Wafer tray and wafer bearing device

Abstract

The utility model provides a wafer tray and a wafer bearing device, and relates to the technical field of semiconductor processing, the front surface of the wafer tray is provided with a wafer groove for accommodating a wafer, the wafer groove is internally provided with a plurality of support members, the plurality of support members are arranged along the circumferential wall of the wafer groove at intervals, the support members protrude out of the bottom wall of the wafer groove, and the wafer tray is provided with a plurality of wafer grooves. The supporting member is used for supporting the back surface of the wafer. Through reasonable distribution, the support members not only can support the wafer, but also ensure the stability of the wafer in the wafer groove, and the support members are arranged at intervals along the peripheral wall, so that normal placement and taking out of the wafer cannot be blocked. More importantly, through the arrangement of the supporting piece, a gap can be formed between the wafer and the bottom wall of the wafer groove. The design of the gap greatly reduces the direct contact between the back surface of the wafer and the wafer tray, avoids large-area friction, and can effectively prevent the back surface of the wafer from being damaged in the operation process.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor processing, in particular to a wafer tray and a wafer bearing device. BACKGROUND

[0002] The wafer tray is a key device for bearing and protecting wafers, and is widely used in the process flow of semiconductor manufacturing, packaging and testing. Through special design and materials, the wafer tray can effectively prevent the wafer from being contaminated, damaged or scratched by the external environment, and ensure the stability and safety of the wafer during processing and transportation.

[0003] However, in the existing tray design, the wafer is usually directly placed in the wafer groove in the tray, and the back of the wafer is in contact with the bottom of the groove. This contact inevitably causes friction, especially during handling and processing, which may cause slight damage to the wafer surface, thereby affecting product quality. CONTENT OF THE INVENTION

[0004] The purpose of the present application is to provide a wafer tray and a wafer bearing device in view of the above-mentioned deficiencies in the prior art.

[0005] To achieve the above-mentioned purpose, the technical solutions adopted by the embodiments of the present application are as follows:

[0006] In one aspect of the embodiments of the present application, a wafer tray is provided, which is provided with a wafer groove on the front surface for accommodating a wafer, and a plurality of support pieces are arranged in the wafer groove, the plurality of support pieces are arranged at intervals along the peripheral wall of the wafer groove, the support pieces protrude from the bottom wall of the wafer groove, and the support pieces are used to support the back surface of the wafer to form a gap between the wafer and the bottom wall of the wafer groove.

[0007] Optionally, a through groove is further provided on the front surface of the wafer tray, and the through groove is communicated with the wafer groove through the side wall of the wafer groove.

[0008] Optionally, a positioning notch is provided on the side of the through groove opposite to the slot.

[0009] Optionally, a recess is provided on the front surface of the bottom wall of the wafer groove, and the through groove is communicated with the recess through the side wall of the wafer groove.

[0010] Optionally, the support piece comprises a support part and a limiting part connected in sequence, the support part is arranged on the bottom wall of the wafer groove and protrudes from the bottom wall of the wafer groove, the limiting part is arranged on the side wall of the wafer groove and protrudes from the side wall of the wafer groove, the plurality of support parts support the wafer on the back surface of the wafer, and the plurality of limiting parts cooperate with the side surface of the wafer to limit the wafer in the wafer groove.

[0011] Optionally, an annular protrusion is provided on the periphery of the bottom wall of the wafer groove, and the support part is arranged on the annular protrusion and protrudes from the annular protrusion.

[0012] Optionally, the sidewall of the wafer groove comprises an arc sidewall and a plane sidewall connected in sequence.

[0013] Optionally, a plurality of water leakage holes are arranged on the bottom wall of the wafer groove.

[0014] In another aspect of the embodiments of the present application, a wafer carrying device is provided, comprising a carrying box, and at least one wafer tray as described above is arranged in the carrying box.

[0015] Optionally, the carrying box comprises a box body and a box cover, a receiving cavity is arranged in the box body, the wafer tray is arranged in the receiving cavity, the receiving cavity has an opening, and the box cover covers the periphery of the opening.

