Clamping and centering device compatible with double-size wafers

Abstract

The utility model relates to the technical field of wafer processing equipment, in particular to a clamping and centering device compatible with double-size wafers, which comprises a base station, a plurality of first support columns and second support columns are arranged on the upper end face of the base station, small-size wafer bodies are placed on the second support columns, the first support columns are located on the outer sides of the small-size wafer bodies, and the second support columns are located on the outer sides of the small-size wafer bodies. The upper end faces of the first supporting columns are higher than the upper end faces of the small-size wafer bodies, the large-size wafer bodies are placed on the multiple first supporting columns, and the base table is slidably connected with two clamping seats. The clamping seat is provided with two first centering wheels abutting against the outer peripheral wall of the large-size wafer and two second centering wheels abutting against the outer peripheral wall of the small-size wafer, and the base table is provided with a centering driving mechanism driving the clamping seat to slide. The method has the effect of improving the production efficiency of the wafer.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer processing equipment, and particularly relates to a clamping and centering device compatible with double-size wafers. BACKGROUND

[0002] In semiconductor production, wafers must be positioned in a processing chamber with extremely precise accuracy and in a specific direction, so that accurate and reliable wafer centering is crucial for each process step. After a wafer is carried to a processing table by a robot arm, the wafer is clamped and centered by a wafer clamping and centering device.

[0003] With the diversification of wafer sizes, such as the wide application of 8-inch and 12-inch wafers, the traditional wafer clamping and centering device needs to be readjusted or replaced with a centering clamp when switching between different sizes of wafers, which not only consumes time and effort, but also easily introduces errors and reduces the production efficiency of wafers, and therefore needs to be further improved. CONTENT OF THE UTILITY MODEL

[0004] In order to improve the production efficiency of wafers, the present application provides a clamping and centering device compatible with double-size wafers.

[0005] The clamping and centering device compatible with double-size wafers provided by the present application adopts the following technical scheme:

[0006] The clamping and centering device compatible with double-size wafers comprises a base, a plurality of first support columns and second support columns are arranged on the upper end face of the base, a small-size wafer body is placed on the plurality of second support columns, the plurality of first support columns are located outside the small-size wafer body, the upper end face of the first support column is higher than the upper end face of the small-size wafer body, a large-size wafer body is placed on the plurality of first support columns, the base is slidably connected with a clamping seat, the clamping seat is provided with two, the clamping seat is provided with two first centering wheels abutting against the outer circumferential wall of the large-size wafer body and two second centering wheels abutting against the outer circumferential wall of the small-size wafer body, and the base is provided with a centering driving mechanism for driving the clamping seat to slide.

[0007] By adopting the technical scheme, when processing the large-size wafer body, the mechanical hand places the large-size wafer body on the first supporting column, the centering driving mechanism drives the two clamping seats to slide in the direction of approaching each other, the first centering wheels on the clamping seats abut against the outer circumferential wall of the large-size wafer body, the four first centering wheels realize the calibration centering and fixing of the large-size wafer body, when processing the small-size wafer body, the mechanical hand places the small-size wafer body on the second supporting column, the centering driving mechanism drives the two clamping seats to slide in the direction of approaching each other, the second centering wheels on the clamping seats abut against the outer circumferential wall of the small-size wafer body, the four second centering wheels realize the calibration centering and fixing of the small-size wafer body, without re-adjusting or replacing the centering fixture, the centering requirements of the two different sizes of wafers are met, the production efficiency is improved, the production and processing cost of the enterprise is reduced, and the market demand is met.

[0008] Preferably, the centering driving mechanism comprises a linkage sliding seat located between the two clamping seats and slidingly connected to the base, a linkage rod hinged to one end of the linkage sliding seat, and a driving piece driving the linkage sliding seat to slide, the sliding direction of the linkage sliding seat is perpendicular to the sliding direction of the clamping seat, and the linkage rod is correspondingly provided with two linkage rods, and the other end of the linkage rod is hinged to the clamping seat.

[0009] By adopting the technical scheme, the linkage sliding seat slides by the driving piece, and the two clamping seats are correspondingly pushed or pulled to slide by the two linkage rods during the sliding process of the linkage sliding seat, the centering operation of the wafer is realized, the overall structure is more compact, and the linkage rod can effectively absorb and disperse the force impact caused by the driving of the driving piece.

