Welding production line of non-standard perforated Hall sensor

Abstract

The utility model relates to a welding production line of a non-standard perforated Hall sensor. The welding production line comprises a solder paste printing machine, a solder paste printing detection machine, a chip mounter, a reflow soldering machine and an automatic optical detection machine, the solder paste printing machine comprises a bonding pad which is arranged in an oval shape, the bonding pad is printed on a PCB, and a bonding pad hole is formed in the bonding pad. The chip mounter is provided with a feeding area used for containing a tray, a material taking point, a PCB placing area, a picking piece, a first driving piece used for driving the picking piece to move up and down, and a second driving piece used for driving the picking piece to transversely slide between the material taking point and the PCB placing area. The reflow soldering machine is sequentially provided with a preheating area, a heat preservation area, a soldering area and a cooling area. By the adoption of the technical scheme, the welding production line of the non-standard perforated Hall sensor solves the problems that a traditional welding technology is low in welding yield, low in efficiency, high in requirement for equipment precision and the like.

Description

TECHNICAL FIELD

[0001] The utility model relates to a kind of welding production lines of non-standard perforation hall sensor. BACKGROUND

[0002] The traditional welding mode of non-standard perforation hall sensor with lead is generally: automatic welding (contact type) or laser welding (non-contact type) by manipulator;Automatic welding (contact type) by manipulator: insert the formed sensor into PCB pad manually, put into welding fixture, and solder by tin wire by manipulator (with iron head) contact pad heating;Laser welding (non-contact type): insert the formed sensor into PCB pad manually, put into welding fixture, and solder by tin wire by laser without contact pad heating.

[0003] The traditional welding process can meet the basic production requirements, but in actual application, the following shortcomings exist:

[0004] 1. The pad is small, and the welding precision and stability of the welding equipment are required higher;

[0005] 2. The welding equipment has high investment cost;

[0006] 3. The production efficiency is low;

[0007] 4. The production yield is relatively low, and continuous welding, virtual welding, missing welding and PCB burn are easy to occur;

[0008] 5. The maintenance cost is high, the laser generator attenuates, and the price of the vulnerable parts is high. SUMMARY

[0009] The utility model discloses a kind of welding production lines of non-standard perforation hall sensor, solve the problem of low yield rate, low efficiency, high equipment precision requirement of traditional welding process welding.

[0010] The technical scheme of the utility model discloses a kind of welding production lines of non-standard perforation hall sensor, including tin paste printing machine, tin paste printing detection machine, chip mounter, reflow soldering machine and automatic optical detection machine;Wherein,

[0011] Tin paste printing machine includes the pad of oval shape, pad is printed on PCB, and pad hole is provided on pad, and tin paste is printed on pad by doctor blade;

[0012] Chip mounter, the feeding area for being equipped with for holding tray on the chip mounter, pick-up point, PCB board placement area, pick-up piece, the first driving part for driving pick-up piece to make lifting motion and the second driving part for driving pick-up piece to make transverse sliding between pick-up point and PCB board placement area, pick-up piece sends the hall sensor at pick-up point to pad under the action of two driving parts, and the pin of hall sensor passes through pad hole.

[0013] The reflow soldering machine is sequentially provided with a preheating area, a holding area, a soldering area and a cooling area.

[0014] The Hall sensor is welded through the production line, and the yield of the welded product is high, thereby reducing the manufacturing cost.

[0015] The pickup member is provided with a clamping jaw, and the mounting seat is connected with the output shaft of the second driving member and the output shaft of the first driving member.

[0016] The pickup member is provided with a suction nozzle, and the suction nozzle is connected with the electromagnetic valve through a connecting pipe.

[0017] The pickup member is provided with a clamping jaw, and the mounting seat is connected with the output shaft of the second driving member and the output shaft of the first driving member.

[0018] The pickup member is provided with a clamping jaw, and the mounting seat is connected with the output shaft of the second driving member and the output shaft of the first driving member.

[0019] The pickup member is provided with a clamping jaw, and the mounting seat is connected with the output shaft of the second driving member and the output shaft of the first driving member.

[0020] The pickup member is provided with a clamping jaw, and the mounting seat is connected with the output shaft of the second driving member and the output shaft of the first driving member.

