Heating device and coating equipment
By using a heating device to uniformly heat the substrate, the problem of large temperature differences between the center and edge areas of the substrate is solved, improving the coating effect and reducing equipment costs.
Patent Information
- Application Number
- CN202422891990.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-26
- Publication Date
- 2025-10-24
- Estimated Expiration
- 2034-11-26
AI Technical Summary
The temperature difference between the center and edge areas of the existing substrate is large, which affects the coating effect.
A heating device is used, including a heating chamber, a tray, a support frame, and a docking component. The heating component directly heats the substrate on the tray, ensuring uniform heating.
It improves heating efficiency and uniformity, reduces equipment costs and energy consumption, and avoids affecting the coating effect.
Smart Images
Figure CN223468447U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application belongs to the technical field of semiconductor manufacturing equipment, and particularly relates to a heating device and a film coating equipment. BACKGROUND
[0002] At present, when a substrate is coated, a tray is generally used to carry the substrate, and then the tray is sent into a process chamber for coating. However, in order to ensure that the thin film has specific optical and electrical properties, the temperature of the substrate needs to be adjusted before being sent into the process chamber.
[0003] The existing temperature adjustment mode for the substrate is generally to set a preheating chamber, which is located upstream of the process chamber. Specifically, low specific heat capacity gas is introduced into the preheating chamber, and a heating plate is arranged on the inner wall of the preheating chamber, and then heating is performed through heat radiation. Since the preheating chamber has heat loss to the surroundings, the temperature difference between the center region and the edge region of the substrate after heating is large, which affects the coating effect. CONTENT OF THE UTILITY MODEL
[0004] The technical problem to be solved by the application is that the temperature difference between the center region and the edge region of the existing substrate is large, which affects the coating effect. In order to solve the technical problem, a heating device and a film coating equipment capable of ensuring uniform heating of the substrate are provided.
[0005] The technical scheme provided by the application is as follows:
[0006] A heating device comprises:
[0007] a heating chamber;
[0008] a tray movably arranged relative to the heating chamber and capable of passing through the heating chamber during movement; the tray comprises a body for carrying a substrate and a heating member arranged on the body;
[0009] a support frame arranged in the heating chamber and used for supporting the tray passing through the heating chamber; and
[0010] a docking member arranged in the heating chamber and capable of being docked with the heating member of the tray on the support frame, so that the heating member heats the substrate on the body.
[0011] Further, the docking member is movably arranged relative to the support frame and capable of being docked with and separated from the heating member of the tray on the support frame during movement.
[0012] Further, the heating device further comprises a docking driving member arranged on the support frame and connected with the docking member to drive the docking member to move relative to the support frame.
[0013] Further, the support frame is movably arranged in the heating chamber.
[0014] Further, the heating device further comprises a support driving member, the support driving member is arranged outside the heating chamber, and a driving end of the support driving member extends into the heating chamber and is connected with the support frame to drive the support frame to move in the heating chamber.
[0015] Further, the heating member comprises a plurality of heating wires, and the side of the body for carrying the substrate comprises a plurality of heating areas, and the plurality of heating wires correspond to the plurality of heating areas one by one.
[0016] Further, the body comprises a carrying plate and a bottom plate, the carrying plate and the bottom plate are connected with each other, and the heating member is at least partially arranged between the carrying plate and the bottom plate, and the carrying plate is used for carrying the substrate.
[0017] Further, the side of the body away from the substrate is covered with a reflective layer.
[0018] Further, the heating device further comprises a temperature detector, and the temperature detector is arranged on the body.
[0019] A coating equipment comprises a process chamber and the heating device as described above, and the tray can sequentially pass through the heating chamber and the process chamber during movement.
[0020] By using the heating device, the tray is supported on the support frame after being conveyed to the heating chamber, the abutting member is abutted with the heating member, the heating member heats the substrate on the body, and then the tray is conveyed to the downstream for coating operation according to the beat. Since the heating member arranged in the body directly heats the substrate on the body, the uniformity of heating can be ensured, so that the temperature difference between the central region and the edge region of the substrate is small, the temperature uniformity is high, and the subsequent coating effect of the substrate is avoided.
