Distributed semiconductor heat pump water heater equipment

Abstract

The utility model relates to distributed type semiconductor heat pump water heater equipment which comprises a hot water tank, semiconductor sheets are arranged on one or more side walls of the hot water tank, and the high-temperature end faces, releasing heat, of the semiconductor sheets are attached to the side walls of the hot water tank in a surface contact mode under the power-on condition. The low-temperature end face, absorbing heat, of the semiconductor chip is connected with a waste water heat collector or a heat pipe heat exchanger in a surface contact mode under the power-on condition, and the waste water heat collector stores waste water with heat through a first sewer pipe connected with a water outlet of the hand basin. And a refrigerant working medium capable of absorbing air heat flows in a circulation channel configured by the heat pipe heat exchanger. The water heater equipment absorbs heat from air and / or domestic wastewater and releases the heat into the domestic hot water tank by utilizing the characteristic that one side absorbs heat and the other side releases heat after the semiconductor chip is electrified, and simple and energy-saving hot water supply can be realized without configuring mechanical equipment required by a traditional heat pump unit, such as a compressor, a water pump, a fan and the like.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor heat pump, especially to a distributed semiconductor heat pump water heater equipment. BACKGROUND

[0002] The comprehensive utilization of energy saving and resources is the long-term strategic policy of China's economic and social development. Zero energy building refers to the building form that does not consume conventional energy, but relies entirely on solar energy or other renewable energy to maintain normal operation. From energy saving building, green building, ecological building to the recently proposed low-carbon building, these concepts aim to reduce carbon dioxide emissions. The main feature of zero (micro) energy building is that, in addition to emphasizing the passive energy saving design of building envelope, it also turns building energy demand to solar energy, wind energy, shallow geothermal energy and biomass energy and other renewable energy, in order to find the best solution for the harmonious coexistence of human building activities and natural environment.

[0003] In some zero energy buildings (such as hotels, schools, dormitories and residences), the energy consumption of domestic hot water accounts for a large proportion of the total energy consumption. The commonly used hot water solutions at present include small kitchen treasure, distributed electric water heater, centralized electric water heater, gas hot water, solar hot water and heat pump hot water system. Although small kitchen treasure and distributed electric water heater have the advantages of low transmission and distribution loss and low circulation loss, but their heat production efficiency is low; while centralized electric water heater, gas hot water, solar hot water and heat pump hot water system have high efficiency in centralized heating, but the complex circulation pipe network leads to large circulation heat loss, and often appears the phenomenon of "using half and throwing half", these factors are the main reasons for the high energy consumption of domestic hot water.

[0004] Some solutions and products have appeared in the market at present, such as distributed electric water heater and heat pump water heater, but there are still the following urgent problems to be solved:

[0005] 1. It is not suitable for small capacity small kitchen treasure level distributed hot water supply scheme, and there is currently a lack of corresponding small heat pump equipment;

[0006] 2. The system of large capacity distributed conventional heat pump hot water solution is complex, and the equipment cost is high;

[0007] 3. The equipment has large running noise and high maintenance difficulty;

[0008] 4. The equipment has large volume and occupies building space, and many projects do not have installation conditions;

[0009] 5. The running cost is high, because there are many power consumption devices such as compressor, water pump and fan in the system, which leads to the increase of overall energy consumption and cost.

[0010] In summary, the existing distributed hot water system generally exists high investment, high energy consumption, high cost, inconvenient maintenance, unstable operation and large noise and other problems. It is difficult to effectively reduce the hot water energy consumption in zero energy consumption building by using these traditional hot water equipment, so there is a certain difficulty in controlling the energy consumption of zero energy consumption building.

[0011] CN203657269U discloses a semiconductor heat pump energy-saving instant water faucet, which can realize the recovery and utilization of waste heat by using semiconductor heat pump technology, improve the heating efficiency, and has the effect of energy saving. However, the technical scheme uses the heat exchange mode of setting heat end heat dissipation fins in the water supply pipe, but the effective heat exchange area of this mode is small, which will affect the effective heat transfer, and then affect the generation amount and temperature of hot water. In addition, the technical scheme of this patent does not design a hot water storage device, but only uses the heat end heat dissipation fins in the water supply pipe for instant heat exchange, so in the case of different water consumption or water demand fluctuation, the outlet water temperature of the faucet may be different due to the instant and instability of heat.

