Wafer edge searching and degumming mechanism

Abstract

The utility model belongs to the technical field of semiconductor processing, and relates to a wafer edge searching and dispergation mechanism, which comprises a dispergation unit and a wafer edge searching unit, the dispergation unit comprises a dispergation shell, the dispergation shell is provided with a dispergation window, and the dispergation shell is internally provided with a UV lamp group; the wafer edge searching unit is arranged on the dispergation shell, the wafer edge searching unit comprises an edge searching bottom plate, and a wafer edge finder is arranged on the edge searching bottom plate. After the structure is adopted, the beneficial effects are that wafer position calibration and wafer film dispergation can be carried out in a full-automatic manner, and the operation efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of semiconductor processing, and concretely relates to a wafer edge finding and debonding mechanism. BACKGROUND

[0002] With the progress of semiconductor technology, the requirement for product performance is higher and higher, and new packaging processes are emerging continuously. When wafers come out of wafer manufacturing plants, the thickness is relatively thick. Due to the requirement for packaging size, the wafers are thinned during packaging to adapt to smaller packaging sizes. In order to protect the circuit layer of the wafer during thinning, a film is pasted on the circuit layer of the wafer to protect the wafer from being scratched and contaminated during thinning and grinding. After the wafer is thinned, the protective film needs to be removed, and the wafer cannot be damaged during removal.

[0003] Before the wafer film is torn, the wafer film needs to be debonded to facilitate the subsequent film tearing action. In the prior art, the wafer after film pasting is placed and recovered manually, which may cause damage to the wafer during the process, and the operation efficiency is not high. Manual calibration of the wafer position is required, which reduces the operation efficiency. Therefore, it is necessary to improve. UTILITARY MODEL

[0004] In order to solve the above problems in the prior art, the utility model provides a wafer edge finding and debonding mechanism.

[0005] In order to achieve the above purpose, the utility model adopts the following technical scheme:

[0006] As an aspect of the utility model, a wafer edge finding and debonding mechanism is provided, which comprises a debonding unit and a wafer edge finding unit. The debonding unit comprises a debonding shell, a debonding window is formed in the debonding shell, and a UV lamp group is arranged in the debonding shell.

[0007] The wafer edge finding unit is arranged on the debonding shell, and the wafer edge finding unit comprises an edge finding bottom plate, and a wafer edge finder is arranged on the edge finding bottom plate.

[0008] As an option, it further comprises an anti-warping unit connected to the debonding shell.

[0009] As an option, the anti-warping unit comprises an anti-warping cylinder connected to the debonding shell, an anti-warping connecting plate is connected to the movable end of the anti-warping cylinder, a plurality of anti-warping pressing rods are arranged on the anti-warping connecting plate at intervals, and an anti-warping pressing block is connected to the bottom end of the anti-warping pressing rod.

[0010] As an option, the anti-warping pressing block is made of rubber material.

[0011] As an option, a working port is arranged on the side edge of the debonding shell.

[0012] As an option, the working port is provided with a debonding box door.

[0013] As an option, at least one heat dissipation hole is arranged on the side of the debonding shell.

[0014] As an option, a heat dissipation fan is arranged on the heat dissipation hole.

[0015] As an option, the edge searching bottom plate is connected to the lower side of the debonding shell through a support rod.

[0016] As an option, the movable end of the anti-warping cylinder is arranged downward.

[0017] The wafer edge searching and debonding mechanism has the advantages that: 1. It can automatically calibrate the wafer position and debond the wafer film, and improve the operation efficiency. 2. It has an anti-warping mechanism, which can effectively prevent wafer warping when calibrating the wafer position. BRIEF DESCRIPTION OF DRAWINGS

[0018] The drawings accompanying the specification of this application form a part thereof, serve to provide further understanding of the present application, and together with the description of the exemplary embodiments of the present application, serve to explain the present application, and do not constitute an improper limitation on the present application.

[0019] Figure 1 It is an exploded front view of the debonding unit and wafer edge searching unit of the present application;

[0020] Figure 2 It is a structure rear view of the debonding unit and wafer edge searching unit of the present application. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical scheme and advantages of the present application more clear, the technical scheme of the present application will be described clearly and completely below in combination with the specific embodiments of the present application and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0022] One embodiment of a wafer edge searching and debonding mechanism of the present application is as follows: Figures 1-2As shown, it comprises: a debonding unit, which comprises a debonding shell 31, a debonding window 32 is opened on the debonding shell 31 for the mechanical hand of the wafer carrying mechanical hand to enter, a UV lamp group 33 is arranged in the debonding shell 31 for wafer film debonding; The side of the debonding shell 31 is provided with a working port 35, and the working port 35 is provided with a debonding box door 34, and the debonding box door 34 is opened to put into the instrument to measure the illumination intensity of the UV lamp group 33; At least one heat dissipation hole is formed in the side of the debonding shell 31, and a heat dissipation fan is arranged on the heat dissipation hole for cooling and heat dissipation of the UV lamp group 33; The mechanical hand of the wafer carrying mechanical hand clamps the wafer with wafer film from the debonding window 32 into the debonding shell 31, and places the wafer with wafer film below the UV lamp group 33, and then debonds the wafer film through the UV lamp group 33.

[0023] In an embodiment, as shown in Figure 1 It also comprises a wafer edge finding unit 8, which is arranged on the debonding shell 31. The wafer with wafer film first passes through the wafer edge finding unit 8 to calibrate the wafer gap position and rotate to the preset position, and then is sent to the debonding unit 3 for debonding.

