Light-emitting device

Abstract

The utility model discloses a light-emitting device which comprises a light-emitting unit and an optical component. The light-emitting unit comprises a metal support, and at least one part of the metal support extends to the optical component from the periphery of the light-emitting unit to form an outer metal part. The light-emitting unit and the outer metal part are covered by the optical component and embedded into the optical component, at least one part of the outer end face of the outer metal part extends to the outer side face of the optical component, and the outer side face of the optical component is flush with at least one part of the outer end face of the outer metal part. And an electric connection terminal for connecting the light-emitting unit with an external circuit is formed at the bottom of the metal bracket, and is exposed at the bottom of the optical component. The LED lamp has the advantages that the thickness is small, the lighting effect consistency is good, and the optical component is tightly combined with the metal support and the resin shell.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a light emitting device. BACKGROUND

[0002] MINI LED backlight module can realize local dimming, and display quality is greatly improved, which is favored by the market. Figure 1a and Figure 1b A mainstream scheme in the market at present is a POB (Package on Board) scheme, which attaches a lamp bead device (i.e. LED package) 01 on a PCB board 02, and then attaches an optical lens (LENS) 03 on the PCB board 02 by means of adhesion, and covers the lamp bead device 01, as shown in Figure 1b The light efficiency consistency of the final product may be poor due to the influence of the attachment precision and yield of the lamp bead device and the lens, and the attachment efficiency and cost of the lens, resulting in low cost performance of the scheme. In addition, the lens has a large volume (much larger than that of the lamp bead device), so that the thickness of the backlight module is large. SUMMARY

[0003] In view of the above deficiencies of the related art, the purpose of the present application is to provide a light emitting device and a backlight module, aiming to solve the problems of poor light efficiency consistency and large thickness of the backlight module in the prior art.

[0004] The present application provides a light emitting device, comprising a light emitting unit and an optical component; the light emitting unit comprises a metal support, at least a part of the metal support extends from the periphery of the light emitting unit to the optical component to form an outer metal part; the light emitting unit and the outer metal part are covered by and embedded in the optical component, and at least a part of the outer end surface of the outer metal part extends to the outer side surface of the optical component, the outer side surface of the optical component is flush with at least a part of the outer end surface of the outer metal part, the bottom of the metal support forms an electrical connection terminal for connecting the light emitting unit and an external circuit, and the electrical connection terminal is exposed at the bottom of the optical component.

[0005] In an optional embodiment, the outer metal part comprises at least one long branch part extending to the side surface of the optical component, and a short branch part extending out of the periphery of the light emitting unit but not extending to the side surface of the optical component; the outer end surface of the long branch part is flush with the outer side surface of the optical component.

[0006] In an optional embodiment, at least one side of the light emitting unit is provided with at least two long branch parts, and the short branch part is arranged between the at least two long branch parts; the outer side surface of the long branch part or the short branch part is in a shape of ups and downs.

[0007] In an alternative embodiment, the outer metal part surface is provided with at least one through hole or groove, and the optical component fills the through hole or groove.

[0008] In an alternative embodiment, the outer metal part surface is provided with at least one through hole, and a receiving space is provided below the through hole, and part of the material of the optical component fills the receiving space after passing through the through hole.

[0009] In an alternative embodiment, the optical component comprises a concave part located at the middle of the top of the optical component and a convex part extending outward from the concave part and forming a surrounding of the concave part, and a base located below the convex part, wherein the concave part and the convex part are curved surfaces, the side of the base is a plane, and the concave part is located directly above the light emitting unit.

[0010] In an alternative embodiment, the optical component further comprises a horizontal plane between the side of the base and the convex part, and the side of the base is a vertical plane perpendicular to the horizontal plane.

[0011] In an alternative embodiment, the outer side surface of the light emitting unit is provided with a stepped structure, and the optical component covers the stepped structure.