[0012] In addition, on the one hand, there are differences in the understanding of those skilled in the art, and on the other hand, the applicant has studied a large number of literatures and patents when making the utility model, but due to the limited space, all the details and contents are not listed in detail, which does not mean that the utility model does not have the characteristics of the prior art, on the contrary, the utility model has all the characteristics of the prior art, and the applicant reserves the right to add related prior art in the background art. Utility model content

[0013] In view of the deficiencies of the prior art, the present application provides a distributed semiconductor heat pump water heater device, which comprises a hot water tank, one or more side walls of the hot water tank are provided with semiconductor chips, the high temperature end face of the semiconductor chip radiates heat under power supply and is attached to the side wall of the hot water tank in the form of surface contact, the low temperature end face of the semiconductor chip absorbs heat under power supply and is connected to the waste water heat extractor or the heat pipe heat exchanger in the form of surface contact, wherein the waste water heat extractor stores waste water with heat through the first sewer pipe connected to the washbasin drain outlet, and the circulating channel of the heat pipe heat exchanger is provided with a refrigerant working medium capable of absorbing air heat.

[0014] The water heater device utilizes the characteristics of one side of the semiconductor sheet absorbing heat and the other side releasing heat after being powered on, absorbs heat from air and / or domestic wastewater and releases the heat into the domestic hot water tank, without configuring mechanical equipment required by traditional heat pump units such as compressors, water pumps, and fans, greatly simplifying the system structure and reducing maintenance costs.

[0015] According to a preferred embodiment, the hot water tank is configured with a cold water pipe and a hot water pipe in the form of penetrating the surface, the inlet of the cold water pipe is connected to the tap water supply pipe, and the outlet is configured in the bottom layer area of the hot water tank; the outlet of the hot water pipe is connected to the hot water faucet, and the inlet is configured in the top layer area of the hot water tank. By configuring the outlet of the cold water pipe in the bottom layer area of the hot water tank, cold water enters the hot water tank from the bottom. Since cold water has a higher density, it naturally sinks to the bottom. This design takes advantage of the natural convection characteristics of water, avoiding direct impact of cold water on the upper layer of hot water, thereby reducing the mixing loss of heat energy and maintaining the temperature stratification in the hot water tank. This helps to improve the thermal efficiency of the hot water tank and ensures that the water in the upper layer always maintains a high temperature. At the same time, the inlet of the hot water pipe is configured in the top layer area of the hot water tank, and the outlet is connected to the hot water faucet. Hot water is taken out from the top, because hot water has a lower density, it will naturally float to the top. This design ensures that users use water with the highest temperature, improves the use efficiency of hot water, avoids the mixing of cold water that has not been heated at the bottom, and guarantees the quality and temperature of hot water.

[0016] According to a preferred embodiment, the semiconductor sheet includes a direct current positive electrode and a direct current negative electrode connected to an external power source, and a thermally conductive coupling agent is filled between the low temperature end face of the semiconductor sheet and the wastewater heat extractor or the heat pipe heat exchanger. By filling a thermally conductive coupling agent between the low temperature end face of the semiconductor sheet and the wastewater heat extractor or the heat pipe heat exchanger, the heat conduction efficiency can be significantly improved. The thermally conductive coupling agent is a material with high thermal conductivity, which can effectively fill the small gaps between the two, eliminate the thermal resistance of the air layer, and ensure that heat can be quickly and uniformly transmitted. This not only improves the efficiency of heat exchange, but also reduces heat loss, so that the semiconductor sheet can more efficiently absorb heat from the wastewater heat extractor or the heat pipe heat exchanger.

[0017] According to a preferred embodiment, the wastewater heat extractor is connected with a second drain pipe, which is connected with the drain pipe after forming a water seal structure. By forming a water seal structure in the second drain pipe, the backflow of odors and harmful gases from the drain pipe into the indoor environment can be effectively prevented. The water seal structure utilizes the principle of water static pressure to form a column of water in the second drain pipe, blocking the passage of gases from the drain pipe. This design not only improves indoor air quality, but also enhances sanitary conditions, especially suitable for household and public drainage systems.