[0016] The beneficial effects of the present application include:

[0017] The present application provides a wafer tray and a wafer carrying device, a wafer groove for accommodating a wafer is arranged on the front surface of the wafer tray, a plurality of support pieces are arranged in the wafer groove, the plurality of support pieces are arranged at intervals along the peripheral wall of the wafer groove, the support pieces protrude from the bottom wall of the wafer groove, and the support pieces are used to support the back surface of the wafer. Through reasonable distribution, the support pieces not only support the wafer, but also ensure the stability of the wafer in the wafer groove, and the support pieces are arranged at intervals along the peripheral wall and will not block the normal placement and removal of the wafer. More importantly, through the arrangement of the support pieces, a gap can be formed between the wafer and the bottom wall of the wafer groove. The design of this gap greatly reduces the direct contact between the back surface of the wafer and the wafer tray, avoids large-area friction, and can effectively prevent damage to the back surface of the wafer during operation. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0019] Figure 1 One of the structure schematic diagrams of a wafer tray provided by the embodiments of the present application;

[0020] Figure 2 One of the structure schematic diagrams of a wafer tray provided by the embodiments of the present application;

[0021] Figure 3 One of the structure schematic diagrams of a wafer tray provided by the embodiments of the present application;

[0022] Figure 4This is a fourth structural diagram of a wafer tray provided in an embodiment of the present application;

[0023] Figure 5 A schematic structural diagram of a wafer carrier device provided in an embodiment of the present application.

[0024] Icons: 1-wafer tray; 11-wafer slot; 12-support member; 121-support part; 122-limiting part; 13-through slot; 131-positioning notch; 14-groove; 15-annular protrusion; 16-leakage hole; 171-arc side wall; 172-flat side wall; 21-box body; 22-box cover; 3-wafer. DETAILED DESCRIPTION

[0025] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0026] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application as claimed, but merely represents selected embodiments of the present application. It should be noted that, unless there is a conflict, the various features of the embodiments of the present application may be combined with each other, and the combined embodiments are still within the scope of protection of the present application.

[0027] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0028] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the product of this application is typically placed when in use. These terms are intended only to facilitate the description of this application and simplify the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0029] Furthermore, terms such as "horizontal" and "vertical" do not necessarily mean that a component must be absolutely horizontal or overhanging, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but rather that it can be slightly tilted.

[0030] It should also be noted that, in the description of this application, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0031] In one aspect of the embodiment of the present application, a wafer tray 1 is provided. Figures 1 to 4 As shown, a wafer slot 11 for accommodating wafers 3 is provided on the front of the wafer tray 1. A plurality of support members 12 are designed in the wafer slot 11. These support members 12 are distributed at intervals along the peripheral wall of the wafer slot 11 and protrude from the bottom wall of the wafer slot 11. The function of the support members 12 is to support the back of the wafer 3, thereby forming a gap between the wafer 3 and the bottom wall of the wafer slot 11. The design of this gap can greatly reduce direct contact between the back of the wafer 3 and the wafer tray 1, avoid large-area friction, and effectively prevent scratches or other damage to the back of the wafer 3 during operation.

[0032] Specifically, the rational distribution and height design of the supports 12 not only support the wafers 3 but also ensure their stability within the wafer slots 11. The supports 12 are arranged along the perimeter wall, ensuring they do not obstruct the normal placement and removal of the wafers 3. By minimizing the contact area, they also reduce stress concentration on the wafers 3 during handling. This design creates a relatively complete connection within the overall structure of the wafer tray 1, ensuring the safety and integrity of the wafers 3 during manufacturing, transportation, and testing.

[0033] This design also takes into account the high demands placed on wafer 3 surface cleanliness and structural integrity in semiconductor processing. The gap created by support member 12 not only reduces wear caused by physical contact but also facilitates airflow, preventing the accumulation of residue on the backside of wafer 3. Furthermore, the presence of this gap facilitates the use of airflow or suction tools in certain processes, allowing operation from the backside or edge of wafer 3 rather than the front, further reducing the possibility of front-side contamination.

