Power semiconductor module and motor controller

Abstract

The utility model belongs to the technical field of power semiconductors, and particularly relates to a power semiconductor module and a motor controller, which comprise a substrate, a lining plate and a packaging shell, the lining plate is provided with an inversion unit and a rectification unit, and one end of the lining plate used for connecting a direct current terminal is provided with a positive terminal connection area and a negative terminal connection area. The inversion unit and the rectification unit share a positive terminal connection area and a negative terminal connection area, one end, used for being connected with an alternating current terminal, of the lining plate is provided with two independent alternating current terminal connection areas, the inversion unit is connected with one alternating current terminal connection area, and the rectification unit is connected with the other alternating current terminal connection area. On the basis of realizing inversion and rectification functions, a packaging structure and a heat dissipation structure required by the inversion and rectification function unit are simplified, the total volume after packaging is reduced, the utilization rate and the power density are improved, miniaturization and light weight of the motor controller are facilitated, and the cost is reduced. And the smaller outer envelope size requirement and the larger power density requirement on the motor controller at present can be better met.

Description

Technical Field

[0001] The utility model belongs to the technical field of power semiconductors, and in particular relates to a power semiconductor module and a motor controller. Background Art

[0002] In new energy passenger vehicles, hybrid motor controllers require an inverter unit to convert the battery and capacitor DC power into AC power to drive the motor, and a separate rectifier unit to convert the generator's AC power into DC power to charge the onboard battery. Conventional motor controllers require one or more power modules, each packaged independently and with a corresponding cooling system designed independently. Multiple power modules and their associated structural components require a large installation space within the motor controller and increase the complexity of the internal structure, hindering miniaturization and lightweighting. This makes it difficult to meet current requirements for smaller external envelope dimensions and higher power density. Utility Model Content

[0003] The technical problem to be solved by the present invention is to provide a power semiconductor module and a motor controller, which aims to simplify the packaging structure and heat dissipation structure required for the inverter and rectifier functional units on the basis of realizing the inverter and rectifier functions, reduce the total volume after packaging, improve the utilization rate and power density, and facilitate the miniaturization and lightweighting of the motor controller, so as to better meet the current requirements for smaller outer envelope size and greater power density of the motor controller.

[0004] The present utility model provides a power semiconductor module, comprising a substrate, a lining plate and a packaging shell, wherein the packaging shell is fixed to the substrate, the lining plate is arranged on the substrate and located inside the packaging shell, an inverter unit and a rectifier unit are arranged on the lining plate, one end of the lining plate for connecting to a DC terminal is provided with a positive terminal connection area and a negative terminal connection area, the inverter unit and the rectifier unit share the positive terminal connection area and the negative terminal connection area, and one end of the lining plate for connecting to an AC terminal is provided with two independent AC terminal connection areas, the inverter unit is connected to one of the AC terminal connection areas, and the rectifier unit is connected to the other AC terminal connection area.

[0005] Furthermore, the inverter unit and the rectifier unit are adjacently arranged on the lining along the direction in which the two AC terminal connection areas are arranged, two positive terminal connection areas are provided, the negative terminal connection area is located between the two positive terminal connection areas, and the two positive terminal connection areas are connected.

[0006] Furthermore, three DC terminals are provided on one side of the packaging shell corresponding to a single liner, and two AC terminals are provided on the other side corresponding to a single liner. The three DC terminals are connected to the negative terminal connection area and the two positive terminal connection areas on the single liner, and the two AC terminals are connected to the two AC terminal connection areas on the single liner, and the three DC terminals and the two AC terminals extend to the outside of the packaging shell at one end away from the liner.

[0007] Furthermore, the inverter unit and the rectifier unit each include two commutation units connected in series, and a single commutation unit is at least one group of anti-parallel IGBT and diode chips, or any one of an RC chip and a MOS tube with a body diode.

[0008] Furthermore, the lining plate is provided with auxiliary terminals corresponding to the respective commutation units, and the auxiliary terminals are provided through the packaging shell.

[0009] Furthermore, there are three lining boards, the inverter units on the three lining boards form a three-phase inverse conversion circuit, the rectifier units on the three lining boards form a three-phase rectifier commutation circuit, and the three lining boards are arranged on the same substrate and located inside the same packaging shell.

