Thermocouple temperature measuring plate based on VPX architecture

Abstract

The utility model relates to a thermocouple temperature measurement plate based on a VPX framework, and relates to the technical field of electronic equipment, the thermocouple temperature measurement plate comprises a heat dissipation module, a VPX board card, a bottom plate, a panel and a plurality of thermocouple sensors, and the VPX board card is located between the bottom plate and the heat dissipation module in the direction perpendicular to the VPX board card; the panel is located on one side of the VPX board card in the direction parallel to the VPX board card; the VPX board card comprises a central processing unit, and at least part of the thermocouple sensors are used for measuring the surface temperature of the central processing unit; the heat dissipation module comprises a heat-conducting pad; at least part of the thermocouple sensors are used for measuring the surface temperature of the heat-conducting pad; the VPX board card comprises an IPMI module, and the IPMI module is electrically connected with the plurality of thermocouple sensors. Therefore, the measurement precision can be improved, and the heat-conducting property of the heat-conducting pad can be detected. The thermocouple temperature measuring plate is compact in structure and easy to integrate, and can be widely applied to various fields.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of electronic equipment, and in particular to a thermocouple temperature measurement plate based on a VPX architecture. BACKGROUND

[0002] The computer bus, also known as the VPX bus, is a new generation of high-speed serial bus standard proposed by VITA (VME International Trade Association) based on the VME bus in 2007. Due to its high integration, small size, light weight, and convenient maintenance, it has become an important component commonly used in electronic systems. In the fields of industrial automation, aerospace, and national defense, temperature monitoring is crucial for the safety and performance of equipment. As the core unit in integrated data processing, temperature rise must be strictly controlled to ensure the safety of electronic equipment. Therefore, the heat dissipation problem of VPX needs to be solved.

[0003] There are various temperature measurement schemes on the market, but existing thermocouple temperature measurement systems usually face problems such as slow response speed and low integration. With the development of industrial automation and intelligent manufacturing, the accuracy and speed of temperature measurement are increasingly demanding. VPX architecture, as a high-performance modular electronic equipment interface, has high-speed data transmission and strong expansion capability, making it suitable for high-performance temperature measurement systems. UTILITY MODEL CONTENT

[0004] To solve the above technical problems, the present disclosure provides a thermocouple temperature measurement plate based on a VPX architecture to improve temperature measurement accuracy and response speed.

[0005] In a first aspect, the present disclosure provides a thermocouple temperature measurement plate based on a VPX architecture, comprising: a heat dissipation module, a VPX board card, a bottom plate, a panel, and a plurality of thermocouple sensors; along a first direction, the bottom plate is located on one side of the VPX board card, and the heat dissipation module is located on the side of the VPX board card away from the bottom plate, and the first direction is perpendicular to the plane where the VPX board card is located; along a second direction, the panel is located on one side of the VPX board card, and the second direction is parallel to the plane where the VPX board card is located; the VPX board card includes a central processing unit, at least part of the thermocouple sensors are fixed around the central processing unit and in contact with the surface of the central processing unit; the heat dissipation module includes a heat-conducting pad, at least part of the thermocouple sensors are fixed on the side of the heat dissipation module facing the heat-conducting pad and in contact with the surface of the heat-conducting pad; the VPX board card includes an IPMI module, and the IPMI module is electrically connected to a plurality of thermocouple sensors.

[0006] Optionally, the heat dissipation module comprises an upper cold plate and at least one sub-cold plate, the upper cold plate comprises at least one through hole, the sub-cold plate corresponds to the through hole one by one, the sub-cold plate covers the through hole, and the sub-cold plate and the upper cold plate are connected through detachable structure.

[0007] Optionally, the VPX board card comprises a hard disk module, the sub-cold plate comprises a first cold plate, a second cold plate and a third cold plate, along the first direction, the first cold plate at least partially overlaps the central processing unit, the second cold plate at least partially overlaps the IPMI module, and the third cold plate at least partially overlaps the hard disk module.

[0008] Optionally, the thermal pad is located on a side of the first cold plate facing the central processing unit.

