Epoxy resin heating plate with high heat conduction efficiency
By coating the surface of the epoxy resin board with insulating solder resist ink and combining it with a stable connection structure between the connector and the lead, the problem of low thermal conductivity efficiency of the epoxy resin heating plate is solved, and faster heat transfer and stable electrical connection are achieved.
Patent Information
- Application Number
- CN202422679447.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-04
- Publication Date
- 2025-10-21
- Estimated Expiration
- 2034-11-04
AI Technical Summary
The existing epoxy resin heating plate has low thermal conductivity, which affects its performance in high temperature environments.
Insulating solder resist ink is applied on the surface of the epoxy resin board, and electrically connected to the leads through connectors. Combined with soldering and silicone encapsulation, the connection stability is enhanced, and a limiting structure is used to prevent the leads from detaching.
The thermal conductivity of the epoxy resin heating plate is improved, ensuring that heat is quickly transferred to the heated object, enhancing the connection stability between the lead and the plate, and preventing solder joint oxidation.
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Figure CN223463138U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to epoxy resin heating plate technical field, especially in high heat conduction efficiency's epoxy resin heating plate. BACKGROUND
[0002] Epoxy resin heating plate is a kind of heating equipment using epoxy resin material, its design makes it can work safely in high temperature environment, the epoxy resin heating plate of current adoption is that the same kind of material epoxy resin plate is selected in upper and lower two layers, and the thickness of two epoxy resin plates is same, heating wire is installed between upper and lower two layers of epoxy resin plate, electric heating wire is electrically connected with lead wire in mounting hole again, the other end of lead wire is installed connector again, to form epoxy resin heating plate.
[0003] The above device in the process of using, since using is that upper and lower two layers are installed with epoxy resin plate, because the thermal conductivity of epoxy resin plate itself is lower, in use, the heat conduction efficiency of epoxy resin heating plate to object is reduced, to reduce the heat conduction efficiency of epoxy resin heating plate in use, therefore, the present application provides a kind of epoxy resin heating plate to meet the demand of high heat conduction efficiency. UTILITY MODEL CONTENT
[0004] The technical problem to be solved by the utility model is to provide a kind of epoxy resin heating plate with high heat conduction efficiency to solve the problem of low heat conduction efficiency of epoxy resin heating plate in use.
[0005] To solve the above technical problems, the utility model provides the following technical scheme:
[0006] A kind of epoxy resin heating plate with high heat conduction efficiency, including epoxy resin plate, the top of the epoxy resin plate is equipped with heating wire, the surface of the heating wire and epoxy resin plate is coated with insulating solder resist ink, the surface of the epoxy resin plate is provided with a plurality of mounting holes, a plurality of the mounting holes are all connected with connecting piece, the connecting piece is electrically connected with heating wire, the inside of a plurality of the connecting piece is respectively soldered with lead wire one and lead wire two, the end of the lead wire one and lead wire two away from the epoxy resin plate is equipped with connector, the outside of the lead wire one and lead wire two is wrapped with heat shrink sleeve, the surface of the soldering point after soldering is coated with silicone layer.
[0007] Preferably, the connecting piece is rivet, the rivet is riveted in the mounting hole of epoxy resin plate, the lead wire one and lead wire two are inserted into corresponding rivet, the lead wire one and lead wire two are connected with rivet by soldering, the rivet is electrically connected with heating wire.
[0008] Preferably, the connecting piece is a card piece, the connecting piece comprises a circular ring, the top of the circular ring is fixedly connected with a plurality of arc-shaped plates, the outer walls of the plurality of arc-shaped plates are all fixedly connected with limiting blocks, the limiting blocks are arc-shaped, the bottoms of the limiting blocks are in surface contact with the top of the heating wire, the limiting blocks are electrically connected with the heating wire, the lead wire one and the lead wire two are tin soldered with the bottoms of the corresponding circular rings, the top of the circular ring is in surface contact with the bottom of the epoxy resin plate, and the plurality of arc-shaped plates movably penetrate the mounting holes of the epoxy resin plate.
[0009] Preferably, the inner walls of the plurality of arc-shaped plates are all provided with accommodating grooves, and the accommodating grooves are internally provided with elastic sheets.
