivalently, under atmospheric pressure environment P, the first flexible limiting piece 30 located at the two side walls of the carrying groove 24 is in compression state, the wafer 80 can be smoothly placed in the corresponding carrying groove 24, at this time, the wafer 80 has moving space, the first flexible limiting piece 30 plays a buffering role on the corresponding wafer 80, to avoid that the wafer 80 is placed in the carrying groove 24, and forms hard contact with the groove wall of the carrying groove 24.

[0060] When the valve assembly 14 is connected to a vacuum extraction device, the first flexible limiting member 30 is expanded and extended to provide stable limiting for the wafer 80, so as to prevent the wafer 80 from shaking in the bearing groove 24, facilitate the wafer conveying device to convey the wafer 80, and avoid the wafer 80 from being scratched or even broken.

[0061] When the wafer 80 needs to be taken out, the valve assembly 14 on the box body 11 is opened, ambient air enters the containing cavity 13, the containing cavity 13 returns to the atmospheric pressure environment P, the first flexible limiting member 30 returns to the compressed state, and the cover body 12 can be smoothly opened and separated from the box body 11, so as to facilitate the wafer 80 to be smoothly taken out.

[0062] It can be understood that the wafer conveying device provided in the embodiment of the utility model, by setting the first flexible limiting member 30 on the opposite two groove walls of each bearing groove 24, and setting the valve assembly 14 on the box body 11, when the containing cavity 13 is maintained in the vacuum environment T through the valve assembly 14, the first flexible limiting member 30 is expanded and extended, not only can form the buffer for the wafer 80, but also can provide stable limiting for the wafer 80, so as to prevent the wafer 80 from shaking in the bearing groove 24, facilitate the wafer conveying device to convey the wafer 80, and avoid the wafer 80 from being scratched or even broken.

[0063] Figure 4 is the sectional view of the wafer conveying device provided in the embodiment of the utility model.

[0064] Referring to Figure 4 In some embodiments of the utility model, the first flexible limiting member 30 is arranged at the position tangent to the outer contour of the wafer 80.

[0065] Since the wafer 80 is placed in the bearing groove 24, the position tangent to the outer contour of the wafer 80 is most obviously extruded or collided, therefore, the first flexible limiting member 30 arranged at the position can play a good buffering and limiting role.

[0066] Figure 5 is the structural schematic view of the box body in the wafer conveying device provided in the embodiment of the utility model. Figure 6 is the structural schematic view of the cover body in the wafer conveying device provided in the embodiment of the utility model.

[0067] Referring to Figure 5 and Figure 6 In some embodiments of the utility model, the bottom of the box body 11 is provided with a first limiting part 111, a plurality of first limiting grooves 113 are arranged on the first limiting part 111 at intervals, the positions of the first limiting grooves 113 correspond to the positions of the bearing grooves 24 one by one, and the first limiting grooves 113 are used for limiting the wafer 80.

[0068] Meanwhile, the inner wall of the cover 12 is provided with a second limiting part 121, a plurality of second limiting grooves 123 are arranged on the second limiting part 121 at intervals, the positions of the second limiting grooves 123 correspond to the positions of the bearing grooves 24 one by one, and the second limiting grooves 123 are used for limiting the wafer 80.

[0069] That is, a plurality of wedge-shaped first limiting teeth 112 made of low-releasing plastic material are arranged on the first limiting part 111 at intervals along the length direction, a first limiting groove 113 is formed between two adjacent first limiting teeth 112, the wafer 80 is located in the first limiting groove 113, and the groove width of the first limiting groove 113 is wide enough to ensure that the wafer 80 is smoothly placed.

[0070] A plurality of wedge-shaped second limiting teeth 122 made of low-releasing plastic material are arranged on the second limiting part 121 at intervals along the length direction, a second limiting groove 123 is formed between two adjacent second limiting teeth 122, the wafer 80 is located in the second limiting groove 123, and the groove width of the second limiting groove 123 is wide enough to ensure that the wafer 80 is smoothly placed.

