Drive circuit board conductive structure of water pump
By introducing the first and second functional chips as current channels on the driving circuit board of the electronic water pump, the current carrying and heat dissipation problems of the circuit board under high power are solved, and the effects of stable current conduction and efficient heat dissipation are achieved.
Patent Information
- Application Number
- CN202422942255.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-30
- Publication Date
- 2025-10-21
- Estimated Expiration
- 2034-11-30
AI Technical Summary
When the current of the existing electronic water pump drive circuit board increases under high power, the material, cross-sectional area, heat dissipation performance and EMC performance requirements of the printed circuit are improved, resulting in increased costs and design difficulty.
The first and second functional sheets are used as conductive structures and are respectively welded on the driving circuit board to provide additional current channels. Heat is dissipated through welding materials and natural convection, which reduces the current-carrying pressure of the printed circuit and improves the heat exchange efficiency.
It achieves stable conduction of larger current, reduces the current-carrying pressure of the printed circuit, and improves the heat dissipation performance and design flexibility of the driver circuit board.
Smart Images
Figure CN223463169U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to electronic water pump and its spare part technical field, concretely is a kind of driving circuit board conductive structure of water pump. BACKGROUND
[0002] Electronic water pump has higher output efficiency and can realize accurate flow control, therefore, electronic water pump is widely used in automobile, household appliance and industrial equipment, for example, new energy automobile is usually configured with two or more electronic water pumps, to be used as the power source of entire cooling system.
[0003] Driving circuit board is one of the core components of electronic water pump, which is loaded with main control, power electronic device and other peripheral circuits, for driving the stator assembly of electronic water pump to run, so that the stator assembly can generate rotating magnetic field, and then drive the rotor assembly and impeller of electronic water pump to rotate through the rotating magnetic field magnetic coupling, so as to generate fluid power.
[0004] With the increase of power of electronic water pump, the power input / output of its driving circuit board also increases accordingly, and the current on the driving circuit board is mainly conducted by printed circuit, so that the material, cross-sectional area, heat dissipation performance and EMC performance of printed circuit are required to be higher when the current increases, which greatly increases the cost and design difficulty of driving circuit board.
[0005] In summary, how to provide more efficient conductive structure for the driving circuit board of electronic water pump has become one of the problems to be solved. UTILITY MODEL CONTENTS
[0006] The utility model aims at providing a kind of driving circuit board conductive structure of water pump, it can provide efficient conductive structure for driving circuit board.
[0007] To achieve the above purpose, the utility model provides the following technical scheme: a kind of driving circuit board conductive structure of water pump, it includes driving circuit board;The driving circuit board is loaded with several components;The driving circuit board is also loaded with first function sheet, and the first function sheet can be used as the current channel of the driving circuit board to connect at least one component on the driving circuit board.
[0008] In the above technical scheme, the first function sheet includes the first placement body of flat plate, and a plurality of first fixing feet integrally formed on the first placement body;The driving circuit board is provided with circuit board through hole, and the number and position of the circuit board through hole are corresponding with the first fixing feet of the first function sheet;Each first fixing foot of the first function sheet is respectively inserted into and welded in each circuit board through hole of the driving circuit board, and the first placement body of the first function sheet is tightly attached to the surface of the driving circuit board.
[0009] In the first functional sheet, two sides of each first fixed foot are respectively formed with a first crack arrest groove.
[0010] The driving circuit board is provided with a plurality of pads at a corresponding position of the first functional sheet; and the first mounting body of the first functional sheet is welded on the pads of the driving circuit board.
[0011] In the first functional sheet, a plurality of first through holes are formed in the first mounting body; the first through holes allow welding material to pass through the first through holes to reach the bottom of the first mounting body, and the first through holes also allow the welding material to be deposited therein.
[0012] The driving circuit board is provided with a second functional sheet on the other side relative to the first functional sheet, the second functional sheet can serve as a current channel of the driving circuit board; the second functional sheet can serve as a current channel of the driving circuit board to connect at least one component on the driving circuit board.
[0013] The second functional sheet includes a second mounting body in the form of a flat plate; the driving circuit board is provided with a plurality of pads at a corresponding position of the second functional sheet; and the second mounting body of the second functional sheet is welded on the pads of the driving circuit board.
[0014] In the second functional sheet, a plurality of second through holes are formed in the second mounting body; the second through holes allow welding material to pass through the second through holes to reach the bottom of the second mounting body, and the second through holes also allow the welding material to be deposited therein.
