Silicon nitride ceramic substrate carrier

Abstract

The utility model discloses a silicon nitride ceramic substrate carrier. The silicon nitride ceramic substrate carrier comprises a carrier body and a limiting clamping groove formed in the carrier body. When the silicon nitride ceramic substrate carrier is used, a protective pad is glued in a first placement groove, so that the protective pad is mounted on the inner side of a limiting plate, then the limiting plate is connected with one end of a limiting spring, and then the other end of the limiting spring is mounted in a second placement groove; the limiting plates are arranged on the inner walls of the front side and the rear side of the carrier body, then the ceramic substrate body is placed in the limiting clamping grooves, and when the ceramic substrate body enters the limiting clamping grooves, the limiting plates can extrude the ceramic substrate protection outer frame under the elastic force action of the limiting springs, so that the ceramic substrate protection outer frame is prevented from being damaged. And protection pads installed on the inner sides of the limiting plates can protect the ceramic substrate protection outer frame, and through arrangement of limiting springs and the limiting plates, the ceramic substrate body can be limited.

Description

Technical Field

[0001] The utility model belongs to the technical field related to semiconductors, and in particular relates to a silicon nitride ceramic substrate carrier. Background Art

[0002] Silicon nitride ceramic substrate is a basic material used in the manufacture of electronic devices, usually made of silicon nitride ceramic material. This substrate has excellent thermal conductivity, mechanical properties and chemical stability, so it is widely used in harsh environments such as high temperature and high frequency. The silicon nitride ceramic substrate needs to be placed in a carrier during processing. The existing silicon nitride ceramic substrate carrier is mainly composed of a carrier body, a limit slot and other components. The existing silicon nitride ceramic substrate carrier may shake during processing during use, which may affect the quality of the silicon nitride ceramic substrate, so a silicon nitride ceramic substrate carrier is indispensable. Utility Model Content

[0003] The present invention aims to provide a silicon nitride ceramic substrate carrier to solve the problem in the background art mentioned above that the existing silicon nitride ceramic substrate carrier may vibrate during processing, thereby affecting the quality of the silicon nitride ceramic substrate.

[0004] To achieve the above object, the present invention provides the following technical solutions: a silicon nitride ceramic substrate carrier, comprising

[0005] A carrier body and a limit slot arranged inside the carrier body;

[0006] A ceramic substrate protection outer frame is installed at the inner position of the limit card slot, and a ceramic substrate body is installed at the inner position of the ceramic substrate protection outer frame;

[0007] A second placement groove is provided at the inner wall positions on the front and rear sides of the carrier body, a limit spring is installed at the inner position of the second placement groove, the inner position of the limit spring is connected to the limit plate, a first placement groove is provided at the inner position of the limit plate, and a protective pad is installed inside the first placement groove. The setting of the limit spring and the limit plate can play a limiting role on the ceramic substrate body, and the setting of the protective pad can protect the protective outer frame of the ceramic substrate.

[0008] Preferably, a mounting block is provided at the upper end of the carrier body and at the front and rear sides of the ceramic substrate protective frame, and a threaded shaft is connected to the upper end of the mounting block.

[0009] Preferably, a pressing plate is mounted on the outer side of the threaded rotating shaft at the upper end of the mounting block, and a fastening knob is mounted on the upper end of the pressing plate at the outer side of the threaded rotating shaft.

[0010] Preferably, an inner thread is arranged on the inner wall of the fastening knob, an outer thread is arranged on the outer wall of the threaded rotating shaft, and the fastening knob is connected with the threaded rotating shaft through the inner thread of the inner wall and the outer thread of the outer wall, so that the pressing plate and the mounting block are fixed together.

[0011] Preferably, a pressing pad is arranged on the lower end of the pressing plate at the upper end of the ceramic substrate protective outer frame, and the pressing pad is connected with the pressing plate by gluing.

[0012] Preferably, the pressing pad and the protective pad are both made of silica gel material, and the setting of the mounting block and the pressing plate further strengthens the limiting of the ceramic substrate body, and the setting of the pressing pad can protect the ceramic substrate protective outer frame.