[0071] That is, when the wafer 80 is placed in the wafer conveying device, the left-right direction of the wafer 80 is limited by the first bearing part 21 and the second bearing part 22 on the two sides of the wafer bearing device 20, the front-back direction of the wafer 80 is limited by the two groove walls of the bearing groove 24, the up-down direction of the wafer 80 is limited by the first limiting part 111 and the second limiting part 121, and the wafer 80 can be stably kept in the wafer conveying device, so that the wafer 80 can be prevented from shaking during the conveying process.

[0072] In addition, the first limiting part 111 can also be arranged on the bottom of the box body 11, a plurality of first limiting grooves 113 are arranged on the first limiting part 111 at intervals and used for limiting the wafer 80, or the second limiting part 121 can be arranged on the inner wall of the cover 12, a plurality of second limiting grooves 123 are arranged on the second limiting part 121 at intervals and used for limiting the wafer 80. That is, one of the first limiting groove 113 and the second limiting groove 123 is arranged, and the other limiting part can be limited by using the existing structure.

[0073] Continuing to refer to Figures 4 to 6 In some embodiments of the utility model, the second flexible limiting part 40 is arranged on the two groove walls of each first limiting groove 113, when the accommodating cavity 13 is maintained in the vacuum environment T by the valve assembly 14, the second flexible limiting part 40 expands and extends to limit the corresponding wafer 80.

[0074] The third flexible limiting part 50 is arranged on the two groove walls of each second limiting groove 123, when the accommodating cavity 13 is maintained in the vacuum environment T by the valve assembly 14, the third flexible limiting part 50 expands and extends to limit the corresponding wafer 80.

[0075] That is, on the two second limiting teeth 122 forming the second limiting groove 123, the third flexible limiting piece 50 is arranged on the two mirror image wedge surfaces facing the wafer 80, and the third flexible limiting piece 50 is perpendicular to the normal direction of the contact surface of the wafer 80.

[0076] Under the atmospheric pressure environment P, the first flexible limiting piece 30 located on the opposite two side walls of the bearing groove 24 is in a compressed state, and the wafer 80 can be smoothly placed in the corresponding bearing groove 24, at this time, the wafer 80 has a moving space, the first flexible limiting piece 30 plays a buffering role on the corresponding wafer 80, avoiding the wafer 80 from being in hard contact with the groove wall of the bearing groove 24 when being placed in the bearing groove 24; at the same time, the second flexible limiting piece 40 located on the opposite two groove walls of the first limiting groove 113 is in a compressed state; the third flexible limiting piece 50 located on the opposite two groove walls of the second limiting groove 123 is in a compressed state, facilitating the wafer 80 to be placed in the corresponding limiting groove.

[0077] When the valve assembly 14 is connected to the vacuum pumping device to maintain the containing cavity 13 in the vacuum environment T, the first flexible limiting piece 30, the second flexible limiting piece 40 and the third flexible limiting piece 50 are all expanded and extended to provide stable limiting for the wafer 80, so as to prevent the wafer 80 from shaking in the bearing groove 24, facilitate the wafer conveying device to convey the wafer 80, and avoid the wafer 80 from being scratched or even broken.

[0078] When the wafer 80 needs to be taken out, the valve assembly 14 located on the box body 11 is opened, the ambient air enters the containing cavity 13, the containing cavity 13 returns to the atmospheric pressure environment P, the first flexible limiting piece 30, the second flexible limiting piece 40 and the third flexible limiting piece 50 all return to the compressed state, the cover body 12 can be smoothly opened and separated from the box body 11, and the wafer 80 can be smoothly taken out.

[0079] That is, in the embodiment of the utility model, the wafer conveying device can not only realize limiting in the front-back direction, the left-right direction and the up-down direction of the wafer 80, but also can realize flexible support through the corresponding flexible limiting piece at each limiting position.

[0080] In addition, the second flexible limiting piece 40 can also be arranged on the opposite two groove walls of the first limiting groove 113 to flexibly limit the wafer 80, or the third flexible limiting piece 50 can be arranged on the opposite two groove walls of the second limiting groove 123 to limit the wafer 80. That is, the second flexible limiting piece 40 and the third flexible limiting piece 50 can be selected to be arranged, and the other limiting can be limited by the hard limiting block.

