Power device and inverter device

Abstract

The utility model is suitable for the technical field of inverters, and provides a power device and an inverter device. The power device comprises a heat dissipation substrate, a plurality of first IGBT modules are arranged on the heat dissipation substrate, each first IGBT module is provided with a plurality of first heat pipes, and one first heat pipe is correspondingly arranged on one first IGBT module. In the power device provided by the embodiment of the utility model, only one first IGBT module is cooled by one first heat pipe. Thus, the number of heating sources on the single first heat pipe is reduced, heat is balanced, and the effect of improving the heat dissipation efficiency of the power device is achieved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to inverter technical field, especially, it relates to a kind of power device and inverter device. BACKGROUND

[0002] Inverter is a kind of power electronic equipment that converts direct current (DC) into alternating current (AC). Its main function is to convert the electrical energy from a DC power source (such as solar panels, batteries, etc.) into AC power for household appliances or power grid. Inverter has applications in many fields, especially in solar power generation system, uninterruptible power supply (UPS) and electric vehicle.

[0003] However, the power module of the inverter in the prior art is usually cooled by heat pipes. In the prior art, the heat pipes are evenly arranged on the substrate for simple layout, without considering the actual heat distribution of the heat pipes. Multiple IGBTs with serious heat emission use the same heat pipe, which leads to low heat dissipation efficiency of the power module of the inverter in the prior art. SUMMARY

[0004] The utility model provides a kind of power device and inverter device, to solve the technical problem that the power module of the inverter in the prior art leads to low heat dissipation efficiency.

[0005] The utility model embodiment is implemented as follows: the power device includes a heat dissipation substrate, a plurality of first IGBT modules are arranged on the heat dissipation substrate, a plurality of first heat pipes are arranged on each first IGBT module, and one first heat pipe is arranged on one first IGBT module.

[0006] Further, a plurality of second IGBT modules are arranged on the heat dissipation substrate, a plurality of second heat pipes are arranged on each second IGBT module, and one second heat pipe is arranged on a plurality of second IGBT modules;Wherein, the interval between adjacent two first IGBT modules is smaller than the interval between adjacent two second IGBT modules.

[0007] Further, a first temperature measuring module is arranged on the first heat pipe.

[0008] Further, a second temperature measuring module is arranged on the second heat pipe.

[0009] Further, the heat dissipation substrate has a first edge, and a third temperature measuring module is arranged on the first heat pipe closest to the first edge.

[0010] Further, the power device further includes a temperature display module, and the temperature display module is electrically connected to the third temperature measuring module.

[0011] Further, at least one end of the first heat pipe is curved.

[0012] Further, the distance between two adjacent first heat pipes on one first IGBT module is 1.5-3.5 cm.

[0013] Further, the distance between two adjacent second heat pipes is 30-50 cm.

[0014] The utility model embodiment further provides an inverter device, the inverter device includes the power device as described above.

[0015] The utility model embodiment provides a power device and inverter device. The power device includes a heat dissipation substrate, a plurality of first IGBT modules are arranged on the heat dissipation substrate, a plurality of first heat pipes are arranged on each first IGBT module, and one first heat pipe is arranged on one first IGBT module. In the power device of the utility model embodiment, one first heat pipe only dissipates heat for one first IGBT module. In this way, the heat source on a single first heat pipe is reduced, heat is balanced, and the effect of improving the heat dissipation efficiency of the power device is achieved. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 is the module structure schematic view of the inverter device provided by the utility model embodiment;

[0017] Figure 2 is the structure schematic view of the prior art inverter;

[0018] Figure 3 is a structure schematic view of the power device provided by the utility model embodiment;

[0019] Figure 4 is another structure schematic view of the power device provided by the utility model embodiment;

[0020] Figure 5 is still another structure schematic view of the power device provided by the utility model embodiment;

[0021] Figure 6 is the module schematic view of the temperature display module of the power device in the utility model embodiment.

[0022] Main element symbol explanation: 1000, inverter device;100, power device;10, heat dissipation substrate;11, first edge;20, first IGBT module;30, first heat pipe;40, second IGBT module;50, second heat pipe;61, first temperature measurement module;62, second temperature measurement module;63, third temperature measurement module;80, temperature display module. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical scheme and advantages of the utility model clearer and more understandable, the utility model will be further described in detail below in combination with the drawings and examples. It should be understood that the specific examples described herein are only used to explain the utility model and not to limit the utility model.