[0009] Optionally, the thermocouple sensor comprises a first thermocouple sensor and a second thermocouple sensor, the first thermocouple sensor is fixed on both sides of the central processing unit along the second direction and in surface contact with the central processing unit, and the second thermocouple sensor is fixed on a side of the first cold plate facing the thermal pad and in surface contact with the thermal pad; along the first direction, the first thermocouple sensor and the second thermocouple sensor are projected to overlap.

[0010] Optionally, the thermocouple sensor comprises a K-type thermocouple sensor.

[0011] Optionally, the plate material of the heat dissipation module comprises a metal material and a high-thermal-conductivity non-metal material.

[0012] Optionally, the IPMI module comprises a thermocouple temperature acquisition circuit, the thermocouple temperature acquisition circuit comprises an amplifier, a digital-to-analog converter and a single-chip microcomputer, the amplifier is connected with the thermocouple sensor one by one, the amplifier is connected with the digital-to-analog converter, and the digital-to-analog converter is connected with the single-chip microcomputer in parallel port form.

[0013] Optionally, the thermocouple temperature measurement panel comprises a communication interface, the panel comprises a plurality of grooves, the grooves penetrate through the panel along the second direction, and the grooves and the communication interface are projected to overlap along the second direction.

[0014] Compared with the prior art, the technical scheme provided by the embodiments of the present disclosure has the following advantages:

[0015] The thermocouple temperature measurement panel based on the VPX architecture has the advantages of compact structure, high measurement accuracy, fast response speed and easy integration, is suitable for temperature monitoring requirements in various fields, and has wide application prospect. BRIEF DESCRIPTION OF DRAWINGS

[0016] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0017] In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0018] Figure 1 FIG2 is a schematic structural diagram of a thermocouple temperature measurement board based on a VPX architecture provided by an embodiment of the present disclosure;

[0019] Figure 2 Shown Figure 1 Exploded diagram;

[0020] Figure 3 Shown Figure 1 Schematic diagram of the heat dissipation module;

[0021] Figure 4 Shown Figure 1 Diagram showing the relative positions of the through holes in the middle and upper cold plates and the CPU;

[0022] Figure 5 Shown Figure 1 A diagram showing the relative positions of the first thermocouple sensor and the second thermocouple sensor;

[0023] Figure 6 Shown is a connection diagram of a thermocouple temperature acquisition circuit provided by an embodiment of the present disclosure. DETAILED DESCRIPTION

[0024] In order to more clearly understand the above-mentioned objectives, features and advantages of the present disclosure, the scheme of the present disclosure will be further described below. It should be noted that the embodiments of the present disclosure and the features therein can be combined with each other in the absence of conflict.

[0025] In the following description, many specific details are set forth to facilitate a full understanding of the present disclosure, but the present disclosure may also be implemented in other ways different from those described herein; it is obvious that the embodiments in the specification are only part of the embodiments of the present disclosure, rather than all of the embodiments.

[0026] Figure 1 FIG. 1 is a schematic diagram of a thermocouple temperature measurement board based on a VPX architecture provided by an embodiment of the present disclosure. Figure 2 Shown Figure 1 Exploded diagram, Figure 3 Shown Figure 1A schematic diagram of the heat dissipation module in plan view, Figure 4 As shown in Figure 1 A diagram of the relative positions of the through holes in the upper cold plate and the central processor, Figure 5 As shown in Figure 1 A diagram of the relative positions of the first and second thermocouple sensors, please refer to Figures 1 to 5 The present disclosure provides a thermocouple temperature measurement plate 100 based on a VPX architecture, comprising: a heat dissipation module 9, a VPX board 2, a bottom plate 5, a panel 1, and a plurality of thermocouple sensors 7; along a first direction D1, the bottom plate 5 is located on one side of the VPX board 2, and the heat dissipation module 9 is located on the side of the VPX board 2 away from the bottom plate 5, and the first direction D1 is perpendicular to the plane on which the VPX board 2 is located; along a second direction D2, the panel 1 is located on one side of the VPX board 2, and the second direction D2 is parallel to the plane on which the VPX board 2 is located; please refer to Figure 5 The VPX board 2 includes a central processor 0, and at least part of the thermocouple sensors 7 are fixed around the central processor 0 and in contact with the surface of the central processor 0; the heat dissipation module 9 includes a heat-conducting pad 10, and at least part of the thermocouple sensors 7 are fixed on the side of the heat dissipation module 9 facing the heat-conducting pad 10 and in contact with the surface of the heat-conducting pad 10; please refer to Figures 2 to 5 The VPX board 2 includes an IPMI module 6 (Intelligent Platform Management Interface), and the IPMI module 6 is electrically connected to the plurality of thermocouple sensors 7. It should be noted that "electrical connection" in this document includes direct electrical connection and indirect electrical connection, including electrical connection achieved by direct contact or wire, and also including electrical connection achieved by switching through other conductive devices, and the present disclosure does not make specific limitations on this, as long as the signal transmission between the two is satisfied.