[0081] Continuing to refer to Figure 4In some embodiments of the utility model, the second flexible limiting piece 40 is arranged at the position where the first limiting groove 113 is tangent to the outer contour of the wafer 80, and the third flexible limiting piece 50 is arranged at the position where the second limiting groove 123 is tangent to the outer contour of the wafer 80.

[0082] When the wafer 80 is placed in the bearing groove 24, the position where the wafer 80 is tangent to the outer contour is most obviously squeezed or collided, therefore, the second flexible limiting piece 40 is arranged at the position where the first limiting groove 113 is tangent to the outer contour of the wafer 80, and the third flexible limiting piece 50 is arranged at the position where the second limiting groove 123 is tangent to the outer contour of the wafer 80, which can play a good buffering and flexible limiting role.

[0083] When the wafer 80 is placed in the wafer conveying device, the wafer 80 is flexibly limited by the first flexible limiting piece 30, the second flexible limiting piece 40 and the third flexible limiting piece 50, and the wafer 80 can be stably kept in the wafer conveying device.

[0084] Continuing to refer to Figure 4 In some embodiments of the utility model, one of the box body 11 and the cover body 12 is provided with a sealing groove 114, and the other of the box body 11 and the cover body 12 is provided with a sealing protrusion 124 which is matched with the sealing groove 114 to seal.

[0085] That is, the sealing groove 114 in the annular shape can be arranged at the upper edge of the box body 11, and the sealing protrusion 124 can be arranged at the lower edge of the cover body 12 and matched with the box body 11; or the sealing protrusion 124 can be arranged at the upper edge of the box body 11, and the sealing groove 114 can be arranged at the lower edge of the cover body 12 and matched with the box body 11.

[0086] At least one of the sealing groove 114 and the sealing protrusion 124 is provided with a sealing air bag 60, that is, the sealing air bag 60 can be arranged at the groove bottom of the sealing groove 114, or the sealing air bag 60 can be arranged at the bottom of the sealing protrusion 124, that is, the shape of the sealing air bag 60 is the same as that of the sealing groove 114, and the sealing air bag 60 can be in the annular shape. When the accommodation cavity 13 is maintained in the vacuum environment T through the valve assembly 14, the sealing air bag 60 is inflated and extended to seal the gap between the groove wall of the sealing groove 114 and the sealing protrusion 124, so as to increase the sealing area, increase the pressing force of the atmospheric pressure inside and outside the accommodation cavity 13 on the cover body 12 and the box body 11, and ensure the air tightness of the wafer conveying device.

[0087] Further, when the sealing groove 114 is arranged on the box body 11, the groove wall of the sealing groove 114 is provided with an air passage communicated with the accommodating cavity 13, so that when the accommodating cavity 13 is maintained in the vacuum environment T by the valve assembly 14, the sealing air bag 60 is inflated and extended to seal the gap between the groove wall of the sealing groove 114 and the sealing protrusion 124. When the wafer 80 needs to be taken out, the valve assembly 14 on the box body 11 is opened, the ambient air enters the accommodating cavity 13, the accommodating cavity 13 returns to the atmospheric pressure environment P, the sealing air bag 60 can quickly return to the compressed state, and the cover body 12 can be smoothly opened and separated from the box body 11, so that the wafer 80 can be smoothly taken out.

[0088] With reference to Figure 4 and Figure 5 In some embodiments of the utility model, the first inner wall of the box body 11 is spaced apart from the first limiting rib 115 and the second limiting rib 116, and the wafer carrier 20 is inserted between the first limiting rib 115 and the second limiting rib 116; the first bearing part 21 abuts against the first limiting rib 115, and the second bearing part 22 abuts against the second limiting rib 116.

