Mini LED lamp bead structure, lamp bead and equipment

Abstract

The utility model provides a Mini LED lamp bead structure, lamp bead and equipment, the Mini LED lamp bead structure comprises a plate body, a plurality of solid crystal plates and a plurality of conducting strips, the plate body is connected with the plurality of solid crystal plates and the plurality of conducting strips, the solid crystal plates are provided with a plurality of first grooves, the solid crystal plates are connected with conducting strips, the conducting strips are connected with the conducting strips, the conducting strips are provided with a plurality of second grooves, and the second grooves are connected with the conducting strips. A plurality of arc-shaped grooves are formed in the board body, metal layers are arranged on the side walls of the arc-shaped grooves, the conducting strips are connected with the metal layers, the metal layers are connected with the pins, coarsening metal layers are arranged on one sides of the metal layers, insulating blocks are arranged in the arc-shaped grooves, and the coarsening metal layers are connected with the insulating blocks. By arranging the plurality of die bonding sheets and arranging the plurality of first grooves, die bonding functional areas are independent, water vapor permeation is prevented, the heat dissipation capability is improved, the first grooves and the second grooves dredge water vapor, and the water vapor is prevented from being gathered in the functional areas; and the coarsening metal layer is arranged, so that the air tightness of the lamp bead structure is effectively improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor, especially relates to a Mini LED lamp pearl structure, lamp pearl and equipment. BACKGROUND

[0002] The existing Mini LED lamp pearl adopts the flat plate type substrate as the support, and the front surface circuit and the back surface circuit are made on the substrate. The front surface circuit is used for binding the light emitting chip and realizing the electrical interconnection, and the back surface circuit is used for welding with the PCB board of the LED display module. The front surface and the back surface circuit realize the conduction through the through hole and the metal.

[0003] The front surface circuit of the substrate is divided into die bonding functional area, soldering wire functional area and insulation isolation area. The red light chip is fixed on the red light die bonding functional area by silver glue. The blue light chip and the green light chip are fixed on the corresponding die bonding functional area by insulation glue or silver glue, and the die bonding functional areas are connected into a whole.

[0004] However, during die bonding, due to the precision of the machine and the characteristics of the die bonding glue, the glue in the die bonding functional area of the Mini LED lamp pearl with small chip spacing is easily connected, which easily leads to low chip adhesive yield and easy falling. Due to the difference in material properties, the combination of the packaging glue, the through hole ink and the electroplated lead of the front surface circuit is poor. In addition, the substrate of the lamp pearl is left with a quarter of the through hole by cutting, and the material in the through hole is exposed, which makes it easier for water vapor to enter the inside of the lamp pearl. Moreover, the size of the internal components of the existing Mini LED lamp pearl is small, the spacing is small, the heat dissipation capacity of the lamp pearl is insufficient, which leads to faster aging of the lamp pearl and shorter service life. UTILITY MODEL CONTENTS

[0005] In view of the defects of the prior art, the utility model aims to provide a Mini LED lamp pearl structure, lamp pearl and equipment, which aims to solve the problems of low chip adhesive yield, easy entry of water vapor into the inside of the lamp pearl and poor reliability of the Mini LED lamp pearl in the prior art.

[0006] In order to achieve the above purpose, the utility model is realized by the following technical scheme:

[0007] A Mini LED lamp bead structure, comprising a plate body, a plurality of die bonding pieces and a plurality of conductive pieces, one side of the plate body is connected with the plurality of die bonding pieces and the plurality of conductive pieces, the die bonding piece is provided with a plurality of first grooves on one side facing the plate body and one side away from the plate body, the first grooves extend from one side wall of the die bonding piece to the opposite side wall, the die bonding piece is used for connecting a chip, the die bonding piece is connected with a conductive strip, one end of the conductive strip away from the die bonding piece is connected with the conductive piece, the conductive strip is provided with a plurality of second grooves on one side away from the plate body, the second grooves extend from one side wall of the conductive strip to the opposite side wall, a plurality of arc-shaped grooves are formed in the side wall of the plate body, a metal layer is arranged on the side wall of the arc-shaped groove, the conductive piece is in position correspondence with the arc-shaped groove and is connected with the metal layer, one end of the metal layer away from the conductive piece is connected with a pin, the plurality of pins are located on one side of the plate body away from the conductive piece, a roughened metal layer is arranged on one side of the metal layer away from the plate body, an insulating block is arranged in the arc-shaped groove, and the roughened metal layer is connected with the insulating block.