[0010] Preferably, the inner walls of the plurality of arc-shaped plates are all fixedly connected with blocking strips, the blocking strips comprise upper convex portions and lower convex portions, the upper convex portions and the lower convex portions are arc-shaped, the end portions of the upper convex portions are in surface contact with the end portions of the upper convex portions of adjacent blocking strips, the end portions of the lower convex portions are in surface contact with the lower convex portions of adjacent blocking strips, and the upper convex portions and the lower convex portions of the adjacent two blocking strips are mutually stacked.
[0011] Preferably, the top of the arc-shaped plate is provided with a convex portion.
[0012] Preferably, the top of the limiting block is provided with an inclined portion.
[0013] Preferably, the inner wall of the circular ring is provided with an inclined surface one.
[0014] Preferably, the inner wall of the mounting hole of the epoxy resin plate is provided with an inclined surface two.
[0015] Compared with the prior art, the utility model has at least the following beneficial effects:
[0016] In the scheme, through the setting of the insulating solder resist ink, the heating wire is installed on the surface of the epoxy resin plate, and then the insulating solder resist ink is coated on the surface of the heating wire and the epoxy resin plate, in use, the surface coated with the insulating solder resist ink is in contact with the object, since the thickness of the insulating solder resist ink itself is thin, the heat conductivity to the object can be better improved, the heat conduction efficiency of the epoxy resin heating plate is improved, and the heat conduction efficiency of the epoxy resin heating plate to the object is improved, so that the heat energy can be converted faster, and the heat can be quickly transferred to the heated object.
[0017] Through the setting of the connecting piece, when the lead wire one and the lead wire two need to be inserted into the connecting piece, the connecting piece is first clamped in the mounting hole of the epoxy resin heating plate, then the lead wire one and the lead wire two are inserted into the connecting piece through the circular ring, then the inclined surface formed in the inner wall of the circular ring is used for tin soldering, and after the tin soldering is completed, the surface of the welding point is treated with point silicon glue for insulation packaging, so that the oxidation of the welding point in long-term use can be better prevented, thereby improving the pulling force between the lead wire one and the lead wire two and the epoxy resin plate, and the connection stability between the lead wire one and the lead wire two and the epoxy resin plate is better improved.
[0018] Through the setting of the blocking strip, when the lead wire one or the lead wire two is inserted into the connecting piece, the setting of the blocking strip can better limit the insertion depth of the lead wire one or the lead wire two, and the upper convex part and the lower convex part of the blocking strip are stacked with each other, so that the thickness of the blocking strip can be better increased, and the blocking strip is prevented from being excessively deformed due to excessive force in the process of insertion of the lead wire one or the lead wire two.
[0019] Through the setting of the elastic sheet, after the lead wire one or the lead wire two is inserted into the corresponding connecting piece, the outer wall of the elastic sheet is in abutment with the circumferential surface of the lead wire one or the lead wire two, so that the lead wire one or the lead wire two inserted into the arc-shaped plate can be better fixed, the lead wire one or the lead wire two is prevented from falling from the corresponding connecting piece in the process of tin soldering, and tin soldering can be more conveniently performed. BRIEF DESCRIPTION OF DRAWINGS
[0020] The accompanying drawings, which are incorporated herein and constitute part of the specification, illustrate embodiments of the present disclosure and, together with the description, further serve to explain the principles of the present disclosure and to enable a person skilled in the relevant art to implement and use the present disclosure.
[0021] Figure 1 It is a whole structure schematic view of the utility model;
[0022] Figure 2 It is a three-dimensional structure schematic view of the utility model for removing insulation solder resist ink;
[0023] Figure 3 It is Figure 2 It is an enlarged view of A in the middle;
[0024] Figure 4 It is a connector and heat shrink sleeve assembly structure schematic view;
[0025] Figure 5 It is Figure 4 It is an enlarged view of B in the middle;
[0026] Figure 6 It is a connecting piece three-dimensional structure schematic view.
[0027] [REFERENCE SIGNS]
[0028] 1, epoxy plate; 2, connecting piece; 21, circular ring; 22, arc plate; 23, limiting block; 3, lead wire one; 4, lead wire two; 5, connector; 6, heat shrink sleeve; 7, inclined surface one; 8, heating wire; 9, insulating solder resist ink; 10, accommodating groove; 11, elastic sheet; 12, blocking strip; 13, protruding part; 14, inclined part; 15, inclined surface two; 16, upper protruding part; 17, lower protruding part.