[0027] Specifically, in an optional embodiment provided by the present disclosure, the structure size of the thermocouple temperature measurement plate 100 conforms to the VPX standard (such as 3U or 6U), so as to facilitate rapid integration into existing systems. The structure of the thermocouple temperature measurement plate 100 provides a standardized interface (such as a VPX backplane interface 3) to facilitate data transmission and power supply.

[0028] The thermocouple temperature measurement plate 100 includes a panel 1, and optionally, the panel 1 is a 6U7HP board profile panel structure conforming to the VPX standard, and the present disclosure does not make specific limitations on the model of the panel 1. It can be understood that if other standard form panels 1 are required in actual use scenarios, 3U or 6U other width size panel 1 components conforming to the VPX standard can be replaced as required.

[0029] The thermocouple temperature measurement plate 100 comprises a VPX board card 2, which is optionally a high-performance Feiteng 2000+ 64-core 6U board card. The board card complies with the OpenVPX 6U standard specification, and the signal definition complies with the OpenVPX VITA 65 standard requirement. The present disclosure does not specifically limit the model of the VPX board card 2, and other hardware architecture form board card types can be used according to actual conditions. A 3U board card size form can also be used.

[0030] The thermocouple temperature measurement plate 100 comprises a bottom plate 5 for protecting the devices on the VPX board card 2 and having a certain heat dissipation function.

[0031] Referring to Figures 3 to 5 The thermocouple temperature measurement plate 100 further comprises a plurality of thermocouple sensors 7. Along the second direction D2, at least part of the thermocouple sensors 7 are located around the central processor 0. Optionally, at least part of the thermocouple sensors 7 are located on both sides of the central processor 0 along the second direction D2, or at least part of the thermocouple sensors 7 are located outside any adjacent three edges of the central processor 0, or at least part of the thermocouple sensors 7 surround the periphery of the circumference of the central processor 0. The present disclosure does not limit this, and the specific conditions are subject to actual needs. Please refer to Figure 5 The thermocouple sensor 7 located around the central processor 0 is a first thermocouple sensor 71. The test sensing head of the first thermocouple sensor 71 is in contact with the surface of the central processor 0, and is used to measure the temperature of the central processor 0. Optionally, the first thermocouple sensor 71 can be adhered to the VPX board card 2 by means of hot melt adhesive. The present disclosure does not limit the connection mode of the first thermocouple sensor 71 and the VPX board card 2. They can also be connected by other modes, and the specific conditions are subject to actual needs. At least part of the thermocouple sensors 7 are fixed to one side of the heat dissipation module 9 facing the heat conduction pad 10. The thermocouple sensor 7 fixed to the heat dissipation module 9 is a second thermocouple sensor 72. The test sensing head of the second thermocouple sensor 72 is in contact with the surface of the heat conduction pad 10, and is used to measure the temperature of the heat conduction pad 10. Optionally, the heat dissipation module 9 comprises a clamping groove (not shown in the figure). The second thermocouple sensor 72 can be clamped in the clamping groove to achieve fixation. The present disclosure does not limit the connection mode of the second thermocouple sensor 72 and the heat dissipation module 9. For example, it can also be in other forms such as adhesion, and the specific conditions are subject to actual needs. That is, along the first direction D1, the test sensing probe of the first thermocouple sensor 71 is in contact with the surface of the central processor 0, and is used to measure the surface temperature of the central processor 0. The test sensing probe of the second thermocouple sensor 72 is in contact with the surface of the heat conduction pad 10, and is used to measure the surface temperature of the heat conduction pad 10.