[0034] It should be understood that the size, material and arrangement of the wafer groove 11 and the support 12 can be customized according to different specifications of the wafer 3. By precisely controlling the shape and position of the support 12, the stability of the wafer 3 when placed and the versatility of the wafer tray 1 can be ensured, so that the wafer tray 1 can be applied to wafers 3 of different sizes and thicknesses, meet a wide range of process requirements, and reduce the complexity and manufacturing cost of the wafer tray 1 design.

[0035] In summary, the wafer tray 1 provided by the embodiments of the present application can not only reduce the risk of wear on the back of the wafer 3 and improve process yield, but also effectively protect the front of the wafer 3 by reducing contact contamination on the surface of the wafer 3, and improve the ventilation performance of the wafer tray 1 through the design of the gap, thereby significantly improving the safety and reliability of the wafer 3 during processing.

[0036] Optionally, a through groove 13 is further arranged on the front surface of the wafer tray 1, and the through groove 13 is in communication with the wafer groove 11 through the side wall of the wafer groove 11.

[0037] Specifically, as shown in Figure 1 the slot of the through groove 13 faces the front surface of the wafer tray 1, the bottom wall of the through groove 13 is flush with the bottom wall of the wafer groove 11, and the through groove 13 penetrates along the thickness direction of the side wall of the wafer groove 11, that is, the through groove 13 is in communication with the wafer groove 11 through the side wall of the wafer groove 11. Therefore, the grabbing mechanism (such as a mechanical hand or a vacuum suction pen) can pass through the through groove 13 from the side of the wafer tray 1 and directly extend into the wafer groove 11, so as to firmly grab the back of the wafer 3, to realize the operation of taking out the wafer 3 from the wafer tray 1 or stably placing it in the wafer tray 1, avoiding the direct contact with the front surface of the wafer 3 in the traditional operation. This design not only ensures the accuracy of the grabbing action, but also greatly reduces the risk of contamination or damage to the front surface of the wafer 3. It should be noted that the front surface of the wafer 3 is usually its working surface, and any contamination thereof will affect the subsequent process. Therefore, this way of grabbing from the back has great advantages.

[0038] Optionally, the side wall of the wafer groove 11 includes an arc side wall 171 and a plane side wall 172 connected in sequence.

[0039] Specifically, the design of the side wall of the wafer groove 11 is based on the characteristics of the shape of the wafer 3, fully considering the requirements of its special geometric structure. The flat edge design of the wafer 3 is usually used to mark the orientation of the wafer 3, or to provide a positioning reference in some process steps. Therefore, the design of the plane side wall 172 in the wafer tray 1 can ensure that the flat edge of the wafer 3 is oriented correctly, which is helpful for automatic recognition and processing in subsequent processes.

[0040] Specifically, as shown in Figure 1As shown, the sidewall of the wafer slot 11 is composed of an arc sidewall 171 and a plane sidewall 172 connected in sequence. The arc sidewall 171 is designed to fit the round part of the wafer 3, ensuring that the wafer 3 can be stably accommodated and supported. While the plane sidewall 172 is designed for the flat edge of the wafer 3, so as to accurately place and fix the flat edge part of the wafer 3. This design not only enhances the stability of the wafer 3, but also effectively reduces the adjustment time when the wafer 3 is placed, and effectively prevents the possibility of the wafer 3 sliding or rotating in the wafer slot 11.

[0041] The transition between the arc sidewall 171 and the plane sidewall 172 should be smooth and natural, ensuring smooth operation when the wafer 3 is placed. The arc sidewall 171 can fully wrap the round part of the wafer 3 by designing an arc shape that conforms to the curvature of the wafer 3, preventing displacement during processing or transportation. While the flat design of the plane sidewall 172 provides reliable support for the flat edge of the wafer 3, ensuring that the wafer 3 always maintains a fixed directionality in the wafer tray 1. In addition, the size and sidewall shape of the wafer slot 11 can be customized according to different specifications of the wafer 3, making the wafer tray 1 suitable for various types and sizes of wafers 3. Through the precise design and processing of the arc sidewall 171 and the plane sidewall 172, the wafer tray 1 can ensure the accurate placement and stable protection of the wafer 3.