[0021] The pickup member is provided with a clamping jaw, and the mounting seat is connected with the output shaft of the second driving member and the output shaft of the first driving member.

[0022] The utility model discloses still further setting: still be equipped with mounting panel and the fourth drive that drive mounting panel slides along the X axle direction of tray and the fifth drive that drive mounting panel slides along the Y axle direction of tray in the chip mounter, the pickup, first drive and second drive all are equipped on mounting panel, and pickup is equipped with a plurality.

[0023] Adopt the above still further setting, can take a plurality of hall element simultaneously, more convenient and fast. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 For the device flow chart of the embodiment of the utility model;

[0025] Figure 2 For the schematic diagram of hall sensor insertion pad hole of the embodiment of the utility model;

[0026] Figure 3 For the schematic diagram of tray of the embodiment of the utility model;

[0027] Figure 4 For the schematic diagram of mounting seat and clamping jaw of the embodiment of the utility model;

[0028] Figure 5 For the schematic diagram of mounting seat and clamping jaw of the embodiment of the utility model;

[0029] Figure 6 For the schematic diagram of mounting seat of the embodiment of the utility model;

[0030] Figure 7 For the connection schematic diagram of third drive and clamping jaw of the embodiment of the utility model;

[0031] Figure 8 For the schematic diagram of mounting panel and each pickup of the embodiment of the utility model.

[0032] In the drawing, 1, solder paste printing machine;11, PCB board;12, pad hole;2, solder paste printing detection machine;3, chip mounter;31, pickup;311, mounting seat;312, clamping jaw;313, third drive;314, partition;315, first installation area;316, second installation area;32, first drive;33, second drive;34, mounting panel;4, reflow soldering machine;5, automatic optical detection machine;6, tray;61, placement hole;7, hall sensor;71, pin. DETAILED DESCRIPTION

[0033] The technical solutions in the embodiments will be described clearly and completely below with reference to the drawings. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts fall within the scope of the present application.

[0034] It should be noted that, in the description of the present application, all directional indications (such as up, down, front, back, etc.) are only used to explain the relative positional relationship, movement condition, etc. between components in a certain specific posture (as shown in the drawings), and if the specific posture changes, the directional indications also change accordingly.

[0035] In addition, the description of "first", "second" and the like in the present application is only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. In the description of the present application, the meaning of "several" is at least two, for example, two, three, etc., unless otherwise specifically limited.

[0036] In addition, the technical solutions of each embodiment of the present application can be combined with each other, but it must be based on the realization of the person skilled in the art, and when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, and is not within the protection scope required by the present application.

[0037] As shown in FIG. Figures 1-8 A soldering production line of a non-standard perforated Hall sensor includes a tin paste printing machine 1, a tin paste printing detection machine 2, a chip mounter 3, a reflow soldering machine 4, and an automatic optical detection machine 5. Among them,

[0038] The tin paste printing machine 1 includes an elliptical solder pad, which is printed on a PCB 11, and a solder pad hole is arranged on the solder pad. The tin paste is printed on the solder pad by a scraper, and after printing, the tin paste is checked by a detection machine to ensure that the tin paste printing meets the requirements.

[0039] The patch machine 3 is provided with a feeding area for placing a tray, a taking point, a PCB board 11 placing area, a pickup piece 31, a first driving piece 32 for driving the pickup piece 31 to make lifting movement, and a second driving piece 33 for driving the pickup piece 31 to make transverse sliding movement between the taking point and the PCB board 11 placing area. The pickup piece 31 sends the Hall sensor 7 at the taking point to the pad under the action of the two driving pieces. The pin 71 of the Hall sensor 7 penetrates through the pad hole 12. The first driving piece 32 and the second driving piece 33 are preferably provided with air cylinders. The first driving piece 32 is arranged on the output shaft of the second driving piece 33 or the second driving piece 33 is arranged on the output shaft of the first driving piece 32. Of course, the driving pieces can also be provided with motors.