[0032] Optionally, the heat conduction pad 10 on the heat dissipation module 9 is of a detachable structure, which is convenient for replacement.

[0033] The VPX board card 2 comprises an IPMI module 6, the IPMI module 6 is electrically connected with a plurality of thermocouple sensors 7, the IPMI module 6 can integrate a high-precision data acquisition chip, has a fast sampling and high resolution capability. Further, a supporting software can be provided to support real-time monitoring and data recording of the central processor 0 and the heat-conducting pad 10. Further, the IPMI module 6 has a data analysis capability, can generate and output a temperature change curve, and is convenient for intuitive monitoring.

[0034] In this way, by arranging the thermocouple temperature measurement plate 100 comprising the heat dissipation module 9, the plurality of thermocouple sensors 7, the VPX board card 2, the bottom plate 5 and the panel 1, the heat-conducting performance of the heat-conducting pad 10 can be detected; the temperature of the central processor 0 and the heat-conducting pad 10 is detected at the same time, the measurement accuracy can be improved, the heat-conducting pad 10 can be replaced in time, and the response speed can be improved; the thermocouple temperature measurement plate 100 has a compact structure and is easy to integrate, and can be widely applied to various fields.

[0035] Please refer to Figures 2 to 4 The heat dissipation module 9 comprises an upper cold plate e and at least one sub-cold plate f, the upper cold plate e comprises at least one through hole 12, the sub-cold plate f corresponds to the through hole 12 one by one, the sub-cold plate f covers the through hole 12, and the sub-cold plate f is connected with the upper cold plate e through a detachable structure.

[0036] Specifically, in an optional embodiment provided in the present disclosure, the upper cold plate e comprises at least one through hole 12, the through hole 12 penetrates the upper cold plate e along the first direction D1, the heat dissipation module 9 comprises at least one sub-cold plate f, the sub-cold plate f is connected with the upper cold plate e through a detachable structure, and the sub-cold plate f covers the through hole 12. Optionally, a plurality of sub-cold plates f are connected with the upper cold plate e through bolts d respectively, and the present disclosure does not make a specific limitation on the form of the detachable structure, for example, the detachable structure can also be a clamping structure, a mortise and tenon structure or other structures, and the specific form can be set according to actual needs. The sub-cold plate f is connected with the upper cold plate e in a detachable manner, which facilitates disassembly and replacement. In this way, by arranging the sub-cold plate f and the upper cold plate e in a detachable structure, the disassembly and replacement of each sub-cold plate f are facilitated, and manpower and material resources are saved.

[0037] The number of through holes 12 is only an example in the drawings, and the present disclosure does not make a specific limitation on the number of through holes 12. Correspondingly, the present disclosure does not make a specific limitation on the number of sub-cold plates f, and the specific number is subject to actual needs, as long as the number of through holes 12 corresponds to the number of sub-cold plates f one by one.

[0038] Please refer to Figure 2 and Figure 3 The VPX board card 2 comprises a hard disk module 4, the sub-cold plate f comprises a first cold plate a, a second cold plate b and a third cold plate c, along the first direction D1, the first cold plate a at least partially overlaps with the central processor 0, the second cold plate b at least partially overlaps with the IPMI module 6, and the third cold plate c at least partially overlaps with the hard disk module 4.