[0042] Overall, the combination of the arc sidewall 171 and the plane sidewall 172 greatly improves the stability of the wafer 3 in the wafer tray 1, and also ensures high-precision positioning of the wafer 3 in subsequent processes, effectively improving the convenience and reliability of the semiconductor manufacturing process.

[0043] Optionally, a positioning notch 131 is provided on the side of the through slot 13 opposite the slot opening.

[0044] Specifically, as Figure 1As shown, positioning notches 131 are arranged on the side of the through groove 13 opposite the notch, i.e. on the edge of the bottom wall of the through groove 13. The positioning notches 131, in combination with the bottom wall of the through groove 13, form an effective positioning reference point. When the wafer trays 1 are stacked, a vertical positioning protrusion is arranged in the loading device for placing multiple wafer trays 1, so that the positioning notches 131 of the multiple wafer trays 1 are all positioned in cooperation with the positioning protrusion. At this time, the positioning notches 131 of the multiple wafer trays 1 are aligned, i.e. each wafer tray 1 can be accurately aligned, ensuring the stability and consistency of the overall stack. The positioning notches 131 and the positioning protrusion are positioned by accurate machinery, which not only simplifies the stacking operation, but also ensures that the multiple wafer trays 1 do not slide or dislocate between the stacked wafer trays 1, avoids the multiple wafer trays 1 from being offset during the stacking process, and also ensures that the wafers 3 placed in the wafer trays 1 can always be accurately positioned. This design not only improves the stacking efficiency of the multiple wafer trays 1, but also provides a convenient operation mode for batch processing of wafers 3. In addition, the consistent positioning of the wafers 3 in the multiple stacked wafer trays 1 can also improve the safety and process yield of the operation, further optimizing the processing effect of the wafers 3 in the semiconductor manufacturing process.

[0045] It should be noted that the size and shape of the positioning notches 131 can be adjusted according to the design of different wafer trays 1, such as U-shaped notches or V-shaped notches, to ensure that they are suitable for wafer trays 1 of various specifications. In addition, the position and shape design of the positioning notches 131 should conform to the overall structural characteristics of the wafer tray 1, neither affecting the normal function of the wafer groove 11 or the through groove 13, nor achieving its positioning function.

[0046] Optionally, the support member 12 comprises a support portion 121 and a limiting portion 122 connected in sequence, the support portion 121 is arranged on the bottom wall of the wafer groove 11, and the support portion 121 protrudes from the bottom wall of the wafer groove 11, the limiting portion 122 is arranged on the side wall of the wafer groove 11, and the limiting portion 122 protrudes from the side wall of the wafer groove 11, the multiple support portions 121 support the wafers 3 on the back surface of the wafers 3, and the multiple limiting portions 122 cooperate with the side surface of the wafers 3 to limit the wafers 3 in the wafer groove 11.

[0047] Specifically, as Figure 1As shown, the sequentially connected support part 121 and the limiting part 122 form an L-shaped structure, which can provide double support for the wafer 3. The protrusion of the support part 121 forms a gap between the wafer 3 and the bottom wall of the wafer groove 11, reducing the large-area contact between the back surface of the wafer 3 and the bottom wall of the wafer groove 11, avoiding friction and surface damage. At the same time, the limiting part 122 is located on the side wall of the wafer groove 11, providing effective lateral support, and the protruding design ensures the fixation of the side surface of the wafer 3, preventing the wafer 3 from shifting due to lateral movement during operation. Through the L-shaped structural layout of the support part 121 and the limiting part 122 of the support part 12, the support part 121 and the limiting part 122 simultaneously support and limit the wafer 3, not only ensuring the overall stability of the wafer 3 in the wafer groove 11, but also ensuring the precise positioning of the wafer 3, ensuring that the wafer 3 is always in the best fixed state under complex process conditions, thereby improving the precision and reliability of the wafer 3 processing. In addition, this design structure is simple and will not increase the manufacturing cost of the wafer tray 1, but can significantly improve the practicality and applicability of the wafer tray 1.