[0015] The driving circuit board is provided with the component on the other side relative to the first functional sheet; and when a projection direction is perpendicular to the driving circuit board, the projection of the first functional sheet has an overlapping relationship with the projection of the component, so that the first functional sheet can exchange heat with at least part of the component through the driving circuit board.
[0016] The first functional sheet further includes a first protruding rib integrally formed on the first mounting body; the first protruding rib is used to improve the mechanical strength of the first functional sheet, and to increase the heat exchange area of the first functional sheet with the outside.
[0017] Compared with the prior art, the water pump driving circuit board conductive structure of the utility model has the advantages that: the first function sheet and / or the second function sheet are used as conductors to provide a current channel allowing larger current to pass through for the driving circuit board, thereby providing a current channel outside the printed circuit for the driving circuit board, reducing the current carrying pressure of the printed circuit on the driving circuit board, and when the first function sheet and / or the second function sheet are used as the current channel, the heat generation of the first function sheet and / or the second function sheet is small, providing more possibilities for the circuit design of the driving circuit board. BRIEF DESCRIPTION OF DRAWINGS
[0018] Figure 1 It is a perspective view of the utility model.
[0019] Figure 2 It is an exploded view of the utility model.
[0020] Figure 3 It is a structure view of the driving circuit board in the utility model.
[0021] Figure 4 It is a second structure view of the driving circuit board in the utility model.
[0022] Figure 5 It is Figure 4 A partial enlarged view in the utility model.
[0023] Figure 6 It is a structure view of the second function sheet in the utility model.
[0024] Figure 7 It is a structure view when applied to the water pump in the utility model.
[0025] The figure mark is: 1, driving circuit board;11, component;12, circuit board through hole;13, first function sheet;131, first pasting body;132, first convex rib;133, first fixed foot;134, first through hole;135, first crack stopping groove;14, second function sheet;141, second pasting body;142, second convex rib;143, second through hole;144, second crack stopping groove;2, main heat conduction plate part;21, heat conduction sheet slot;211, deepened sub slot;22, component slot;10, water pump body;20, cavity. DETAILED DESCRIPTION
[0026] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.
[0027] The embodiment provides a conductive structure of a driving circuit board of a water pump, which can be applied to the water pump (especially an electronic water pump).
[0028] Please refer to Figures 1-6 The conductive structure of the driving circuit board of the water pump comprises a driving circuit board 1.
[0029] The driving circuit board 1 is a printed circuit board (PCB), which at least carries a main control, power electronic devices for driving the stator assembly to operate and other peripheral circuits, so that the driving circuit board 1 can at least realize the function of driving the stator assembly to operate.
[0030] At least one side of the driving circuit board 1 carries a plurality of components 11.
[0031] It should be noted that the components 11 can be power electronic devices (such as field effect tubes, thyristors and IGBTs), driving / control devices (such as main controls and special chips), or basic components (such as capacitors, resistors and transformers); the components 11 can be packaged devices (such as surface mount packaged devices, which are commonly used for field effect tubes), or bare devices; the components 11 can be mounted on the driving circuit board 1 by surface mounting or plug-in mounting.
[0032] In order to effectively improve the current-carrying performance of the driving circuit board 1, the driving circuit board 1 further carries a first functional sheet 13, which can be used as a current channel of the driving circuit board to connect at least one component 11 on the driving circuit board.
[0033] It should be noted that the first functional sheet 13 has good conductivity and heat conductivity, and is fixed on the driving circuit board 1 by welding; in the embodiment, the first functional sheet 13 is a copper sheet, such as a pure copper sheet or an alloy copper sheet with a thermal conductivity of 350-400 W / (m*K).
[0034] In fact, only the pads in the area covered by the first functional sheet 13 on the driving circuit board 1 need to be set, and the pads are electrically connected with the corresponding components 11 on the driving circuit board 1 (the electrical connection is realized by printing circuit), so that the first functional sheet 13 can be used as a current channel of the driving circuit board 1; it can be understood that in most cases, the first functional sheet 13 is used as a current trunk of the driving circuit board 1, that is, one first functional sheet 13 is connected with a plurality of components 11 through the pads and the printing circuit on the driving circuit board 1.
[0035] The first functional sheet 13 is used as a conductor to provide a current channel for the driving circuit board 1 to allow a larger current to pass, thereby providing the driving circuit board 1 with a current channel outside the printed circuit, reducing the current carrying pressure of the printed circuit on the driving circuit board 1, and when the first functional sheet 13 is used as a current channel, the heat generated by the first functional sheet 13 itself is small, providing more possibilities for the circuit design of the driving circuit board 1.