[0012] In an alternative embodiment, the light emitting unit further comprises a resin shell, an LED light emitting chip, and a sealing member, wherein the resin shell is formed on the metal support, the resin shell is provided with a receiving cavity in the middle for accommodating the LED light emitting chip, part of the surface of the metal support is exposed to the bottom surface of the receiving cavity, the LED light emitting chip is mounted in the receiving cavity and electrically connected with the metal support, and the sealing member fills the receiving cavity to seal the LED light emitting chip, and the resin shell is a light-transmitting material.

[0013] In an alternative embodiment, the sealing member contains a wavelength conversion material, the bottom of the electrical connection terminal is provided with a concave part, and the surface of the metal support is provided with a light reflecting layer. Advantages

[0014] Compared with the prior art, the light emitting device provided by the present application has the advantages of more compact structure, smaller volume, smaller thickness, and better light efficiency consistency, and the optical component, the resin shell and the metal support are combined with each other, the combination force is better, the optical component is not easy to fall off, and the area of the metal support can also be made larger, which can increase the heat dissipation area and the welding area between the light emitting device and other electrical components. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1a and Figure 1b Fig. 1 shows a structure schematic diagram of mounting an LED lamp bead device and a lens on a PCB in the prior art;

[0016] Figure 2a Fig. 1 shows a top view of a light emitting device according to an embodiment;

[0017] Figure 2b Fig. 2 shows a cross-sectional view of A-A of Fig. 1; Figure 2a

[0018] Figure 3a Fig. 3 shows a top view of a light emitting device according to an embodiment; Figure 3b

[0019] Fig. 4 shows a top view of a light emitting device according to an embodiment; Figure 4a

[0020] Fig. 5 shows a cross-sectional view of B-B of Fig. 4; Figure 4b Figure 4a

[0021] Fig. 6 shows a top view of a light emitting device according to an embodiment; Figure 5a

[0022] Fig. 7 shows a top view of a light emitting device according to an embodiment; Figure 5b

[0023] Fig. 8 shows a top view of a light emitting device according to an embodiment; Figure 5c

[0024] Fig. 9 shows a top view of a light emitting device according to an embodiment; Figure 6

[0025] Fig. 10 shows a top view of a light emitting device according to an embodiment; Figure 7a

[0026] Fig. 11 shows a cross-sectional view of C-C of Fig. 10; Figure 7b Figure 7a Fig. 12 shows a cross-sectional view of a light emitting device according to an embodiment;

[0027] Figure 8 Fig. 13 shows a cross-sectional view of a light emitting device according to an embodiment;

[0028] Figure 9 Fig. 14 shows a cross-sectional view of a light emitting device according to an embodiment;

[0029] Figure 10 Fig. 15 shows a cross-sectional view of a light emitting device according to an embodiment. DETAILED DESCRIPTION

[0030] ​​​For the purposes of this application, a more complete description of the application will be presented in the following with reference to the accompanying drawings. The drawings show preferred embodiments of the application. However, the application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, the purpose of these embodiments is to make the disclosure of the application more thorough and comprehensive.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. Embodiment One

[0032] With reference to Figure 2a And Figure 2b The embodiment provides a light emitting device 100, comprising a light emitting unit 20 and an optical component 150. The light emitting unit 20 comprises a metal support 110, at least a part of the metal support 110 extending from the periphery of the light emitting unit 20 to the optical component 150 to form an outer metal part 112; the light emitting unit 20 and the outer metal part 112 are covered by and embedded in the optical component 150, and at least a part of the outer end surface 1121 of the outer metal part 112 extends to the outer side surface 151 of the optical component 150, and the outer side surface 151 of the optical component 150 is flush with at least a part of the outer end surface 1121 of the outer metal part 112. The bottom of the metal support 110 forms electrical connection terminals 110a and 110b for connecting the light emitting unit 20 to external circuits, and the electrical connection terminals 110a and 110b are exposed at the bottom of the optical component 150.