[0024] Please refer to Figure 1 The inverter device 1000 in the embodiment of the utility model can include the power device 100 in the embodiment of the utility model, and the inverter device 1000 can be used for power conversion. The inverter device 1000 is specifically applied to power electronic equipment, household appliances, renewable energy equipment, power management equipment, industrial equipment, industrial equipment, smart grid equipment and other electronic equipment.

[0025] As Figure 2 shown, for the heat dissipation layout of the inverter power module in the prior art, the heat dissipation strips are arranged transversely, and the heat dissipation strips are evenly arranged on the substrate for simple layout, without considering the actual heat dissipation condition for heat pipe distribution. Multiple serious heat generating IGBTs use the same heat dissipation strip, which leads to the reduction of the heat dissipation efficiency of the power module in the prior art, and the temperature will affect each other, and the power module of the inverter has low heat dissipation efficiency.

[0026] Please refer to Figure 3 The power device 100 in the embodiment of the utility model includes a heat dissipation substrate 10, which is the bottom part of the entire structure. A plurality of working elements can be arranged on the heat dissipation substrate 10, and the heat dissipation substrate 10 can provide heat dissipation support for the plurality of working elements. Optionally, the heat dissipation substrate 10 can be made of high thermal conductivity material, such as copper or aluminum, for effectively dissipating the heat generated by the working elements.

[0027] A plurality of first IGBT modules 20 are arranged on the heat dissipation substrate 10, and each first IGBT module 20 is a working element arranged on the heat dissipation substrate 10. Each first IGBT module 20 will generate a large amount of heat when working. A plurality of first heat pipes 30 are arranged on each first IGBT module 20, and one first heat pipe 30 is arranged on one first IGBT module 20. Each IGBT module has a corresponding heat pipe, and the heat pipe is a device that uses liquid evaporation and condensation to conduct heat, which is usually used for efficient heat dissipation. The first heat pipe 30 arranged on the first IGBT module 20 can dissipate the heat generated by the first IGBT module 20 when working.

[0028] Specifically, in the embodiment of the utility model, each first IGBT module 20 is arranged in turn along the width direction of the heat dissipation substrate 10, and each first IGBT module 20 also extends along the length direction of the heat dissipation substrate 10. A plurality of first heat pipes 30 are arranged on each first IGBT module 20. Moreover, unlike the heat pipe in the prior art which is arranged on a plurality of IGBT modules, that is, a plurality of IGBT modules share one heat pipe, in the embodiment of the utility model, one first heat pipe 30 is arranged on one first IGBT module 20, that is, each first heat pipe 30 corresponds to only one first heat pipe 30. Each first heat pipe 30 is arranged along the width direction of the first IGBT module 20 and extends along the length direction of the first IGBT module 20.

[0029] Therefore, by arranging a plurality of first heat pipes 30 on each first IGBT module 20, one first heat pipe 30 is arranged on one first IGBT module 20. In the power device 100 of the embodiment of the utility model, that is, the arrangement mode of the heat pipe and the IGBT module is changed, and one first heat pipe 30 only dissipates heat for one first IGBT module 20. In this way, the heat sources on a single first heat pipe 30 are reduced, the heat is balanced, and the effect of improving the heat dissipation efficiency of the power device 100 is achieved. Moreover, uniform heat dissipation not only reduces the temperature fluctuation of each first IGBT module 20, but also improves the reliability and service life of the power device 100, and improves the heat dissipation efficiency of the power device 100. In addition, this heat pipe arrangement mode can also achieve the flexibility of the layout of the power device 100, so that the heat dissipation scheme can be optimized according to the specific application requirements, and at the same time, the dependence on the active cooling system can be reduced, and the effect of simplifying the overall design is achieved.

[0030] Through tests, compared with the traditional heat pipe arrangement mode, the layout of the first heat pipe 30 in the utility model can reduce the temperature of a single first heat pipe 30 by 5 to 10 degrees, thereby greatly improving the heat dissipation efficiency of the power device 100.

[0031] Optionally, on one first IGBT module 20, the spacing between two adjacent first heat pipes 30 is 1.5 cm to 3.5 cm. In this way, by such spacing design, it is ensured that there is enough space for heat conduction and dissipation between the two adjacent first heat pipes 30, thereby avoiding heat accumulation. Reasonable spacing not only helps to improve the overall heat dissipation efficiency, but also ensures the working stability of the heat pipe, and further achieves the effect of enhancing the reliability of the IGBT module and the operation safety of the system. Preferably, the spacing between two adjacent first heat pipes 30 can be 2 cm, 2.7 cm.