[0018] According to a preferred embodiment, the heat pipe heat exchanger includes a heat pipe condenser and a heat pipe evaporator, the height of the heat pipe condenser is higher than that of the heat pipe evaporator, and the two are connected by a working fluid liquid downcomer and a working fluid vapor riser to form a channel allowing the circulation of refrigerant working fluid. By setting the height of the heat pipe condenser higher than that of the heat pipe evaporator, the natural circulation of working fluid is promoted by gravity. When the refrigerant absorbs heat and evaporates into gas in the heat pipe evaporator, it will rise to the heat pipe condenser through the working fluid vapor riser. In the condenser, the refrigerant releases heat and recondenses into liquid, then returns to the evaporator through the working fluid liquid downcomer. This natural circulation not only reduces the dependence on external power sources, but also improves the energy efficiency of the system, reducing operating costs.

[0019] According to a preferred embodiment, the two ends of the working fluid liquid downcomer are connected with the bottom of the heat pipe condenser and the bottom of the heat pipe evaporator respectively, and the two ends of the working fluid vapor riser are connected with the top of the heat pipe condenser and the top of the heat pipe evaporator respectively. Since the two ends of the working fluid vapor riser are connected with the top of the heat pipe condenser and the top of the heat pipe evaporator respectively, it ensures that the vapor working fluid can smoothly rise from the evaporator to the condenser. This design takes advantage of the natural upward trend of vapor, allowing heat in the evaporator to be efficiently transferred to the condenser. The vapor contacts the pipe wall during the rising process, further enhancing the heat exchange effect and improving the heat exchange efficiency of the system.

[0020] According to a preferred embodiment, the first drain pipe is provided with an overflow hole on the side wall of the section between the wastewater heat extractor and the wash basin, and the overflow hole extends a sloping overflow pipe to the second drain pipe and is connected with it in liquid tight manner.

[0021] The overflow hole effectively prevents the water level in the wastewater heat extractor from being too high when the wash basin's drainage capacity is too large. When the wash basin's drainage capacity exceeds the processing capacity of the wastewater heat extractor, the excess water will flow into the overflow pipe through the overflow hole and eventually be discharged into the second drain pipe. This not only prevents the wastewater heat extractor from overflowing due to high water level, reducing potential water damage and safety hazards, but also ensures the normal operation of the system.

[0022] According to a preferred embodiment, a fastening assembly is arranged between the semiconductor sheet and the hot water tank, the waste water heat extractor or the heat pipe heat exchanger to achieve detachable connection. The use of the fastening assembly ensures close contact between the semiconductor sheet and the hot water tank, the waste water heat extractor or the heat pipe heat exchanger, thereby improving the heat conduction efficiency. The fastening assembly such as a spring clamp or a bolt fixing member can provide a continuous pressing force, ensuring that there is no air gap between the semiconductor sheet and the contact surface, reducing the thermal resistance, so that heat can be efficiently transferred. This not only improves the heat exchange efficiency of the system, but also ensures the stable performance of the equipment during long-time operation.

[0023] According to a preferred embodiment, a valve is arranged on the second drain pipe, which is located between the connection point of the overflow pipe and the second drain pipe and the connection point of the second drain pipe and the waste water heat extractor. After the semiconductor sheet completes heat extraction, the valve can be opened to discharge the cooling waste water in the waste water heat extractor. The arrangement of the valve improves the energy efficiency and energy saving effect of the system. After the semiconductor sheet completes heat extraction, the discharged waste water has released most of the heat, and this part of the heat has been effectively transferred to the hot water tank. In this way, not only the waste heat in the waste water is fully utilized, but also the dependence on other heat sources is reduced, and the overall energy consumption is reduced.

[0024] According to a preferred embodiment, the waste water heat extractor and the heat pipe condenser are attached to the contact surface of the semiconductor sheet and are electroplated or coated with an anti-corrosion layer. The electroplated or coated anti-corrosion layer is usually made of materials with high thermal conductivity, such as nickel, chromium or graphene, etc. These materials not only have good anti-corrosion performance, but also have high thermal conductivity. This makes the anti-corrosion layer protect the metal surface while not significantly increasing the thermal resistance, ensuring that heat can be efficiently transferred from the semiconductor sheet to the waste water heat extractor and the heat pipe condenser. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 is the structure schematic diagram of the first perspective view of the distributed semiconductor heat pump water heater equipment of the utility model when being equipped with the heat pipe heat exchanger;

[0026] Figure 2 is the structure schematic diagram of the second perspective view of the distributed semiconductor heat pump water heater equipment of the utility model when being equipped with the heat pipe heat exchanger;

[0027] Figure 3 is the structure schematic diagram of the front perspective view of the distributed semiconductor heat pump water heater equipment of the utility model when being equipped with the heat pipe heat exchanger;

