Power supply device for solid state disk flash memory particle characteristic analysis

Abstract

The utility model belongs to the technical field of solid state disks, and provides a power supply device for analyzing flash memory particle characteristics of a solid state disk, which comprises a bracket, connecting wires, a locking piece, a cooling fan and a power supply, the connecting wires are arranged on the bracket at intervals, and one ends of the connecting wires are electrically connected with the solid state disk; the locking piece is arranged on the bracket and is used for binding the connecting wire on the bracket; the cooling fan is arranged on the side surface of the bracket; the power supply is electrically connected with the other end of the connecting line. According to the utility model, batch power supply can be realized in the process of running particle analysis firmware by SSD particles; meanwhile, the connecting wires are arranged at intervals, so that heat dissipation can be guaranteed, mutual contact after the solid state disk is installed is avoided, and short circuit is prevented; and heat is reduced while batch power supply is realized by matching with a cooling fan.

Description

TECHNICAL FIELD

[0001] The utility model relates to solid state disk technical field, concretely relates to a power supply device for solid state disk flash memory grain characteristic analysis. BACKGROUND

[0002] Solid state disk (Solid State Disk or Solid State Drive, simply SSD) is a hard disk made of solid state electronic storage chip array. As a new type of storage device, solid state disk has been widely used in the storage field, and the typical storage medium used by SSD is flash memory (NAND Flash) grain, which is mainly divided into SLC, MLC, TLC and QLC four types. SLC (Single-Level Cell) grain stores 1bit data in each storage unit, the service life can reach 100000 times of erasing and writing, the speed is fast and stable, but the price is expensive. MLC (Multi-Level Cell) grain stores 2bit data in each storage unit, the service life is between 5000 to 10000 times of erasing and writing, the speed is moderate, and it is suitable for high-end household products pursuing performance. TLC (Triple-Level Cell) grain stores 3bit data in each storage unit, the service life is between 500 to 1000 times of erasing and writing, the price is relatively low, and it is suitable for middle-end products. QLC (Quad-Level Cell) grain stores 4bit data in each storage unit, the service life is relatively short, about 150 times of erasing and writing, but the price is the cheapest, and it is suitable for low-end products.

[0003] However, flash memory grain has various unreliable factors, such as wear degree, read interference, write interference, programming interference suppression, data retention and the like. At present, the power supply scheme for flash memory grain characteristic analysis is to connect SSD to a computer, a server or the like for power supply. However, due to the limited interface of the computer and the server, a computer and a server can only supply power to limited SSD, and batch SSD flash memory grain characteristic analysis cannot be realized. UTILITY MODEL CONTENTS

[0004] In view of the defects in the prior art, the utility model provides a power supply device for solid state disk flash memory grain characteristic analysis to solve the problem that the current power supply scheme for flash memory grain characteristic analysis cannot realize batch operation.

[0005] The utility model provides a power supply device for solid state disk flash memory grain characteristic analysis, which comprises:

[0006] A bracket;

[0007] A connecting line is arranged at intervals on the bracket, and one end of the connecting line is electrically connected with the solid state disk.

[0008] locking pieces arranged on the bracket and used for binding the connecting lines on the bracket;

[0009] heat dissipation fans arranged on the sides of the bracket;

[0010] power supply sources and the other ends of the connecting lines are electrically connected.

[0011] According to the above technical solution, the power supply device for solid state disk flash memory particle characteristic analysis can realize batch power supply in the process of running particle analysis firmware of the SSD, the connecting lines are arranged at intervals, the contact between the solid state disks after installation can be avoided to prevent short circuit, and the heat can be reduced while realizing batch power supply with the heat dissipation fans.

[0012] Optionally, the bracket is a hollow mesh structure, the connecting lines can be bound to the bracket by the locking pieces, the connection strength of the solid state disk and the bracket can be improved, and the hollow mesh structure facilitates heat dissipation.

[0013] Optionally, a plurality of plug-in interfaces are arranged at one end of the connecting line, the plug-in interfaces are arranged at intervals, and the solid state disk is plugged into the plug-in interface.

[0014] Optionally, the plug-in interfaces on the adjacent connecting lines are arranged alternately, a plurality of rows of connecting lines can be arranged in the bracket with limited length and width, the solid state disks plugged into the adjacent connecting lines do not affect each other, and the power supply quantity in batch flash memory particle characteristic analysis can be improved.

[0015] Optionally, the solid state disk is vertically plugged into the bracket, the heat dissipation fan is vertically arranged on the bracket, and the heat dissipation fan and the solid state disk are vertically arranged, so that the air flow of the heat dissipation fan flows through the gap between the solid state disks, the heat exchange between the solid state disks is promoted, and the heat dissipation efficiency is improved.

[0016] According to the above technical solution, the power supply device for solid state disk flash memory particle characteristic analysis can realize batch power supply in the process of running particle analysis firmware of the SSD, the connecting lines are arranged at intervals, the contact between the solid state disks after installation can be avoided to prevent short circuit, and the heat can be reduced while realizing batch power supply with the heat dissipation fans.

[0017] The power supply device for solid state disk flash memory particle characteristic analysis can realize batch power supply in the process of running particle analysis firmware of the SSD, the connecting lines are arranged at intervals, the contact between the solid state disks after installation can be avoided to prevent short circuit, and the heat can be reduced while realizing batch power supply with the heat dissipation fans. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the following will briefly introduce the drawings needed to be used in the specific embodiments or the prior art description. In all the drawings, similar elements or parts are generally identified by similar reference signs. In the drawings, the elements or parts are not necessarily drawn according to the actual proportions.