[0039] Specifically, in an optional embodiment provided by the present disclosure, the upper cold plate e includes three through holes 12, which can be of the same shape or different shapes, and the present disclosure does not limit this. One through hole 12 covers the first cold plate a, and the first cold plate a is connected with the upper cold plate e through the bolt d. Optionally, the bolt d is located on both sides of the first cold plate a along the second direction D2, and the present disclosure does not limit the position of the bolt. The bolt d can also be located at other positions, and the specific position can be determined according to actual needs, as long as the bolt d can fix the first cold plate a and the upper cold plate e. Along the first direction D1, the first cold plate a is located on the side of the central processor 0 away from the bottom plate 5. Optionally, the area of the first cold plate a is approximately equal to that of the central processor 0, and the present disclosure does not limit this. The area of the first cold plate a can also be larger than that of the central processor 0, and the specific size can be determined according to actual needs, as long as the projection of the first cold plate a on the central processor 0 in the first direction D1 at least partially overlaps. Figure 5 Optionally, the side of the first cold plate a facing the central processor 0 further includes a heat-conducting pad 10, which is detachably connected to the first cold plate a. The first cold plate a further fixedly has a second thermocouple sensor 72, which is used to measure the temperature of the side of the heat-conducting pad 10 away from the central processor 0. By modularizing the heat dissipation module 9, the heat-conducting pad 10 or the thermocouple sensor 7 can be replaced or upgraded as needed according to application requirements. It should be noted that, in order to facilitate understanding of the relative position relationship between the first thermocouple sensor 71 and the second thermocouple sensor 72, the second thermocouple sensor 72 is drawn on the side of the heat-conducting pad 10 facing the central processor 0. Actually, the second thermocouple sensor 72 is located on the side of the heat-conducting pad 10 away from the central processor 0. It can be understood that the second thermocouple sensor 72 can also be located at other positions, and the specific position can be determined according to actual needs.

[0040] Optionally, referring to Figures 2 to 3 , one through hole 12 covers the second cold plate b, and the second cold plate b is connected with the upper cold plate e through the bolt d. The second cold plate b is located on the side of the IPMI module 6 away from the bottom plate 5. Optionally, one through hole 12 covers the third cold plate c, and the third cold plate c is connected with the upper cold plate e through the bolt d. The third cold plate c is located on the side of the hard disk module 4 away from the bottom plate 5. Since the IPMI module 6 and the hard disk module 4 are both fixed in the form of a small buckle plate on the VPX board card 2, by modularizing the heat dissipation module 9, the IPMI module 6 and the hard disk module 4 can be used for inspection or replacement. The second cold plate b or the third cold plate c can also be repaired or replaced as needed.

[0041] In this way, by arranging the heat dissipation module 9 in the form of the above cold plate e as a substrate and the plurality of sub-cold plates f being detachably connected, the maintenance or replacement of each device on the VPX board card 2 can be facilitated, and the maintenance or replacement of the heat-conducting pad 10 and the thermocouple sensor 7 can be facilitated, thereby reducing the difficulty of maintenance and saving manpower and resources.

[0042] Optionally, the hard disk module 4 adopts a hard disk module with an mSATA SSD 256GB memory space, which can realize large-capacity long-time data storage for test data. The type of the hard disk module 4 is not specifically limited in the present disclosure, and the hard disk module 4 can also include hard disks of other types and capacities, which are specifically set according to actual needs.

[0043] Please refer to Figures 1 to 5 , the heat-conducting pad 10 is located on the side of the first cold plate a facing the central processor 0.

[0044] Specifically, the heat-conducting pad 10 is made of high-performance heat-conducting material and can be used to enhance the heat dissipation capacity of the heat-generating device on the VPX board card 2. As described above, the first thermocouple sensor 71 is used to detect the temperature of the surface of the central processor 0, and the second thermocouple sensor 72 is used to detect the temperature of the surface of the side of the heat-conducting pad 10 away from the central processor 0. Along the first direction D1, the projection of the heat-conducting pad 10 and the central processor 0 at least partially overlaps, and the heat-conducting pad 10 is used to enhance the heat dissipation capacity of the central processor 0. In this way, by arranging the heat-conducting pad 10 on the side of the first cold plate a facing the central processor 0, the heat dissipation capacity of the central processor 0 can be enhanced, and the normal operation of the central processor 0 can be ensured.

[0045] Please refer to Figure 4 and Figure 5 , the thermocouple sensor 7 includes the first thermocouple sensor 71 and the second thermocouple sensor 72. The first thermocouple sensor 71 is fixed on both sides of the central processor 0 along the second direction D2 and in contact with the surface of the central processor 0. The second thermocouple sensor 72 is fixed on the side of the first cold plate a facing the heat-conducting pad 10 and in contact with the surface of the heat-conducting pad 10. Along the first direction D1, the projection of the first thermocouple sensor 71 and the second thermocouple sensor 72 overlaps.