[0021] In addition, compared with the gas heat conduction mode for heating the substrate, the heating efficiency is higher, the heating speed is faster, so that the temperature of the substrate can be heated to the preset temperature within the tray staying time, and multiple heating chambers are not needed, so that the equipment cost and energy consumption cost are reduced. BRIEF DESCRIPTION OF DRAWINGS
[0022] The accompanying drawings are included to provide a further understanding of the present application, and constitute a part of the specification, illustrate the present application together with the embodiments thereof, and explain the present application, but do not limit the present application.
[0023] Figure 1 The structure schematic view of components in the heating chamber of the heating device provided by an embodiment of the present application;
[0024] Figure 2 Fig. 1 is a schematic view of a side structure of components in a heating chamber; Figure 1
[0025] Figure 3 Fig. 2 is a schematic view of a structure of a tray in components in a heating chamber; Figure 1
[0026] Figure 4 Fig. 3 is a schematic view of a bottom surface of the tray; Figure 3
[0027] Figure 5 Fig. 4 is a schematic view of the tray without a bottom plate. Figure 4
[0028] BRIEF DESCRIPTION OF THE DRAWINGS
[0029] 100, tray; 110, heating member; 111, heating wire; 112, interface; 120, bearing plate; 130, bottom plate; 140, frame; 210, support frame; 220, interface member; 230, support driving member. DETAILED DESCRIPTION
[0030] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0031] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.
[0032] In order to facilitate understanding of the technical solutions of the present application, the existing method of heating the substrate by using a preheating cavity is described as follows:
[0033] In one aspect, the heating plate of the preheating cavity is arranged on the inner wall of the cavity. During the heating process of the heating plate, the inner wall of the preheating cavity also transmits heat to the outside of the preheating cavity, that is, the heat is lost to the surroundings, thereby causing poor heating uniformity of the substrate in the preheating cavity, resulting in a large temperature difference between the center region and the edge region of the substrate after heating, and further affecting the film coating effect.
[0034] On the other hand, due to the limitation of the preheating cavity temperature rising speed and production rhythm, the number of preheating cavities is usually set to be multiple. Specifically, due to the limitation of the production rhythm, the residence time of the tray in the preheating cavity is generally within 1 min, and the substrate needs to reach a temperature of about 150-450℃. At the same time, the preheating cavity is heated by thermal radiation. In order to avoid a large temperature difference of the substrate, the size of each preheating cavity is also limited, that is, the residence time of the tray in the preheating cavity cannot be prolonged by expanding the size of the preheating cavity. Therefore, the setting of multiple preheating cavities results in high equipment cost.
[0035] In addition to the above problems, the preheating cavity conducts heat by gas. Compared with solid and liquid, in order to ensure the heating effect, the gas needs more time during the heat conduction process, and at the same time, the distance between the heating plate and the substrate needs to be reduced as much as possible. However, as described above, the residence time of the tray is limited. Even if the distance between the heating plate and the substrate is reduced as much as possible or the heating power is increased under the premise of realizing the transportation of the tray, the heat conduction by the gas also has the problem of poor heating uniformity.
[0036] In view of the above problems, in one aspect, the application provides a heating device applied to a substrate film coating process and used for heating the substrate before film coating. At the same time, the heating device has a fast temperature rising speed, does not need to be set with multiple preheating cavities, and can reduce the equipment cost; has high heating uniformity, ensures uniform heating of the substrate, and thereby avoids affecting the film coating effect.
[0037] As shown in Figure 1 and Figure 2 , the heating device comprises a heating chamber, a tray 100, a support frame 210 and a docking piece 220. The tray 100 is movably arranged relative to the heating chamber, and the tray 100 can pass through the heating chamber during movement. The tray 100 comprises a body and a heating piece 110 (see Figure 5 ). The body is used for carrying the substrate, and the heating piece 110 is arranged on the body.
[0038] The support frame 210 and the docking piece 220 are arranged in the heating chamber. The support frame 210 is used for supporting the tray 100 passing through the heating chamber; and the docking piece 220 is used for docking with the heating piece 110 of the tray 100 on the support frame 210, so that the heating piece 110 heats the substrate on the body.