[0089] The second inner wall opposite to the first inner wall in the box body 11 is provided with a limiting air bag 70, which can be in a strip shape, and the maximum length of the limiting air bag 70 can be the same as the length of the first bearing part 21 or the second bearing part 22. When the accommodating cavity 13 is maintained in the vacuum environment T by the valve assembly 14, the limiting air bag 70 is inflated and extended to abut against the first bearing part 21 or the second bearing part 22.

[0090] That is, the wafer carrier 20 as a whole is limited in the left-right direction by the first limiting rib 115 and the second limiting rib 116, the wafer carrier 20 as a whole is limited in the front-rear direction by the first inner wall of the box body 11 and the limiting air bag 70, and the wafer carrier 20 as a whole is limited in the up-down direction by the bottom wall of the box body 11 and the cover body 12. Not only the degrees of freedom of the wafer 80 on the wafer carrier 20 are limited, but also the degrees of freedom of the wafer carrier 20 itself are limited, so that the wafer 80 can be more stable when being transported.

[0091] With reference to Figure 4 and Figure 6 In some embodiments of the utility model, the inner wall of the cover body 12 is spaced apart from the first limiting strip 125 and the second limiting strip 126, and when the cover body 12 is arranged on the box body 11, the first limiting strip 125 abuts against the top of the first bearing part 21, and the second limiting strip 126 abuts against the top of the second bearing part 22.

[0092] The first limiting strip 125 and the second limiting strip 126 are used to compensate the gap between the first bearing part 21 and the second bearing part 22 and the cover 12. When the cover 12 is covered on the box body 11 and can abut against the first bearing part 21 and the second bearing part 22, the first limiting strip 125 and the second limiting strip 126 are not needed to be arranged.

[0093] The bottom of the first bearing part 21 is clamped on one side of the first limiting part 111 of the box body 11, and the bottom of the second bearing part 22 is clamped on the other side of the first limiting part 111 of the box body 11.

[0094] In this way, the left-right direction of the wafer carrier 20 as a whole is also limited by the first limiting part 111, the wafer carrier 20 as a whole is limited in the up-down direction by the bottom wall of the box body 11 and the first limiting strip 125 and the second limiting strip 126, and the stability of the wafer carrier 20 in the box body 11 is higher.

[0095] Figure 7 It is a structure schematic view of the first flexible limiting part 30, the second flexible limiting part 40, the third flexible limiting part 50, the sealing air bag 60 or the limiting air bag 70 in the wafer conveying device provided by the embodiment of the utility model. Figure 8 It is Figure 7 It is a sectional view along the front direction of the structure schematic view. Figure 9 It is Figure 8 It is a sectional view along the side direction of the structure schematic view.

[0096] Referring to Figures 7 to 9 The structure principles of the first flexible limiting part 30, the second flexible limiting part 40, the third flexible limiting part 50, the sealing air bag 60 and the limiting air bag 70 provided by the embodiment of the utility model are same, the structure settings are similar, and the structure design is mainly determined according to the specific setting positions of the components.

[0097] The first flexible limiting part 30, the second flexible limiting part 40, the third flexible limiting part 50, the sealing air bag 60 or the limiting air bag 70 all comprise a flexible body 31, the inside of the flexible body 31 is filled with compressed inert gas H with light molecular weight, and the inert gas H cannot pollute the inside environment of the containing cavity 13 even if it is missed. Under the vacuum environment T, the inert gas H in the inside of the flexible body 31 expands, so that the flexible body 31 extends; under the atmospheric pressure environment P, the atmospheric pressure on the outside of the flexible body 31 is greater than the gas pressure in the inside of the flexible body 31, so that the flexible body 31 shrinks to compress the inert gas H.

[0098] The flexible body 31 is a gas bag structure made of perfluorinated rubber, the inert gas H with light molecular weight can be helium, and the helium is commonly used and easy to expand. That is, the flexible body 31 is filled with compressed helium, and then the flexible body 31 is sealed. The compressed helium in the flexible body 31 plays an important role in the working process of the flexible body 31. The low density of the helium makes the flexible body 31 light in weight after being filled with the gas, and the expansion and contraction response speed of the flexible body 31 to the change of the air pressure outside the flexible body 31 is fast and the effect is obvious. At the same time, the chemical property of the helium is stable, and the helium is not easy to react with other substances, so as to ensure the reliability and safety of the flexible body 31.

