LED packaging device capable of reducing central light emission
By introducing a bowl-shaped cavity design and a light-blocking layer into the LED package, the problem of excessive center brightness is solved, light uniformity and thermal management are improved, glare and light pollution are reduced, and the reliability and life of the device are improved.
Patent Information
- Application Number
- CN202422851684.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-21
- Publication Date
- 2025-10-21
- Estimated Expiration
- 2034-11-21
AI Technical Summary
Traditional LED packaging devices have problems such as excessive central brightness and uneven light distribution, which leads to glare and light pollution.
The design adopts a bowl-shaped cavity inside the bracket, and the LED chip is placed at the bottom of the cavity. It is combined with a solid crystal adhesive layer, a light blocking layer and an encapsulation adhesive layer. The light blocking layer is used to block or reduce the central light output, and the encapsulation adhesive layer provides protection and fixation.
It improves the uniformity of light, reduces glare and light pollution, improves luminous efficiency and thermal management performance, and extends the service life of the device.
Smart Images
Figure CN223463299U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to LED technical field, concretely is a kind of LED packaging device of reducing center light. BACKGROUND
[0002] The traditional LED packaging device when emitting light, there is often central brightness too high, light distribution uneven problem, this not only affects the visual effect of LED device, also can cause unnecessary glare or light pollution to surrounding environment. Therefore, how to design a kind of LED packaging device capable of effectively reducing center light, improve light uniformity, become the problem to be solved urgently in current LED technical field. SUMMARY
[0003] In order to overcome the problems in the prior art, the utility model aims at providing a kind of LED packaging device of reducing center light.
[0004] The utility model solves technical problems employing the technical scheme that a kind of LED packaging device of reducing center light, comprising:
[0005] Support, LED chip, die bonding glue layer, light barrier layer and encapsulation glue layer;
[0006] The support is equipped with the cavity that is bowl-shaped, and the side of the LED chip is attached with the bottom of the cavity, the other side of the LED chip is attached with the side of the die bonding glue layer, the side of the die bonding glue layer is attached with the side of the light barrier layer, the other side of the encapsulation glue layer is towards the opening of the support, the encapsulation glue layer covers the surface of the LED chip, the die bonding glue layer, the light barrier layer, and the surface of the encapsulation glue layer is flush with the opening edge of the support.
[0007] Main working principle: LED chip is accurately placed at the bottom of bowl-shaped cavity in support. This design ensures the close attachment of LED chip and cavity bottom, which is conducive to heat conduction and preliminary guidance of light. Die bonding glue layer is applied between LED chip and support, as well as between LED chip and subsequent components, to provide stable connection. Die bonding glue layer not only plays a fixing role, but also can buffer thermal stress and mechanical stress generated by LED chip during work to a certain extent. Light barrier layer is placed above LED chip and attached with one side of die bonding glue layer. The design of light barrier layer is crucial, which is used to block or reduce the light output of LED chip center area, so as to improve the uniformity of light. Encapsulation glue layer is coated on the surface of LED chip, die bonding glue layer and light barrier layer, and towards the opening of support. Encapsulation glue layer not only provides additional protection and fixing effect, but also ensures the sealing and environmental adaptability of the whole packaging device. Finally, the surface of encapsulation glue layer is flush with the opening edge of support, forming a smooth appearance.
[0008] When the LED chip is activated by power, it emits light. These light first passes through the material of the LED chip itself, then encounters the die bonding glue layer and the light blocking layer. The die bonding glue layer mainly plays a role of light transmission here, and has little effect on the propagation of light. However, its existence ensures the connection between the LED chip and the subsequent components. The light blocking layer plays a key role. It can block or reduce the light output in the central region of the LED chip. In this way, the central light that may be too concentrated is dispersed or blocked, thereby improving the light uniformity of the entire packaged device. The light blocked by the light blocking layer may be reflected back into the LED chip, or finally output from the edge region after multiple reflections inside the encapsulation glue layer. This design helps to reduce glare and light pollution, improve light utilization efficiency and visual effect.
