Calibration jig of optical sensor, detection device and wafer carrying system
By designing a light sensor calibration fixture, the position of the light sensor is calibrated using the non-reflective part and the empty area, which solves the problem of misjudgment of light sensors in wafer handling systems, improves detection accuracy and reduces false alarm rate.
Patent Information
- Application Number
- CN202422965431.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-02
- Publication Date
- 2025-10-24
- Estimated Expiration
- 2034-12-02
AI Technical Summary
Optical sensors in wafer handling systems have misjudgment problems, resulting in poor detection accuracy and a high probability of false alarms, especially when the detection light hits the edge area of the reflector.
Design a light sensor calibration fixture, including a non-reflective part and an empty area, to expose the middle area of the reflective element and block the rest of the area, so as to calibrate the position of the light sensor and make the detection light accurately illuminate the middle area of the reflective surface.
The accuracy of the optical sensor in detecting the presence of a wafer box on the wafer handling system is improved, reducing the probability of misjudgment and error reporting.
Smart Images
Figure CN223471579U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of semiconductor technology, in particular to a light sensor calibration jig, a detection device and a wafer handling system. BACKGROUND
[0002] In a semiconductor automated factory (Fab for short), a wafer handling system is usually used to quickly and accurately transport a FOUP (Front Opening Unified Pod) containing a wafer to a destination based on the wafer handling system, thereby improving production efficiency.
[0003] The wafer handling system usually has a light sensor and a light-reflecting plate. The light sensor emits detection light to the middle region of the light-reflecting plate, and determines whether a wafer cassette exists on the wafer handling system according to whether the reflected light can be received.
[0004] In the related art, the detection light emitted by the light sensor irradiates the edge region of the light-reflecting plate, which may cause misjudgment. Therefore, it is necessary to provide a new light sensor calibration jig, a detection device and a wafer handling system to at least partially solve the above problems. SUMMARY
[0005] A series of simplified concepts are introduced in the summary part of the application. This will be further described in detail in the detailed description. The summary part of the application does not mean to try to limit the key features and necessary technical features of the claimed technical solutions, nor to try to determine the protection scope of the claimed technical solutions.
[0006] In view of the existing problems, the present application provides a light sensor calibration jig, which is used to emit detection light to a light-reflecting member on a wafer handling system. The calibration jig comprises:
[0007] A non-light-reflecting part is arranged on the light-reflecting member, and the non-light-reflecting part is provided with an empty area.
[0008] The empty area is used to expose the middle region of the light-reflecting surface of the light-reflecting member, and the non-light-reflecting part is used to shield the remaining region of the light-reflecting surface.
[0009] In some embodiments of the present application, the empty area is located in the middle region of the non-light-reflecting part.
[0010] In some embodiments of the present application, the size of the non-light-reflecting part is greater than or equal to the size of the light-reflecting member.
[0011] In some embodiments of the present application, the non-reflective part is provided with a fixing part, and the calibration jig is fixed to the reflective part through the fixing part.
[0012] In some embodiments of the present application, the fixing part comprises a buckle.
[0013] In some embodiments of the present application, the non-reflective part is provided with a scale.
[0014] According to another aspect of the present application, a detection device is provided for detecting whether a wafer box exists on a wafer conveying system, the detection device comprising:
[0015] a reflective part provided on the wafer conveying system;
[0016] a light sensor provided on the wafer conveying system, configured to emit a detection light to a reflective surface of the reflective part;
[0017] the calibration jig of the light sensor according to any one of the above, wherein the calibration jig is provided on the reflective part, and is configured to calibrate a position of the light sensor so that the detection light is emitted to a middle region of the reflective surface.
[0018] In some embodiments of the present application, the detection device further comprises an indicator electrically connected to the light sensor, the indicator being configured to indicate, in a first state, that the wafer box exists on the wafer conveying system, and to indicate, in a second state, that the wafer box does not exist on the wafer conveying system.
[0019] According to still another aspect of the present application, a wafer conveying system is provided, comprising the detection device.