[0099] In addition, the flexible body 31 can also be made of other rubber elastomer materials with stable chemical properties, and the compressed gas filled in the flexible body 31 can also be other low-density gases.

[0100] It should be noted that the connection mode between the flexible body 31 and the external fixed base material includes but is not limited to adhesive bonding, one-piece injection coating, and buckle connection. For example, when the flexible body 31 is used as the first flexible limiting piece 30, the flexible body 31 is connected to the bearing tooth by adhesive bonding.

[0101] Figure 10 is Figure 7 the use state principle diagram of the structure shown.

[0102] As Figure 10 shown, when the flexible body 31 is placed in an atmospheric pressure environment P, the flexible body 31 and the internal compressed helium are in an original compressed state. When the flexible body 31 is placed in an environment P lower than the atmospheric pressure or a vacuum environment T, the compressed helium in the flexible body 31 will expand, causing the flexible body 31 to expand and stretch outward, and the expansion and stretching amount can be adjusted according to the environmental pressure value outside the flexible body 31. When the external environment of the flexible body 31 returns to normal atmospheric pressure, the external air pressure causes the flexible body 31 to shrink, and the helium in the flexible body 31 is in a compressed state.

[0103] Referring to Figure 8 and Figure 9 , in some embodiments of the present application, the flexible body 31 includes a fixed part 311 and a telescopic part 312 connected to each other, the fixed part 311 is connected with the corresponding fixed base material, and the telescopic part 312 is adapted to extend outward with the expansion of the inert gas H in the vacuum environment T.

[0104] Referring to Figure 8 and Figure 9 , in some embodiments of the present application, the thickness of the telescopic part 312 gradually decreases from the position of the fixed part 311 to the direction away from the fixed part 311.

[0105] That is, the flexible body 31 is composed of two parts, namely, a base and an upper wall, and the thickness of the upper wall gradually decreases from the base to the upper wall, which makes the flexible body 31 have different strength and elastic properties at different positions. The thicker base plays a role of stable support and provides a basis for the whole flexible body 31 to be firmly connected with the outside. The gradually-thinning upper wall gives the flexible body 31 the flexibility and the directional stretching and contracting properties, and the directional stretching and contracting function enables the flexible body 31 to more accurately adapt to different working scenes and stress conditions in use.

[0106] For example, in the case of needing specific direction buffering or support, the flexible body 31 of the air bag structure can provide more effective protection and support through directional stretching and contracting.

[0107] Continuing to refer to Figure 7 In some embodiments of the present application, the outer side surface of the telescopic part 312 is provided with an anti-skid layer 313, which can improve the support performance of the flexible body 31.

[0108] Since the flexible body 31 is made of a rubber elastic body, the provided support has the anti-skid property, or an anti-skid layer is directly provided on the outer side of the flexible body 31 to increase the friction of the flexible body 31 and improve the support performance of the flexible body 31.

[0109] In some embodiments of the present application, the flexible limiting part further comprises a support shell (not shown in the figure) and an elastic telescopic body (equivalent to the flexible body 31 in the above embodiments), and the support shell is provided with a limiting hole. The elastic telescopic body is arranged in the inside of the support shell, and the inside of the elastic telescopic body is filled with an inert gas H suitable for expansion in a vacuum environment T, and the elastic telescopic body is suitable for extending from the limiting hole.

[0110] That is, the flexible body 31 can be a single-layer structure or a double-layer structure. When the flexible body 31 is a double-layer structure, the outer layer of the flexible body 31 is a hard shell protective layer and is provided with an opening in a specific direction, and the inner layer is a soft elastic telescopic body, and the inside of the elastic telescopic body is filled with compressed helium.

[0111] When the flexible body 31 is placed in an atmospheric pressure environment P, the elastic telescopic body and the compressed helium in the inside are in an original compressed state, and the elastic telescopic body is in the support shell.