[0008] Compared with the prior art, the beneficial effects of the utility model lie in that: by setting a plurality of die bonding pieces and a plurality of first grooves, the die bonding function areas of various color chips in the traditional lamp bead are independent, the glue is prevented from being connected, the die bonding piece and the substrate and the die bonding piece and the glue are more strongly combined by rasterizing the die bonding piece, water vapor is prevented from penetrating and the heat dissipation capacity is improved by increasing the metal surface area, the second grooves improve the capacity of the conductive strip to prevent water vapor from penetrating and dissipating heat, and since the first grooves and the second grooves both horizontally pass through the metal structure, when a small amount of water vapor enters the lamp bead, the water vapor can be dredged through the first grooves and the second grooves to prevent the water vapor from gathering in the functional area, the roughened metal layer is set to enhance the combination of the arc-shaped groove formed by the cut-through through hole and the insulating block, prevent water vapor from penetrating, and effectively increase the air tightness of the lamp bead structure.

[0009] Further, the plurality of first grooves are parallel to each other, the plurality of second grooves are parallel to each other, and the first grooves and the second grooves are perpendicular to each other.

[0010] Further, one side of the die bonding piece away from the plate body is connected with glue, part of the glue is located in the first groove, and the glue is connected with the chip.

[0011] Further, one side of the roughened metal layer away from the metal layer is provided with a plurality of third grooves.

[0012] Further, the bottom surface of the insulating block is higher than the pin.

[0013] Further, a plurality of bonding wires are arranged on the chip, and one end of the bonding wires is connected to the conductive sheet.

[0014] Further, an ink layer is arranged on one side of the insulating block close to the conductive sheet, and the ink layer is connected to the conductive sheet corresponding to the insulating block and connected to part of the plate body.

[0015] Further, Mark points are arranged on one side of the plate body facing the pins.

[0016] A lamp bead comprises the Mini LED lamp bead structure as described in the above technical solutions.

[0017] An apparatus comprises the lamp bead as described in the above technical solutions. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 FIG. 1 is a main structure schematic diagram of a Mini LED lamp bead structure in an embodiment of the present application;

[0019] Figure 2 FIG. 2 is a die bonding schematic diagram of the Mini LED lamp bead structure in the embodiment of the present application;

[0020] Figure 3 FIG. 3 is a side view schematic diagram of part of the structure of the Mini LED lamp bead structure in the embodiment of the present application;

[0021] Figure 4 FIG. 4 is a structure schematic diagram of an insulating block in the Mini LED lamp bead structure in the embodiment of the present application;

[0022] Figure 5 FIG. 5 is a structure schematic diagram of a bottom surface of the Mini LED lamp bead structure in the embodiment of the present application;

[0023] Figure 6 FIG. 6 is a structure schematic diagram of a colloid and a chip in the Mini LED lamp bead structure in the embodiment of the present application;

[0024] Figure 7 FIG. 7 is a structure schematic diagram of an ink layer in the Mini LED lamp bead structure in the embodiment of the present application;

[0025] MAIN ELEMENT SYMBOL EXPLANATION

[0026] plate body 100 die bonding wafer 110 first groove 111 conductive strip 120 second groove 121 conductive strip 130 arc-shaped groove 200 metal layer 210 roughened metal layer 211 insulating block 220 pin 300 mark point 310 chip 400 glue 410 bonding wire 420 ink layer 500 encapsulation glue 600

[0027] The following specific embodiments will further illustrate the present application in combination with the above drawings. DETAILED DESCRIPTION

[0028] For the convenience of understanding the utility model, the utility model will be described more fully below with reference to the relevant drawings. The drawings show several embodiments of the utility model. However, the utility model can be realized in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the utility model more thorough and comprehensive.