[0010] Furthermore, the packaging shell includes a tube shell and a cover plate, the tube shell is fixed to the substrate, two reinforcing beams are arranged inside the tube shell at intervals, the edge of the tube shell and the two reinforcing beams correspond to enclose three installation areas, the three lining plates are correspondingly located in the three installation areas, and the cover plate is arranged on the top of the tube shell and covers the three installation areas at the same time.

[0011] Furthermore, four mounting holes for connecting to the cooling unit are equidistantly provided on both long sides of the substrate, and the side surface of the tube shell is concavely provided facing the locations of the mounting holes to form an installation avoidance area.

[0012] Furthermore, heat dissipation pin fins are provided on a side of the substrate facing away from the lining plate.

[0013] The present invention further provides a motor controller, which is characterized in that it is provided with the power semiconductor module as described above.

[0014] The utility model discloses a beneficial effect is, inverter unit and rectification unit are integrated in same power semiconductor module, and inverter unit and rectification unit can be through same baseplate heat dissipation and through same package shell package, and heat dissipation, insulation, mechanical protection etc. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is the exploded view schematic diagram of the utility model power semiconductor module.

[0016] Figure 2 It is the structure schematic diagram of the utility model lining plate.

[0017] Figure 3 It is the structure schematic diagram of the utility model lining plate and has connected the direct current terminal and alternating current terminal.

[0018] Figure 4 It is the structure schematic diagram of the utility model pipe shell.

[0019] Figure 5 It is the structure schematic diagram of the utility model power semiconductor module and removes the cover plate.

[0020] Figure 6 It is the circuit topology diagram of the utility model power semiconductor module.

[0021] In the drawing: 1, baseplate;11, mounting hole;2, lining plate;21, IGBT;22, diode chip;23, positive terminal connection area;24, negative terminal connection area;25, alternating current terminal connection area;26, auxiliary terminal;201, inverter unit;202, rectification unit;3, pipe shell;31, reinforcing beam;4, cover plate;5, direct current terminal;6, alternating current terminal. DETAILED DESCRIPTION

[0022] As Figures 1-6The utility model provides a kind of power semiconductor module, the power semiconductor module includes substrate 1, backing plate 2 and package shell.The package shell is fixed with substrate 1, the backing plate 2 is arranged on substrate 1 and is located inside package shell.Copper is covered on the upper and lower surfaces of backing plate 2, for circuit interconnection, the copper area of backing plate 2 can be bare copper, or gold, nickel, silver and other plating layers are arranged on copper surface.And backing plate 2 is provided with corresponding ceramic insulating layer.The backing plate 2 and substrate 1 can be welded, or sintered or transient liquid phase diffusion welding.

[0023] The backing plate 2 is provided with inverter unit 201 and rectifier unit 202, one end of the backing plate 2 for connecting direct current terminal 5 is provided with positive terminal connecting area 23 and negative terminal connecting area 24, the inverter unit 201 and rectifier unit 202 are connected with the positive terminal connecting area 23 and negative terminal connecting area 24, that is, the inverter unit 201 and rectifier unit 202 share the positive terminal connecting area 23 and negative terminal connecting area 24.One end of the backing plate 2 for connecting alternating current terminal 6 is provided with two independent alternating current terminal connecting areas 25, the inverter unit 201 is connected with one of the alternating current terminal connecting areas 25, and the rectifier unit 202 is connected with the other alternating current terminal connecting area 25, that is, one end of the backing plate 2 for connecting alternating current terminal 6 is partitioned and set, respectively corresponding to connecting inverter unit 201 and rectifier unit 202.