[0048] It should be noted that the size, shape and arrangement of the support part 121 and the limiting part 122 can be flexibly adjusted according to the specifications of the wafer 3 to adapt to different types and sizes of wafers 3. By precisely controlling the protruding position of the support part 12 and the limiting part 122, the wafer tray 1 can provide stable support and limiting function for the wafer 3 without affecting the placement and removal of the wafer 3.

[0049] Optionally, an annular protrusion 15 is arranged on the bottom wall of the wafer groove 11, and the support part 121 is arranged on the annular protrusion 15, and the support part 121 protrudes from the annular protrusion 15.

[0050] Specifically, as shown in Figure 1 The combination of the annular protrusion 15 and the support part 121 forms a multi-level support structure. The annular protrusion 15 as a protruding part of the bottom wall lifts the support part 121, so that it can not only support the back surface of the wafer 3, but also further increase the vertical distance between the wafer 3 and the bottom wall of the wafer tray 1, leaving enough depth and freedom for the operation of the grabbing mechanism. This design can effectively avoid the inconvenience caused by insufficient space in the traditional wafer tray 1, ensuring that the grabbing mechanism can accurately contact the back surface of the wafer 3.

[0051] Optionally, a groove 14 is arranged on the front surface of the bottom wall of the wafer groove 11, and the through groove 13 communicates with the groove 14 through the side wall of the wafer groove 11.

[0052] Specifically, as shown in Figure 1As shown, the recess 14 is designed in the center area of the bottom wall of the wafer slot 11 and is in communication with the through slot 13 through the side wall of the wafer slot 11. The communication between the recess 14 and the through slot 13 forms a smooth grabbing channel, so that the grabbing mechanism can easily enter the bottom of the wafer tray 1 to operate. The depth of the recess 14 is designed to take into account the distance requirement between the wafer 3 and the bottom wall of the wafer tray 1. By further increasing this distance, the operation of the automated equipment can be facilitated, and it can be more freely operated on the wafer 3.

[0053] Optionally, a plurality of water leakage holes 16 are formed in the bottom wall of the wafer slot 11.

[0054] Specifically, as shown, Figure 1 the water leakage holes 16 should be evenly distributed on the bottom wall of the wafer slot 11 to ensure that the liquid can be quickly and effectively discharged. The position of the water leakage hole 16 should be reasonably designed, which will not affect the support structure of the wafer 3 and the overall strength of the wafer tray 1, and will not interfere with the stability of the wafer 3 in the wafer tray 1. The design of the water leakage hole 16 aims to optimize the handling capacity of the wafer 3 to the liquid during cleaning, processing or storage, to ensure that the liquid can flow naturally into these water leakage holes 16 and be quickly discharged, to avoid the accumulation of liquid at the bottom of the wafer tray 1, to help maintain the cleanliness and dryness of the wafer 3 and the wafer tray 1, and to reduce the pollution or damage caused by liquid residue.

[0055] In another aspect of the embodiments of the present application, a wafer carrying device is provided, as shown in Figure 5 which comprises a carrying box in which at least one wafer tray 1 of any of the above is placed, for realizing the safe storage, transportation and processing of the wafer 3 in the semiconductor manufacturing process. The carrying box as an external protection structure can ensure that the wafer tray 1 and the wafer 3 in it remain stable and clean in various operating environments, and also provides protection and sealing function, reducing the influence of the external environment on the wafer 3.

[0056] The carrying box is closely matched with the wafer tray 1 to ensure that the wafer tray 1 does not slide or displace in the carrying box. The size and shape of the inside of the carrying box are specially designed to accommodate the wafer tray 1, and one or more wafer trays 1 can be placed. Its internal structure can provide effective positioning to keep the wafer tray 1 horizontal, avoiding tilting or collision during transportation or operation. At the same time, the carrying box can be designed as a structure easy to stack, which is convenient for saving space during storage or transportation.