[0009] The bowl-shaped cavity design of the bracket not only facilitates the guidance of light, but also provides a good heat management channel. The LED chip generates heat when working, and these heat can be conducted to the external environment through the cavity and the bracket. The die bonding glue layer and the encapsulation glue layer also have certain heat conduction performance, which can help to disperse the heat generated by the LED chip to a larger area, thereby reducing the working temperature of the LED chip and improving the reliability of the device. The encapsulation glue layer also provides protection for the LED chip and the entire packaged device. It can prevent external moisture, dust and other contaminants from entering the interior of the packaged device, thereby prolonging the service life of the device and improving its stability.
[0010] In summary, the LED packaging device with reduced central light output achieves effective guidance and blocking of the light emitted by the LED chip through precise structural design and component configuration. This design not only improves the uniformity of light and reduces glare and light pollution, but also improves the heat management performance and protection performance of the device.
[0011] As a preferred, the bottom of the cavity is hexagonal, and the cavity gradually expands outward along the opening direction.
[0012] As a preferred, the LED chip is arranged at the center of the cavity.
[0013] As a preferred, the light blocking layer covers part of the surface of the LED chip.
[0014] As a preferred, the light blocking layer is parallel to the LED chip, and the light blocking layer covers the center line of the LED chip, the bottom of the light blocking layer extends to the edge of the LED chip and is flush with or exceeds the edge of the LED chip, and the two sides of the bottom of the light blocking layer leave a gap with the edge of the LED chip.
[0015] As preferred, the light blocking layer is arranged along a diagonal line of one pair of corners of the LED chip, and gaps are left between the other pair of corners of the LED chip and two sides of the light blocking layer.
[0016] As preferred, the bottom surface of the light blocking layer is in the shape of one of a square, a rectangle and a polygon, and the three-dimensional structure of the light blocking layer is one of a prism and a prismatic column.
[0017] As preferred, the light blocking layer is composed of a transparent thermosetting resin material filled with a reflective material with a reflectivity of 60-70%, and the light transmittance of the light blocking layer is 20-40%.
[0018] As preferred, the encapsulating adhesive layer is one of a transparent thermosetting resin material and a thermosetting resin material containing fluorescent powder.
[0019] As preferred, the LED chip is one of a normal chip, a vertical chip and a flip chip, and the shape of the LED chip is one of a cube and a cuboid.
[0020] Compared with the prior art, the LED encapsulating device has the following beneficial effects:
[0021] The LED encapsulating device can significantly reduce the light output in the central region of the LED chip, making the light distribution more uniform. This helps to avoid the problem of glare caused by excessive brightness in the center and improves the visual comfort. The design of the light blocking layer not only reduces the central light output, but also promotes the blocked light to be output from the edge region after multiple reflections inside the encapsulating device. This design helps to make full use of the light emitted by the LED chip and improve the luminous efficiency. The bowl-shaped cavity design of the bracket and the heat conduction performance of the die bonding adhesive layer and the encapsulating adhesive layer together form an effective heat management channel. This helps to conduct the heat generated by the LED chip to the external environment in a timely manner, reduces the working temperature of the device, and improves the reliability and service life. The encapsulating adhesive layer not only provides sealing for the LED chip and the entire encapsulating device, but also has certain mechanical strength and corrosion resistance. This helps to prevent external moisture, dust and other contaminants from entering the interior of the encapsulating device and protects the device from damage.
[0022] Due to the excellent performance of the encapsulating device in terms of light uniformity, luminous efficiency, heat management performance, protection performance and manufacturing process, it has wide application prospects. It can be used in various occasions requiring high-quality lighting, such as indoor lighting, automotive lighting, display screen backlighting, etc.