[0028] Figure 4 is the structure schematic diagram of the front perspective view of the semiconductor sheet of the utility model;

[0029] Figure 5 is the structure schematic diagram of the side perspective view of the semiconductor sheet of the utility model;

[0030] Figure 6 is a schematic diagram of the overall structure of the heat pipe heat exchanger of the utility model;

[0031] Figure 7 is a schematic diagram of the structure of the distributed semiconductor heat pump water heater equipment under the first overhead perspective view arranged below the wash basin;

[0032] Figure 8 is a schematic diagram of the structure of the distributed semiconductor heat pump water heater equipment under the second overhead perspective view arranged below the wash basin;

[0033] Figure 9 is a schematic diagram of the structure of the distributed semiconductor heat pump water heater equipment under the overhead perspective view arranged below the wash basin;

[0034] Figure 10 is a schematic diagram of the structure of the distributed semiconductor heat pump water heater equipment under the front perspective view arranged below the wash basin;

[0035] Figure 11 is the distributed semiconductor heat pump water heater equipment of the utility model.

[0036] List of reference signs

[0037] 110: hot water tank; 111: cold water pipe; 112: hot water pipe; 120: semiconductor sheet; 121: direct current positive electrode; 122: direct current negative electrode; 123: low temperature end face; 124: high temperature end face; 130: heat pipe heat exchanger; 131: heat pipe condenser; 132: heat pipe evaporator; 133: working fluid liquid downcomer; 134: working fluid vapor riser; 140: heat conductive coupling agent; 210: hot water faucet; 220: wash basin; 230: first downcomer; 240: waste water heat extractor; 250: second downcomer; 260: drain pipe. DETAILED DESCRIPTION

[0038] The utility model will be described in detail below in combination with the drawings.

[0039] In the embodiment, a distributed semiconductor heat pump water heater is provided, aiming to improve energy utilization efficiency, especially suitable for controlling hot water energy consumption in zero energy consumption buildings. Figures 1-3 As shown in the figure, the water heater comprises a hot water tank 110, a semiconductor sheet 120, a waste water heat extractor 240 and a heat pipe heat exchanger 130, and realizes effective recovery, conversion and utilization of energy through heat transfer between each component.

[0040] Preferably, as Figures 1-3As shown, the hot water tank 110, as the main component of the water heater, is installed in a location where hot water is needed, such as a kitchen or bathroom. It is preferably placed approximately 1 meter above the ground to facilitate pipe connections and routine maintenance. Depending on the actual installation space, the hot water tank 110 can be vertical or horizontal, and its shape can be cylindrical or rectangular for ease of installation and maintenance.

[0041] Preferably, if Figure 3 、 Figure 11 As shown, one or more semiconductor chips 120 are distributed on one or more sidewalls of the hot water tank 110. When powered, the high-temperature end surfaces 124 of these semiconductor chips 120 directly contact the outer wall of the hot water tank 110, ensuring that heat is quickly and evenly transferred to the water within the tank, thereby improving heating efficiency. Furthermore, the low-temperature end surfaces 123 of the semiconductor chips 120 can be connected to the wastewater heat exchanger 240 or heat pipe heat exchanger 130 through surface contact, thereby forming a closed energy recovery loop between the hot water tank 110, the semiconductor chips 120, the wastewater heat exchanger 240, or the heat pipe heat exchanger 130.

[0042] Preferably, if Figures 7-11 As shown, wastewater heat exchanger 240 is designed as a small water storage device located below wash basin 220 and connected to the drain outlet of wash basin 220 via a first downpipe 230. A filter screen is installed inside first downpipe 230 to prevent clogging and ensure unimpeded water flow. When a user uses wash basin 220, wastewater at a certain temperature flows into wastewater heat exchanger 240. The waste heat of this wastewater is effectively recovered through direct contact with the low-temperature end surface 123 of semiconductor chip 120, and then converted by semiconductor chip 120 into heat energy in hot water tank 110.

[0043] Preferably, the wastewater heat exchanger 240 is designed as a flattened rectangle or oval to increase the contact area with the low-temperature end surface 123 of the semiconductor chip 120. Specifically, the main body of the wastewater heat exchanger 240 can be designed as a flattened rectangular or oval box-like structure, with a thickness that is relatively small relative to its length and width. The purpose of this flattened design is to ensure that the surface of the wastewater heat exchanger 240 and the low-temperature end surface 123 of the semiconductor chip 120 can fit more closely, reducing the air layer in between, thereby improving heat conduction efficiency. By increasing the contact area, the heat in the wastewater can be transferred to the semiconductor chip 120 more evenly and efficiently, thereby improving the efficiency of thermal energy conversion.

