Multi-pixel integrated LED module

Abstract

The utility model provides a multi-pixel integrated LED (light-emitting diode) module. The multi-pixel integrated LED module comprises a PCB (printed circuit board), a radiator, a control circuit and a 0R connecting resistor, the radiator is arranged on one side of the PCB, and the control circuit and the 0R connecting resistor are arranged on the other side of the PCB; the PCB is formed by embedding an LED circuit board and a PCBA circuit board, and the LED circuit board is exposed to the bottom of the PCB and connected with the radiator. The PCB is formed by embedding and pressing the LED substrate circuit board and the module circuit board, so that the LED substrate is directly contacted with the radiator, the heat-conducting property is greatly improved, and meanwhile, the cost can be reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to LED module technical field, concretely relates to a kind of multi-pixel integrated LED module. BACKGROUND

[0002] The existing multi-pixel integrated LED module structure, because of the heat concentration of multi-pixel LED, its substrate is usually adopted the substrate with superior heat dissipation performance, the chip is fixedly welded on the substrate, then LED encapsulation is carried out, and it is installed on the PCB by the assembly of welding, WIRE bonding, glue sealing process.Using this way, the heat dissipation performance of LED is low, and its heat dissipation is first through the laminated structure of each layer of PCB and then conducts heat to the heat sink, and the heat dissipation performance of module structure is poor, in order to the heat dissipation performance of module, the PCBA module circuit board is usually selected high-thermal-conductivity metal plate, and its multilayer plate cost is high, and currently the most selected is 2 layers of plate. Or LED adopts CSP encapsulation process, then multiple LED arrangement interval is small, light source density is increased to improve brightness, and heat management performance is good, and LED can be directly attached on PCB, but CSP process requires high, equipment requires high, and realization cost is higher. SUMMARY

[0003] In order to overcome the above technical defects, the utility model provides a kind of multi-pixel integrated LED module, which can improve heat dissipation performance and reduce cost.

[0004] In order to solve the above problems, the utility model is realized according to the following technical scheme:

[0005] A kind of multi-pixel integrated LED module, including: PCB board, heat sink, control circuit, 0R connection resistance;

[0006] The heat sink is arranged on one side of the PCB board, and the control circuit and the 0R connection resistance are arranged on the other side of the PCB board;

[0007] The PCB board is inlaid by LED circuit board and PCBA circuit board, and the LED circuit board is exposed to the bottom of the PCB board and connected with the heat sink.

[0008] As a further improvement of the utility model, the PCBA circuit board is provided with a pad corresponding to the electrical polarity pad on the LED circuit board.

[0009] As a further improvement of the utility model, one end of the 0R connection resistance is arranged on the LED circuit board, and the other end is arranged on the PCBA circuit board.

[0010] As a further improvement of the utility model, the thickness of the LED circuit board and the PCBA circuit board is equal.

[0011] As a further improvement of the utility model, the control circuit adopts FR4 multilayer board.

[0012] Compared with the prior art, the utility model has the advantages that the PCB board is obtained by inlaying and pressing the LED base material circuit board and the module circuit board, the LED base plate directly contacts with the radiator, the heat conduction performance is greatly improved, and the cost can be reduced. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 It is the schematic view of the standby power supply device in actual application of the utility model;

[0014] Figure 2 It is the structural schematic view of the standby power supply device of the utility model;

[0015] Figure 3 It is the connection schematic view of the OR connecting resistance of the utility model.

[0016] Mark 1, PCB board; 11, LED circuit board; 12, PCBA circuit board; 2, control circuit; 3, radiator; 4, OR connecting resistance. DETAILED DESCRIPTION

[0017] The preferred embodiments of the utility model are described below in combination with the drawings, and it should be understood that the preferred embodiments described herein are only used for illustrating and explaining the utility model, and are not used for limiting the utility model.

[0018] The utility model provides a kind of multi-pixel integrated type LED module, as shown in Figure 1 And Figure 2 As shown, including: PCB board 1, radiator 3, control circuit 2, OR connecting resistance 4;Radiator 3 is arranged in one side of PCB board 1, control circuit 2, OR connecting resistance 4 are arranged in the other side of PCB board 1;PCB board 1 is inlaid and combined by LED circuit board 11 and PCBA circuit board 12, and LED circuit board 11 is exposed to the bottom of PCB board 1 and is connected with the radiator 3.

