Small LED support with built-in IC

Abstract

The utility model discloses a small LED support with a built-in IC, which comprises a support main body with a bowl cup, a plurality of luminous wafers, an IC chip, a plurality of bonding pads arranged on the support main body and a plurality of soldering tin pins connected with the plurality of bonding pads in a one-to-one correspondence manner, the bonding pads extend into the bowl cup, the plurality of luminous wafers are positioned in the bowl cup and arranged on the front surfaces of the bonding pads, and the IC chip is arranged in the bowl cup. The IC chip is located in the bowl cup and arranged on the back face of one bonding pad, and the IC chip is electrically connected with all the bonding pads and all the light-emitting wafers through wires. According to the utility model, the plurality of light-emitting wafers are arranged on the front surface of the bonding pad, and the IC chip is arranged on the back surface of the bonding pad, so that compared with the design that the light-emitting wafers and the IC chip are arranged on the front surface of the bonding pad in the prior art, the occupied area of the front surface of the bonding pad can be greatly reduced, and the LED lamp bead can be suitable for small LED lamp beads.

Description

TECHNICAL FIELD

[0001] The utility model relates to LED technical field, specifically is LED support with built-in IC. BACKGROUND

[0002] The Chinese patent document with the authorization announcement number CN210516750U and the name of a full-color LED with built-in IC discloses the technology of built-in IC in the LED lamp pearl, including support main part, paster, G paster, B paster, pad, soldering tin foot and IC chip, wherein the pad and soldering tin foot are arranged on the support main part, the support main part is equipped with bowl cup, R paster, G paster, B paster and IC chip are all arranged on the pad and are located in the bowl cup.The structure although built-in IC in the LED lamp pearl, but the IC chip and R paster, G paster, B paster together, all are arranged on the front of pad, lead to the area of pad front is relatively large, make the volume of support main part and even entire LED lamp pearl also be relatively large, therefore the technology is not applicable to small LED lamp pearl. SUMMARY

[0003] In order to solve the problems of the prior art, the utility model provides a LED support with smaller pad front area, applicable to small LED lamp pearl.

[0004] The technical scheme adopted by the utility model to solve the problems is:

[0005] The small LED support with built-in IC includes support main part with bowl cup, multiple light emitting chips, IC chip, multiple pads arranged on the support main part and multiple soldering tin feet connected with the multiple pads one by one, the pad extends into the bowl cup, the multiple light emitting chips are located in the bowl cup and arranged on the front of pad, the IC chip is located in the bowl cup and arranged on the back of one of the pads, and the IC chip is electrically connected with each pad and each light emitting chip through wires.

[0006] Further improvement, the multiple light emitting chips are arranged on the front of one or more pads.

[0007] Further improvement, the multiple light emitting chips and the IC chip are arranged on the same pad.

[0008] Further improvement, the pad where the light emitting chip and the IC chip are located is located in the middle of the bowl cup.

[0009] Further improvement, the side of the pad where the light emitting chip and the IC chip are located is also provided with a protruding block.

[0010] Further improvement, the front of the pad where the light emitting chip and the IC chip are located is provided with a barrier line, and the barrier line is located between adjacent light emitting chips.

[0011] Further improvement, the plurality of soldering pins includes a second soldering pin, the second soldering pin is same as the number of light emitting chips, the lead wire of the IC chip connected with each light emitting chip respectively passes through the corresponding pad of the second soldering pin.

[0012] Further improvement, the soldering pin other than the second soldering pin is a first soldering pin, the end of the first soldering pin extends to the back of the support body, and the end of the second soldering pin extends to the side of the support body.

[0013] Further improvement, rubber ribs are arranged between adjacent pads.