[0010] Preferably, the driving piece is a centering cylinder, the cylinder body of the centering cylinder is fixedly connected to the base, the piston rod of the centering cylinder is axially parallel to the sliding direction of the linkage sliding seat, and the piston rod of the centering cylinder is fixedly connected to the linkage sliding seat.

[0011] By adopting the technical scheme, the centering cylinder is used as the driving piece, the sliding movement of the linkage sliding seat can be accurately controlled, the synchronous movement of the clamping seat is ensured, the efficient centering of the large-size wafer body and the small-size wafer body is realized, in addition, in the centering process driven by the centering cylinder, the linkage rod can effectively absorb and disperse the force impact caused by the driving of the cylinder, thereby reducing the generation of vibration and noise.

[0012] Preferably, the base is fixedly connected with a linear guide rail, and the clamping seat is fixedly connected with a sliding block slidingly connected to the linear guide rail.

[0013] By adopting the technical scheme, the clamping seat can stably and accurately slide under the action of the centering driving mechanism through the linear guide rail and the sliding block, the stability and reliability of the centering process are improved, and the centering precision and production efficiency are further improved.

[0014] Preferably, the base is provided with a limiting seat between the two clamping seats, and the limiting seat is provided with an oil pressure buffer for abutting the clamping seat.

[0015] By adopting the above technical scheme, when the clamping seat moves to the wafer body under the action of the centering driving mechanism and finally abuts, the oil pressure buffer can effectively absorb and slow down the impact force of the clamping seat, prevent the clamping seat from generating excessive impact due to sudden stop, and protect the wafer body from damage.

[0016] Preferably, the outer wall of the large-size wafer body has a first stop straight surface, and the clamping seat is provided with at least two first stop wheels abutting the first stop straight surface.

[0017] By adopting the above technical scheme, the first stop straight surface and the first stop wheel are added, when the first centering wheel abuts the circumferential wall of the large-size wafer body, the first stop wheel abuts the first stop straight surface, effectively preventing the large-size wafer body from rotating around its own axis.

[0018] Preferably, the outer wall of the small-size wafer body has a second stop straight surface, and the clamping seat is provided with at least two second stop wheels abutting the second stop straight surface.

[0019] By adopting the above technical scheme, the second stop straight surface and the second stop wheel are added, when the second centering wheel abuts the circumferential wall of the small-size wafer body, the second stop wheel abuts the second stop straight surface, effectively preventing the small-size wafer body from rotating around its own axis.

[0020] In summary, the utility model has the following beneficial effects:

[0021] 1. When processing the large-size wafer body, the mechanical hand is used to place the large-size wafer body on the first supporting column, the centering driving mechanism is driven to drive the two clamping seats to slide in the direction of approaching each other, the first centering wheel on the clamping seat abuts the outer circumferential wall of the large-size wafer body, and the four first centering wheels are used to realize the calibration centering and fixing of the large-size wafer body; when processing the small-size wafer body, the mechanical hand is used to place the small-size wafer body on the second supporting column, the centering driving mechanism is driven to drive the two clamping seats to slide in the direction of approaching each other, the second centering wheel on the clamping seat abuts the outer circumferential wall of the small-size wafer body, and the four second centering wheels are used to realize the calibration centering and fixing of the small-size wafer body; without re-adjusting or replacing the centering clamp, the centering demand of two different sizes of wafers is met, the production efficiency is improved, the enterprise production and processing cost is reduced, and the market demand is met.

[0022] 2. The driving member drives the linkage sliding seat to slide, and the linkage sliding seat slides to push or pull the two clamping seats through the two linkage rods in the sliding process, the centering operation of the wafer is realized, the overall structure is more compact, and the linkage rod can effectively absorb and disperse the force impact caused by the driving member;

[0023] 3. When the clamping seat moves to the wafer body under the action of the centering driving mechanism and finally abuts, the oil buffer can effectively absorb and slow down the impact force of the clamping seat, prevent the clamping seat from generating excessive impact due to sudden stop, and protect the wafer body from damage. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 It is a schematic diagram of the overall structure of a clamping and centering device compatible with double-size wafers.