[0013] Preferably, a magnet plate is arranged on the lower end of the mounting block at the upper end of the carrier body, and the magnet plate is connected with the carrier body by magnetic adsorption.

[0014] Preferably, the carrier body is made of metal material, and the setting of the magnet plate strengthens the flexibility of mounting and dismounting of the mounting block.

[0015] Compared with the prior art, the nitrogenized silicon ceramic substrate carrier has the following beneficial effects:

[0016] In the nitrogenized silicon ceramic substrate carrier, when the nitrogenized silicon ceramic substrate carrier is used, the protective pad is glued inside the first placing groove, so that the protective pad is installed inside the limiting plate, then one end of the limiting plate is connected with the limiting spring, and the other end of the limiting spring is installed inside the second placing groove, so that the limiting plate is installed at the inner wall positions of the front and rear sides of the carrier body, at this time, the ceramic substrate body is placed inside the limiting clamping groove, when the ceramic substrate body enters the limiting clamping groove, the limiting plate is pressed against the ceramic substrate protective outer frame under the elastic force of the limiting spring, and the protective pad installed inside the limiting plate protects the ceramic substrate protective outer frame, then the carrier body is installed on the processing equipment to process the ceramic substrate body, and the setting of the limiting spring and the limiting plate can limit the ceramic substrate body, and the setting of the protective pad can protect the ceramic substrate protective outer frame.

[0017] In the silicon nitride ceramic substrate carrier, when the silicon nitride ceramic substrate carrier is used, the ceramic substrate body is first placed in the limiting clamping groove, then the mounting block is mounted at the front and rear positions of the carrier body, then the pressing plate is passed through the threaded rotating shaft, then the pressing plate is rotated, so that the other end of the pressing plate is in contact with the ceramic substrate protection outer frame through the pressing pad, then the fastening knob is sleeved on the outer wall of the threaded rotating shaft, and the fastening knob is connected with the outer thread of the outer wall of the threaded rotating shaft through the inner thread of the inner wall, so that the pressing plate and the mounting block are fixed together, and the limiting of the ceramic substrate body is further strengthened through the mounting block and the pressing plate, and the ceramic substrate protection outer frame is protected through the pressing pad. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is a whole structure schematic view of the silicon nitride ceramic substrate carrier.

[0019] Figure 2 It is a structure schematic view of the silicon nitride ceramic substrate carrier without mounting the mounting block.

[0020] Figure 3 It is a structure schematic view of the silicon nitride ceramic substrate carrier without mounting the ceramic substrate body.

[0021] Figure 4 It is a structure schematic view of the silicon nitride ceramic substrate carrier second placing groove.

[0022] Figure 5 It is a structure schematic view of the silicon nitride ceramic substrate carrier mounting block.

[0023] In the figure: 1, carrier body; 2, mounting block; 3, pressing plate; 4, ceramic substrate body; 5, ceramic substrate protection outer frame; 6, limiting clamping groove; 7, protection pad; 8, limiting plate; 9, first placing groove; 10, limiting spring; 11, second placing groove; 12, pressing pad; 13, magnet plate; 14, fastening knob; 15, threaded rotating shaft. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.

[0025] The present application provides a Figures 1-5The shown silicon nitride ceramic substrate carrier, a silicon nitride ceramic substrate carrier, comprising a carrier body 1 and a limiting slot 6 arranged at the inner position of the carrier body 1; The limiting slot 6 is installed at the inner position of the limiting slot 6. The ceramic substrate protection frame 5 is installed at the inner position of the ceramic substrate protection frame 5. The inner position of the ceramic substrate body 4 is installed at the inner position of the ceramic substrate body 4. The second placing groove 11 is arranged at the inner wall position of the front and rear sides of the carrier body 1. The limiting spring 10 is installed at the inner position of the second placing groove 11. The limiting plate 8 is connected to the inner position of the limiting spring 10. The first placing groove 9 is arranged at the inner position of the limiting plate 8. The protective pad 7 is installed in the first placing groove 9. Through the setting of the limiting spring 10 and the limiting plate 8, the ceramic substrate body 4 can be limited. The setting of the protective pad 7 can protect the ceramic substrate protection frame 5.