[0039] Therefore, the tray 100 passing through the heating chamber refers to the tray 100 entering and exiting the heating chamber, and after the tray 100 enters the heating chamber, the support frame 210 can support the tray 100, and the connecting piece 220 can be connected with the heating piece 110 in the tray 100 supported by the support frame 210, so that the heating piece 110 heats the substrate on the body. Optionally, the heating piece 110 can include a heating wire 111 and an interface 112 connected with the heating wire 111 and used for connection. After the connecting piece 220 is connected with the interface 112, the heating wire 111 is powered on, so that the heating wire 111 heats the substrate on the body.
[0040] It should be explained that in actual application, the tray 100 is conveyed by a conveying mechanism, which can convey the tray 100 to the support frame 210 in the heating chamber, and also can output the tray 100 on the support frame 210 from the heating chamber and convey the tray 100 to the downstream film coating process.
[0041] By using the above heating device, after the tray 100 is conveyed to the heating chamber and supported on the support frame 210, the connecting piece 220 is connected with the heating piece 110, so that the heating piece 110 heats the substrate on the body. Then, the tray 100 is conveyed to the downstream for film coating operation according to the beat. Since the heating piece 110 arranged in the body directly heats the substrate on the body, the uniformity of heating can be ensured, so that the temperature difference between the central region and the edge region of the substrate is small, the temperature uniformity is high, and the subsequent film coating effect of the substrate is avoided.
[0042] In addition, compared with the way of heating the substrate by gas heat conduction, the heating efficiency is higher and the heating speed is faster, so that the temperature of the substrate can be heated to the preset temperature within the tray 100 staying time, without the need to set multiple heating chambers, thereby reducing the equipment cost and energy consumption cost.
[0043] It should be explained that the heating piece 110 is arranged in the body, and the material on the side of the body for carrying the substrate is preferably a high-thermal-conductivity material, such as one or more of graphite, carbon-carbon composite material and stainless steel, to quickly transfer heat to the substrate, thereby improving the heating efficiency and accelerating the heating speed; and when the heating piece 110 is a heating wire 111, the heating wire 111 can be laid flat to ensure the uniformity of heating, so that the substrate is uniformly heated. In other embodiments, the heating piece 110 can also include a heating wire and a heating liquid, which is heated by the heating wire to uniformly heat the substrate on the body.
[0044] Further, the one side of the body for carrying the substrate comprises a plurality of heating areas; the heating element 110 comprises a plurality of heating wires 111, which correspond to the plurality of heating areas one by one, so as to realize the individual control of the temperature of the plurality of heating areas, and to realize the corresponding adjustment according to the heating requirements of different areas, so as to ensure that the temperature of the substrate meets the requirements. In addition, it should be noted that the plurality of heating areas can be powered through one interface 112, or a plurality of interfaces 112 can be set according to the actual situation, and the corresponding abutting member 220 can be abutted with the interface 112.
[0045] In one embodiment, the heating device further comprises a temperature detector arranged on the body, for detecting the heating temperature of the heating element 110, and the heating element 110 controls the temperature according to the detection of the temperature detector, so as to ensure that the temperature and temperature uniformity of the substrate meet the requirements. As an example, for the plurality of heating areas and the plurality of heating wires 111, the temperature detector can also be provided with a plurality of temperature detectors, and each temperature detector is arranged corresponding to one heating wire 111. Preferably, the temperature detector is a high-precision thermocouple, and the temperature detector is also connected with the external controller through the interface 112.
[0046] In one embodiment, the support frame 210 is movably arranged in the heating chamber, so as to adjust the position of the support frame 210 in the heating chamber, so that after the conveying mechanism conveys the tray 100 into the heating chamber, the support frame 210 lifts the tray 100 to be separated from the conveying mechanism, and then the abutting member 220 is abutted with the heating element 110 in the tray 100 on the support frame 210.
[0047] Further, the heating device further comprises a support driving member 230 arranged outside the heating chamber, and specifically at the bottom of the heating chamber. The driving end of the support driving member 230 extends into the heating chamber and is connected with the support frame 210 to drive the support frame 210 to move in the heating chamber. As an example, the support driving member 230 is a pneumatic cylinder, an oil cylinder or an electric cylinder, and the support driving member 230 is used to drive the support frame 210 to ascend and descend in the heating chamber, and the support frame 210 can lift the tray 100 to be separated from the conveying mechanism during the ascending process.