[0112] When the flexible body 31 is placed in an environment P lower than the atmospheric pressure or a vacuum environment T, the compressed helium in the inside of the elastic telescopic body will expand to make the elastic telescopic body expand and stretch outward and protrude from the opening on the support shell.

[0113] Figure 11 is a use state schematic view of a wafer conveying device provided by the embodiments of the present application (under an atmospheric pressure environment). Figure 12It is the use state schematic view of the wafer conveying device (vacuum environment) provided by the embodiment of the utility model

[0114] The use process of the wafer conveying device provided by the embodiment of the utility model is shown as follows:

[0115] As Figure 11 shown, under the atmospheric pressure environment P, the first flexible limiting piece 30 on the bearing tooth 23 is in the compression state, the wafers 80 are placed in the bearing grooves 24 between the two bearing teeth 23 of the corresponding wafer bearing 20 in turn, the adjacent wafers 80 are separated by the bearing tooth 23, at this time, the wafers 80 are vertically dropped in the bearing area formed between the first bearing 21 and the second bearing 22, and the wafers 80 have a moving space, but the first flexible limiting piece 30 plays a buffering role on the movement of the wafers 80, and no violent collision occurs with the bearing tooth 23.

[0116] The wafer bearing 20 carrying the wafers 80 is placed inside the box body 11, and the cover body 12 is covered, at this time, the wafer conveying device is in the atmospheric pressure environment P, the sealing protrusion 124 on the cover body 12 cooperates with the sealing groove 114 of the box body 11, so that the cover body 12 and the box body 11 are accurately matched; the corresponding limiting strips of the cover body 12 and the corresponding bearing of the wafer bearing 20 are matched and pressed tightly, so that the wafer bearing 20 is limited in the vertical direction inside the wafer conveying device. The limiting edges of the bearing of the wafer bearing 20 cooperate with the limiting ribs of the inner wall of the box body 11, so that the wafer bearing 20 is limited in the horizontal left-right direction inside the wafer conveying device; at this time, the first flexible limiting piece 30, the second flexible limiting piece 40 and the third flexible limiting piece 50 are distributed on the circumferential edge of the wafer 80, the first flexible limiting piece 30 is distributed on both sides of the wafer 80 in the horizontal direction, and the second flexible limiting piece 40 and the third flexible limiting piece 50 are distributed on both ends of the wafer 80 in the vertical direction.

[0117] As Figure 11 enlarged view of A part in the figure, the sealing gas bag 60 in the annular sealing groove 114 and the helium inside are in the compression state, and the gap between the sealing protrusion 124 outside the sealing gas bag 60 and the sealing groove 114 is in the atmospheric pressure environment P. As Figure 11 enlarged view of B part in the figure, the limiting gas bag 70 and the helium inside are in the compression state, the limiting gas bag 70 and the corresponding bearing are in the separated state, and the gap between the limiting gas bag 70 and the corresponding bearing is in the atmospheric pressure environment P. As Figure 11 enlarged view of C part in the figure, the second flexible limiting piece 40 on the first limiting tooth 112 and the helium inside are in the compression state, the second flexible limiting piece 40 and the wafer 80 are in the separated state, and the gap between the two is in the atmospheric pressure environment P. That is, the first flexible limiting piece 30, the second flexible limiting piece 40, the third flexible limiting piece 50, the sealing gas bag 60 or the limiting gas bag 70 are all in the compression state.