[0014] The utility model discloses beneficial effect: the utility model discloses a plurality of light emitting chips are arranged on the front of pad, and IC chip is arranged on the back of pad, compared with prior art both are arranged on the design of pad front, can greatly reduce the area of pad front, makes it can be applicable to small LED lamp pearl. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is the front view structure schematic drawing of the utility model discloses the main view structure schematic drawing of the utility model;

[0016] Figure 2 It is the rear view structure schematic drawing of the utility model;

[0017] Figure 3 It is the three-dimensional structure schematic drawing of the utility model;

[0018] Figure 4 It is the three-dimensional structure schematic drawing of the utility model removes the support body. DETAILED DESCRIPTION

[0019] The following will combine embodiment and attached drawing to the conception of the utility model creation, specific structure and the technical effect produced clear, complete description, to fully understand the purpose, features and effects of the utility model creation. The various technical features in the utility model creation can be interactively combined under the premise of not mutually contradictory conflict.

[0020] As Figures 1 to 4 The utility model discloses a small LED support with built-in IC, including support body 1, a plurality of light emitting chips 2, IC chip 3, a plurality of pads 4 and a plurality of soldering pins. Wherein, the bowl cup 11 is set up on the support body 1, the pad 4 is same as the number of soldering pin and one-to-one correspondence, the soldering pin is set up around the support body 1, and the pad 4 is mainly located in the bowl cup 11, and each soldering pin is fixedly connected with the corresponding pad 4, and preferably adopts integrated structure.

[0021] The light emitting chips 2 include red light emitting chips, green light emitting chips and blue light emitting chips, i.e. RGB light emitting chips, and full-color LEDs are formed by mixing the three primary colors of red, green and blue. Of course, other colors of light emitting chips can also be added according to actual needs, such as warm white light emitting chips and cold white light emitting chips, and adjustable color temperature LEDs can be formed by adjusting the mixing ratio of the two.

[0022] The light emitting chips 2 are arranged on the front surface of the pads 4 in the bowl cup 11, and the bowl cup 11 can play a certain role in light collection when the light emitting chips 2 emit light. The light emitting chips 2 can be distributed on two or more pads 4, such as RGB light emitting chips, two of which are arranged on one pad 4, and the remaining one is arranged on another pad 4; or the three light emitting chips can be arranged on three different pads 4.

[0023] The IC chip 3 is arranged on the back surface of one of the pads 4 in the bowl cup 11. The IC chip 3 is electrically connected to each pad 4 and each light emitting chip 2 through a wire. The IC chip 3 controls the light emitting intensity of the light emitting chips 2 according to external control signals to achieve different light mixing ratios.

[0024] Arranging multiple light emitting chips 2 on the front surface of the pads 4 and arranging the IC chip 3 on the back surface of the pads 4 can greatly reduce the area occupied by the pads 4 on the front surface, so that it can be applied to small LED lamp beads. As shown in Figure 1 , the length and width of the lamp bead can be as small as 3.30 mm and 3.2 mm, respectively.

[0025] In an embodiment, referring to Figure 1 , the light emitting chips 2 are arranged on the front surface of the same pad 4. Preferably, referring to Figure 2 , the IC chip 3 is arranged on the back surface of the same pad 4 as the light emitting chips 2, so that the overall structure and installation are simple. In addition, the pad 4 on which the light emitting chips 2 are arranged is preferably arranged in the middle of the bowl cup 11.

[0026] In an embodiment, the multiple soldering pins are divided into first soldering pins 51 and second soldering pins 52, and the number of the second soldering pins 52 is the same as the number of the light emitting chips 2. Referring to Figures 1 to 4 , the second soldering pins 52 are arranged side by side on one side of the support body 1, and the wires connecting the IC chip 3 and each light emitting chip 2 pass through the corresponding pads 4 of the second soldering pins 52. Through the second soldering pins 52, it can be detected whether each light emitting chip 2 and the IC chip 3 are in conduction, and whether the lamp bead is normal before packaging, which is conducive to improving the yield of products.

[0027] These second solder legs 52 do not require solder, so their ends extend to the side of the bracket body 1 for easy inspection. The ends of the first solder legs 51 extend to the back of the bracket body 1 for easy soldering.

[0028] In one embodiment, referring to Figures 1 to 3 , rubber ribs 6 are provided between adjacent pads 4 to effectively improve the anti-permeability and airtightness. Figure 4 As shown, a bump 41 is further provided on the side of the pad 4 where the light emitting chip 2 and the IC chip 3 are located. The bump 41 is wrapped in the rubber rib 6 to play a role in glue fixation.