[0033] In the embodiment, the light emitting unit 20 comprises, in addition to the metal support 110, a resin housing 120, an LED light emitting chip 130, a sealing member 140, and the optical component 150. The resin housing 120 is formed on the metal support 110; the resin housing 120 has a receiving cavity 121 in the middle for accommodating the LED light emitting chip 130, and a part of the surface 111 of the metal support 110 is exposed at the bottom surface of the receiving cavity 121, and the LED light emitting chip 130 is mounted in the receiving cavity 121 and electrically connected to the metal support 110; the sealing member 140 is filled in the receiving cavity 121 to seal the LED light emitting chip 130; and the optical component 150 covers the upper surface and the side surface of the resin housing 120. The outer metal part 112 can be formed by the part of the metal support extending out of the range of the resin housing 120.

[0034] In other embodiments, the light emitting unit 20 can also have other structures. For example, the light emitting unit 20 can only include the LED light emitting chip 130 and the metal support, without the resin shell and the sealing member. The outer metal part 112 can be formed by the part of the metal support extending out of the LED light emitting chip. For another example, the light emitting unit 20 can only include the LED light emitting chip 130 and the metal support and the light-transmitting sealing member, without the resin shell. The outer metal part 112 can be formed by the part of the metal support extending out of the LED light emitting chip.

[0035] In the present embodiment, the optical component 150 is made of a light-transmitting material, for example, the optical component 150 can be made of a transparent resin material. The function of the optical component 150 is to perform secondary distribution of the light generated by the light emitting unit. The optical component 150 can also be referred to as a lens.

[0036] In the present embodiment, the material of the resin shell 120 can be PCT resin or EMC resin or PPA resin or SMC resin.

[0037] In the present embodiment, the outer contour of the resin shell 120 is circular, and in other embodiments, the shape of the resin shell 120 can also be square or other shapes.

[0038] In the present embodiment, the metal support 110 includes two metal plates that are symmetrically arranged and insulated from each other, and the two metal plates are also the electrical connection terminals 110a and 110b for connecting the light emitting unit 20 and the external circuit. The LED light emitting chip 130 is a flip-chip LED chip, and the electrical connection terminals 110a and 110b are respectively connected to the positive and negative electrodes of the LED chip. In other embodiments, as shown in Figure 4a and Figure 4b The electrical connection terminals 110a and 110b are asymmetric in shape, and the LED light emitting chip 130 is a normal-chip LED chip, but the two metal plates are symmetrically arranged with respect to the geometric center of the light emitting device 100, which has the advantage of making the light emitting pattern of the light emitting device uniform.

[0039] The resin shell 120 and the metal support 110 and the sealing member 140 encapsulate the LED light emitting chip 130 in the accommodating cavity 121 of the resin shell 120 to form an LED encapsulation structure (i.e. an exemplary structure of a light emitting unit), and the optical component 150 is directly covered and formed on the resin shell 120 and the metal support 110. The optical component 150 can be designed into the shape of a lens according to the required optical effect, and there is no need to separately provide an independent lens component. Since the separately designed lens component needs to consider the assembly structure with the LED encapsulation device, the volume is usually relatively large. Since the optical component 150 of the present application is directly formed on the LED encapsulation structure, there is no need to separately design an assembly structure for cooperation with the LED encapsulation device, and therefore the structure is more compact, the volume is smaller, and the thickness is smaller. There is no active space between the optical component and the LED encapsulation structure, the relative position is fixed, and there is no problem of poor light efficiency consistency caused by the deviation of the assembly precision of the LED encapsulation and the lens in the prior art. The light emitting device 100 of the present application has better light efficiency consistency.

[0040] In the present embodiment, the metal support 110 extends out of the resin shell 120 and contacts the optical component 150, so that the optical component 150 simultaneously contacts the resin shell 120 and the metal support 110, and the three are combined with each other, the combination force is better, the optical component 150 is not easy to fall off, and the area of the metal support 110 can also be made larger to increase the heat dissipation area and increase the welding area between the light emitting device 100 and other electrical components.