[0029] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there can be a middle element. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or there can be a middle element. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the utility model belongs. The terms used in the specification of the utility model herein are only for the purpose of describing specific embodiments and are not intended to limit the utility model. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0031] Please refer to Figures 1 to 7 The Mini LED lamp bead structure in the embodiment of the utility model, including board 100, a plurality of fixed crystal piece 110 and a plurality of conductive sheet 130, one side of the board 100 is connected with a plurality of fixed crystal piece 110 and a plurality of conductive sheet 130, one side of the fixed crystal piece 110 towards the board 100 and one side of the fixed crystal piece 110 away from the board 100 are provided with a plurality of first recess 111, the first recess 111 extends from one side wall of the fixed crystal piece 110 to the opposite side wall, a plurality of first recess 111 are parallel to each other, the fixed crystal piece 110 is used to connect chip 400, one side of the fixed crystal piece 110 away from the board 100 is connected with adhesive 410, part of the adhesive 410 is located in the first recess 111, the adhesive 410 is connected with the chip 400, a plurality of bonding wires 420 are arranged on the chip 400, one end of the bonding wire 420 away from the chip 400 is connected with the conductive sheet 130. Preferably, three fixed crystal pieces 110 are arranged, and correspond to three chips 400 respectively, three chips 400 are blue light chip, green light chip and red light chip respectively, the adhesive 410 connected with the blue light chip and the green light chip is insulating adhesive, the adhesive 410 connected with the red light chip is silver adhesive, the board 100 is BT board, the top of the board 100 adopts encapsulation adhesive 600 for encapsulating Mini LED lamp bead, please refer to Figure 7The blue light chip and the green light chip are connected to two bonding wires 420, and the red light chip is connected to one bonding wire 420. Understandably, three fixed crystal pieces 110 are arranged respectively, which can effectively prevent the continuous glue caused by the precision and error of the machine during fixed crystal, prevent the mutual adhesion of the glue under different chips, and prevent the mutual adhesion of the glue under different chips. A plurality of first grooves 111 enhance the bonding force between the fixed crystal piece 110 and the plate body 100, and enhance the bonding force between the fixed crystal piece 110 and the glue 410 and the packaging glue 600. The penetration of water vapor is greatly reduced, and the surface area of the fixed crystal piece 110 is increased, which is beneficial to enhancing the heat dissipation capacity, effectively improving the air tightness and heat dissipation capacity of the Mini LED lamp bead structure.

[0032] The fixed crystal piece 110 is connected to a conductive strip 120, one end of the conductive strip 120 away from the fixed crystal piece 110 is connected to a conductive sheet 130, a plurality of second grooves 121 are arranged on one side of the conductive strip 120 away from the plate body 100, the second grooves 121 extend from one side wall of the conductive strip 120 to the opposite side wall, a plurality of second grooves 121 are parallel to each other, and the first grooves 111 and the second grooves 121 are perpendicular to each other. Preferably, the number of conductive strips 120 is three, corresponding to three fixed crystal pieces 110 respectively, the conductive sheet 130 connected by the conductive strip 120 corresponding to the blue light chip and the green light chip includes a plated lead, and the plated lead extends to the edge of the plate body 100. Understandably, a plurality of second grooves 121 are beneficial to improving the air tightness and heat dissipation performance of the Mini LED lamp bead structure, and because they are perpendicular to the first grooves 111, if water vapor enters the inside of the packaging glue 600, it can guide the water vapor in two directions respectively, preventing water vapor from gathering in the functional area and causing negative effects on the chip 400.

[0033] The side wall of the plate body 100 is provided with a plurality of arc-shaped grooves 200, the side wall of the arc-shaped groove 200 is provided with a metal layer 210, the conductive sheet 130 corresponds to the position of the arc-shaped groove 200 and is connected to the metal layer 210, one end of the metal layer 210 away from the conductive sheet 130 is connected to a pin, the roughened metal layer 211 is arranged on the side of the metal layer 210 away from the plate body 100, a plurality of third grooves are arranged on the side of the roughened metal layer 211 away from the metal layer 210, the arc-shaped groove 200 is provided with an insulating block 220, the roughened metal layer 211 is connected to the insulating block 220, the bottom surface of the insulating block 220 is higher than the pin 300, a plurality of pins 300 are arranged on the side of the plate body 100 away from the conductive sheet 130, the side of the plate body 100 facing the pin 300 is provided with a Mark point 310, the side of the insulating block 220 close to the conductive sheet 130 is provided with an ink layer 500, the ink layer 500 is connected to part of the conductive sheet 130 corresponding to the insulating block 220 and part of the plate body 100. Preferably, the arc-shaped groove 200 is formed by cutting a through hole, which is a quarter through hole, a plurality of arc-shaped grooves 200 are arranged at the four corners of the plate body 100, a plurality of third grooves are arranged on the surface of the roughened metal layer 211 to form a certain roughness, the material of the insulating block 220 is resin, please refer to Figure 5 and Figure 7 The positions of the pin 300, the Mark point 310 and a plurality of ink layers 500, the ink layer 500 corresponds to the position of the arc-shaped groove 200 and is arranged at the four corners of the plate body 100, it can be understood that the bonding force between the metal with a certain roughness and the heterogeneous resin is stronger, which greatly improves the air tightness of the Mini LED lamp bead structure, the ink layer 500 plays an insulating and isolating role, which is beneficial to further improve the reliability and service life of the lamp bead prepared by the Mini LED lamp bead structure.