[0040] The reflow soldering machine 4 is sequentially provided with a preheating area, a holding area, a soldering area and a cooling area. The automatic optical detection machine 5 can perform high-speed and high-precision visual processing and automatically detect whether the welding of each sensor on the pad is qualified. The solder paste printing machine 1, the detection machine, the reflow soldering machine 4 and the automatic optical detection machine 5 can be directly purchased from the market. The solder paste printing machine 1 prints solder paste on the pad. The Hall sensor is molded by a molding device to a fixed size. The molded Hall sensor is sequentially placed into a tray, and the tray is placed into the feeding area of the patch machine 3. The Hall sensor in the tray is picked up to the pad by the pickup piece 31. The pin is inserted from the pad hole. Finally, the reflow soldering is performed. The yield of the product after welding is high, and the manufacturing cost is reduced.

[0041] The reflow soldering machine 4 sets the furnace temperature. The highest temperature is ≤260℃, the temperature rising slope is ≤3℃ / s, and the temperature falling slope is ≤6℃ / s.

[0042] The preheating area preheats the PCB and components to achieve balance, removes water and solvent in the solder paste to prevent the solder paste from collapsing and the solder from splashing, and ensures that the temperature rises relatively slowly, the solvent volatilizes, and the thermal shock to the components is as small as possible. Too fast rising temperature can cause damage to the components, such as cracking of the multilayer ceramic capacitor, and can also cause solder splashing, forming solder balls and insufficient solder points in the entire non-welding area of the PCB.

[0043] The holding area ensures that the solder is completely dried before reaching the reflow temperature, and also plays a role in activating the flux to remove metal oxides in the components, pads and solder powder. The time is about 60-120 seconds, which is different according to the properties of the solder.

[0044] The solder in the solder paste in the welding area causes the gold powder to begin to melt and become fluid again, replacing the liquid flux to wet the pads and components. This wetting action causes the solder to further spread. For most solders, the wetting time is 60 to 90 seconds. The reflow temperature must be higher than the melting point of the solder paste. Generally, it must be 20 to 35 degrees Celsius higher than the melting point to ensure the quality of reflow. Sometimes this area is divided into two zones, namely the melting zone and the reflow zone.

[0045] The solder in the cooling zone solidifies as the temperature drops, allowing the components to form good electrical contact with the solder paste. The cooling speed requirement is the same as the preheating speed.

[0046] The picking member 31 is provided with a clamping claw 312, such as Figures 4-7 As shown, it includes a mounting base 311 and two oppositely arranged clamping jaws 312, the middle parts of the two clamping jaws 312 are hinged on the mounting base 311, and the upper parts of the two clamping jaws 312 are connected to the third driving member 313. The third driving member 313 drives the two clamping jaws 312 to move toward each other or away from each other to achieve the clamping or release of the Hall sensor. The mounting base 311 is connected to the output shaft of the second driving member 33, and the second driving member 33 is connected to the output shaft of the first driving member 32. When the third driving member 313 drives the lower parts of the clamping jaws 312 to move toward each other, the upper parts of the clamping jaws 312 move away from each other to achieve the release of the Hall sensor. When the third driving member 313 drives the lower parts of the clamping jaws 312 to move away from each other, the upper parts of the clamping jaws 312 move toward each other to achieve the clamping of the Hall sensor. The structure is simple and the operation is convenient. The mounting base 311 is further provided with a partition 314 to divide the mounting base 311 into a first mounting area 315 and a second mounting area 316. The two clamping jaws 312 are respectively hinged in the corresponding mounting areas. The partition 314 extends to the lower half of the two clamping jaws 312, and the structure is more solid. At the same time, the clamping jaws 312 are accurately installed and positioned. When the clamping jaws 312 clamp the Hall sensor, the partition 314 presses against the upper end face of the Hall sensor to position it. At the same time, when the pad is installed, the Hall sensor can be pressed to make its structure solid.

[0047] like Figure 2 As shown, the picking part 31 can also be set up with a suction nozzle. The placement machine 3 is also provided with a vacuum pump and a solenoid valve. The vacuum pump is connected to the solenoid valve. The solenoid valve and the suction nozzle are connected by a connecting pipe. The vacuum pump and the solenoid valve can be fixed in the placement machine 3 and do not slide synchronously with the suction nozzle. The connecting pipe can be connected to the suction nozzle. The Hall sensor is adsorbed by vacuum adsorption. The operation is convenient and fast, and the structure is stable when the Hall sensor is transported. It can be accurately placed on the pad to facilitate subsequent welding.