[0044] Preferably, the heat pipe heat exchanger 130 is used to absorb heat from the environment and transfer to the semiconductor sheet 120, which in turn converts into heat energy in the hot water tank 110. The design of the heat pipe heat exchanger 130 is based on heat pipe technology, mainly including two parts of heat pipe condenser 131 and heat pipe evaporator 132, which are connected by specific pipes to form a closed circulation channel, filled with specific refrigerant working medium.

[0045] Preferably, as shown in Figures 1-3 、 Figure 6 , the heat pipe condenser 131 and the heat pipe evaporator 132 both adopt a flat rectangular design to increase the surface area in contact with the air and improve heat exchange efficiency. The heat pipe condenser 131 is located at a higher position in the overall device, installed at a height of about 1 meter above the ground, while the heat pipe evaporator 132 is located at a lower position, about half a meter from the ground. Such a layout helps to promote the natural circulation of the refrigerant working medium using gravity. The heat pipe condenser 131 and the heat pipe evaporator 132 are connected by two pipes: the working medium liquid downpipe 133 and the working medium vapor uppipe 134. The two ends of the working medium liquid downpipe 133 are connected to the bottom of the heat pipe condenser 131 and the bottom of the heat pipe evaporator 132, respectively, while the two ends of the working medium vapor uppipe 134 are connected to the top of the heat pipe condenser 131 and the top of the heat pipe evaporator 132, respectively, forming a complete circulation loop. When the heat pipe evaporator 132 absorbs heat from the surrounding air, the internal refrigerant working medium evaporates into gas due to heating, and due to the pressure difference, these gases rise to the heat pipe condenser 131 through the working medium vapor uppipe 134. In the heat pipe condenser 131, the gaseous refrigerant working medium releases heat, which is transferred to the hot water tank 110 through the semiconductor sheet 120, while the refrigerant working medium cools and re-liquefies. The liquefied refrigerant working medium then flows back to the heat pipe evaporator 132 through the working medium liquid downpipe 133 under the action of gravity, completing a cycle. This process is repeated continuously, allowing the heat pipe heat exchanger 130 to continuously absorb heat from the environment and effectively transfer it. To further improve heat exchange efficiency, the outer surfaces of the heat pipe condenser 131 and the heat pipe evaporator 132 are designed with fin structures, increasing the contact area with the air and promoting rapid heat transfer. Considering the reliability of long-term use, all pipes and joints are made of corrosion-resistant materials and are strictly sealed to prevent refrigerant leakage, ensuring the safety and long life of the system. The refrigerant working medium is preferably water, ethylene glycol, alcohol, ammonia, freon, and other environmentally friendly working media that can work in the temperature range of the device.

[0046] Preferably, as shown in Figure 4 、 Figure 5As shown, the semiconductor pieces 120 are in the shape of rectangular thin sheets, each of which has a high-temperature end face 124 on one side and a low-temperature end face 123 on the other side. The high-temperature end face 124 is tightly attached to the side wall of the hot water tank 110 in the form of surface contact, and the low-temperature end face 123 is filled with a thermally conductive coupling agent 140 between the waste water heat extractor 240 or the heat pipe heat exchanger 130, so as to reduce the thermal resistance and improve the heat transfer efficiency. In order to realize detachable connection, fastening assemblies are arranged between the semiconductor pieces 120 and the hot water tank 110, the waste water heat extractor 240 or the heat pipe heat exchanger 130, which can be spring clips, bolt fasteners or other similar mechanical devices. Specifically, the semiconductor pieces 120 are uniformly distributed on one or more side walls of the hot water tank 110 and are usually installed vertically to ensure that heat can be uniformly transferred to the water in the tank. The side wall of the hot water tank 110 is pre-designed with mounting holes or grooves for fixing the fastening assemblies. The edges of each semiconductor piece 120 are provided with spring clips or bolt fasteners, which are tightly pressed to ensure the close contact between the high-temperature end face 124 and the side wall of the hot water tank 110. The design of these fastening assemblies should facilitate disassembly to facilitate maintenance and replacement of the semiconductor pieces 120. For example, the spring clips can be designed as adjustable buckle structures, and the bolt fasteners should have appropriate thread length and diameter to ensure good contact even when the material expands and shrinks due to temperature changes.