[0032] Further, for the first heat pipe 30, in a possible implementation, at least one end of the first heat pipe 30 is curved. The at least one end of the first heat pipe 30 is designed to be curved, which helps to optimize the layout of the heat dissipation path and the space utilization. By bending one end of the first heat pipe 30, the installation requirements between the first IGBT module 20 and the heat dissipation substrate 10 can be more flexibly adapted, so that the heat pipe can better contact the heat dissipation component, increase the distance of heat diffusion of the first heat pipe 30, and thus improve the heat conduction efficiency. At the same time, the design of the curved end of the first heat pipe 30 can reduce the space conflict of the heat pipe with other elements, avoid interference in the installation process, and improve the overall heat dissipation performance and compactness of the power device 100. Such a design can not only ensure the effective heat dissipation of the first heat pipe 30, but also enhance the flexibility of the internal space of the power device 100.

[0033] Further, for the IGBT modules on the heat dissipation substrate 10, in a possible implementation, a plurality of second IGBT modules 40 are arranged on the heat dissipation substrate 10, and each second IGBT module 40 is provided with a plurality of second heat pipes 50, and one second heat pipe 50 is arranged on each of the plurality of second IGBT modules 40. Among them, the interval between two adjacent first IGBT modules 20 is less than the interval between two adjacent second IGBT modules 40.

[0034] Specifically, the heat dissipation substrate 10 is further provided with second IGBT modules 40 in addition to the first IGBT modules 20, and the interval between two adjacent first IGBT modules 20 is less than the interval between two adjacent second IGBT modules 40. Each second heat pipe 50 is arranged along the length direction of the second IGBT module 40 and extends along the width direction of the second IGBT module 40. That is, one second heat pipe 50 can be shared by a plurality of second IGBT modules 40 for heat dissipation.

[0035] Optionally, the interval between two adjacent second heat pipes 50 is 30-50 cm. In this way, through such an interval design, it is ensured that there is enough space between two adjacent second heat pipes 50 for heat conduction and dissipation, so as to avoid heat accumulation. Reasonable interval not only helps to improve the overall heat dissipation efficiency, but also ensures the working stability of the heat pipe, further achieving the effect of enhancing the reliability of the IGBT module and the operation safety of the system. Preferably, the interval between two adjacent second heat pipes 50 can be 45 cm or 47.8 cm.

[0036] For the second IGBT modules 40, because the distance between two adjacent second IGBT modules 40 is relatively large, one second heat pipe 50 can be provided on multiple second IGBT modules 40. The large distance between two adjacent second IGBT modules 40 allows for more flexible heat dissipation design. Providing one second heat pipe 50 to simultaneously cover multiple second IGBT modules 40 for heat dissipation can reduce the number of heat pipes, thereby optimizing the efficiency of heat dissipation resource utilization for the power device 100. For the second IGBT modules 40, because the distance between two adjacent second IGBT modules 40 is relatively large, one second heat pipe 50 can effectively disperse and conduct heat from multiple IGBT modules, thereby reducing the number of heat pipes required in the power device 100, simplifying the heat dissipation design, and reducing costs. While ensuring heat dissipation performance, it also improves the integration of heat dissipation for the entire power device 100.

[0037] Specifically, the distance between two adjacent first IGBT modules 20 is 10 cm to 20 cm, preferably 16 cm or 18 cm; the distance between two adjacent second IGBT modules 40 is 80 cm to 100 cm, preferably 85 cm or 95 cm.

[0038] Furthermore, the first IGBT module 20 and the second IGBT module 40 may be the same IGBT module, and the first heat pipe 30 and the second heat pipe 50 may be the same heat pipe.

[0039] In addition, regarding the arrangement of the second heat pipe 50 , in other embodiments, one second heat pipe 50 may be correspondingly arranged on one second IGBT module 40 , and the user may make a selection based on actual conditions.

[0040] Furthermore, if Figure 4 As shown, the temperature of each heat pipe can also be detected. In one possible embodiment, a first temperature measuring module 61 is provided in the first heat pipe 30. Specifically, the first temperature measuring module 61 can be composed of a temperature measuring element (the temperature measuring element can be a thermistor, a thermometer, a temperature sensor, etc.) and its external circuit. In this way, the temperature of each first heat pipe 30 can be monitored, and it can be determined whether the inverter power needs to be characterized, thereby achieving a multiple protection effect. In other embodiments, the first temperature measuring module 61 can be electrically connected to the controller of the inverter device 1000, so that the temperature data of each first heat pipe 30 can be transmitted to the controller of the inverter device 1000, and it can be determined whether the inverter device 1000 needs to adjust the power.