[0034] Another embodiment of the utility model provides a lamp bead, the lamp bead comprises the Mini LED lamp bead structure of the above-mentioned embodiment.

[0035] Another embodiment of the utility model provides a device, the device comprises the lamp bead of the above-mentioned embodiment.

[0036] In the description of the specification, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the utility model. In the specification, the illustrative description of the above terms does not necessarily mean the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0037] The above-described embodiments only express several implementation manners of the utility model, the description is more specific and detailed, but it cannot be understood as the limitation of the utility model patent scope. It should be pointed out that for ordinary skilled person in the art, without departing from the concept of the utility model, a number of modifications and improvements can be made, which belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent should be subject to the appended claims.

Claims

1. A Mini LED lamp bead structure, characterized in that, The application relates to a Mini LED lamp bead structure, which comprises a plate body, a plurality of die bonding pieces and a plurality of conductive pieces, one side of the plate body is connected with the plurality of die bonding pieces and the plurality of conductive pieces, the die bonding piece is provided with a plurality of first grooves on one side thereof facing the plate body and one side thereof facing away from the plate body, the first grooves extend from one side wall of the die bonding piece to the opposite side wall, the die bonding piece is used for connecting a chip, the die bonding piece is connected with a conductive strip, one end of the conductive strip facing away from the die bonding piece is connected with the conductive piece, the conductive strip is provided with a plurality of second grooves on one side thereof facing away from the plate body, the second grooves extend from one side wall of the conductive strip to the opposite side wall, a plurality of arc-shaped grooves are formed in the side wall of the plate body, a metal layer is arranged on the side wall of the arc-shaped grooves, the conductive piece is in position correspondence with the arc-shaped grooves and is connected with the metal layer, one end of the metal layer facing away from the conductive piece is connected with a pin, the plurality of pins are arranged on one side of the plate body facing away from the conductive piece, a roughened metal layer is arranged on one side of the metal layer facing away from the plate body, an insulating block is arranged in the arc-shaped groove, and the roughened metal layer is connected with the insulating block.

2. The Mini LED lamp bead structure according to claim 1, wherein, The plurality of first grooves are parallel to each other, the plurality of second grooves are parallel to each other, and the first grooves are perpendicular to the second grooves.

3. The Mini LED lamp bead structure according to claim 1, wherein, One side of the die bonding piece facing away from the plate body is connected with a glue body, part of the glue body is arranged in the first groove, and the glue body is connected with the chip.

4. The Mini LED lamp bead structure according to claim 1, wherein, One side of the roughened metal layer facing away from the metal layer is provided with a plurality of third grooves.

5. The Mini LED lamp bead structure according to claim 1, wherein, The bottom surface of the insulating block is higher than the pin.

6. The Mini LED lamp bead structure according to claim 1, wherein, A plurality of bonding wires are arranged on the chip, and one end of the bonding wire away from the chip is connected with the conductive piece.

7. The Mini LED lamp bead structure according to claim 1, wherein, One side of the insulating block close to the conductive piece is provided with an ink layer, the ink layer is connected with part of the conductive piece corresponding to the insulating block and part of the plate body.

8. The Mini LED lamp bead structure according to claim 1, wherein, One side of the plate body facing the pin is provided with a Mark point.

9. A lamp bead, characterized by The application further relates to a lamp bead comprising the Mini LED lamp bead structure.

10. An apparatus, comprising: The application further relates to a lamp bead comprising the lamp bead.

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