[0118] At this time, the external equipment is connected through the valve assembly 14, the inside of the wafer transfer device is vacuumized, and then the valve assembly 14 is closed. The atmospheric pressure outside the wafer transfer device will press the cover body 12 and the box body 11, as shown in the enlarged view of part D in FIG. 4. Figure 12 As shown in the enlarged view of part D in FIG. 4, the sealing air bag 60 in the sealing groove 114 and the helium inside are in an expanded state. A part of the sealing air bag 60 is embedded in the gap between the sealing protrusion 124 outside the sealing air bag 60 and the sealing groove 114, and the gap is in a vacuum environment T. As shown in the enlarged view of part E in FIG. 4, the limiting air bag 70 and the helium inside are in an expanded state. The limiting air bag 70 and the corresponding bearing are in a contact state, which ensures that the wafer carrier 20 is limited in the horizontal direction inside the wafer transfer device as a whole. Figure 12 As shown in the enlarged view of part D in FIG. 4, the sealing air bag 60 in the sealing groove 114 and the helium inside are in an expanded state. A part of the sealing air bag 60 is embedded in the gap between the sealing protrusion 124 outside the sealing air bag 60 and the sealing groove 114, and the gap is in a vacuum environment T. As shown in the enlarged view of part E in FIG. 4, the limiting air bag 70 and the helium inside are in an expanded state. The limiting air bag 70 and the corresponding bearing are in a contact state, which ensures that the wafer carrier 20 is limited in the horizontal direction inside the wafer transfer device as a whole. Figure 12 As shown in the enlarged view of part F in FIG. 4, the second flexible limiting member 40 on the first limiting tooth 112 and the helium inside are in an expanded state. The second flexible limiting member 40 and the wafer 80 are in a contact state. The other first flexible limiting member 30, the second flexible limiting member 40, the third flexible limiting member 50, the sealing air bag 60 or the limiting air bag 70 are in an expanded state, and can realize flexible support for the wafer 80.

[0119] When the wafer transfer device is in a vacuum state, it can be moved and stored. When the wafer 80 needs to be taken out, the valve assembly 14 is opened, and the external atmospheric pressure air enters the wafer transfer device. The first flexible limiting member 30, the second flexible limiting member 40, the third flexible limiting member 50, the sealing air bag 60 or the limiting air bag 70 inside the wafer transfer device return to a compressed state. The cover body 12 can be smoothly opened and separated from the box body 11, and the wafer carrier 20 and the wafer 80 can be smoothly taken out.

[0120] When the wafer conveying device is placed in an atmospheric pressure environment P, the first flexible limiting member 30, the second flexible limiting member 40 and the third flexible limiting member 50 are in an original compressed state, the wafer 80 can be smoothly put into and fall on the inner wall of the first flexible limiting member 30, the second flexible limiting member 40 and the third flexible limiting member 50, and the first flexible limiting member 30, the second flexible limiting member 40 and the third flexible limiting member 50 have a buffering effect on the wafer 80; when the wafer conveying device is placed in an environment P lower than the atmospheric pressure or in a vacuum environment T, the compressed helium inside expands to cause the mirror image distributed flexible bodies 31 on the two wedge-shaped surfaces of the corresponding groove to expand outward and stretch, contact and tighten the tangent position of the wafer 80, and be in elastic contact, so that the wafer 80 is prevented from shaking in the corresponding groove during use, the displacement of the wafer 80 in four horizontal directions in the wafer carrier 20 is limited, and the wafer 80 is prevented from being broken or scratched due to collision with the corresponding teeth. When the wafer carrier 20 is restored to the atmospheric pressure environment P, the first flexible limiting member 30, the second flexible limiting member 40 and the third flexible limiting member 50 of the air bag clamped with the wafer 80 on the teeth of the wafer carrier 20 contract and separate from the wafer 80, and the wafer 80 can be easily and smoothly taken out.

[0121] Figure 13 It is the structure schematic diagram of another embodiment of the wafer conveying device provided by the embodiment of the utility model. Figure 14 It is Figure 13 It is the structure schematic diagram of the box body in the wafer conveying device shown in the utility model. Figure 15 It is Figure 13 It is the structure schematic diagram of the cover body in the wafer conveying device.

[0122] Referring to Figures 13 to 15 , the embodiment of the utility model provides the structure schematic diagram of another embodiment of the wafer conveying device, which is equivalent to that the wafer carrier is integrally arranged with the box body to form a front opening wafer conveying box. The wafer conveying device belongs to FOUP or FOSB, and the wafer conveying device runs on the track through the overhead crane and reciprocates between various process equipment.