[0046] Specifically, along the first direction D1, the first thermocouple sensor 71 for detecting the surface temperature of the central processor 0 overlaps the projection of the second thermocouple sensor 72 for detecting the surface temperature of the heat-conducting pad 10, that is, the first thermocouple sensor 71 and the second thermocouple sensor 72 are located on both sides of the heat-conducting pad 10 along the first direction D1, respectively for detecting the temperature of the central processor 0 and the heat-conducting pad 10. Further, since the heat distribution inside the central processor 0 can be uneven, the first thermocouple sensor 71 and the second thermocouple sensor 72 are arranged in one-to-one correspondence in the first direction D1, and the temperature data measured by the second thermocouple sensor 72 is compared with the temperature data measured by the first thermocouple sensor 71 at the corresponding position, which can be used to detect the heat-conducting performance of the heat-conducting pad 10; when the temperature data of the heat-conducting pad 10 and the temperature data of the central processor 0 in the same projection position are compared, it is more convincing. It can be understood that the number of the first thermocouple sensor 71 and the second thermocouple sensor 72 is equal.

[0047] In this way, by arranging the first thermocouple sensor 71 and the second thermocouple sensor 72 in one-to-one correspondence in the first direction D1, the temperature data of the heat-conducting pad 10 and the central processor 0 in the same projection position can be compared more convincingly, which is beneficial to subsequent temperature comparison analysis.

[0048] It should be noted that in the embodiments of the present disclosure, only 4-way temperature data of the central processor 0 and 4-way thermocouple data of the heat-conducting pad 10 are tested, and the present disclosure does not specifically limit the number of test sites, and the number of test thermocouple sensors 7 and the number of test sites can be increased as needed.

[0049] Please refer to Figures 1 to 5 , the thermocouple sensor 7 includes a K-type thermocouple sensor 7.

[0050] Specifically, the thermocouple temperature measurement plate 100 is embedded with multiple types of thermocouple sensors 7 (such as K-type, J-type, etc.), and the present disclosure does not limit the type of thermocouple sensor 7, and other types of thermocouples can be selected according to needs. Taking the K-type thermocouple sensor 7 as an example, the electrode material of the K-type thermocouple sensor 7 is nickel-chromium-nickel-silicon, the measurement accuracy can reach 0.01 level, the temperature range is -40℃~+500℃, and the test sensing head thickness is 0.16mm thin sheet, which can make the measurement data more accurate.

[0051] Please refer to Figures 1 to 5 , the plate material of the heat dissipation module 9 includes metal materials and high-thermal-conductivity non-metal materials.

[0052] Specifically, the upper cold plate e and the sub-cold plate f in the heat dissipation module 9 can be made of high thermal conductivity materials, such as high thermal conductivity metal materials and high thermal conductivity non-metallic materials. Optionally, the metal material includes a metal with high thermal conductivity, such as aluminum or copper, to improve the thermal response speed. Optionally, the non-metallic material includes a non-metallic material with high thermal conductivity, such as carbon fiber. These materials are not listed here one by one. It is sufficient that the plate of the heat dissipation module 9 is made of a material with high thermal conductivity. This will help improve the thermal response speed and facilitate heat dissipation.

[0053] Figure 6 The figure shows a connection diagram of a thermocouple temperature acquisition circuit provided by an embodiment of the present disclosure. Please refer to Figures 1 to 6 The IPMI module 6 includes a thermocouple temperature acquisition circuit, which includes an amplifier, a digital-to-analog converter and a single-chip microcomputer. The amplifier is connected to the thermocouple sensor 7 in a one-to-one correspondence, the amplifier is connected to the digital-to-analog converter, and the digital-to-analog converter is connected to the single-chip microcomputer in a parallel port form.