[0036] Please refer to Figure 4 and Figure 5 Specifically, the first functional sheet 13 includes a first placement body 131 in the form of a flat plate, and a plurality of first fixing feet 133 integrally formed on the first placement body 131; in fact, the first fixing feet 133 can be integrally formed on the first placement body 131 by stamping or one-piece die casting; the driving circuit board 1 is provided with circuit board through holes 12, and the number and position of the circuit board through holes 12 correspond to the first fixing feet 133 of the first functional sheet 13; in this embodiment, the circuit board through holes 12 are through holes with copper plating on both sides of the driving circuit board 1, which facilitates the welding process and improves the heat dissipation performance of the driving circuit board 1 at each circuit board through hole 12; each first fixing foot 133 of the first functional sheet 13 is inserted into and welded in each circuit board through hole 12 of the driving circuit board 1, and the first placement body 131 of the first functional sheet 13 is tightly attached to the surface of the driving circuit board 1.
[0037] Further, in the first functional sheet 13, a first crack stopping groove 135 is formed on both sides of each first fixing foot 133, i.e., the first crack stopping groove 135 is a small groove integrally formed on both sides of each first fixing foot 133, which can be formed by blanking or machining; the first crack stopping groove 135 can prevent burrs from being generated during the formation of the first fixing foot 133, so that when the first fixing foot 133 of the first functional sheet 13 is inserted into the circuit board through hole 12 of the driving circuit board 1, the first functional sheet 13 does not interfere with the driving circuit board 1, thereby ensuring the tightness and flatness of the first functional sheet 13 when it is attached to the driving circuit board 1.
[0038] Further, the driving circuit board 1 is provided with a plurality of pads at the corresponding positions of the first functional sheet 13; it can be understood that when the first functional sheet 13 is used as a current channel, the pads are electrically connected to the components on the driving circuit board 1 (specifically by a printed circuit); the first placement body 131 of the first functional sheet 13 is welded on the pads of the driving circuit board 1, and the heat dissipation through the pads and the welding material can further improve the heat exchange efficiency between the driving circuit board 1 and the first functional sheet 13.
[0039] Further, in the first functional sheet 13, a plurality of first through holes 134 are formed in the first placement body 131, the first through holes 134 are through holes penetrating through two surfaces of the first placement body 131, and the first through holes 134 can be formed by punching or machining; the first through holes 134 can allow the welding material to pass through the first through holes 134 to the bottom of the first placement body 131, and the first through holes 134 can also allow the welding material to be placed in the first through holes 134; the first through holes 134 can facilitate the welding and fixation of the first functional sheet 13, and can make the welding of the first functional sheet 13 more reliable, and can further improve the heat exchange efficiency between the driving circuit board 1 and the first functional sheet 13 through the heat conduction of the welding material.
[0040] Please refer to Figure 1 、 Figure 3 and Figure 6 Further, the driving circuit board 1 is placed with a second functional sheet 14 on the other surface relative to the first functional sheet 13; the second functional sheet 14 can serve as a current channel of the driving circuit board 1, in fact, only the pads in the area of the driving circuit board 1 covered by the second functional sheet 14 need to be electrically connected (specifically, electrically connected through a printed circuit) with the corresponding components 11 on the driving circuit board 1, and the second functional sheet 14 can be used as a current channel of the driving circuit board 1 to further improve the current carrying performance of the driving circuit board 1; it can be understood that in most cases, the second functional sheet 14 is used as a current trunk of the driving circuit board 1, that is, a second functional sheet 14 is connected to a plurality of components 11 through the pads and the printed circuit on the driving circuit board 1.
[0041] Specifically, the second functional sheet 14 includes a second placement body 141 in the form of a flat plate, and the driving circuit board 1 is provided with a plurality of pads at the corresponding position of the second functional sheet 14; it can be understood that when the second functional sheet 14 is used as a current channel, the pads are electrically connected (specifically, electrically connected through a printed circuit) with the components on the driving circuit board 1; the second placement body 141 of the second functional sheet 14 is welded on the pads of the driving circuit board 1, and the heat conduction through the pads and the welding material can further improve the heat exchange efficiency between the driving circuit board 1 and the second functional sheet 14.