[0123] The front opening wafer conveying box comprises a cover body 12 and a box body 11, a fixed block (not numbered in the drawing) above the box body 11 is used to fix the linking device of the overhead crane. An air valve is arranged on the box body 11, the inside of the conveying box can be evacuated and filled with air through the air valve, and the air valve can be quickly opened and closed.

[0124] A ring-shaped sealing air bag 60 is arranged in the sealing groove 114 of the box body 11 and the cover body 12, and a gas channel is arranged between the upper wall of the sealing air bag 60 and the inside of the conveying box. In the state that the inside of the conveying box is evacuated, the compressed helium in the sealing air bag 60 expands to cause the upper wall of the sealing air bag 60 to be embedded in the gas channel, increase the sealing area, increase the pressing force of the atmospheric pressure inside and outside the conveying box on the cover body 12 and the box body 11, and ensure the air tightness of the conveying box.

[0125] The wedge-shaped bearing teeth 23 are arranged on the inner wall of the box body 11 and the inner wall of the cover body 12, and the wafer 80 can be directly placed in the bearing groove 24 formed by the bearing teeth 23 without the wafer carrier 20. The first flexible limiting member 30 is arranged on the bearing teeth 23, which can limit the movement of the wafer 80 in the horizontal four directions and the vertical direction in the transfer box and avoid the wafer 80 from being broken or scratched due to collision with the bearing teeth 23.

[0126] When the wafer 80 needs to be taken out, the air valve is opened, the external atmospheric air enters the transfer box, the first flexible limiting member 30, the second flexible limiting member 40, the third flexible limiting member 50, the sealing air bag 60 or the limiting air bag 70 in the transfer box returns to the compressed state, the cover body 12 can be smoothly opened and separated from the box body 11, and the wafer 80 can be smoothly taken out.

[0127] Finally, it should be noted that: the above examples are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing examples, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing examples, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A flexible stopper, characterized by, The flexible body (31) is filled with compressed inert gas (H) with light molecular weight, and the inert gas (H) inside the flexible body (31) expands under vacuum environment (T) to extend the flexible body (31); the air pressure outside the flexible body (31) is greater than the air pressure inside the flexible body (31) under atmospheric pressure environment (P), and the flexible body (31) shrinks. The flexible body (31) comprises a fixed part (311) and an elastic part (312) connected with each other, the fixed part (311) is connected with a fixed base material, and the elastic part (312) is adapted to expand outward under vacuum environment (T) with the inert gas (H).

2. The flexible stop of claim 1, wherein, The thickness of the elastic part (312) gradually decreases from the position of the fixed part (311) to the direction away from the fixed part (311).

3. The flexible stop of claim 2, wherein, The connection between the flexible body (31) and the fixed base material comprises adhesive bonding.

4. The flexible stop of claim 1, wherein, The flexible body (31) is a gas bag structure made of perfluorinated rubber.

5. The flexible stop of claim 1, wherein, The inert gas (H) comprises helium.

6. The flexible stop of claim 1, wherein, The outer surface of the flexible body (31) is provided with an anti-skid layer (313).

7. The flexible stop of any one of claims 1 to 6, wherein, The support shell is provided with a limiting hole; 8. A flexible stopper, characterized by, The elastic body is filled with compressed inert gas (H) with light molecular weight inside, and the inert gas (H) inside the elastic body expands under vacuum environment (T) to extend the elastic body from the limiting hole; the air pressure outside the elastic body is greater than the air pressure inside the elastic body under atmospheric pressure environment (P), and the elastic body shrinks. The flexible limiting part comprises a first bearing part (21), a second bearing part (22) and any one of the flexible limiting parts according to claims 1 to 8; The first bearing part (21) and the second bearing part (22) are oppositely arranged and connected with each other, and a plurality of bearing grooves (24) for placing wafers (80) are correspondingly arranged on the first bearing part (21) and the second bearing part (22), and the flexible limiting parts are arranged on the two groove walls opposite to each other of each bearing groove (24).

9. A wafer carrier, characterized by, The wafer carrier (20) is adapted to be mounted to the shell assembly (10). ​ 10. A wafer transfer device, comprising: ​

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