[0054] Specifically, in an optional embodiment provided by the present disclosure, 8 AD8495 amplifiers are used to amplify the tiny signals of the analog inputs of the 8-way thermocouple sensors 7, and the signals output from the amplifiers enter the analog-to-digital converter AD7606 to be converted into digital signals, which are transmitted to the single-chip microcomputer MCU in the form of a parallel port. The single-chip microcomputer MCU then filters the received data and finally transmits the processed thermocouple temperature data to the backplane MCU unit (Micro Control Unit) through the IPMB bus (Intelligent Platform Management Bus).

[0055] Optionally, the amplifier includes a built-in cold-junction compensation function. Since the voltage measured by the thermocouple sensor 7 reflects the temperature difference between the hot and cold junctions (the connection terminal or the end away from the measured object), and the cold junction temperature is often not zero degrees, this can reduce the thermoelectric potential difference and cause inaccurate measurements. To reduce this error, the amplifier internally implements certain measures, such as connecting thermal resistors in series to form a bridge, to compensate for the effects of cold-junction temperature variations, thereby determining the true hot-junction temperature. In this way, temperature measurement errors caused by temperature variations can be reduced, effectively improving measurement accuracy.

[0056] In this way, by setting up the IPMI module 6 with a thermocouple temperature acquisition circuit, the measurement accuracy can be effectively improved while collecting temperature data, and the final processed temperature data can be transmitted to the backplane MCU unit, realizing the integration of temperature acquisition, compensation and transmission.

[0057] It should be noted that other functions of the IPMI module 6 are the same as those in the prior art and are not described in detail here.

[0058] Please refer to Figure 2 and Figure 5 The thermocouple temperature measurement plate 100 includes a communication interface 11, and the panel 1 includes a plurality of grooves 13 penetrating the panel 1 along the second direction D2, and the projection of the communication interface 11 along the second direction D2 overlaps the grooves 13.

[0059] Specifically, in an optional embodiment provided by the present disclosure, the communication interface 11 in the VPX board card 2 includes a 2-way usb3.0 (Universal Serial Bus) interface, a 1-way ETH (Ethernet) network interface, and a 1-way VGA (Video Graphics Array) interface, etc. The communication interface 11 is responsible for communication with external systems, can realize single-board data export and processing, and the front interface is designed with an indicator light, which can display the state of the board card. Along the second direction D2, the panel 1 includes a plurality of grooves 13 penetrating the panel 1, the number and shape of the grooves 13 are adapted to the communication interface 11 in the VPX board card 2, for user access to the communication interface 11 from the front end of the panel 1, and the panel 1 can also be used to protect the VPX board card 2. Optionally, the panel 1 can also include a display screen for displaying temperature curves, etc.

[0060] For example, the present disclosure is a 6U7HP VPX standard board card, but this scheme can be derived into a 3U VPX standard board card and other forms of non-standard board cards, etc., and the present disclosure does not limit this.

[0061] The thermocouple temperature measurement plate 100 based on the VPX architecture provided by the embodiments of the present disclosure has the advantages of compact structure, high measurement accuracy, fast response speed, and easy integration, etc., is suitable for temperature monitoring needs in various fields, and has a wide application prospect.

[0062] In summary, the present disclosure provides a thermocouple temperature measurement plate based on VPX architecture, which comprises a heat dissipation module, a plurality of thermocouple sensors, a VPX board, a bottom plate and a panel. The thermocouple temperature measurement plate can be used to detect the heat conduction performance of the heat conduction pad. The temperature detection is performed on the central processor and the heat conduction pad at the same time, which can improve the measurement accuracy. The thermocouple temperature measurement plate has a compact structure and is easy to integrate, and can be widely used in various fields. By setting the sub-cooling plate and the upper cooling plate in a detachable structure connection, the disassembly and replacement of each sub-cooling plate is facilitated. By modularizing the heat dissipation module, the heat conduction pad or the thermocouple sensor can be replaced or upgraded. By setting the heat dissipation module in the form of the upper cooling plate as the substrate and the plurality of sub-cooling plates being detachably connected, the devices on the VPX board, the heat conduction pad and the thermocouple sensor can be repaired or replaced, which reduces the difficulty of repair and saves manpower and resources. By setting the first thermocouple sensor and the second thermocouple sensor in one-to-one correspondence in the first direction, the temperature data comparison of the heat conduction pad and the central processor in the same projection position is more convincing, which is beneficial to subsequent temperature comparison analysis. The plate material of the heat dissipation module is a material with high thermal conductivity, which is beneficial to heat dissipation. By setting the IPMI module with the thermocouple temperature acquisition circuit, temperature acquisition, compensation and transmission integration are realized.