[0024] The power semiconductor module provided by the utility model simultaneously sets inverter unit 201 and rectifier unit 202 on the same backing plate 2, so that the inverter unit 201 and rectifier unit 202 are integrated in the same power semiconductor module, the inverter unit 201 and rectifier unit 202 can be cooled through the same substrate 1 and packaged through the same package shell, and the components for cooling, insulation and mechanical protection are shared, and the direct current input ends of the inverter unit 201 and rectifier unit 202 are shared, so that the width of the copper area required to be set on the end of the backing plate 2 can be reduced, thereby reducing the size of the backing plate 2 and further reducing the overall volume of the power semiconductor module, realizing the partition of the alternating current terminal 6 side of the inverter unit 201 and rectifier unit 202 core function on the backing plate 2, independent output and realizing the respective functions.Based on the foregoing setting, on the basis of realizing the inverter and rectifier functions, the packaging structure and cooling structure required by the inverter and rectifier function units are simplified, the overall volume after packaging is reduced, the packaging cost is reduced, the utilization rate and power density are improved, the installation space required in the motor controller is reduced, which is beneficial to the miniaturization and light weight of the motor controller, and can better meet the smaller envelope size requirement and larger power density requirement of the motor controller.

[0025] The arrangement direction of the two alternating current terminal connecting areas 25 on the backing plate 2 is as follows Figure 2The lateral direction under the perspective view is the length direction of the side edge of the two AC terminal connection areas 25 provided with one end of the backing plate 2. In the utility model, the inverter unit 201 and the rectifier unit 202 are arranged adjacent to each other in the direction along which the two AC terminal connection areas 25 are arranged on the backing plate 2, that is, in the direction along which the two AC terminal connection areas 25 are arranged on the backing plate 2. Figure 2 The lateral direction under the perspective view is adjacent. The positive terminal connection area 23 is provided with two, the negative terminal connection area 24 is located between the two positive terminal connection areas 23, and the two positive terminal connection areas 23 are connected, so that the two positive terminal connection areas 23 are connected to form a C-shaped area, and the negative terminal connection area 24 is located in the C-shaped area. Based on the foregoing arrangement, on the basis of sharing the positive terminal connection area 23 and the negative terminal connection area 24, the current path of the inverter unit 201 and the rectifier unit 202 is shorter, and the integrated inductance of the backing plate 2 can be reduced.

[0026] In the utility model, as shown in Figure 4 The DC terminal 5 and the AC terminal 6 are arranged on the packaging shell, one side of the packaging shell is provided with three DC terminals 5 corresponding to a single backing plate 2, the other side is provided with two AC terminals 6 corresponding to a single backing plate 2, as shown in Figure 3 The three DC terminals 5 are connected to the negative terminal connection area 24 and the two positive terminal connection areas 23 on the single backing plate 2, and the two AC terminals 6 are connected to the two AC terminal connection areas 25 on the single backing plate 2. The connection mode can be through ultrasonic bonding. The three DC terminals 5 and the two AC terminals 6 extend to the outside of the packaging shell from one end away from the backing plate 2, and are used for connecting with external electronic elements. Among them, the DC terminal 5 connected with the negative terminal connection area 24 is the DC negative terminal, that is, the N terminal, and the DC terminal 5 connected with the positive terminal connection area 23 is the DC positive terminal, that is, the P terminal.

[0027] The inverter unit 201 and the rectifier unit 202 each include two series-connected commutation units, that is, four commutation units are provided on a single backing plate 2, and these commutation units realize corresponding functions through different internal circuit connection modes according to use requirements. In an embodiment of the utility model, as shown in Figure 2 And Figure 3As shown, the single converter unit is at least one group of anti-parallel IGBT 21 and diode chip 22, that is, the single converter unit can be a group of anti-parallel IGBT 21 and diode chip 22, or two or more groups of anti-parallel IGBT 21 and diode chip 22, which can be determined according to actual needs, and the diode chip 22 is FRD or other chip. Each two series converter units, the bottom electrode of IGBT 21 and diode chip 22 is welded or sintered on the backing plate 2, and the top electrode is interconnected with the backing plate 2 through bonding wire or metal sheet, forming a half-bridge circuit. In other embodiments of the utility model, the converter unit can also be an RC chip, or a MOS tube with body diode.

[0028] The backing plate 2 is provided with an auxiliary terminal 26 corresponding to each converter unit in the corresponding copper-clad area, which is a C / G / E auxiliary terminal and can be soldered or ultrasonic welded on the backing plate 2. The auxiliary terminal 26 is provided through the packaging shell and is used to connect with external control elements to realize corresponding control functions.