[0029] As shown in the drawings, in order to clearly realize the structure of the embodiments of the present application, specific structures and devices are marked in the drawings, but this is only for the need of illustration, and is not intended to limit the present application in the specific structure, device and environment, and the ordinary skilled in the art can adjust or modify these devices and environment according to specific needs, and the adjustment or modification still includes in the scope of the appended claims. DETAILED DESCRIPTION
[0030] The epoxy resin heating plate with high heat conduction efficiency provided by the present application is described in detail below in combination with the drawings and specific embodiments. It should be noted that in order to make the embodiments more detailed, the following embodiments are the best and preferred embodiments, and other alternative ways can also be used by those skilled in the art to implement some known technologies; and the drawings are only used to more specifically describe the embodiments, and are not intended to specifically limit the present application.
[0031] It should be noted that in the specification, "one embodiment", "embodiment", "exemplary embodiment", "some embodiments" and the like indicate that the described embodiments can include specific features, structures or characteristics, but not necessarily every embodiment includes the specific features, structures or characteristics. In addition, when a specific feature, structure or characteristic is described in combination with an embodiment, it should be within the knowledge of those skilled in the related art to realize this feature, structure or characteristic in combination with other embodiments (whether or not explicitly described).
[0032] Generally, the terms can be understood at least in part from the usage in context. For example, depending at least in part on the context, the term "one or more" as used herein can be used to describe any feature, structure, or characteristic in the singular or can be used to describe combinations of features, structures, or characteristics, in the plural, without necessarily dictating that the feature, structure, or characteristic restrictively includes only a single instance, or a certain number of instances. Moreover, the term "based on" can be understood as not necessarily a set of exclusive factors, but rather, can allow for existence of additional factors not explicitly described, as at least in part depending on the context.
[0033] As Figures 1-2As shown, the embodiment of the utility model provides a kind of epoxy resin heating plate of high heat conduction efficiency, including epoxy resin plate 1, the top of epoxy resin plate 1 is equipped with heating wire 8, heating wire 8 is used to heat object, the surface of heating wire 8 and epoxy resin plate 1 is coated with insulating solder resist ink 9, insulating solder resist ink 9 can better improve heat conduction efficiency, the surface of epoxy resin plate 1 is equipped with several mounting holes, mounting hole is located at the top right side of epoxy resin plate 1, several mounting holes are all connected with connecting piece 2, connecting piece 2 is electrically connected with heating wire 8, the inside of several connecting pieces 2 is respectively soldered with lead wire one 3 and lead wire two 4, the end of lead wire one 3 and lead wire two 4 away from epoxy resin plate 1 is equipped with connector 5, connector 5 is used to connect power supply, lead wire one 3 and lead wire two 4 are wrapped with heat shrink tube 6 outside, heat shrink tube 6 is used to protect lead wire one 3 and lead wire two 4, the surface of soldering point after soldering is daubed with silica gel layer, and silica gel layer is used to improve the connection stability between lead wire one 3 and lead wire two 4 and epoxy resin plate 1.
[0034] As Figure 1 Shown, connecting piece 2 is rivet, rivet is riveted in the mounting hole of epoxy resin plate 1, lead wire one 3 and lead wire two 4 are inserted in corresponding rivet, lead wire one 3 and lead wire two 4 are soldered with rivet, and rivet is electrically connected with heating wire 8;Rivet can better install lead wire one 3 and lead wire two 4.
[0035] As Figure 3 Shown, connecting piece 2 is card piece, and connecting piece 2 includes circular ring 21, the top of circular ring 21 is fixedly connected with several arc-shaped plates 22, the outer wall of several arc-shaped plates 22 is fixedly connected with limiting block 23, limiting block 23 is arc-shaped, the bottom of limiting block 23 is attached to the top of heating wire 8, limiting block 23 is electrically connected with heating wire 8, lead wire one 3 and lead wire two 4 are soldered with the bottom of corresponding circular ring 21, the top of circular ring 21 is attached to the bottom of epoxy resin plate 1, and several arc-shaped plates 22 are movably penetrated into the mounting hole of epoxy resin plate 1;By inserting connecting piece 2 into the mounting hole of epoxy resin plate 1, limiting block 23 can better fix connecting piece 2 in the mounting hole of epoxy resin plate 1, after the installation of connecting piece 2 is completed, lead wire one 3 or lead wire two 4 is inserted into corresponding connecting piece 2, and then lead wire one 3 or lead wire two 4 is soldered by the bottom of disc, to better install lead wire one 3 or lead wire two 4.