[0023] In summary, the LED encapsulating device with reduced central light output has significant beneficial effects in many aspects and has broad market application prospects and important technical value. BRIEF DESCRIPTION OF DRAWINGS
[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0025] Figure 1 This is a top view of the LED package device that reduces the center light output. Figure One ;
[0026] Figure 2 This is a top view of the LED package device that reduces the center light output. Figure Two ;
[0027] Figure 3 This is a side view of the LED package device with reduced center light output. Figure One ;
[0028] Figure 4 This is a side view of the LED package device with reduced center light output. Figure Two ;
[0029] Figure 5 A light distribution curve diagram of the LED package device along the short side of the light blocking layer 4;
[0030] Figure 6 Graph showing the light distribution along the long side of the light blocking layer 4 of the LED package device.
[0031] 1. Bracket; 10. Cavity; 2. LED chip; 3. Solid crystal adhesive layer; 4. Light blocking layer; 5. Encapsulation adhesive layer. DETAILED DESCRIPTION
[0032] In order to more clearly understand the above-mentioned purposes, features and advantages of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the absence of conflict, the embodiments of this application and the features in the embodiments can be combined with each other. In the following description, many specific details are set forth in order to fully understand the present invention. The embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.
[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description herein is for describing particular embodiments only and is not intended to be limiting of the application.
[0034] Embodiment 1
[0035] This embodiment discloses a LED packaging device with reduced central light output, as shown in Figures 1-4 The LED packaging device includes a bracket, a LED chip, a die bonding layer, a light blocking layer, and an encapsulation layer. The bracket has a bowl-shaped cavity inside. One side of the LED chip is attached to the bottom of the cavity, and the other side is attached to one side of the die bonding layer. The other side of the die bonding layer is attached to one side of the light blocking layer, and the encapsulation layer covers the surfaces of the LED chip, the die bonding layer, and the light blocking layer. The other side of the encapsulation layer faces the opening of the bracket and is flush with the edge of the opening.
[0036] When the LED chip is activated by power, it emits light. The light first passes through the material of the LED chip itself, and then encounters the die bonding layer. The die bonding layer mainly serves as a light transmission here and guides the light to the light blocking layer. The design of the light blocking layer aims to block or reduce the light output in the central region of the LED chip, so that the light is more evenly distributed around the LED packaging device. The light that is not blocked by the light blocking layer continues to pass through the encapsulation layer and is radiated out from the opening of the bracket. Through the design of the light blocking layer, the light output in the central region of the LED chip is significantly reduced, avoiding the problem of glare caused by excessive brightness in the center. The light blocking layer makes the light more evenly distributed around the LED packaging device, improving the visual effect. The die bonding layer and the encapsulation layer provide protection and fixation for the LED chip and the light blocking layer, enhancing the stability and reliability of the packaging device.
[0037] Specifically, please refer to Figures 5 to 6 , Figure 5 The light distribution curve along the short side of the light blocking layer of the LED packaging device of this embodiment can be seen that the light intensity of the LED packaging device along the short side direction increases from 0 degrees to 60 degrees and then decreases, showing a bat-wing type curve, and the light output angle can achieve 150 degrees of light output. Figure 6 The light distribution curve along the long side of the light blocking layer of the LED packaging device of this embodiment can be seen that the light intensity of the LED packaging device along the long side direction decreases from 0 degrees to 90 degrees, showing a near-Lambert type curve, and the light output angle can achieve 130 degrees of light output; while weakening the light intensity in the center of the LED device, different angle ranges of light output and different light distribution curves can also be achieved in different directions.
[0038] In some alternative embodiments, the bottom of the cavity is hexagonal, and the cavity gradually expands outward along the opening direction. The hexagonal design of the cavity bottom can better match the shape of the LED chip, so that the light is more uniformly distributed in the cavity. At the same time, the gradual expansion of the cavity helps the light to spread more uniformly from the LED chip to the surrounding, further improving the uniformity of the light.
[0039] In some alternative embodiments, the LED chip is arranged at the center of the cavity. Arranging the LED chip at the center of the cavity can ensure that the light is uniformly radiated from the center of the chip to the surrounding. At the same time, the bowl-shaped design of the cavity also helps the light to be uniformly distributed in the cavity. Arranging the LED chip at the center of the cavity simplifies the design and production process of the packaged device.