[0024] Specifically, as shown in Figures 1-2 The wafer edge finding unit 8 comprises an edge finding base plate 81, which is arranged below the debonding shell 31. For example, the edge finding base plate 81 is connected to the lower side of the debonding shell 31 through a support rod. A wafer edge finder 82 is arranged on the edge finding base plate 81. The structure and working principle of the wafer edge finder 82 are both prior art, which will not be described here. The wafer carrying mechanical hand unit places the wafer with wafer film on the edge finding chuck 821 of the wafer edge finder 82, and the wafer edge finder 82 starts to position the wafer edge gap position, so as to determine the direction and position of the wafer.

[0025] Further, as shown in Figures 1-2 It also comprises a warping prevention unit 9, which is used to prevent the wafer from warping during the edge finding process. The warping prevention unit 9 is connected to the debonding shell 31 of the debonding unit. The warping prevention unit 9 comprises a warping prevention cylinder 91 connected to the debonding shell 31, and the movable end of the warping prevention cylinder 91 is arranged downward. A warping prevention connecting plate 92 is connected to the movable end of the warping prevention cylinder 91. A plurality of warping prevention pressing rods 93 are arranged on the warping prevention connecting plate 92 at intervals. The bottom end of the warping prevention pressing rod 93 is connected to a warping prevention pressing block 94 made of rubber material. While the wafer edge finder 82 is calibrating, the warping prevention cylinder 91 of the warping prevention unit 9 drives the warping prevention pressing block 94 to press the upper surface of the wafer with wafer film downward, so as to prevent the wafer from warping during the calibration process.

[0026] The beneficial effects of the present application are as follows: the wafer position calibration and wafer film debonding can be automatically performed, and the operation efficiency is improved; the anti-warping mechanism can effectively prevent wafer warping when the wafer is calibrated.

[0027] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments in accordance with the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising," when used in this specification, specify the presence of stated features, steps, operations, devices, components and / or combinations thereof, but do not preclude the presence or addition of one or more other features, steps, operations, devices, components and / or combinations thereof.

[0028] The relative arrangement of parts and steps, numerical expressions, and numerical values set forth in these embodiments are not meant to limit the scope of the present application unless otherwise specifically stated. It is to be understood that the drawings shown in the figures are not drawn to scale for the purpose of convenience in description. Techniques, methods, and devices known to those of ordinary skill in the relevant art can not be discussed in detail herein, but should be considered part of the specification as appropriate. In all examples shown and discussed herein, any specific value is to be interpreted as merely exemplary and not as a limitation. Thus, other examples of the example embodiments can have different values. It should be noted that like reference numerals and letters refer to like items in the following drawings, and thus, once an item is defined in one drawing, it need not be discussed further in subsequent drawings.

[0029] In the description of the present application, it should be understood that the orientation words such as "front, back, up, down, left, right", "horizontal, vertical, perpendicular, horizontal" and "top, bottom" and the like indicate the orientation or positional relationship shown in the drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate and imply that the indicated device or element must have a particular orientation or be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the scope of protection of the present application; the orientation words "inner, outer" refer to the inner and outer relative to the contour of each component.

[0030] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used herein to describe the spatial positional relationship of a device or feature to other devices or features as shown in the figures. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figures. For example, if the device in the drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0031] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of this application.

[0032] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "provided with," "connected," etc. should be understood in a broad sense. For example, "connected" may refer to a fixed connection, a detachable connection, or an integral connection; it may refer to a mechanical connection or an electrical connection; it may refer to a direct connection or an indirect connection through an intermediate medium; it may refer to internal communication between two components. Those skilled in the art will be able to understand the specific meanings of the above terms in this utility model in specific circumstances.

[0033] The above description is only a preferred embodiment of the present invention. All equivalent changes and modifications made according to the scope of the patent application of the present invention should fall within the scope of the present invention.

Claims

1. A wafer edge finding and disassembly mechanism, characterized in that: It includes: The debonding unit includes a debonding shell, a UV lamp group is arranged in the debonding shell, and a debonding window is arranged on the debonding shell. The wafer edge finding unit is arranged on the debonding shell, and the wafer edge finding unit includes an edge finding bottom plate.

2. The wafer edge finding and debonding mechanism of claim 1, wherein, It also includes a warping prevention unit connected to the debonding shell.

3. The wafer edge finding and debonding mechanism of claim 2, wherein, The warping prevention unit includes a warping prevention cylinder connected to the debonding shell, a warping prevention connecting plate connected to the movable end of the warping prevention cylinder, a plurality of warping prevention pressing rods arranged at intervals on the warping prevention connecting plate, and a warping prevention pressing block connected to the bottom end of the warping prevention pressing rod.

4. The wafer edge finding and debonding mechanism of claim 3, wherein, The warping prevention pressing block is made of rubber material.

5. The wafer edge finding and debonding mechanism of claim 3, wherein, The side of the debonding shell is provided with a working port.

6. The wafer edge finding and debonding mechanism of claim 5, wherein, The debonding box door is arranged on the working port.

7. The wafer edge finding and debonding mechanism of claim 1, wherein, At least one heat dissipation hole is arranged on the side of the debonding shell.

8. The wafer edge finding and debonding mechanism of claim 7, wherein, A heat dissipation fan is arranged on the heat dissipation hole.

9. The wafer edge finding and debonding mechanism of claim 1, wherein, The edge finding bottom plate is connected to the lower side of the debonding shell through a support rod.

10. The wafer edge finding and debonding mechanism of claim 3, wherein, The movable end of the warping prevention cylinder is arranged downward.

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