[0036] As Figures 4-5As shown, the inner wall of the plurality of arc-shaped plates 22 is provided with a receiving groove 10, the inner part of the receiving groove 10 is provided with an elastic sheet 11, the outer wall of the elastic sheet 11 is in contact with the circumferential surface of the corresponding lead one 3 or lead two 4; after the lead one 3 or lead two 4 is inserted into the connecting piece 2, the outer wall of the elastic sheet 11 is in contact with the circumferential surface of the lead one 3 or lead two 4, which can better fix the lead one 3 or lead two 4, prevent the lead one 3 or lead two 4 from falling out of the corresponding connecting piece 2 during soldering, and make soldering more convenient.
[0037] As shown in the figure, Figure 6 The inner wall of the plurality of arc-shaped plates 22 is fixedly connected with a blocking strip 12, the blocking strip 12 includes an upper protruding part 16 and a lower protruding part 17, the upper protruding part 16 and the lower protruding part 17 are both arc-shaped, the end of the upper protruding part 16 is in contact with the end of the upper protruding part 16 of the adjacent blocking strip 12, the end of the lower protruding part 17 is in contact with the lower protruding part 17 of the adjacent blocking strip 12, and the upper protruding part 16 and the lower protruding part 17 of the adjacent two blocking strips 12 are stacked with each other; when the lead one 3 or lead two 4 is inserted into the connecting piece 2, the setting of the blocking strip 12 can better limit the insertion depth of the lead one 3 or lead two 4, and the upper protruding part 16 and the lower protruding part 17 of the blocking strip 12 can better increase the thickness of the blocking strip 12, preventing the lead one 3 or lead two 4 from being excessively forced during insertion, which can prevent the blocking strip 12 from being excessively deformed.
[0038] As shown in the figure, Figure 6 The top of the arc-shaped plate 22 is provided with a protruding part 13; when the lead one 3 or lead two 4 is inserted into the connecting piece 2, the protruding part 13 is pushed outward to drive the arc-shaped plate 22 to expand outward, which can more conveniently insert the lead one 3 or lead two 4 into the corresponding connecting piece 2.
[0039] As shown in the figure, Figure 5 The top of the limiting block 23 is provided with an inclined part 14; during the insertion of the connecting piece 2, the setting of the inclined part 14 can better guide the insertion, making the insertion more convenient.
[0040] As shown in the figure, Figure 5 The inner wall of the circular ring 21 is provided with an inclined surface one 7; the inclined surface one 7 cooperates with the inclined part 14 of the limiting block 23 to guide the insertion of the connecting piece 2, which can more conveniently insert the connecting piece 2, and the setting of the inclined surface one 7 increases the distance between the inner wall of the circular ring 21 and the lead one 3 or lead two 4, which can better solder in the distance.
[0041] As shown in the figure, Figure 5As shown, the inner wall of the mounting hole of the epoxy plate 1 is provided with an inclined surface two 15; during the insertion of the lead one 3 or the lead two 4, the lead one 3 or the lead two 4 can be better guided through the arrangement of the inclined surface two 15, and the insertion of the lead can be more convenient.
[0042] Working principle:
[0043] By inserting the connecting piece 2 into the mounting hole of the epoxy plate 1, during the insertion, the inclined surface one 7 and the inclined part 14 of the limiting block 23 are matched with each other, and during the insertion of the connecting piece 2, the insertion of the connecting piece 2 can be better guided, and the insertion of the connecting piece 2 can be more convenient. After the insertion of the connecting piece 2 is completed, the lead one 3 and the lead two 4 are inserted into the corresponding connecting piece 2, and during the insertion, the lead one 3 or the lead two 4 can be better guided through the guidance of the inclined surface two 15, and the insertion of the lead can be more convenient. During the insertion of the lead one 3 or the lead two 4, the insertion depth of the lead one 3 or the lead two 4 can be better limited through the arrangement of the blocking strip 12, so as to prevent excessive insertion, and the thickness of the blocking strip 12 can be better increased through the mutual stacking of the upper convex part 16 and the lower convex part 17 of the blocking strip 12, so as to prevent excessive force during the insertion of the lead one 3 or the lead two 4, and prevent excessive deformation of the blocking strip 12. After the insertion is completed, the lead one 3 or the lead two 4 can be better fixed through the abutment between the outer wall of the elastic sheet 11 and the circumferential surface of the lead one 3 or the lead two 4, so as to prevent the lead one 3 or the lead two 4 from falling out of the corresponding connecting piece 2 during the soldering process. After the lead one 3 and the lead two 4 are fixed, the lead one 3 or the lead two 4 is soldered through the bottom of the circular ring 21, so as to complete the installation of the lead one 3 and the lead two 4.