[0042] It can be understood that the second functional sheet 14 is also used to further improve the heat dissipation performance of the driving circuit board 1, in fact, the second functional sheet 14 dissipates heat through natural convection or heat exchange with the rear end cover of the electronic water pump.
[0043] Further, the second functional sheet 14 further comprises a second protruding rib 142 integrally formed on the second attaching body 141. In this embodiment, the second protruding rib 142 is a sheet structure perpendicular to the second attaching body 141. The second protruding rib 142 can be integrally formed on the second attaching body 141 by punching, bending or integrally die casting. The second protruding rib 142 is used to improve the mechanical strength of the second functional sheet 14 and increase the heat exchange area of the second functional sheet 14. In this embodiment, the second protruding rib 142 is arranged at the long side of the second attaching body 141 to reduce the deformation of the second attaching body 141 at the long side, so that the second attaching body 141 is more flat and easier to be attached to the driving circuit board 1.
[0044] Further, in the second functional sheet 14, a plurality of second crack arrest grooves 144 are formed on the second attaching body 141. The second crack arrest grooves 144 can be formed by punching or machining. In this embodiment, the second crack arrest grooves 144 are respectively arranged at the two sides of the second protruding rib 142. The second crack arrest grooves 144 are arranged to avoid cracking of the second attaching body 141.
[0045] Further, in the second functional sheet 14, a plurality of second through holes 143 are formed on the second attaching body 141. The second through holes 143 are through holes penetrating through the two sides of the second attaching body 141. The second through holes 143 can be formed by punching or machining. The second through holes 143 can be used for the welding material to pass through the second through holes 143 to the bottom of the second attaching body 141, and the welding material can be left in the second through holes 143. The second through holes 143 are arranged to facilitate the welding and fixation of the second functional sheet 14, make the welding of the second functional sheet 14 more reliable, and further improve the heat exchange efficiency between the driving circuit board 1 and the second functional sheet 14 by heat conduction of the welding material.
[0046] Part of the components 11 (for example, a surface mount package field effect tube) in this embodiment are arranged on the driving circuit board 1 in an array form. Regardless of the form of the components 11, the components 11 are arranged on the driving circuit board 1 by welding (i.e., there is welding material between the components 11 and the body of the driving circuit board 1, and the welding material usually has good heat conduction performance). Therefore, the heat generated by the components 11 is easily conducted to the body of the driving circuit board 1, so that a high heat generation area is formed on the driving circuit board 1, and the heat dissipation requirement of the high heat generation area is the highest.
[0047] In order to effectively lead out the heat in the high heat area of the driving circuit board 1, the driving circuit board 1 is provided with components 11 (for example, field effect tubes in a patch type package) on the other side relative to the first functional sheet 13; and when the direction perpendicular to the driving circuit board 1 is taken as the projection direction, the projection of the first functional sheet 13 has an overlapping relationship with the projection of the components 11, so that the first functional sheet 13 can exchange heat with at least part of the components 11 through the driving circuit board 1; Figure 3 The relative position relationship between the first functional sheet 13 and the components 11 is schematically shown in a perspective manner (the components shown by the dashed line are the first functional sheet 13).
[0048] In order to effectively lead out the heat of the first functional sheet 13, the water pump of the embodiment further comprises a main heat conduction plate member 2.
[0049] The main heat conduction plate member 2 is a plate-shaped workpiece of a metal material, for example, stainless steel or aluminum alloy material, which can be used as a structural member of a water pump (especially an electronic water pump) and has good heat conduction performance.
[0050] The driving circuit board 1 is mounted on the main heat conduction plate member 2, or the driving circuit board 1 and the main heat conduction plate member 2 are mutually attached, so that the first functional sheet 13 of the driving circuit board 1 can exchange heat with the main heat conduction plate member 2; in the embodiment, positioning columns are formed on the main heat conduction plate member 2, and positioning holes are provided on the driving circuit board 1, the positioning columns of the main heat conduction plate member 2 and the positioning holes of the driving circuit board 1 are matched to position the driving circuit board 1; if the positioning columns of the main heat conduction plate member 2 and the positioning holes of the driving circuit board 1 are matched in interference, the driving circuit board 1 can be fixed, or the driving circuit board 1 can also be locked and fixed on the main heat conduction plate member 2 by buckling or screws.
[0051] The main heat conduction plate member 2 can exchange heat with liquid medium and / or gas medium to lead out the heat.