[0029] In the utility model, the backing plate 2 has three, the three backing plates 2 have the same structure, and the inverter units 201 on the three backing plates 2 form a three-phase inverter conversion circuit, and the rectifier units 202 on the three backing plates 2 form a three-phase rectifier conversion circuit, and the three backing plates 2 are arranged on the same substrate 1 and located inside the same packaging shell, so as to realize three-phase rectification and inversion functions on the same power semiconductor module, reduce packaging cost, and improve utilization and power density.

[0030] As shown in Figure 4 and Figure 5 As shown, the packaging shell is provided with three DC terminals 5 and two AC terminals 6 corresponding to each backing plate 2, and when the backing plate 2 is three, the DC terminals 5 provided on the packaging shell are a total of 9, and the AC terminals 6 are a total of 6. Taking a group of anti-parallel IGBT 21 and diode chip 22 as an example, the circuit topology of the power semiconductor module with three backing plates 2 is as shown in Figure 6 .

[0031] Figure 6The middle: P is the positive electrode, and N is the negative electrode; S1-S12 are all commutation units, two of which are a group and are connected in series to form a corresponding functional unit; specifically, H1, H2, and H3 are the rectification units 202 on the three backing plates 2, S1 and S2, S3 and S4, and S5 and S6 correspond to two commutation units connected in series in the aforementioned three rectification units 202, and the aforementioned three rectification units 202 (H1, H2, and H3) form a three-phase rectification commutation loop; H4, H5, and H6 are the inversion units 201 on the three backing plates 2, S7 and S8, S9 and S10, and S11 and S12 correspond to two commutation units connected in series in the aforementioned three inversion units 201, and the aforementioned three inversion units 201 (H4, H5, and H6) form a three-phase rectification commutation loop.

[0032] The packaging shell includes a tube shell 3 and a cover plate 4, the tube shell 3 is fixed with the substrate 1, two reinforcing beams 31 are arranged inside the tube shell 3 at intervals, the strength of the tube shell 3 can be strengthened, and the edges of the tube shell 3 and the two reinforcing beams 31 correspond to enclose three mounting areas to form three mounting spaces for the three backing plates 2, the three backing plates 2 correspond to be located in the three mounting areas, the cover plate 4 is arranged on the top of the tube shell 3 and covers the three mounting areas at the same time, the cover plate 4 and the tube shell 3 are connected by buckling or other ways, and combine the substrate 1 to form a relatively closed surrounding space outside the three backing plates 2, the surrounding space is filled with insulating materials such as silica gel or epoxy resin to realize electrical insulation between elements in the surrounding space.

[0033] The two long edges of the substrate 1 are both arranged at equal intervals with four mounting holes 11 for connecting with the cooling unit, the side surface of the tube shell 3 is concave at the positions where the mounting holes 11 are located to form a mounting avoiding area. To ensure that the mounting force can be evenly distributed around the edges of the substrate 1, the substrate 1 with a certain arc after welding is flattened and closely attached to the cooling unit, ensuring the installation stability and sealing performance.

[0034] The substrate 1 can be a metal substrate such as copper, aluminum alloy, AlSiC, etc., the heat generated by each chip on the backing plate 2 is conducted to the fluid in the cooling unit through the welding / sintering layer and the ceramic insulating layer. It is further preferred that the side of the substrate 1 away from the backing plate 2 is provided with heat dissipation fins to increase the heat dissipation effect, which can provide better heat dissipation efficiency for the power semiconductor module, increase the working current, and improve the power density.

[0035] The utility model also provides a motor controller, the motor controller is provided with above -mentioned power semiconductor module. Based on this power semiconductor module setting, on the basis of realizing inverter and rectification function, the packaging structure and heat dissipation structure required by inverter and rectification function unit are simplified, the packaging cost is reduced, the utilization ratio and power density are improved, the installation space required in the motor controller is reduced, the miniaturization and light weight of motor controller are beneficial, can better satisfy the smaller external envelope size requirement and the greater power density requirement of current motor controller.

[0036] Those skilled in the art should understand: the discussion of the above any embodiment is only exemplary, and is not intended to imply that the protection scope of the application is limited to these examples; under the idea of the application, the above embodiments or technical features in different embodiments can also be combined, the steps can be implemented in any order, and there are many other changes of different aspects of one or more embodiments in the application as described above, which are not provided in details for the sake of simplicity.