[0020] The calibration jig of the light sensor, the detection device and the wafer conveying system according to the embodiments of the present application expose the middle region of the reflective surface of the reflective part through the empty area, and the non-reflective part shields the remaining region of the reflective surface, so that the reflected light can be received only when the detection light emitted by the calibrated light sensor is accurately emitted to the middle region of the reflective surface, thereby avoiding the misjudgment phenomenon caused by the detection light emitted by the light sensor being emitted to the edge region of the reflective plate, improving the accuracy of the light sensor in detecting whether the wafer box exists on the wafer conveying system, and reducing the error probability. BRIEF DESCRIPTION OF DRAWINGS
[0021] The following drawings of the present application are hereby incorporated into the present application as part of the present application for the purpose of understanding the present application. The embodiments of the present application and the description thereof shown in the drawings are used to explain the principles of the present application.
[0022] Figure 1 A schematic diagram showing that the light sensor emits the detection light to the edge region of the reflective plate in the related art is shown.
[0023] Figure 2 A front view of a calibration jig of one embodiment of the present application is shown.
[0024] Figure 3 A side view of a calibration jig of one embodiment of the present application is shown.
[0025] Figure 4 A schematic diagram showing a light sensor emitting detection light to a middle region of a light-reflecting plate of one embodiment of the present application is shown.
[0026] In the drawings:
[0027] 100 calibration jig;
[0028] 110 non-reflecting part;
[0029] 120 empty area;
[0030] 130 buckle;
[0031] 131 buckle slot;
[0032] 140 scale;
[0033] 200 light sensor;
[0034] 300 light-reflecting part. DETAILED DESCRIPTION
[0035] In the following description, numerous specific details are set forth to provide a more thorough understanding of the present application. However, it will be apparent to one of skill in the art that the present application can be practiced without one or more of these specific details. In other instances, well-known features have not been described in order to avoid obscuring the present application. In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the present application. It will be apparent, however, to one of ordinary skill in the art that the present application can be practiced without one or more of these specific details.
[0036] It is to be understood that the present application can be carried out by different embodiments and that modifications will occur to those skilled in the art. Therefore, the foregoing description is to be interpreted only as illustrative of the present application and not as limiting. In the drawings, the size and relative sizes of layers and regions can be exaggerated for clarity. Identical reference numerals have been used, where applicable, to designate corresponding elements with the same or similar functions for the same or similar purposes.
[0037] It will be understood that when an element or layer is referred to as being "on" or "connected to" another element or layer, it can be directly on or connected to the other element or layer or intervening elements or layers can be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element or layer, there are no intervening elements or layers present. It will also be understood that, although the terms first, second, third, etc. can be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present application.
[0038] Spatially relative terms, such as "beneath", "below", "lower", "under", "above", "upper" and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" or "over" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
[0039] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising", when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. As used herein the term "and / or" includes any and all combinations of one or more of the associated listed items.
[0040] A light sensor and a light-reflecting plate are usually arranged on a wafer conveying system. The light sensor emits detection light to the middle region of the light-reflecting plate, and whether the wafer conveying system has a wafer box is determined according to whether the reflected light can be received. If the reflected light can be received, it indicates that the detection light is not blocked by the wafer box, and the wafer conveying system does not have the wafer box. If the reflected light cannot be received, it indicates that the detection light is blocked by the wafer box, and the wafer conveying system has the wafer box.
[0041] In the related art, as shown in FIG. 1, the detection light emitted by the light sensor 200 is invisible. When the detection light emitted by the light sensor 200 irradiates the edge region of the light-reflecting piece 300, the light sensor 200 can receive the reflected light regardless of whether the wafer conveying system has the wafer box, resulting in a misjudgment phenomenon. The accuracy of the light sensor 200 in detecting whether the wafer conveying system has the wafer box is poor, and the error probability is high. Figure 1
[0042] To solve at least one of the above technical problems, the present application provides a calibration jig of a light sensor, the light sensor being used for emitting detection light to a light-reflecting piece on a wafer conveying system, the calibration jig comprising: a non-light-reflecting part arranged on the light-reflecting piece, the non-light-reflecting part being provided with an empty area; wherein the empty area is used for exposing the middle region of the light-reflecting surface of the light-reflecting piece, and the non-light-reflecting part is used for shielding the remaining region of the light-reflecting surface.