[0052] Further, the surface of the main heat conduction plate member 2 is concave to form a heat conduction sheet embedding groove 21, which is matched with the shape of the first functional sheet 13 on the driving circuit board 1; in fact, the heat conduction sheet embedding groove 21 can be formed on the surface of the main heat conduction plate member 2 by using integrated die casting or machining; when the driving circuit board 1 is mounted on the main heat conduction plate member 2, the first functional sheet 13 on the driving circuit board 1 is embedded in the heat conduction sheet embedding groove 21 of the main heat conduction plate member 2, so that the heat exchange area between the first functional sheet 13 and the main heat conduction plate member 2 can be increased, and the heat exchange efficiency between the first functional sheet 13 and the main heat conduction plate member 2 can be improved.
[0053] The first functional sheet 13 is tightly attached to the surface of the driving circuit board 1, so that the heat exchange between the first functional sheet 13 and the driving circuit board 1 is easy to occur. In addition, each first fixing leg 133 of the first functional sheet 13 penetrates and is welded in each circuit board through hole 12 of the driving circuit board 1, so that each first fixing leg 133 can also exchange heat with the driving circuit board 1, thereby enabling the first functional sheet 13 to absorb heat on the side of the component 11. In the embodiment, each first fixing leg 133 of the first functional sheet 13 is in clearance fit with each circuit board through hole 12 of the driving circuit board 1, so that the first fixing leg 133 is easy to be installed in the circuit board through hole 12. In the embodiment, the connection between each first fixing leg 133 of the first functional sheet 13 and the first attaching body 131 is chamfered or rounded, so as to guide the first fixing leg 133 when it is installed in the circuit board through hole 12.
[0054] Further, the first functional sheet 13 further comprises a first protruding rib 132 integrally formed on the first attaching body 131. In the embodiment, the first protruding rib 132 is a sheet structure perpendicular to the first attaching body 131, and the first protruding rib 132 can be integrally formed on the first attaching body 131 by punching, bending or one-piece die casting. The first protruding rib 132 is used to improve the mechanical strength of the first functional sheet 13 and increase the heat exchange area between the first functional sheet 13 and the outside. Specifically, the first functional sheet 13 is embedded in the deeper part of the heat conduction sheet embedding groove 21 of the main heat conduction plate 2, so as to increase the heat exchange area between the first functional sheet 13 and the main heat conduction plate 2. In the embodiment, the groove bottom of the heat conduction sheet embedding groove 21 is further sunken at the position corresponding to the first protruding rib 132, forming a deepened sub-groove 211 (the deepened sub-groove 211 can be formed by one-piece die casting or machining), and the first protruding rib 132 of the first functional sheet 13 is embedded in the deepened sub-groove 211. In the embodiment, the first protruding rib 132 is arranged at the long side of the first attaching body 131, so as to reduce the deformation of the first attaching body 131 at the long side, making the first attaching body 131 more flat and easier to be attached to the driving circuit board 1.
[0055] Further, the driving circuit board 1 also carries a plurality of components 11 on the same side of the first functional sheet 13, that is, the driving circuit board 1 carries a plurality of components 11 on both sides. The surface of the main heat conduction plate 2 is concave, forming a component embedding groove 22, and the component embedding groove 22 can be formed on the surface of the main heat conduction plate 2 by one-piece die casting or machining. When the driving circuit board 1 is installed on the main heat conduction plate 2, the components 11 on the driving circuit board 1 are embedded in the component embedding groove 22 of the main heat conduction plate 2. In this way, the heat exchange area between the components 11 and the main heat conduction plate 2 can be increased, thereby improving the heat exchange efficiency between the components 11 and the main heat conduction plate 2.
[0056] It should be noted that the body of the drive circuit board 1, each component 11 on the drive circuit board 1 and the first functional sheet 13 on the drive circuit board 1 are not in contact with the main heat plate 2, and the fixing structure of the drive circuit board 1 and the main heat plate 2 should also be insulated to avoid short circuit between the drive circuit board 1 and the main heat plate 2.
[0057] Further, the drive circuit board 1 and the main heat plate 2 are filled with a heat-conducting medium, especially, the first functional sheet 13 of the drive circuit board 1 and the main heat plate 2, and the components 11 of the drive circuit board 1 and the main heat plate 2 are filled with a heat-conducting medium, so as to fill the gap between the drive circuit board 1 and the main heat plate 2 through the heat-conducting medium, and further improve the heat exchange efficiency between the drive circuit board 1 and the main heat plate 2; in the embodiment, the heat-conducting medium is an insulating heat-conducting gel, so as to ensure the insulation performance between the drive circuit board 1 and the main heat plate 2.