[0037] One or more embodiments in the application are intended to cover all such alternatives, modifications and variations falling within the broad scope of the application. Therefore, any omission, modification, equivalent replacement, improvement, etc. made in the spirit and principles of one or more embodiments in the application should be included in the protection scope of the application.

Claims

1. A power semiconductor module, characterized by, The application relates to a packaging structure of a power supply device, which comprises a substrate (1), a backing plate (2) and a packaging shell, the packaging shell is fixed with the substrate (1), the backing plate (2) is arranged on the substrate (1) and located inside the packaging shell, the backing plate (2) is provided with an inverter unit (201) and a rectifier unit (202), one end of the backing plate (2) used for connecting a direct-current terminal (5) is provided with a positive terminal connecting area (23) and a negative terminal connecting area (24), the positive terminal connecting area (23) and the negative terminal connecting area (24) are shared by the inverter unit (201) and the rectifier unit (202), one end of the backing plate (2) used for connecting an alternating-current terminal (6) is provided with two independent alternating-current terminal connecting areas (25), the inverter unit (201) is connected with one of the alternating-current terminal connecting areas (25), and the rectifier unit (202) is connected with the other alternating-current terminal connecting area (25).

2. The power semiconductor module according to claim 1, characterized in that The inverter unit (201) and the rectifier unit (202) are arranged adjacently along the direction in which the two alternating-current terminal connecting areas (25) are arranged on the backing plate (2), the positive terminal connecting area (23) is provided with two, and the negative terminal connecting area (24) is located between the two positive terminal connecting areas (23) and connected with the two positive terminal connecting areas (23).

3. The power semiconductor module according to claim 2, characterized in that One side of the packaging shell is provided with three direct-current terminals (5) corresponding to a single backing plate (2), the other side is provided with two alternating-current terminals (6) corresponding to a single backing plate (2), the three direct-current terminals (5) are connected with the negative terminal connecting area (24) and the two positive terminal connecting areas (23) on the single backing plate (2), the two alternating-current terminals (6) are connected with the two alternating-current terminal connecting areas (25) on the single backing plate (2), and one end of the three direct-current terminals (5) and the two alternating-current terminals (6) away from the backing plate (2) extends to the outside of the packaging shell.

4. The power semiconductor module according to any one of claims 1 to 3, characterized in that The inverter unit (201) and the rectifier unit (202) each comprise two series-connected commutation units, and each commutation unit is at least one group of anti-parallel IGBTs (21) and diode chips (22), or any one of RC chips, MOS tubes with body diodes.

5. The power semiconductor module according to claim 4, characterized in that The backing plate (2) is provided with auxiliary terminals (26) corresponding to the commutation units, and the auxiliary terminals (26) penetrate through the packaging shell.

6. The power semiconductor module according to any one of claims 1 to 3, 5, characterized in that, The backing plate (2) has three, the inverter units (201) on the three backing plates (2) form a three-phase inverter commutation loop, the rectifier units (202) on the three backing plates (2) form a three-phase rectifier commutation loop, and the three backing plates (2) are arranged on the same substrate (1) and located inside the same packaging shell.

7. The power semiconductor module according to claim 6, characterized in that The packaging shell comprises a tube shell (3) and a cover plate (4), the tube shell (3) is fixed with the substrate (1), two reinforcing beams (31) are arranged at intervals in the tube shell (3), the edges of the tube shell (3) are enclosed into three mounting areas corresponding to the two reinforcing beams (31), the three backing plates (2) are located in the three mounting areas, and the cover plate (4) is arranged on the top of the tube shell (3) and covers the three mounting areas.

8. The power semiconductor module according to claim 7, characterized in that Four mounting holes (11) for connecting with a cooling unit are equidistantly arranged on both long sides of the substrate (1), and the tubular shell (3) is concavely arranged at positions corresponding to the mounting holes (11), forming mounting avoiding areas.

9. The power semiconductor module according to any one of claims 1 to 3, 5, 7, 8, characterized in that The substrate (1) is provided with heat dissipation needle fins on a side away from the backing plate (2).

10. An electric motor controller characterized by, A power semiconductor module as claimed in any of claims 1 to 9 is provided.

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