[0043] According to the calibration jig of the light sensor of the present application, the middle region of the light-reflecting surface of the light-reflecting piece is exposed through the empty area, and the remaining region of the light-reflecting surface is shielded by the non-light-reflecting part. Therefore, the detection light emitted by the calibrated light sensor can only be received when it accurately irradiates the middle region of the light-reflecting surface, thereby avoiding the misjudgment phenomenon caused by the detection light emitted by the light sensor irradiating the edge region of the light-reflecting plate, improving the accuracy of the light sensor in detecting whether the wafer conveying system has the wafer box, and reducing the error probability.
[0044] In order to thoroughly understand the present application, detailed steps and structures will be proposed in the following description in order to explain the technical solutions proposed by the present application. The preferred embodiments of the present application are described in detail as follows, however, in addition to these detailed descriptions, the present application can also have other implementation manners.
[0045] The following description will be made with reference to the drawings. Figures 2 to 4 A calibration jig 100 of a light sensor according to an embodiment of the present application is described. The light sensor 200 is used to emit detection light to a light-reflecting piece 300 on a wafer handling system. The calibration jig 100 comprises a non-light-reflecting part 110 arranged on the light-reflecting piece 300, and the non-light-reflecting part 110 is provided with a hollow area 120. The hollow area 120 is used to expose a middle region of a light-reflecting surface of the light-reflecting piece 300, and the non-light-reflecting part 110 is used to shield the remaining region of the light-reflecting surface.
[0046] When calibrating the light sensor 200, the non-light-reflecting part 110 is arranged on the light-reflecting piece 300 on the wafer handling system, so that the hollow area 120 exposes the middle region of the light-reflecting surface of the light-reflecting piece 300, and the non-light-reflecting part 110 shields the remaining region of the light-reflecting surface. Then, as shown in FIG. 2B, the light sensor 200 emits detection light to the light-reflecting piece 300. If the light sensor 200 can receive reflected light, it indicates that the detection light emitted by the light sensor 200 irradiates the middle region of the light-reflecting surface, and the position of the light sensor 200 meets the requirement. If the light sensor 200 cannot receive reflected light, it indicates that the detection light emitted by the light sensor 200 does not irradiate the middle region of the light-reflecting surface, and the position of the light sensor 200 does not meet the requirement. The position of the light sensor 200 can be adjusted until the light sensor 200 can receive reflected light. Figure 4
[0047] Based on this, the present application provides a calibration jig 100 capable of calibrating the position of the light sensor 200. According to the calibration jig 100 of the present application, the hollow area 120 exposes the middle region of the light-reflecting surface of the light-reflecting piece 300, and the non-light-reflecting part 110 shields the remaining region of the light-reflecting surface. Therefore, the detection light emitted by the calibrated light sensor 200 can only be received when it accurately irradiates the middle region of the light-reflecting surface, thereby avoiding the misjudgment phenomenon caused by the detection light emitted by the light sensor 200 irradiating the edge region of the light-reflecting plate, improving the accuracy of the light sensor 200 in detecting whether there is a wafer box on the wafer handling system, and reducing the error probability.
[0048] In some embodiments, the light sensor 200 can be a laser sensor 200 or any other suitable type of light sensor 200, which is not limited in this regard.
[0049] In some embodiments, the light-reflecting piece 300 can be a light-reflecting plate or any other suitable light-reflecting device, which is not limited in this regard.
[0050] In some embodiments, as shown in FIG. 2A, Figure 1 As shown, the empty area 120 is located in the middle region of the non-reflective part 110, so that the middle region of the non-reflective part 110 corresponds to the middle region of the reflecting surface of the reflecting piece 300, to facilitate the installation of the assembly connection of the non-reflective part 110 and the reflecting piece 300. Of course, the empty area 120 can also be located in any other suitable region of the non-reflective part 110, as long as the middle region of the reflecting surface of the reflecting piece 300 exposed by the empty area 120 is blocked by the non-reflective part 110.