[0026] As Figure 1 , Figure 3 and Figure 4 shown, in order to can play a limiting role to the ceramic substrate body 4 when using silicon nitride ceramic substrate carrier, first, the protective pad 7 is glued in the first placing groove 9, so that the protective pad 7 is installed in the inner side of the limiting plate 8, then the limiting plate 8 and one end of the limiting spring 10 are connected, then the other end of the limiting spring 10 is installed in the second placing groove 11, so that the limiting plate 8 is installed at the inner wall position of the front and rear sides of the carrier body 1, then the ceramic substrate body 4 is put into the limiting slot 6, when the ceramic substrate body 4 enters the limiting slot 6, the limiting plate 8 is pressed by the elastic force of the limiting spring 10, and the protective pad 7 installed in the inner side of the limiting plate 8 protects the ceramic substrate protection frame 5, then the carrier body 1 is installed on the processing equipment to process the ceramic substrate body 4. Through the setting of the limiting spring 10 and the limiting plate 8, the ceramic substrate body 4 can be limited. The setting of the protective pad 7 can protect the ceramic substrate protection frame 5.

[0027] The upper end of the carrier body 1 and the front and rear positions of the ceramic substrate protection frame 5 are provided with mounting blocks 2, the upper end of the mounting block 2 is connected with a threaded shaft 15, the outside of the threaded shaft 15 and the upper end of the mounting block 2 is provided with a pressing plate 3, the upper end of the pressing plate 3 and the outside of the threaded shaft 15 is provided with a fastening knob 14, the inner wall of the fastening knob 14 is provided with an internal thread, the outer wall of the threaded shaft 15 is provided with an external thread, the fastening knob 14 is connected with the threaded shaft 15 through the internal thread of the inner wall and the external thread of the outer wall, so that the pressing plate 3 and the mounting block 2 are fixed together, the lower end of the pressing plate 3 and the upper end of the ceramic substrate protection frame 5 is provided with a pressing pad 12, the pressing pad 12 and the pressing plate 3 are connected by gluing, the pressing pad 12 and the protection pad 7 are made of silica gel material, the setting of the mounting block 2 and the pressing plate 3 further strengthens the limiting of the ceramic substrate body 4, and the setting of the pressing pad 12 can protect the ceramic substrate protection frame 5.

[0028] As Figure 1 , Figure 2 and Figure 5 shown, in order to further strengthen the limiting of the ceramic substrate body 4, when using a silicon nitride ceramic substrate carrier, first put the ceramic substrate body 4 into the limiting clamping groove 6, then install the mounting block 2 at the front and rear positions of the carrier body 1, then pass the pressing plate 3 through the threaded shaft 15, then rotate the pressing plate 3, so that the other end of the pressing plate 3 contacts the ceramic substrate protection frame 5 through the pressing pad 12, then put the fastening knob 14 on the outer wall of the threaded shaft 15, the fastening knob 14 is connected with the threaded shaft 15 through the internal thread of the inner wall and the external thread of the outer wall, so that the pressing plate 3 and the mounting block 2 are fixed together, the setting of the mounting block 2 and the pressing plate 3 further strengthens the limiting of the ceramic substrate body 4, and the setting of the pressing pad 12 can protect the ceramic substrate protection frame 5.

[0029] The lower end of the mounting block 2 and the upper end of the carrier body 1 is provided with a magnet plate 13, the magnet plate 13 is connected with the carrier body 1 by magnetic adsorption, the carrier body 1 is made of metal material, the setting of the magnet plate 13 strengthens the flexibility of the mounting and dismounting of the mounting block 2.