[0019] Figure 1 A schematic view of a power supply device for solid state disk flash memory particle characteristic analysis provided by the embodiments of the present application is shown in the figure.

[0020] Figure 2 A schematic view of a power supply device for solid state disk flash memory particle characteristic analysis provided by the embodiments of the present application is shown in the figure. Figure 1 An enlarged view of the A part shown in the figure.

[0021] Figure 3 A schematic view of a power supply device for solid state disk flash memory particle characteristic analysis provided by the embodiments of the present application is shown in the figure.

[0022] Reference signs:

[0023] 1 - bracket; 2 - connecting line; 21 - plug interface; 3 - locking piece; 4 - cooling fan; 5 - power supply; 6 - solid state disk. DETAILED DESCRIPTION

[0024] The embodiments of the technical solutions of the present application will be described in detail below with reference to the drawings. The following embodiments are only used to more clearly illustrate the technical solutions of the present application, and therefore only serve as examples, and cannot limit the protection scope of the present application.

[0025] It should be noted that, unless otherwise specified, the technical terms or scientific terms used in the present application should be understood as the usual meaning understood by the skilled person in the field of the present application.

[0026] In the present application, unless otherwise specified and limited, the first feature is "on", "under" or "above" the second feature, which can be direct contact between the first and second features, or indirect contact between the first and second features through an intermediate medium. Moreover, the first feature "above", "above" and "above" the second feature can be directly above or obliquely above the first feature, or only indicate that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature can be directly below or obliquely below the first feature, or only indicate that the horizontal height of the first feature is less than that of the second feature.

[0027] As Figure 1As shown, the embodiment provides a power supply device for solid state drive flash memory particle characteristic analysis, which comprises a bracket 1, a connecting line 2, a locking piece 3, a cooling fan 4 and a power supply 5, the connecting line 2 is arranged on the bracket 1 in intervals, and one end of the connecting line 2 is electrically connected with a solid state drive 6; the locking piece 3 is arranged on the bracket 1, and is used for binding the connecting line 2 on the bracket 1; the cooling fan 4 is arranged on the side of the bracket 1; and the power supply 5 is electrically connected with the other end of the connecting line 2. Based on this, batch power supply can be realized in the process of running the particle analysis firmware of the SSD particle; meanwhile, the connecting lines 2 are arranged in intervals, so that the solid state drives 6 can be prevented from contacting each other after being installed, and short circuit is prevented; and the cooling fan 4 is matched to realize batch power supply while reducing heat.

[0028] As shown in the figure, Figures 1-3 The bracket 1 is a hollow mesh structure, the connecting line 2 can be bound to the bracket 1 by the locking piece 3, the connection strength of the solid state drive 6 and the bracket 1 can be improved, and the hollow mesh structure is convenient for heat dissipation.

[0029] In one embodiment, one end of the connecting line 2 is provided with a plurality of plug-in interfaces 21, the plug-in interfaces 21 are arranged in intervals, and the solid state drive 6 is inserted into the plug-in interfaces 21. For any connecting line 2, a plurality of plug-in interfaces 21 can be arranged at the end of the connecting line 2, so that a plurality of solid state drives 6 can be connected to any connecting line 2, and batch power supply during flash memory characteristic analysis is realized.

[0030] Further, the plug-in interfaces 21 on adjacent connecting lines 2 are staggered. By such arrangement, a plurality of rows of connecting lines 2 can be arranged in the bracket 1 with limited length and width, and the solid state drives 6 inserted on adjacent connecting lines 2 do not affect each other, so that the power supply quantity during batch flash memory particle characteristic analysis is improved.

[0031] As shown in the figure, Figure 3 The solid state drive 6 is vertically inserted into the bracket 1, the cooling fan 4 is also vertically arranged on the bracket 1, and the cooling fan 4 and the solid state drive 6 are vertically arranged. As shown in the figure, Figure 3 The solid state drive 6 is inserted, the cooling fan 4 realizes heat circulation between the solid state drives 6, and the heat dissipation efficiency is improved.

[0032] In the specification of the utility model, a large number of specific details are explained. However, it can be understood that the embodiments of the utility model can be practiced without these specific details. In some examples, well-known methods, structures and techniques are not shown in detail, so as not to obscure the understanding of the specification.

[0033] Finally, it should be noted that: the above embodiments are used to illustrate the technical solutions of the present application, rather than limiting them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should be covered in the scope of the claims and the specification of the present application.

Claims

1. A power supply device for solid state hard disk flash memory chip characterization, characterized by, The utility model relates to a solid state disk fixing device, including: A bracket; A connecting line is arranged on the bracket, and one end of the connecting line is electrically connected with a solid state disk; A locking piece is arranged on the bracket and is used for binding the connecting line on the bracket; A cooling fan is arranged on the side of the bracket; A power supply is electrically connected with the other end of the connecting line.

2. The power supply device for solid state hard disk flash memory characteristics analysis according to claim 1, wherein, The bracket is a hollow mesh structure.

3. The power supply device for solid state hard disk flash memory characteristics analysis according to claim 1, wherein, One end of the connecting line is provided with a plurality of plug-in interfaces, the plug-in interfaces are arranged at intervals, and the solid state disk is inserted into the plug-in interfaces.

4. The power supply device for solid state hard disk flash memory characteristics analysis according to claim 3, wherein, The plug-in interfaces on adjacent connecting lines are staggered.

5. The power supply device for solid state hard disk flash memory characteristics analysis according to claim 1, wherein, The solid state disk is vertically inserted into the bracket, the cooling fan is vertically arranged on the bracket, and the cooling fan and the solid state disk are vertically arranged.

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