[0041] Further, in one possible implementation, the second heat pipe 50 is provided with a second temperature measuring module 62. Specifically, the second temperature measuring module 62 can be composed of a temperature measuring element (which can be a thermistor, a thermometer, a temperature sensor, etc.) and its external circuit. Thus, the temperature of each second heat pipe 50 can be monitored, and it can be determined whether the power of the inverter needs to be adjusted, achieving the effect of multiple safeguards. In other embodiments, the second temperature measuring module 62 can be electrically connected to the controller of the inverter device 1000, so that the temperature data of each second heat pipe 50 can be transmitted to the controller of the inverter device 1000, and it can be determined whether the power of the inverter device 1000 needs to be adjusted.

[0042] As shown in Figure 5 Further, the heat dissipation substrate 10 has a first edge 11, and the first heat pipe 30 closest to the first edge 11 is provided with a third temperature measuring module 63. Specifically, through experimental testing, for each heat pipe (the first heat pipe 30 and the second heat pipe 50) on the heat dissipation substrate 10, the heat pipe closest to the first edge 11 has the highest temperature point of the power device 100, i.e., the first heat pipe 30 closest to the first edge 11 has the highest temperature point of the power device 100, and the first heat pipe 30 closest to the first edge 11 bears the highest temperature of the power device 100.

[0043] Therefore, for each heat pipe of the power device 100, by providing the third temperature measuring module 63 on the first heat pipe 30 closest to the first edge 11, only one temperature measuring module needs to be provided on the first heat pipe 30 closest to the first edge 11 to effectively monitor the temperature change of the entire power device 100. This design simplifies the arrangement of the power device 100, not only reduces the number and cost of temperature measuring modules, but also accurately obtains the highest temperature point data of the power device 100, ensuring the effective monitoring and safe operation of the power device 100. Similarly, the third temperature measuring module 63 can be composed of a temperature measuring element (which can be a thermistor, a thermometer, a temperature sensor, etc.) and its external circuit. The first temperature measuring module 61, the second temperature measuring module 62, and the third temperature measuring module 63 can specifically be temperature measuring modules of the same structure.

[0044] Further, as shown in Figure 5 and Figure 6As shown, in a possible implementation, the power device 100 further comprises a temperature display module 80, which is electrically connected with the third temperature measurement module 63. Specifically, the highest temperature of the power device 100 can be visualized. In the embodiment of the present application, by setting the temperature display module 80 to be electrically connected with the third temperature measurement module 63, the third temperature measurement module 63 can send the temperature information of the first heat pipe 30 closest to the first edge 11 to the temperature display module 80, the temperature display module 80 receives and processes the data, and converts it into intuitive temperature display, so that the user can monitor the temperature change of the power device 100. This visual temperature monitoring method facilitates the user to find temperature abnormalities in time, and then take necessary adjustment or maintenance measures, to ensure the safe operation of the power device 100 and improve the reliability of the system. Specifically, the temperature display module 80 can specifically include a display screen, and the temperature display module 80 can be arranged on the inverter device 1000, or can be separated from the inverter device 1000 and arranged independently of the inverter device 1000.

[0045] In the description of the present specification, the description referring to the terms "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" etc. means that the specific features, structures, materials or characteristics described in connection with the embodiments or examples are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0046] In addition, the above is only a preferred embodiment of the present application, and is not used to limit the present application, and any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A power device, characterized by, The heat dissipation substrate is provided with a plurality of first IGBT modules, each of which is provided with a plurality of first heat pipes, and one first heat pipe is arranged on one first IGBT module.

2. The power device of claim 1, wherein, A plurality of second IGBT modules are arranged on the heat dissipation substrate, each of which is provided with a plurality of second heat pipes, and one second heat pipe is arranged on a plurality of second IGBT modules. The interval between two adjacent first IGBT modules is smaller than the interval between two adjacent second IGBT modules.

3. The power device according to claim 1 or 2, characterized in that, A first temperature measuring module is arranged on the first heat pipe.

4. The power device of claim 2, wherein, A second temperature measuring module is arranged on the second heat pipe.

5. The power device according to claim 1 or 2, characterized by The heat dissipation substrate has a first edge, and a third temperature measuring module is arranged on the first heat pipe closest to the first edge.

6. The power device of claim 5, wherein, A temperature display module is further included and electrically connected with the third temperature measuring module.

7. The power device of claim 1, wherein, At least one end of the first heat pipe is curved.

8. The power device of claim 1, wherein, The interval between two adjacent first heat pipes on one first IGBT module is 1.5-3.5 cm.

9. The power device of claim 2, wherein, The interval between two adjacent second heat pipes is 30-50 cm.

10. An inverter device characterized by comprising: The inverter device comprises the power device according to any one of claims 1-9.

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