[0058] Please refer to Figure 7 When the embodiment is applied to a water pump, a water pump body 10 is arranged, a cavity 20 is formed in the water pump body 10, and the cavity 20 is used for flowing liquid medium; it can be understood that the flow of the liquid medium is driven by the rotor assembly and the impeller of the water pump body 10, and the rotor assembly of the water pump body 10 is driven by the rotating magnetic field generated by the stator assembly.
[0059] The main heat plate 2 serves as an inner end cover of the water pump body 10 and is used for closing the rear opening of the cavity 20, at this time, the main heat plate 2 can directly contact the liquid medium in the cavity 20, so as to exchange heat with the liquid medium, and the flowing liquid medium can quickly take away the heat of the main heat plate 2, thereby quickly dissipating the heat of the drive circuit board 1 (especially the components 11).
[0060] The drive circuit board conductive structure of the water pump of the embodiment uses the first functional sheet 13 and / or the second functional sheet 14 as a conductor to provide a current channel allowing larger current to pass through for the drive circuit board 1, thereby providing a current channel outside the printed circuit for the drive circuit board 1, which can reduce the current carrying pressure of the printed circuit on the drive circuit board 1, and when the first functional sheet 13 and / or the second functional sheet 14 serve as the current channel, the heat generation of the first functional sheet 13 and / or the second functional sheet 14 is small, which provides more possibilities for the circuit design of the drive circuit board 1.
[0061] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.
Claims
1. A drive circuit board conductive structure of a water pump, characterized by, The drive circuit board is provided with a plurality of components; The drive circuit board is further provided with a first functional sheet, which can serve as a current channel of the drive circuit board to connect at least one component on the drive circuit board. The first functional sheet comprises a first flat sheet and a plurality of first fixing feet integrally formed on the first flat sheet; 2. The drive circuit board conductive structure of a water pump according to claim 1, characterized by, The drive circuit board is provided with a plurality of board holes, and the number and position of the board holes correspond to the first fixing feet of the first functional sheet; Each first fixing foot of the first functional sheet is inserted into and welded in a corresponding board hole of the drive circuit board, and the first flat sheet of the first functional sheet is tightly attached to the surface of the drive circuit board. In the first functional sheet, both sides of each first fixing foot are formed with first crack-stop grooves.
3. The drive circuit board conductive structure of a water pump according to claim 2, characterized by, The drive circuit board is provided with a plurality of pads at positions corresponding to the first functional sheet; 4. The drive circuit board conductive structure of a water pump according to claim 2, characterized by, The first flat sheet of the first functional sheet is welded on the pads of the drive circuit board. In the first functional sheet, a plurality of first through holes are formed in the first flat sheet; 5. The drive circuit board conductive structure of a water pump according to claim 4, characterized by, The first through holes allow welding material to pass through and reach the bottom of the first flat sheet, and the first through holes also allow welding material to be stored therein. The drive circuit board is provided with a second functional sheet on the other side relative to the first functional sheet, which can serve as a current channel of the drive circuit board; 6. The drive circuit board conductive structure of a water pump according to claim 1, wherein The second functional sheet can serve as a current channel of the drive circuit board to connect at least one component on the drive circuit board. The second functional sheet comprises a second flat sheet; 7. The drive circuit board conductive structure of a water pump according to claim 6, wherein The drive circuit board is provided with a plurality of pads at positions corresponding to the second functional sheet; The second flat sheet of the second functional sheet is welded on the pads of the drive circuit board. In the second functional sheet, a plurality of second through holes are formed in the second flat sheet; 8. The drive circuit board conductive structure of a water pump according to claim 7, wherein The second through holes allow welding material to pass through and reach the bottom of the second flat sheet, and the second through holes also allow welding material to be stored therein. The drive circuit board is provided with the components on the other side relative to the first functional sheet; 9. The conductive structure of a drive circuit board of a water pump according to any one of claims 2 to 5, characterized in that, When the projection direction is perpendicular to the drive circuit board, the projection of the first functional sheet overlaps with the projection of the components, so that the first functional sheet can exchange heat with at least part of the components through the drive circuit board. The first functional sheet further comprises a first protruding rib integrally formed on the first flat sheet; 10. The drive circuit board conductive structure of a water pump according to claim 9, wherein, The first protruding rib is used to improve the mechanical strength of the first functional sheet and increase the heat exchange area between the first functional sheet and the outside.