[0047] As shown in Figure 4 , Figure 5 Preferably, the direct current positive electrode 121 and the direct current negative electrode 122 of each semiconductor piece 120 are respectively connected to an external power source. In order to ensure stable supply of current, the wires should be made of low-resistance copper and be properly insulated to prevent short circuit or electric leakage. At the same time, in order to avoid the arrangement of the direct current positive electrode 121 and the direct current negative electrode 122 blocking the heat transfer path of the hot water tank 110 and the heat exchanger (the heat pipe evaporator 132 and the waste water heat extractor 240), the wires of the two electrodes can be led out from the side of the semiconductor piece 120 rather than from the two heat absorbing and releasing end faces.

[0048] Preferably, in order to prevent corrosion, the waste water heat extractor 240 and the heat pipe condenser 131 are attached to the contact surface of the semiconductor piece 120 and are plated or coated with an anti-corrosion layer. These anti-corrosion layers can be metal plating layers (such as nickel plating layers) or anti-corrosion paints, which have good corrosion resistance and thermal conductivity and can ensure that the heat transfer efficiency will not decrease due to corrosion in long-term use.

[0049] Preferably, a layer of heat-conducting coupling agent 140 is further filled between the low-temperature end surface 123 of the semiconductor sheet 120 and the waste water heat extractor 240 or the heat pipe heat exchanger 130. The coupling agent has high heat conductivity and good fluidity, and can form a uniform heat-conducting layer between the low-temperature end surface 123 and the waste water heat extractor 240 or the heat pipe heat exchanger 130, further reducing the thermal resistance. The heat-conducting coupling agent 140 can be selected from machine oil, transformer oil, lubricating grease, glycerol, water glass (sodium silicate Na2SiO3), or industrial glue, chemical paste, etc. These materials have good chemical stability and temperature resistance, so as to ensure that they will not degrade or fail during long-term operation. In addition, in order to ensure uniform distribution of the coupling agent, a syringe or other tool can be used for precise filling during installation, avoiding the generation of air bubbles and ensuring optimal heat transfer effect.

[0050] Preferably, as shown in Figure 4 、 Figure 5 , the top and bottom of the hot water tank 110 are each provided with a through-surface pipe, which is the cold water pipe 111 and the hot water pipe 112, respectively. The inlet of the cold water pipe 111 is connected to the tap water supply pipe, and the outlet is arranged in the bottom layer area of the hot water tank 110, specifically about 50-100 mm from the bottom of the tank. A filter screen is also installed at the inlet of the cold water pipe 111 to prevent impurities from entering the hot water tank 110 and affecting water quality and system operation. The outlet of the hot water pipe 112 is connected to the hot water faucet 210, and the inlet is arranged in the top layer area of the hot water tank 110, specifically about 50-100 mm from the top of the tank. The hot water pipe 112 is designed in a straight pipe form to reduce water flow resistance and ensure smooth flow of hot water.

[0051] Preferably, the first downpipe 230 is provided with an overflow hole on the side wall of the section between the waste water heat extractor 240 and the wash basin 220. The diameter of the overflow hole is smaller than that of the first downpipe 230, and it is located about 20-30 mm from the top of the first downpipe 230, which can be determined according to the installation space. The overflow hole extends a sloping overflow pipe towards the second downpipe 250. The overflow pipe is made of PVC and can be connected to the second downpipe 250 in liquid-tight manner to ensure that water does not leak. The second downpipe 250 is made of PVC and can be led out from the bottom of the waste water heat extractor 240, extending downward and connecting to the drain pipe 260 after forming a water seal structure. The design of the water seal structure can prevent the reverse flow of odors in the sewer and improve sanitary conditions. A manual valve is arranged on the second downpipe 250, which is located between the connection point of the overflow pipe and the second downpipe 250 and the connection point of the second downpipe 250 and the waste water heat extractor 240, facilitating operation and maintenance.

[0052] The overflow hole and the overflow pipe are designed to ensure that when the wastewater heat exchanger 240 is full, the excess wastewater can flow through the overflow hole into the overflow pipe and then into the second sewer pipe 250, preventing the wastewater from overflowing and causing sanitation problems. To further optimize the performance of the device, the overflow pipe of the first sewer pipe 230 and the connection of the second sewer pipe 250 can be sealed with a sealing ring or glue to ensure that the water flow does not leak. At the same time, the slope design of the overflow pipe needs to meet the building drainage specification to ensure smooth water flow and avoid water accumulation.