[0051] In some embodiments, the size of the non-reflective part 110 is greater than or equal to the size of the reflecting piece 300. By making the size of the non-reflective part 110 greater than or equal to the size of the reflecting piece 300, the non-reflective part 110 can completely block the remaining regions of the reflecting surface except for the middle region of the reflecting surface of the reflecting piece 300 exposed by the empty area 120, avoiding the phenomenon of incomplete blocking of the remaining regions of the reflecting surface.
[0052] In addition, the shape of the non-reflective part 110 and the empty area 120 is not limited in the present embodiment. For example, Figure 2 As shown, the non-reflective part 110 and the empty area 120 can be rectangular, or can also be any other suitable shape.
[0053] In some embodiments, the end of the non-reflective part 110 is provided with a fixing part, and the calibration jig 100 is fixedly arranged on the reflecting piece 300 through the fixing part. The fixing part can be implemented as a buckle 130, a bolt fixing structure, a rivet fixing structure, a key fixing structure, etc., which is not limited.
[0054] For example, Figure 3 As shown, taking the buckle 130 provided at the end of the non-reflective part 110 as an example, a clamping groove 131 is formed in the buckle 130, and the reflecting piece 300 can be clamped in the clamping groove 131, so that the non-reflective part 110 and the reflecting piece 300 are fixedly assembled together.
[0055] In some embodiments, a scale 140 can also be provided on the non-reflective part 110. The scale 140 can be provided at the edge region of the non-reflective part 110 or any other suitable position. For example, Figure 2 As shown, the scale 140 can be provided at both edge regions of the non-reflective part 110.
[0056] In the present embodiment, by providing the scale 140 on the non-reflective part 110, when the position of the light sensor 200 does not meet the requirements and the light sensor 200 cannot receive the reflected light, the light sensor 200 can be accurately moved by a certain distance according to the actual situation until the position of the light sensor 200 meets the requirements and the light sensor 200 can receive the reflected light.
[0057] According to another aspect of the present application, a detection device is provided for detecting whether a wafer box exists on a wafer handling system, the detection device comprising: a reflective member 300 arranged on the wafer handling system; a light sensor 200 arranged on the wafer handling system for emitting a detection light to a reflective surface of the reflective member 300; and a calibration jig 100 of the light sensor arranged on the reflective member 300 for calibrating a position of the light sensor 200 so that the detection light is irradiated on a middle region of the reflective surface.
[0058] The calibration jig 100 of the light sensor can be implemented as the calibration jig 100 of the light sensor described above, and details are not repeated here.
[0059] Specifically, before detecting whether a wafer box exists on the wafer handling system by the detection device, the position of the light sensor 200 can be calibrated by the calibration jig 100 so that the detection light is irradiated on the middle region of the reflective surface. Then, the detection light is emitted to the reflective surface of the reflective member 300 based on the calibrated position of the light sensor 200. If the reflected light can be received by the light sensor 200, it indicates that the detection light is not blocked by the wafer box, and the wafer box does not exist on the wafer handling system. If the reflected light cannot be received by the light sensor 200, it indicates that the detection light is blocked by the wafer box, and the wafer box exists on the wafer handling system.
[0060] In some embodiments, the detection device further comprises an indicator electrically connected to the light sensor 200, the indicator indicating that the wafer box exists on the wafer handling system in a first state, and indicating that the wafer box does not exist on the wafer handling system in a second state.
[0061] The indicator can include an indicator light, an indicator panel, etc., and is not limited in this regard. The first state and the second state can include bright and dark states, display and non-display states, different color states, different display content states, etc., and are not limited in this regard.
[0062] Exemplarily, taking the indicator as an indicator light, when the reflected light cannot be received by the light sensor 200, the indicator light is green to indicate that the wafer box exists on the wafer handling system, and when the reflected light can be received by the light sensor 200, the indicator light is yellow to indicate that the wafer box does not exist on the wafer handling system.
[0063] According to another aspect of the present application, a wafer handling system is provided, the wafer handling system comprising the detection device.