[0041] Reference Figure 3a And Figure 3b When the light emitting device 100 is attached to the PCB 200, the electrical connection terminals 110a and 110b at the bottom of the light emitting device 100 are respectively electrically connected to the positive electrode pad 200a and the negative electrode pad 200b on the PCB. The PCB 200 includes a substrate layer 210, a circuit layer 220 disposed on the substrate layer 210, and a solder resist layer 230 covering the circuit layer 220 and the substrate layer 210. The solder resist layer 230 is windowed at positions corresponding to the positive electrode pad 200a and the negative electrode pad 200b, so as to expose the positive electrode pad 200a and the negative electrode pad 200b.

[0042] In the present embodiment, reference Figure 2bAs shown, the optical component 150 includes a concave portion 152 and a convex portion 153 extending outwardly from the concave portion 152 and forming a rim around the concave portion 152, and a base 151 located below the convex portion 153. The concave portion 152 and the convex portion 153 are both curved surfaces, and the side surface of the base 151 of the optical component 150 is a flat surface. The concave portion 152 is located directly above the light emitting unit 20, i.e. the geometric centers of the two are substantially overlapped, which has the advantage of making the light emitted by the light emitting device 100 more divergent and uniform, and avoiding the light intensity being too high at the central axis position of the light emitting device. In other embodiments, the optical component 150 can also be semi-spherical or other shapes.

[0043] In an alternative embodiment, referring to Figure 8 and Figure 9 , the optical component 150 further includes a horizontal surface 154 between the side surface of the base 151 and the convex portion 153, and the side surface 154 of the optical component 150 is a vertical surface perpendicular to the horizontal surface 154. The edge of the convex portion 153 can be located within the horizontal surface 154 and there is a gap between the edge of the convex portion 153 and the edge of the horizontal surface 154, or the edge of the convex portion 153 can be tangent to the edge of the horizontal surface 154. This horizontal surface can provide a horizontal reference surface for the design of the convex portion 153 and the concave portion 152 of the optical component, facilitate the optical design of the shape of the convex portion 153 and the concave portion 152, improve the design tolerance of the optical component 150, and reduce the difficulty of product design.

[0044] In this embodiment, the light emitting device 100 has at least four side surfaces 101, 102, 103, and 104, and two opposite side surfaces 103 and 104. The outer metal portion 112 has two, which respectively extend outwardly from the two sides of the two electrical connection terminals 110a and 110b to the outer side surfaces 103 and 104 of the light emitting device 100 (i.e. the outer side surfaces of the optical component 150), referring to Figure 2a and Figure 4a As shown, the two outer metal portions 112 are block-shaped and have a large area, so that the contact area between the optical component 150 and the upper surface of the metal support 110 is large enough, increasing the bonding force between the metal support 110 and the optical component 150, and at the same time, the light emitting device has a larger heat dissipation area, reducing the thermal resistance, and is suitable for use in high-power products. Figure 2a and Figure 4a In the embodiment shown, the outer metal portion 121 of the light emitting device 100 does not extend to the other two surfaces 101 and 102, but in other embodiments, referring to Figure 5b , the outer metal portion 121 can also extend partially to the other two surfaces 101 and 102. Figure 2a and Figure 4a The outer metal portion 112 in the embodiment shown can also be designed to be larger according to actual application conditions.

[0045] In an alternative embodiment, referring to Figure 3bThe resin shell 120 is made of a light-transmitting material. The light emitted by the LED light emitting chip 130 can be emitted from the side of the resin shell 120, which can improve the light emission rate of the light emitting device 100 and make the light emitted by the light emitting device 100 more divergent, avoiding too high light intensity at the top.

[0046] In an alternative embodiment, the surface of the metal support 110 is provided with a light reflecting layer (not shown), which can reflect the light incident on the surface of the metal support 110, reduce the absorption and loss of light, and improve the light emission rate of the light emitting device 100.