[0048] It should be noted that the heating chamber needs to be sealed during operation, so the connection between the driving end of the support driving member 230 and the heating chamber is a sealed connection, and the driving end can be telescoped relative to the heating chamber. The specific mode can be to realize the sealed and movable connection between the two through a bellows or other means.
[0049] In one embodiment, the docking member 220 is movably arranged relative to the support frame 210, and the docking member 220 can be docked with and separated from the heating member 110 of the tray 100 on the support frame 210 during the movement of the docking member 220, so that the heating member 110 can heat the substrate when the docking member 220 is docked with the heating member 110, and the tray 100 can be moved away from the support frame 210 when the docking member 220 is separated from the heating member 110. As described above, when the heating member 110 comprises the heating wire 111 and the interface 112, the docking member 220 can comprise an electrode which is docked with the interface 112 to supply power to the heating wire 111 when the docking member 220 is docked with the interface 112, and the docking member 220 can avoid hindering the tray 100 from moving away from the support frame 210 when the docking member 220 is separated from the interface 112.
[0050] Further, the heating device further comprises a docking driving member arranged on the support frame 210 and connected with the docking member 220 to drive the docking member 220 to move relative to the support frame 210. As an example, the docking driving member is a pneumatic cylinder or an electric cylinder, and the docking driving member is used to drive the docking member 220 to move up and down relative to the support frame 210. It can be understood that the interface 112 of the heating member 110 is arranged on the bottom of the body.
[0051] Please refer to Figures 3 to 5 In one embodiment, the body comprises a carrier plate 120 and a bottom plate 130, the carrier plate 120 and the bottom plate 130 are connected with each other, the heating member 110 is at least partially arranged between the carrier plate 120 and the bottom plate 130, and the carrier plate 120 is used to carry the substrate. As described above, when the heating member 110 comprises the heating wire 111 and the interface 112, the heating wire 111 is arranged between the carrier plate 120 and the bottom plate 130 to heat the substrate on the carrier plate 120, and the interface 112 is arranged on the bottom plate 130. It can be determined that, as described above, the carrier plate 120 is preferably made of a high-thermal-conductivity material to improve the heat conduction effect.
[0052] Further, the body further comprises a frame 140, the carrier plate 120 and the bottom plate 130 are laminated, and the frame 140 is arranged on the edges of the carrier plate 120 and the bottom plate 130 to fix the carrier plate 120 and the bottom plate 130. It should be noted that the material of the frame 140 is preferably the same as that of the carrier plate 120.
[0053] In one embodiment, a plurality of carrier grooves are arranged on the surface of the carrier plate 120 away from the bottom plate 130, and each carrier groove is used to carry and position the substrate. The heating member 110 arranged between the carrier plate 120 and the bottom plate 130 is used to uniformly heat the substrate in the carrier groove.
[0054] In one embodiment, the side of the body away from the substrate is covered with a reflective layer, that is, the bottom plate 130 is covered with a reflective layer on the side away from the carrier plate 120, so as to reflect the heat radiation out, which can finally be reflected to the substrate on the carrier plate 120 in the heating chamber, so as to improve the heating effect on the substrate. It can be understood that when the heating element 110 generates heat, heat radiation will also be generated. By setting the bottom surface of the bottom plate 130 as a highly reflective surface, a large amount of heat radiation can be avoided from being absorbed, and the heat radiation can be reflected to the substrate, thereby improving the heating effect on the substrate. It can be understood that in order to ensure that the heat radiation can be reflected to the substrate, the inner wall of the heating chamber can also be covered with a highly reflective material.
[0055] It needs to be explained in combination with the above embodiments that when the heating device of the present application is applied to a film coating process, and the film coating process is plasma enhanced chemical vapor deposition, the material of the carrier plate 120 also needs to have high conductivity and corrosion resistance; the material of the bottom plate 130 also needs to have good conductivity, so the bottom plate 130 is preferably made of aluminum, and at this time the bottom surface of the bottom plate 130 can be polished smooth to achieve a high reflection effect.
[0056] In addition, in order to facilitate understanding of the technical solutions of the present application, the film coating process is taken as an example to explain the specific process flow of the heating device in the above embodiments:
[0057] The conveying mechanism conveys the tray 100 carrying the substrate into the heating chamber, the support driving element 230 drives the support frame 210 to rise and lift the tray 100, then the docking driving element drives the docking element 220 to rise and insert into the interface 112 at the bottom of the tray 100, so as to be docked with the heating element 110 and supply power to the heating element 110. The heating element 110 heats the substrate, and after heating is completed, the support frame 210 is lowered and the tray 100 returns to the conveying mechanism. After a predetermined residence time is reached, the conveying mechanism conveys the tray 100 to the downstream for film coating operation.