[0030] As Figure 1 and Figure 5As shown, in order to enhance the flexibility of mounting and dismounting of the mounting block 2, when the silicon nitride ceramic substrate carrier is used, the magnet plate 13 is first glued to the lower end of the mounting block 2, and then the mounting block 2 is placed on the upper end of the carrier body 1, so that the magnet plate 13 at the lower end of the mounting block 2 is in contact with the carrier body 1, when the magnet plate 13 is in contact with the carrier body 1, the magnet plate 13 is adsorbed on the upper end of the carrier body 1, so that the mounting block 2 is mounted on the upper end of the carrier body 1, through the setting of the magnet plate 13, the flexibility of mounting and dismounting of the mounting block 2 is enhanced, so that the mounting and dismounting of the mounting block 2 becomes more convenient.

[0031] Finally, it should be noted that: the above only for the preferred embodiments of the present application, and not for the limit of the present application, although the foregoing detailed description of the present application is made with reference to the foregoing embodiments, for the skilled in the art, it still can be modified, or part of the technical features of the equivalent replacement, within the spirit and principles of the present application, any modification, equivalent replacement, improvement, etc., should be included in the scope of protection of the present application.

Claims

1. A silicon nitride ceramic substrate carrier, comprising a carrier body (1) and a limiting slot (6) arranged at an inner position of the carrier body (1); a ceramic substrate protection frame (5) is installed at an inner position of the limiting slot (6), and a ceramic substrate body (4) is installed at an inner position of the ceramic substrate protection frame (5); characterized in that second placing grooves (11) are arranged at inner wall positions of front and back sides of the carrier body (1), limiting springs (10) are installed at inner positions of the second placing grooves (11), limiting plates (8) are connected to inner positions of the limiting springs (10), first placing grooves (9) are arranged at inner positions of the limiting plates (8), and protection pads (7) are installed at inner positions of the first placing grooves (9), so that the ceramic substrate body (4) is limited, and the ceramic substrate protection frame (5) is protected by the protection pads (7).

2. The silicon nitride ceramic substrate support of claim 1, wherein: mounting blocks (2) are arranged at upper ends of the carrier body (1) and at front and back sides of the ceramic substrate protection frame (5), and threaded rotating shafts (15) are connected to upper end positions of the mounting blocks (2).

3. The silicon nitride ceramic substrate support of claim 2, wherein: pressing plates (3) are installed at outer positions of the threaded rotating shafts (15) and at upper end positions of the mounting blocks (2), and fastening knobs (14) are installed at upper ends of the pressing plates (3) and at outer positions of the threaded rotating shafts (15).

4. The silicon nitride ceramic substrate support of claim 3, wherein: inner threads are arranged at inner wall positions of the fastening knobs (14), outer threads are arranged at outer wall positions of the threaded rotating shafts (15), the fastening knobs (14) are connected to the threaded rotating shafts (15) through the inner threads of the inner wall and the outer threads of the outer wall, so that the pressing plates (3) and the mounting blocks (2) are fixed together.

5. The silicon nitride ceramic substrate support of claim 4, wherein: pressing pads (12) are arranged at lower ends of the pressing plates (3) and at upper end positions of the ceramic substrate protection frame (5), and the pressing pads (12) are connected to the pressing plates (3) by gluing.

6. The silicon nitride ceramic substrate support of claim 5, wherein: The pressing pads (12) and the protection pads (7) are both made of silica gel material, the limiting of the ceramic substrate body (4) is further strengthened by the mounting blocks (2) and the pressing plates (3), and the ceramic substrate protection frame (5) is protected by the pressing pads (12).

7. The silicon nitride ceramic substrate support of claim 4, wherein: magnet plates (13) are arranged at lower ends of the mounting blocks (2) and at upper end positions of the carrier body (1), and the magnet plates (13) are connected to the carrier body (1) by magnetic adsorption.

8. The silicon nitride ceramic substrate support of claim 7, wherein: The carrier body (1) is made of metal material, and the flexibility of mounting and dismounting of the mounting blocks (2) is strengthened by the magnet plates (13).

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