[0025] Figure 2 It is a schematic diagram of the structure of the base;

[0026] Figure 3 It is a schematic diagram of the structure of the centering driving mechanism;

[0027] Figure 4 It is a schematic diagram of the structure of the clamping seat.

[0028] In the figure, 1 is a base; 11 is a first support column; 12 is a second support column; 13 is a mounting cavity; 14 is a through slot; 15 is a linear guide rail; 16 is a limiting seat; 17 is an oil buffer; 2 is a clamping seat; 21 is a sliding block; 22 is a mounting bracket; 23 is a first mounting arm; 24 is a first centering wheel; 25 is a first stop wheel; 26 is a second mounting arm; 27 is a second centering wheel; 28 is a second stop wheel; 3 is a centering driving mechanism; 31 is a linkage sliding seat; 32 is a linkage rod; 33 is a centering cylinder; 10 is a large-size wafer body; 101 is a first stop straight surface; 20 is a small-size wafer body; 201 is a second stop straight surface. DETAILED DESCRIPTION

[0029] The following will be described in detail in combination with the accompanying Figures 1-4 The present application is further described in detail.

[0030] The embodiments of the present application disclose a clamping and centering device compatible with double-size wafers, referring to Figure 1 , Figure 2, including the base 1, the upper end surface of the base 1 is provided with a plurality of first support column 11 and second support column 12, in this embodiment, the first support column 11 and the second support column 12 are provided with four, four first support column 11 enclose to form a large size square, four second support column 12 enclose to form a small size square. Small size wafer body 20 is placed on a plurality of second support column 12, a plurality of first support column 11 is located outside the small size wafer body 20, the upper end surface of the first support column 11 is higher than the upper end surface of the small size wafer body 20, the large size wafer body 10 is placed on a plurality of first support column 11.

[0031] Referring to Figure 2 、 Figure 3 , the base 1 has a mounting cavity 13, the mounting cavity 13 of the base 1 is connected with the clamping seat 2 along the transverse sliding, the clamping seat 2 is provided with two and is distributed along the center line of the base 1 symmetrically, the opposite two side walls of the base 1 are provided with a through slot 14 communicated with the mounting cavity 13 for the clamping seat 2 to pass through. The inner wall of the bottom of the mounting cavity 13 of the base 1 is fixedly connected with the linear guide rail 15, the length direction of the linear guide rail 15 is arranged along the transverse direction, the linear guide rail 15 is provided with two and is distributed along the center line of the base 1 symmetrically, the lower end surface of the clamping seat 2 is fixedly connected with the sliding block 21 slidably connected with the linear guide rail 15. The bottom wall of the mounting cavity 13 is fixedly connected with the limiting seat 16 located between the two clamping seats 2, the limiting seat 16 is provided with only one, the limiting seat 16 is provided with an oil buffer 17, the axial direction of the oil buffer 17 is parallel to the length direction of the linear guide rail 15. The main body of the oil buffer 17 is fixedly connected to the limiting seat 16, and the impact head of the oil buffer 17 is used to abut against the side wall of one of the clamping seats 2.

[0032] The base 1 is provided with a centering driving mechanism 3 for driving the two clamping seats 2 to slide synchronously towards each other or away from each other, the centering driving mechanism 3 comprises a linkage sliding seat 31 located between the two clamping seats 2 and slidably connected to the inner wall of the bottom wall of the mounting cavity 13, a linkage rod 32 hingedly connected to the linkage sliding seat 31 and a driving member for driving the linkage sliding seat 31 to slide. The sliding direction of the linkage sliding seat 31 is perpendicular to the sliding direction of the clamping seat 2, the linkage rod 32 is built in the mounting cavity 13, the linkage rod 32 is correspondingly provided with two, the other end of the linkage rod 32 is hingedly connected to the clamping seat 2. In this embodiment, the driving member adopts a centering cylinder 33, the cylinder body of the centering cylinder 33 is fixedly provided in the side wall of the base 1, the piston rod of the centering cylinder 33 is axially parallel to the sliding direction of the linkage sliding seat 31, and the piston rod of the centering cylinder 33 is fixedly connected to the linkage sliding seat 31. In other embodiments, the driving member can drive the linkage sliding seat 31 to slide in the form of screw rod transmission.