[0044] The utility model covers any alternative, modification, equivalent method and scheme which are made on the essence and range of the utility model. In order to make the public have thorough understanding of the utility model, the specific details are explained in the above preferred embodiment of the utility model, and the utility model can also be completely understood without the description of these details for the person skilled in the art.
[0045] The above is only the preferred embodiment of the utility model, and it should be pointed out that, for ordinary skilled person in the art, without departing from the principle of the utility model, a plurality of improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection range of the utility model.
Claims
1. An epoxy resin heating plate with high thermal conductivity, characterized in that: Include: The top of the epoxy board (1) is provided with heating wire (8), the surface of the heating wire (8) is coated with insulating solder resist ink (9), the surface of the epoxy board (1) is provided with a plurality of mounting holes, a plurality of mounting holes are connected with connecting piece (2), connecting piece (2) is electrically connected with heating wire (8), a plurality of connecting piece (2) is respectively tin soldered with lead wire one (3) and lead wire two (4), the end of lead wire one (3) and lead wire two (4) away from epoxy board (1) is provided with connector (5), the outside of lead wire one (3) and lead wire two (4) is wrapped with heat shrink sleeve (6), the surface of the soldering point after tin soldering is coated with silica gel layer.
2. The epoxy resin heat generating sheet having high heat conduction efficiency according to claim 1, characterized by The connecting piece (2) is a rivet, the rivet is riveted in the mounting hole of the epoxy board (1), the lead wire one (3) and the lead wire two (4) are inserted into the corresponding rivet, the lead wire one (3) and the lead wire two (4) are tin soldered with the rivet, the rivet is electrically connected with the heating wire (8).
3. The epoxy resin heat generating sheet having high heat conduction efficiency according to claim 1, wherein The connecting piece (2) is a clamping piece, the connecting piece (2) comprises a circular ring (21), the top of the circular ring (21) is fixedly connected with a plurality of arc plates (22), the outer wall of a plurality of arc plates (22) is fixedly connected with a limiting block (23), the limiting block (23) is arc-shaped, the bottom of the limiting block (23) is in contact with the top of the heating wire (8), the limiting block (23) is electrically connected with the heating wire (8), the lead wire one (3) and the lead wire two (4) are tin soldered with the bottom of the corresponding circular ring (21), the top of the circular ring (21) is in contact with the bottom of the epoxy board (1), a plurality of arc plates (22) are movably penetrated through the mounting hole of the epoxy board (1).
4. The epoxy resin heat generating sheet having high heat conduction efficiency according to claim 3, characterized by The inner wall of a plurality of arc plates (22) is provided with a containing groove (10), the inner part of the containing groove (10) is provided with a spring piece (11), the outer wall of the spring piece (11) is in contact with the circumferential surface of the corresponding lead wire one (3) or lead wire two (4).
5. The epoxy heat-generating sheet having high heat conduction efficiency according to claim 3, wherein The inner wall of a plurality of arc plates (22) is fixedly connected with a blocking strip (12), the blocking strip (12) comprises an upper convex part (16) and a lower convex part (17), the upper convex part (16) and the lower convex part (17) are arc-shaped, the end of the upper convex part (16) is in contact with the end of the upper convex part (16) of the adjacent blocking strip (12), the end of the lower convex part (17) is in contact with the lower convex part (17) of the adjacent blocking strip (12), the upper convex part (16) and the lower convex part (17) of the adjacent two blocking strips (12) are stacked with each other.
6. The epoxy heat-generating sheet having high heat conduction efficiency according to claim 3, wherein The top of the arc plate (22) is provided with a convex part (13).
7. The epoxy resin heat generating sheet having high heat conduction efficiency according to claim 3, wherein The top of the limiting block (23) is provided with an inclined part (14).
8. The epoxy resin heat generating sheet having high heat conduction efficiency according to claim 1, wherein The inner wall of the circular ring (21) is provided with an inclined surface one (7).
9. The epoxy resin heat generating sheet having high heat conduction efficiency according to claim 1, wherein The inner wall of the mounting hole of the epoxy board (1) is provided with an inclined surface two (15).