[0058] In summary, the heating device provided by the present application has at least the following advantages:
[0059] 1. The substrate is directly heated by the heating element 110 in the tray 100, so that the heating speed is faster, the substrate can be heated to a predetermined temperature within a residence time, a plurality of heating chambers do not need to be provided, the equipment cost is reduced, and in addition, the heating uniformity is higher when the heating element 110 is used for heating, the substrate is heated more uniformly, and the subsequent film coating effect is improved.
[0060] 2. The heating plate does not need to be provided on the inner wall of the heating chamber, the volume of the heating chamber is reduced, and at the same time, the heating chamber does not need to be filled with a heat-conducting gas, the cost of the heating chamber is reduced, and the influence of the heat-conducting gas on the temperature uniformity is reduced.
[0061] Based on the heating device in the above embodiments, in another aspect, the application further provides a coating equipment, which comprises the heating device in the above embodiments and a process chamber, the process chamber is arranged downstream of the heating chamber, and the tray 100 can pass through the heating chamber and the process chamber in turn during movement, i.e., the conveying mechanism can convey the tray 100 to the heating chamber and the process chamber in turn.
[0062] It should be noted that in the present embodiment, the process chamber is used for coating operation. In addition, the same structure as the supporting frame 210 and the docking piece 220 in the heating chamber can also be arranged in the process chamber, so that the substrate can be heated in the process chamber according to requirements, i.e., the heating chamber is the process chamber at this time, and there is no need to arrange a heating structure below the process chamber, thereby reducing the height and cost of the process chamber. Similarly, it can be known that the above heating chamber can also be a loading chamber or a preheating chamber located upstream of the process chamber, and as the loading chamber, there is no need to arrange a preheating cavity between the loading chamber and the process chamber.
[0063] Although the embodiments of the application have been shown and described, it is to be understood that for the purpose of the present application, the embodiments can be substantially changed without departing from the spirit and the scope of the present application, the scope of the present application being defined by the appended claims and their equivalents.
Claims
1. A heating device, characterized in that, The heating device comprises: a heating chamber; a tray movably arranged relative to the heating chamber and capable of passing through the heating chamber during movement of the tray, the tray comprising a body for carrying a substrate and a heating element arranged on the body; a support frame arranged in the heating chamber and used for supporting the tray passing through the heating chamber; and a docking element arranged in the heating chamber and capable of docking with the heating element of the tray on the support frame so as to enable the heating element to heat the substrate on the body. The docking element is movably arranged relative to the support frame and capable of docking with and separating from the heating element of the tray on the support frame during movement of the docking element.
2. The heating device of claim 1, wherein The heating device further comprises a docking driving element arranged on the support frame and connected with the docking element so as to drive the docking element to move relative to the support frame.
3. The heating device of claim 2, wherein, The support frame is movably arranged in the heating chamber.
4. The heating device of claim 1, wherein, The heating device further comprises a support driving element arranged outside the heating chamber, a driving end of the support driving element extending into the heating chamber and connected with the support frame so as to drive the support frame to move in the heating chamber.
5. The heating device of claim 4, wherein, The heating element comprises a plurality of heating wires, and the side of the body for carrying a substrate comprises a plurality of heating areas, the plurality of heating wires corresponding to the plurality of heating areas one by one.
6. The heating device of claim 1, wherein The body comprises a carrying plate and a bottom plate, the carrying plate and the bottom plate being connected with each other, the heating element being at least partially arranged between the carrying plate and the bottom plate, and the carrying plate being used for carrying a substrate.
7. The heating device of claim 1, wherein The side of the body away from the substrate is covered with a reflective layer.
8. The heating device of claim 1, wherein, The heating device further comprises a temperature detector arranged on the body.
9. The heating device of claim 1, wherein, The heating device is arranged in a process chamber, and the tray is capable of sequentially passing through the heating chamber and the process chamber during movement of the tray.
10. A coating apparatus, characterized by,