[0053] It should be noted that the above specific embodiments are exemplary, and those skilled in the art can come up with various solutions under the inspiration of the disclosure of the present application, and these solutions also belong to the disclosed range of the present application and fall within the protection scope of the present application. Those skilled in the art should understand that the present application specification and its drawings are illustrative and not constitute a limitation on the claims. The protection scope of the present application is defined by the claims and their equivalents. Throughout the text, the features introduced by "preferably" are only optional, and should not be understood as necessarily provided, therefore the applicant reserves the right to abandon or delete the relevant preferred features at any time.

Claims

1. A distributed semiconductor heat pump water heater device, comprising a hot water tank (110), characterized in that, one or more side walls of the hot water tank (110) are configured with semiconductor pieces (120), high-temperature end faces (124) of the semiconductor pieces (120) that release heat when energized are attached to the side walls of the hot water tank (110) in a surface contact manner, low-temperature end faces (123) of the semiconductor pieces (120) that absorb heat when energized are connected to a wastewater heat extractor (240) or a heat pipe heat exchanger (130) in a surface contact manner, wherein, the wastewater heat extractor (240) stores wastewater with heat through a first sewer pipe (230) connected to a drain of a wash basin (220), the heat pipe heat exchanger (130) is configured with a circulating channel in which a refrigerant working medium that can absorb heat from air flows.

2. The apparatus of claim 1, wherein, the hot water tank (110) is configured with a cold water pipe (111) and a hot water pipe (112) in a through surface manner, an inlet of the cold water pipe (111) is connected to a tap water supply pipe, and an outlet thereof is configured in a bottom area inside the hot water tank (110); an outlet of the hot water pipe (112) is connected to a hot water faucet (210), and an inlet thereof is configured in a top area of the hot water tank (110).

3. The apparatus of claim 1, wherein, the semiconductor pieces (120) comprise a direct current positive electrode (121) and a direct current negative electrode (122) connected to an external power supply, and the low-temperature end faces (123) of the semiconductor pieces (120) are filled with a heat-conducting coupling agent (140) between the low-temperature end faces (123) and the wastewater heat extractor (240) or the heat pipe heat exchanger (130).

4. The apparatus of claim 1, wherein, the wastewater heat extractor (240) is connected to a second sewer pipe (250), and the second sewer pipe (250) is connected to a drain pipe (260) after forming a water seal structure.

5. The apparatus of claim 1, wherein, the heat pipe heat exchanger (130) comprises a heat pipe condenser (131) and a heat pipe evaporator (132), the height of the heat pipe condenser (131) is higher than that of the heat pipe evaporator (132), and the two are connected through a working medium liquid downcomer (133) and a working medium vapor riser (134) to form a channel allowing the circulation of the refrigerant working medium.

6. The apparatus of claim 5, wherein, two ends of the working medium liquid downcomer (133) are connected to the bottom of the heat pipe condenser (131) and the bottom of the heat pipe evaporator (132), respectively, and two ends of the working medium vapor riser (134) are connected to the top of the heat pipe condenser (131) and the top of the heat pipe evaporator (132), respectively.

7. The apparatus of claim 4, wherein, the first sewer pipe (230) is provided with an overflow hole on the side wall of the section between the wastewater heat extractor (240) and the wash basin (220), the overflow hole extends a sloped overflow pipe to the second sewer pipe (250) and is connected thereto in a liquid-tight manner.

8. The apparatus of claim 1, wherein, a fastening assembly is configured between the semiconductor pieces (120) and the hot water tank (110), the wastewater heat extractor (240), or the heat pipe heat exchanger (130) to achieve detachable connection.

9. The apparatus of claim 7, wherein, A valve is arranged on the second drain pipe (250) between the connection point of the overflow pipe and the second drain pipe (250) and the connection point of the second drain pipe (250) and the waste water heat extractor (240), After the heat extraction of the semiconductor wafer (120) is completed, the valve can be opened to discharge the cooling waste water in the waste water heat extractor (240).

10. The apparatus of claim 5, wherein, The contact surface of the waste water heat extractor (240) and the heat pipe condenser (131) is plated or coated with an anti-corrosion layer.

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