[0040] In some alternative embodiments, the light blocking layer partially covers the surface of the LED chip. The light blocking layer partially covers the surface of the LED chip to block or reduce the light output in the central region. The area not covered by the light blocking layer continues to emit light, forming a more uniform light distribution. By adjusting the coverage area and position of the light blocking layer, the light output can be accurately controlled to meet the needs of different application scenarios. The design of the light blocking layer makes the light more uniformly distributed around the LED packaged device, improving the visual effect.
[0041] In some alternative embodiments, as shown in FIG. 1C, the light blocking layer is parallel to the LED chip and covers the middle line of the LED chip, with the bottom extending to the edge of the LED chip or beyond, leaving a gap on both sides. Figure 1 In some alternative embodiments, as shown in FIG. 1D, the light blocking layer is arranged along one of the diagonals of the LED chip, with a gap between the other diagonal on both sides. The light blocking layer is arranged along a specific diagonal line, which can form a specific light distribution pattern. The area not covered by the light blocking layer continues to emit light, forming a more uniform light distribution. At the same time, the gap between the other diagonal on both sides of the light blocking layer can ensure that the edge region has sufficient light output. By adjusting the position and size of the light blocking layer, different light distribution patterns can be formed to meet the needs of different application scenarios.
[0042] In some alternative embodiments, as shown in FIG. 1C, the light blocking layer is parallel to the LED chip and covers the middle line of the LED chip, with the bottom extending to the edge of the LED chip or beyond, leaving a gap on both sides. Figure 2 In some alternative embodiments, as shown in FIG. 1D, the light blocking layer is arranged along one of the diagonals of the LED chip, with a gap between the other diagonal on both sides. The light blocking layer is arranged along a specific diagonal line, which can form a specific light distribution pattern. The area not covered by the light blocking layer continues to emit light, forming a more uniform light distribution. At the same time, the gap between the other diagonal on both sides of the light blocking layer can ensure that the edge region has sufficient light output. By adjusting the position and size of the light blocking layer, different light distribution patterns can be formed to meet the needs of different application scenarios.
[0043] In some alternative embodiments, as shown in FIG. 1D, the light blocking layer is arranged along one of the diagonals of the LED chip, with a gap between the other diagonal on both sides. The light blocking layer is arranged along a specific diagonal line, which can form a specific light distribution pattern. The area not covered by the light blocking layer continues to emit light, forming a more uniform light distribution. At the same time, the gap between the other diagonal on both sides of the light blocking layer can ensure that the edge region has sufficient light output. By adjusting the position and size of the light blocking layer, different light distribution patterns can be formed to meet the needs of different application scenarios. Figures 3-4As shown, the bottom surface shape of the light blocking layer is square, rectangular or polygonal, and the three-dimensional structure is prism or prism. Different shapes and structures of the light blocking layer can affect the propagation and distribution of light. The square, rectangular or polygonal bottom surface shape and the prism or prism three-dimensional structure can form different light distribution patterns. By selecting different bottom surface shapes and three-dimensional structures, different light distribution patterns can be formed to meet the needs of different application scenarios.
[0044] In some optional embodiments, the light blocking layer is composed of transparent thermosetting resin material filled with reflective material with reflectivity of 60-70% and transmittance of 20-40%. The transparent thermosetting resin material provides structural support, and the reflective material is used to block and reflect light. The reflectivity is controlled between 60-70%, which can ensure that most of the light is reflected back to the inside of the LED chip or diffused around; the transmittance is controlled between 20-40%, which can ensure that part of the light passes through the light blocking layer and radiates out. By controlling the reflectivity and transmittance reasonably, efficient light blocking and reflection can be achieved, reducing central light emission and improving light uniformity. The transparent thermosetting resin material has good stability and durability, which can ensure that the packaged device maintains stable performance during long-term use.