[0047] In an alternative embodiment, the sealing member 140 contains a wavelength conversion material. The wavelength conversion material can be a fluorescent powder or a quantum dot powder. By mixing the light emitted by the LED light emitting chip 130 and the excitation light of the wavelength conversion material, various colors of light can be obtained.

[0048] In an alternative embodiment, as shown in Figure 9 , the outer side of the light emitting unit 20 is provided with a stepped structure. Specifically, for this embodiment, the outer side of the light emitting unit 20, i.e. the outer side of the resin shell, is provided with a stepped structure 122 or a reinforcing component (such as a reinforcing rib, not shown in this embodiment) on the periphery of the resin shell 120, and the optical component 150 covers the stepped structure 122 or the reinforcing component. The stepped structure or the reinforcing component can strengthen the mechanical strength of the resin shell 120 and increase the bonding force between the resin shell 120 and the optical component 150 and the metal support 110.

[0049] In an alternative embodiment, as shown in Figure 10 , the bottom of the metal support 110 is provided with a recess 113. This can provide a space for accommodating the solder paste when the light emitting device 100 is attached to the PCB 200, which can limit the solder paste in the third recess 113 and reduce the flow of solder paste to the area of the bottom of the metal support 100 that is not in the recess 113, which can cause inconsistent posture of the light emitting device during attachment and result in poor optical consistency. Embodiment Two

[0050] As an alternative embodiment, as shown in Figure 5a and Figure 5b , different from the first embodiment, the outer metal part 112 in this embodiment includes a long branch part 112a extending to the side of the light emitting device 100, and a short branch part 112b extending out of the resin shell 120 but not extending to the side of the light emitting device 100. The outer end surface 1121 of the long branch part 112a is flush with the outer side surface 151 of the optical component 150 (as shown in Figure 2b and Figure 4b ); the short branch part 112b is covered by the optical component 150. In an alternative embodiment, as shown in Figure 5aAs shown, the metal support 100 has two outer metal parts 121, each outer metal part 121 has only one long branch 112a, the outer end surface 1121 of the two outer metal parts 112 extends to the two opposite sides of the light emitting device 100, and the outer metal part 112 is a short branch 112b except the long branch 112a, the area of the short branch is small, which can reduce the use of metal support material and reduce production cost. Figure 5a and Figure 5b As shown in the embodiment, the outer metal part 112 located at the side 104 is rotationally symmetrical to the outer metal part 112 located at the side 103 relative to the geometric center of the light emitting device. Figure 5b In the embodiment, in addition to the two opposite sides 103 and 104 provided with the outer metal part 112, the other two opposite sides 101 and 102 are also provided with the outer metal part 112 extended from the metal support 110, so as to further increase the bonding force between the metal support 110 and the optical component 150. Figure 5b In the embodiment, the short branch 112b is arranged between the two long branches 112a located at the sides 103 and 104 of the light emitting device 100 respectively, and the optical component 150 fills the space between the two long branches 112a, so that the two long branches 112a form a structure for clamping the optical component 150, and the bonding force between the optical component 150 and the metal support 110 is better. In other embodiments, the number of long branches 112a provided on the outer metal part 121 can also be three or four or other numbers, and the outer end surfaces of the long branches 112a are discontinuous contact. Figure 5b In the embodiment, the outer metal part 112 located at the sides 101 and 102 of the light emitting device 100 is a long branch 112a, and there is no short branch between the two long branches 112a, so that the resin shell 120 can be combined with the side of the metal support 110, and the bonding force between the resin shell 120 and the metal support 110 is enhanced. It can be understood that a short branch can also be arranged between the two long branches 112a.

[0051] In an alternative embodiment, referring to Figure 5c As shown, the outer side surface of the short branch 112b is in a shape of ups and downs, which can enhance the bonding force between the optical component 150 and the metal support 110. It can be understood that the side surface of the long branch 112a in contact with the optical component 150 can also be in a shape of ups and downs, so as to enhance the bonding force between the optical component 150 and the metal support. Embodiment three

[0052] Referring to Figure 6 As shown, the outer metal part 112 of the embodiment is provided with at least one through hole 1122 on the basis of the above two embodiments, and the optical component 150 fills the through hole 1122, which can increase the bonding force between the optical component 150 and the metal support. Figure 6The light emitting device 100 shown has four through holes 1122, in other embodiments, the through holes 1122 can also be one or two or three or other number. The through holes can also be provided on the long or short branch described in embodiment two (not shown).