[0064] The detection device can be implemented as the detection device described above, and details are not repeated here.
[0065] In summary, according to the calibration jig, detection device and wafer conveying system of the light sensor provided in the embodiments of the present application, the middle region of the reflecting surface of the reflecting piece is exposed by the empty region, and the remaining region of the reflecting surface is shielded by the non-reflecting part, so that the reflected light can be received only when the detection light emitted by the calibrated light sensor is accurately irradiated on the middle region of the reflecting surface, thereby avoiding the misjudgment phenomenon caused when the detection light emitted by the light sensor is irradiated on the edge region of the reflecting plate, improving the accuracy of the light sensor in detecting whether the wafer box exists on the wafer conveying system, and reducing the error probability.
[0066] Although example embodiments have been described herein with reference to the accompanying drawings, it is to be understood that the example embodiments are only exemplary and are not intended to limit the scope of the present application. Those of ordinary skill in the art can make various changes and modifications without departing from the scope and spirit of the present application. All such changes and modifications are intended to be included within the scope of the present application as claimed in the appended claims.
[0067] Similarly, it is to be understood that, in describing example embodiments of the present application, various features of the present application have sometimes been grouped together in a single embodiment, figure, or description of related embodiments, for the purpose of streamlining the disclosure and aiding in the understanding of one or more of the various aspects, features and embodiments of the present application. However, this method of disclosure is not to be interpreted as reflecting an intention that the claimed application requires more features than are explicitly recited in each claim. Rather, inventive aspects lie in less than all features of each disclosed embodiment. Accordingly, the claims as filed and hereby presented are intended to cover and embrace all available alternatives, modifications and equivalents.
[0068] Furthermore, to the extent that the terms "comprises", "includes", "has", "contains", "involves", and the like can be used in the detailed description or claims, these terms are always meant to be understood to be inclusive in a manner that the terms do not preclude the possibility of additional or other items in the described compositions, processes, methods, acts, devices, systems, or the like.
[0069] It should be noted that the foregoing embodiments are illustrative and not limiting of the present application, and that other embodiments can be devised without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The use of the words "first", "second", and the like do not imply any order but are used for naming, and do not limit the amount.
Claims
1. A calibration fixture for a light sensor for emitting a detection light to a reflective member on a wafer handling system, the calibration fixture comprising: The calibration jig comprises: a non-reflective part provided on the reflective part, wherein the non-reflective part is provided with an empty area; wherein the empty area is used to expose the middle area of the reflective surface of the reflective part, and the non-reflective part is used to shield the remaining area of the reflective surface.
2. The calibration fixture for optical sensors of claim 1, wherein, The empty area is located in the middle area of the non-reflective part.
3. The calibration fixture for optical sensors of claim 1, wherein, The size of the non-reflective part is greater than or equal to the size of the reflective part.
4. The calibration fixture for optical sensors of claim 1, wherein, The end of the non-reflective part is provided with a fixing part, and the calibration jig is fixed on the reflective part through the fixing part.
5. The calibration fixture for optical sensors of claim 4, wherein, The fixing part comprises a buckle.
6. The calibration fixture for optical sensors of claim 1, wherein, The non-reflective part is provided with a scale.
7. An apparatus for detecting the presence of a wafer cassette on a wafer handling system, comprising: a housing; a wafer cassette detection system disposed within the housing; and a wafer cassette detection system disposed within the housing. The detection device comprises: a reflective part provided on the wafer conveying system; a light sensor provided on the wafer conveying system, used to emit detection light to the reflective surface of the reflective part; The calibration jig of the light sensor according to any one of claims 1-6 is provided on the reflective part, used to calibrate the position of the light sensor, so that the detection light is irradiated on the middle area of the reflective surface.
8. The detection device of claim 7, wherein, The detection device further comprises an indicator electrically connected with the light sensor, which indicates the presence of a wafer box on the wafer conveying system in a first state, and indicates the absence of a wafer box on the wafer conveying system in a second state.
9. A wafer handling system, characterized by, The wafer conveying system comprises the detection device according to claim 7 or 8.