[0019] PCBA circuit board 12 is provided with pad corresponding to electrical polarity pad on LED circuit board 11, to facilitate the electrical connection between OR resistance and LED and module.

[0020] One end of the OR connecting resistor 4 is arranged on the LED circuit board 11, and the other end is arranged on the PCBA circuit board 12. In the prior art integrated LED, gold wire bonding is needed to realize electrical connection, and the gold wire needs to be fixed and protected by sealing glue, which has high process cost and low reliability. Therefore, in the utility model, the electrical connection between the multi-pixel integrated LED and the module control circuit is realized through the OR connecting resistor 4, and the OR connecting resistor 4 replaces the traditional bonding process to realize the electrical connection between the multi-pixel integrated LED and the module control circuit.

[0021] The thicknesses of the LED circuit board 11 and the PCBA circuit board 12 are equal.

[0022] Further, the control circuit 2 adopts an FR4 multilayer board, which has better cost, better wiring, and better EMI effect.

[0023] Next, the utility model will be further explained in combination with the specific manufacturing process as follows:

[0024] S1, the LED circuit board 11 and the PCBA circuit board 12 are inlaid and combined into a PCB board 1, so that the base material of the LED circuit board 11 is exposed to the bottom of the PCB board 1, wherein the thicknesses of the LED circuit board 11 and the PCBA circuit board 12 are equal.

[0025] When designing the layout, the pads corresponding to the electrical polarity pads on the LED circuit board 11 are arranged on the PCBA circuit board 12 to prepare for the subsequent process.

[0026] S2, after the whole PCB board 1 is pressed and made, the LED circuit board 11 is subjected to the processes of die bonding, fluorescent sheet fixing, damming, and glue dispensing.

[0027] S3, the PCB board 1 is subjected to SMT patch processing to obtain a PCBA module; the control circuit 2 and the OR connecting resistor 4 are attached to the PCB board 1. One end of the OR connecting resistor 4 is arranged on the LED circuit board 11, and the other end is arranged on the PCBA circuit board 12.

[0028] S4, the exposed base material of the LED circuit board 11 is fixed and installed with the heat sink 3 to obtain a multi-pixel integrated LED module.

[0029] In summary, the embodiment is by embedding the integrated LED substrate circuit board in the PCBA module circuit board, so that the LED substrate can be in direct contact with the heat sink, the heat dissipation performance is greatly improved, and the PCBA module circuit board substrate can be selected from FR4 multilayer board, the cost is reduced, and the module wiring is optimized. Since the integrated LED substrate circuit board and the PCBA module circuit board have been embedded into a whole circuit board, through one-to-one corresponding pad design, 0R resistance can be used to realize the connection between the multi-pixel integrated LED and the module control circuit, eliminating the bonding and glue fixing processes, optimizing the process cost and avoiding the reliability risk problems such as easy breaking and short circuit of the gold wire of bonding.

[0030] The above is only a preferred embodiment of the present application, and is not intended to limit the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A multi-pixel integrated LED module, characterized by, Comprise: PCB board, radiator, control circuit, OR connecting resistance; The radiator is arranged on one side of the PCB board, and the control circuit and the OR connecting resistance are arranged on the other side of the PCB board; The PCB board is composed of an LED circuit board and a PCBA circuit board, and the LED circuit board is exposed to the bottom of the PCB board and connected with the radiator.

2. The multi-pixel integrated LED module of claim 1, wherein, The PCBA circuit board is provided with pads corresponding to the electrical polarity pads on the LED circuit board.

3. The multi-pixel integrated LED module of claim 1, wherein, One end of the OR connecting resistance is arranged on the LED circuit board, and the other end is arranged on the PCBA circuit board.

4. The multi-pixel integrated LED module of claim 1, wherein, The thickness of the LED circuit board and the PCBA circuit board is equal.

5. The multi-pixel integrated LED module of claim 1, wherein, The control circuit adopts an FR4 multilayer board.

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