[0053] Reference Figure 7a As shown, the outer metal part 112 is provided with a through hole 1122, which is in the shape of a capsule. And the outer metal part 121 is bent upwards and then horizontally extended to the outer side of the light emitting device 100, thereby leaving a containing space 1123 on the back of the metal support 150, so that part of the material of the optical component 150 fills the containing space 1123 after passing through the through hole 1122. Thus the upper and lower surfaces of the through hole 1122 are in contact with the optical component. The advantage of this is that the combination of the optical component 150 and the metal support 110 is more compact and has better bonding force.

[0054] It should be understood that the application of the present application is not limited to the above examples, and those of ordinary skill in the art can make improvements or changes according to the above description, and all such improvements and changes shall fall within the scope of the claims appended to the present application.

Claims

1. A light emitting device, characterized by, The application relates to a light-emitting unit and an optical component; the light-emitting unit comprises a metal support, at least a part of the metal support extends from the periphery of the light-emitting unit to the optical component to form an outer metal part; the light-emitting unit and the outer metal part are covered by the optical component and embedded in the optical component, and at least a part of the outer end surface of the outer metal part extends to the outer side surface of the optical component; the bottom of the metal support forms an electric connection terminal for connecting the light-emitting unit with external circuits, and the electric connection terminal is exposed on the bottom of the optical component.

2. The light emitting device of claim 1, wherein The outer metal part comprises at least one long branch part extending to the side surface of the optical component and at least one short branch part extending out of the periphery of the light-emitting unit but not extending to the side surface of the optical component; the outer end surface of the long branch part is flush with the outer side surface of the optical component.

3. The light emitting device of claim 2, wherein At least one side of the light-emitting unit is provided with at least two long branch parts, and the at least two long branch parts are provided with the short branch part; the outer side surface of the long branch part or the short branch part is in a shape of ups and downs.

4. The light emitting device of claim 1, wherein The surface of the outer metal part is provided with at least one through hole or groove, and the through hole or groove is filled with the optical component.

5. The light emitting device of claim 1, wherein The surface of the outer metal part is provided with at least one through hole, and the through hole is provided with a containing space below; part of the material of the optical component fills the containing space after passing through the through hole.

6. The light emitting device of claim 1, wherein The optical component comprises a recess located at the middle position of the top of the optical component and a convex part extending outwards from the recess and forming a surrounding part of the recess; the optical component further comprises a base located below the convex part; the recess and the convex part are both curved surfaces; the side surface of the base is a plane; and the recess is located directly above the light-emitting unit.

7. The light emitting device of claim 6, wherein The optical component further comprises a horizontal surface located between the side surface of the base and the convex part; and the side surface of the base is a vertical surface perpendicular to the horizontal surface.

8. The light emitting device of claim 1, wherein The outer side surface of the light-emitting unit is provided with a step structure, and the step structure is covered by the optical component.

9. The light emitting device of claim 1, wherein The light-emitting unit further comprises a resin shell, an LED light-emitting chip and a sealing member; the resin shell is formed on the metal support; the resin shell is provided with a containing cavity for containing the LED light-emitting chip; part of the surface of the metal support is exposed on the bottom surface of the containing cavity; the LED light-emitting chip is mounted in the containing cavity and electrically connected with the metal support; the sealing member is filled in the containing cavity to seal the LED light-emitting chip; and the resin shell is made of a light-transmitting material.

10. The light emitting device of claim 9, wherein The sealing member contains a wavelength conversion material; the bottom of the electric connection terminal is provided with a recess; and the surface of the metal support is provided with a light reflection layer.

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