[0063] The above description is only a specific embodiment of the present disclosure, which enables those skilled in the art to understand or implement the present disclosure. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present disclosure. Therefore, the present disclosure will not be limited to these embodiments described herein, but will conform to the widest range consistent with the principles and novel features disclosed herein.

Claims

1. A thermocouple temperature measurement plate based on a VPX architecture, characterized in that, The application relates to a heat dissipation module, a VPX board, a bottom plate, a panel and a plurality of thermocouple sensors. The bottom plate is located on one side of the VPX board along a first direction, the heat dissipation module is located on the side of the VPX board away from the bottom plate along the first direction, and the first direction is perpendicular to the plane where the VPX board is located. The panel is located on one side of the VPX board along a second direction, and the second direction is parallel to the plane where the VPX board is located. The VPX board comprises a central processing unit, and at least part of the thermocouple sensors are fixed around the central processing unit and in surface contact with the central processing unit. The heat dissipation module comprises a heat-conducting pad, and at least part of the thermocouple sensors are fixed on the side of the heat dissipation module facing the heat-conducting pad and in surface contact with the heat-conducting pad. The VPX board comprises an IPMI module, and the IPMI module is electrically connected with the plurality of thermocouple sensors. The heat dissipation module comprises an upper cold plate and at least one sub-cold plate, the upper cold plate comprises at least one through hole, the sub-cold plate corresponds to the through hole one by one, the sub-cold plate covers the through hole, and the sub-cold plate is connected with the upper cold plate through a detachable structure.

2. The thermocouple temperature measurement board based on VPX architecture according to claim 1, wherein, The VPX board comprises a hard disk module, the sub-cold plate comprises a first cold plate, a second cold plate and a third cold plate, along the first direction, the first cold plate at least partially overlaps with the central processing unit, the second cold plate at least partially overlaps with the IPMI module, and the third cold plate at least partially overlaps with the hard disk module.

3. The VPX architecture based thermocouple temperature measurement board as claimed in claim 2, wherein, The heat-conducting pad is located on the side of the first cold plate facing the central processing unit.

4. The VPX architecture based thermocouple temperature measurement board as claimed in claim 3, wherein, The thermocouple sensors comprise first thermocouple sensors and second thermocouple sensors, the first thermocouple sensors are fixed on the two sides of the central processing unit along the second direction and in surface contact with the central processing unit, and the second thermocouple sensors are fixed on the side of the first cold plate facing the heat-conducting pad and in surface contact with the heat-conducting pad.

5. The VPX architecture based thermocouple temperature measurement board as claimed in claim 4, wherein, Along the first direction, the projection of the first thermocouple sensors overlaps with the projection of the second thermocouple sensors. The thermocouple sensors comprise K-type thermocouple sensors.

6. The VPX architecture based thermocouple temperature measurement board as claimed in claim 1, wherein, The plate material of the heat dissipation module comprises metal materials and high-thermal-conductivity non-metal materials.

7. The VPX architecture based thermocouple temperature measurement board as claimed in claim 1, wherein, The IPMI module comprises a thermocouple temperature acquisition circuit, the thermocouple temperature acquisition circuit comprises an amplifier, a digital-analog converter and a single-chip microcomputer, 8. The VPX architecture based thermocouple temperature measurement board as claimed in claim 1, wherein, The amplifier is connected with the thermocouple sensors one by one, the amplifier is connected with the digital-analog converter, and the digital-analog converter is connected with the single-chip microcomputer in the form of a parallel port. The thermocouple temperature acquisition circuit comprises a communication interface, the panel comprises a plurality of grooves, the grooves penetrate through the panel along the second direction, and the projection of the grooves along the second direction overlaps with the projection of the communication interface along the second direction.

9. The VPX architecture based thermocouple temperature measurement board as claimed in claim 1, wherein, ​

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