[0057] In addition, since the wafer carrying device comprises the above-mentioned wafer tray 1, it also has the same beneficial effects as the wafer tray 1, which will not be repeated here.

[0058] Optionally, the carrier box includes a box body 21 and a box cover 22 . A receiving cavity is provided in the box body 21 , and the wafer tray 1 is located in the receiving cavity. The receiving cavity has an opening, and the box cover 22 covers the periphery of the opening.

[0059] Specifically, if Figure 5 As shown, the design of this carrier box includes a box body 21 and a lid 22. Through the precise coordination of the two, they provide a stable, secure storage and protection environment for the wafer trays 1. The accommodating cavity defined within the box body 21 is the primary storage space for the wafer trays 1, capable of accommodating one or more wafer trays 1. The opening of the accommodating cavity is sealed by the lid 22, forming a sealed structure that effectively prevents contamination and damage to the wafer trays 1 and the wafers 3 within them from the external environment.

[0060] Furthermore, positioning protrusions are provided within the box body 21. These protrusions are strategically positioned to ensure that each wafer tray 1 is accurately positioned when placed into the accommodating cavity, preventing slippage or shifting. This design improves the stability of the wafer tray 1 during transport or storage, while also facilitating the stacking of multiple wafer trays 1 within the accommodating cavity.

[0061] The above description is merely a preferred embodiment of the present application and is not intended to limit the present application. Various modifications and variations are possible for those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

Claims

1. A wafer tray, characterized by, A wafer slot (11) for accommodating a wafer (3) is arranged on the front surface of the wafer tray (1), a plurality of support members (12) are arranged in the wafer slot (11), the support members (12) are arranged at intervals along the peripheral wall of the wafer slot (11), the support members (12) protrude from the bottom wall of the wafer slot (11), and the support members (12) are used for supporting the back surface of the wafer (3) to form a gap between the wafer (3) and the bottom wall of the wafer slot (11); A through slot (13) is further arranged on the front surface of the wafer tray (1), the through slot (13) is communicated with the wafer slot (11) through the side wall of the wafer slot (11); A positioning notch (131) is arranged on the side of the through slot (13) opposite to the slot opening.

2. The wafer tray of claim 1, wherein, A groove (14) is arranged on the front surface of the bottom wall of the wafer slot (11), and the through slot (13) is communicated with the groove (14) through the side wall of the wafer slot (11).

3. The wafer tray of claim 1, wherein, The support member (12) comprises a support part (121) and a limiting part (122) connected in sequence, the support part (121) is arranged on the bottom wall of the wafer slot (11), and the support part (121) protrudes from the bottom wall of the wafer slot (11), the limiting part (122) is arranged on the side wall of the wafer slot (11), and the limiting part (122) protrudes from the side wall of the wafer slot (11), the plurality of support parts (121) support the wafer (3) on the back surface of the wafer (3), and the plurality of limiting parts (122) cooperate with the side surface of the wafer (3) to limit the wafer (3) in the wafer slot (11).

4. The wafer tray of claim 3, wherein, An annular protrusion (15) is arranged on the peripheral edge of the bottom wall of the wafer slot (11), and the support part (121) is arranged on the annular protrusion (15) and protrudes from the annular protrusion (15).

5. The wafer tray of claim 1, wherein, The side wall of the wafer slot (11) comprises an arc side wall (171) and a plane side wall (172) connected in sequence.

6. The wafer tray of claim 1, wherein, A plurality of water leakage holes (16) are arranged on the bottom wall of the wafer slot (11).

7. A wafer carrier apparatus, comprising: The carrying box comprises a box body (21) and a box cover (22), an accommodating cavity is arranged in the box body (21), the wafer tray (1) is located in the accommodating cavity, the accommodating cavity has an opening, and the box cover (22) is covered on the peripheral edge of the opening.

8. The wafer carrier apparatus of claim 7, wherein, The carrying box comprises a box body (21) and a box cover (22), an accommodating cavity is arranged in the box body (21), the wafer tray (1) is located in the accommodating cavity, the accommodating cavity has an opening, and the box cover (22) is covered on the peripheral edge of the opening.

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