[0029] In addition, a barrier line 42 is provided on the front of the solder pad 4 where the light emitting chip 2 and the IC chip 3 are located. The barrier line 42 is located between adjacent light emitting chips 2. Figure 1 、 Figure 3 and Figure 4 As shown, there are three light-emitting chips 2 arranged in a triangular shape, and the barrier lines 42 are T-shaped and located in the gaps between the light-emitting chips 2. Since insulating glue is applied to the bottom of the light-emitting chips 2 and the Zener diode, some glue vapor will be emitted during baking, causing the adjacent light-emitting chips to adhere to the glue. The barrier lines 42 effectively isolate the glue vapor, improving the bonding effect of the light-emitting chips.

[0030] In this utility model, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "plurality" refers to two or more, unless expressly limited otherwise. Terms such as "installed," "connected," "connected," and "fixed" should be interpreted broadly. For example, "connected" can mean fixed, removable, or integral; "connected" can mean directly or indirectly through an intermediary. Those skilled in the art will understand the specific meanings of these terms in this utility model based on specific circumstances.

[0031] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by terms such as "up", "down", "left", "right", "front" and "back" are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or unit referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the present invention.

[0032] In the description of the specification, the description of the terms "one embodiment", "some embodiments", "a specific embodiment", and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the utility model. In the specification, the illustrative description of the above terms does not necessarily mean the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0033] It should be noted that the above is only further elaborated on the utility model combined with the embodiments, and does not constitute a limitation on the protection scope of the utility model. If the technology is simply changed, it only realizes the purpose of the utility model creation with substantially the same means, and should belong to the protection scope of the utility model.

Claims

1. A small LED holder with built-in IC, comprising a holder main body (1) provided with a bowl cup (11), a plurality of light emitting chips (2), an IC chip (3), a plurality of soldering pads (4) provided on the holder main body (1), and a plurality of soldering pins connected with the plurality of soldering pads (4) one by one, characterized in that: The soldering pad (4) extends into the bowl cup (11), a plurality of light emitting chips (2) are arranged on the front surface of the soldering pad (4) in the bowl cup (11), and the IC chip (3) is arranged on the back surface of one of the soldering pads (4) in the bowl cup (11), and the IC chip (3) is electrically connected with each soldering pad (4) and each light emitting chip (2) through a wire respectively.

2. The small-sized LED package with a built-in IC according to claim 1, wherein: A plurality of light emitting chips (2) are arranged on the front surface of one or more soldering pads (4).

3. The small-sized LED package with a built-in IC according to claim 1, wherein: The plurality of light emitting chips (2) and the IC chip (3) are arranged on the same soldering pad (4).

4. The small-sized LED package with a built-in IC according to claim 3, wherein: The soldering pad (4) on which the light emitting chip (2) and the IC chip (3) are arranged is located in the middle of the bowl cup (11).

5. The small-sized LED package with a built-in IC according to claim 3, wherein: The side surface of the soldering pad (4) on which the light emitting chip (2) and the IC chip (3) are arranged is further provided with a bump (41).

6. The small-sized LED package with a built-in IC according to claim 3, wherein: The front surface of the soldering pad (4) on which the light emitting chip (2) and the IC chip (3) are arranged is provided with a barrier line (42), and the barrier line (42) is located between adjacent light emitting chips (2).

7. The small-sized LED package with a built-in IC according to claim 1, wherein: The plurality of soldering pins include a second soldering pin (52), the number of the second soldering pin (52) is the same as that of the light emitting chip (2), and the wire connecting the IC chip (3) and each light emitting chip (2) passes through the corresponding soldering pad (4) of the second soldering pin (52).

8. The small-sized LED package with a built-in IC according to claim 7, wherein: The soldering pins other than the second soldering pin (52) are first soldering pins (51), the end of the first soldering pin (51) extends to the back surface of the support body (1), and the end of the second soldering pin (52) extends to the side surface of the support body (1).

9. The small-sized LED package with a built-in IC according to any one of claims 1 to 8, wherein: Rubber ridges (6) are arranged between adjacent soldering pads (4).

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