[0045] In some optional embodiments, the encapsulation adhesive layer is a transparent or fluorescent powder-containing thermosetting resin material.
[0046] The encapsulation adhesive layer not only provides protection and fixation, but also can add fluorescent powder as needed to adjust the light color. The transparent encapsulation adhesive layer can ensure that the light passes through smoothly and radiates out; the encapsulation adhesive layer containing fluorescent powder can convert the light emitted by the LED chip into light of other colors. By adding different types of fluorescent powder, different color light emitting effects can be achieved to meet the needs of different application scenarios.
[0047] In some optional embodiments, the LED chip is one of a normal chip, a vertical chip or a flip chip, and the shape is one of a cube or a cuboid. Different types of LED chips have different light emitting characteristics and packaging requirements. Normal chips, vertical chips and flip chips differ in light emitting efficiency, heat dissipation performance and packaging structure; the shape of a cube or a cuboid affects the distribution of light and the appearance of the packaged device. By selecting different types and shapes of LED chips, the needs of different application scenarios for light emitting characteristics and packaging forms can be met. The same type of LED chip and shape can optimize the performance of the packaged device, improve the light emitting efficiency, heat dissipation performance and stability.
[0048] The above merely describes preferred embodiments of the present application, and is not intended to limit the present application in any form. Any modification, equivalent change and modification of the above embodiments, which does not deviate from the technical solution of the present application and is based on the technical essence of the present application, still belongs to the scope of the technical solution of the present application.
Claims
1. An LED package device that reduces center light emission, characterized by, The application relates to a LED packaging device for reducing central light emission. The bracket is internally provided with a bowl-shaped cavity, one side of the LED chip is attached to the bottom of the cavity, the other side of the LED chip is attached to one side of the die-bonding adhesive layer, one side of the die-bonding adhesive layer is attached to one side of the light-blocking layer, the other side of the packaging adhesive layer faces the opening of the bracket, the packaging adhesive layer covers the surfaces of the LED chip, the die-bonding adhesive layer and the light-blocking layer, and the surface of the packaging adhesive layer is flush with the edge of the opening of the bracket.
2. The LED packaging device for reducing central light emission according to claim 1, wherein the bottom of the cavity is hexagonal, and the cavity gradually expands outward along the opening direction.
3. The LED packaging device for reducing central light emission according to claim 1, wherein the LED chip is arranged at the center of the cavity.
4. The LED packaging device for reducing central light emission according to claim 1, wherein the light-blocking layer covers part of the surface of the LED chip.
5. The LED packaging device for reducing central light emission according to claim 4, wherein the light-blocking layer is parallel to the LED chip, the light-blocking layer covers the middle line of the LED chip, the bottom of the light-blocking layer extends to the edge of the LED chip and is flush with or exceeds the edge of the LED chip at both ends of the bottom of the light-blocking layer, and the bottom of the light-blocking layer leaves a gap with the edge of the LED chip at both sides.
6. The LED packaging device for reducing central light emission according to claim 4, wherein the light-blocking layer is arranged along the line connecting one pair of angles of the LED chip, and the light-blocking layer leaves a gap between the other pair of angles of the LED chip.
7. The LED packaging device for reducing central light emission according to claim 1, wherein the bottom surface of the light-blocking layer is in the shape of one of a square, a rectangle and a polygon, and the three-dimensional structure of the light-blocking layer is one of a prism and a prismatic column.
8. The LED packaging device for reducing central light emission according to claim 1, wherein the light-blocking layer is composed of a transparent thermosetting resin material.
9. The LED packaging device for reducing central light emission according to claim 1, wherein the packaging adhesive layer is one of a transparent thermosetting resin material and a thermosetting resin material containing fluorescent powder.
10. The LED packaging device for reducing central light emission according to claim 1, wherein the LED chip is one of a normal chip, a vertical chip and a flip chip, and the shape of the LED chip is one of a cube and a cuboid.