[0048] The feeding area is provided with a conveying track and a plurality of trays 6 placed on the conveying track, each tray 6 automatically reaches the equipment taking point in sequence through the conveying track, a plurality of placing holes 61 are arranged on the tray 6 in intervals, the pins of the Hall sensor are placed in the placing holes 61, each placing hole 61 is set according to the shape of the Hall sensor, the sensor is sequentially installed in the customized tray according to the direction, the direction is reversed and cannot be installed in the tray groove, the position is ensured to be accurate, and subsequent taking is facilitated. The chip mounter 3 is also provided with a mounting plate 34, a fourth driving piece for driving the mounting plate 34 to slide in the X-axis direction of the tray and a fifth driving piece for driving the mounting plate 34 to slide in the Y-axis direction of the tray, the pickup piece 31, the first driving piece 32 and the second driving piece 33 are all arranged on the mounting plate 34, and the pickup piece 31 is provided with a plurality of pickup pieces, so that a plurality of Hall elements can be clamped at the same time, which is more convenient and fast.

Claims

1. A soldering line for non-marking perforated Hall sensors, characterized by, The application relates to a SMT production line, which comprises a tin paste printing machine (1), a tin paste printing detection machine (2), a chip mounter (3), a reflow soldering machine (4) and an automatic optical detection machine (5). The tin paste printing machine (1) comprises an elliptical solder pad, the solder pad is printed on a PCB (11), and the solder pad is provided with a solder pad hole, and tin paste is printed on the solder pad through a scraper; The chip mounter (3) is provided with a feeding area for containing a tray, a material taking point, a PCB (11) placing area, a pickup piece (31), a first driving piece (32) for driving the pickup piece (31) to make lifting movement, and a second driving piece (33) for driving the pickup piece (31) to make transverse sliding movement between the material taking point and the PCB (11) placing area; the pickup piece (31) sends the Hall sensor at the material taking point to the solder pad under the action of the two driving pieces, and the pin of the Hall sensor penetrates through the solder pad hole; The reflow soldering machine (4) is sequentially provided with a preheating area, a holding area, a soldering area and a cooling area.

2. The soldering line of non-marking hole Hall sensors according to claim 1, characterized in that, The pickup piece (31) is provided with a clamping jaw (312) and comprises a mounting seat (311) and two oppositely arranged clamping jaws (312); the middle portions of the two clamping jaws (312) are hingedly arranged on the mounting seat (311); the upper half portions of the two clamping jaws (312) are connected with a third driving piece (313); the third driving piece (313) drives the two clamping jaws (312) to move towards each other or away from each other, so as to clamp or release the Hall sensor; the mounting seat (311) is connected with the output shaft of the second driving piece (33), and the second driving piece (33) is connected with the output shaft of the first driving piece (32).

3. The soldering line of non-marking hole Hall sensors according to claim 1, characterized in that, The pickup piece (31) is provided with a suction nozzle, and the chip mounter (3) is further provided with a vacuum pump and an electromagnetic valve; the vacuum pump is connected with the electromagnetic valve; and the electromagnetic valve and the suction nozzle are connected through a connecting pipe.

4. The soldering line of non-marking hole Hall sensors according to claim 1 or 2 or 3, characterized in that, The feeding area is provided with a conveying track and a plurality of trays (6) placed on the conveying track; the trays (6) automatically arrive at the equipment material taking point through the conveying track; the trays (6) are provided with a plurality of placing holes (61) arranged at intervals; and the pins of the Hall sensors are arranged in the placing holes (61).

5. The soldering line of non-marking hole Hall sensors according to claim 2, characterized in that, The mounting seat (311) is further provided with a partition plate (314) for dividing the mounting seat (311) into a first mounting area (315) and a second mounting area (316); the two clamping jaws (312) are hingedly arranged in the corresponding mounting areas; and the partition plate (314) extends to the lower half portions of the two clamping jaws (312).

6. The soldering line of non-marking hole Hall sensors according to claim 4, characterized in that, The chip mounter (3) is further provided with a mounting plate (34), a fourth driving piece for driving the mounting plate (34) to slide along the X-axis direction of the tray, and a fifth driving piece for driving the mounting plate (34) to slide along the Y-axis direction of the tray; the pickup piece (31), the first driving piece (32) and the second driving piece (33) are arranged on the mounting plate (34); and the pickup piece (31) is provided with a plurality of pickup pieces.

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