[0033] Referring to Figure 1 、 Figure 4The outer wall of the large-size wafer body 10 has a first stop straight surface 101, and the first stop straight surface 101 is provided with an even number, in this embodiment, two first stop straight surfaces 101 are provided and symmetrically arranged along the axis of the large-size wafer body 10. The outer wall of the small-size wafer body 20 has a second stop straight surface 201, and the second stop straight surface 201 is provided with an even number, in this embodiment, two second stop straight surfaces 201 are provided and symmetrically arranged along the axis of the small-size wafer body 20.

[0034] The clamping seat 2 is fixedly connected with a mounting bracket 22 which is externally arranged on the base 1. The upper end surface of the mounting bracket 22 is fixedly connected with a first mounting arm 23 which is located below the large-size wafer body 10. The first mounting arm 23 is rotationally connected with a first centering wheel 24 which is provided with two first centering wheels 24 and is distributed in the longitudinal direction. The first centering wheel 24 abuts against the circumferential outer wall of the large-size wafer body 10. The first mounting arm 23 is rotationally connected with two first stop wheels 25 which abut against the first stop straight surface 101. The two first stop wheels 25 are located between the two first centering wheels 24.

[0035] The side wall of the mounting bracket 22 is fixedly connected with a second mounting arm 26 which is located below the large-size wafer body 10 through a support rod. The upper end surface of the second mounting arm 26 is rotationally connected with a second centering wheel 27 which is provided with two second centering wheels 27 and is distributed in the longitudinal direction. The second centering wheel 27 abuts against the circumferential outer wall of the small-size wafer body 20. The second mounting arm 26 is rotationally connected with two second stop wheels 28 which abut against the second stop straight surface 201. The two second stop wheels 28 are located between the two second centering wheels 27.

[0036] The implementation principle of the embodiment of the application is as follows: in the initial state, the piston rod of the centering cylinder 33 is elongated, and the two clamping seats 2 are driven to slide away from each other by the linkage sliding seat 31 and the linkage rod 32. When the large-size wafer body 10 is placed on the first support column 11 by the mechanical hand, the piston rod of the centering cylinder 33 is retracted, and the two clamping seats 2 are driven to slide towards each other by the linkage sliding seat 31 and the linkage rod 32. The first centering wheel 24 on the clamping seat 2 abuts against the outer circumferential wall of the large-size wafer body 10, and the first stop wheel 25 abuts against the first stop straight surface 101. The four first centering wheels 24 and the four first stop wheels 25 realize the calibration centering and fixing of the large-size wafer body 10.

[0037] When the small-size wafer body 20 is processed, after the small-size wafer body 20 is placed on the second supporting column 12 by the mechanical arm, the piston rod of the centering cylinder 33 is retracted, the two clamping seats 2 are driven to slide in the direction of approaching each other by the linkage sliding seat 31 and the linkage rod 32, the second centering wheel 27 on the clamping seat 2 abuts against the outer circumferential wall of the small-size wafer body 20, and the second stop wheel 28 abuts against the second stop straight surface 201, the calibration centering and fixing of the small-size wafer body 20 are realized by the four second stop wheels 28, the centering clamp does not need to be adjusted or replaced, the centering requirements of two different sizes of wafers are met, the production efficiency is improved, the production and processing cost of the enterprise is reduced, and the market demand is met.

[0038] The above are preferred embodiments of the present application, and do not limit the protection scope of the present application, so: equivalent changes made according to the structure, shape, principle of the present application should be covered within the protection scope of the present application.

Claims

1. A chucking and centering device compatible with double size wafers, characterized in that: The base (1) is provided with a plurality of first supporting columns (11) and second supporting columns (12) on the upper end face, a small-size wafer body (20) is placed on the plurality of second supporting columns (12), the plurality of first supporting columns (11) are located outside the small-size wafer body (20), the upper end face of the first supporting column (11) is higher than the upper end face of the small-size wafer body (20), a large-size wafer body (10) is placed on the plurality of first supporting columns (11), the base (1) is slidably connected with a clamping seat (2), the clamping seat (2) is provided with two, the clamping seat (2) is provided with two first centering wheels (24) abutting against the outer circumferential wall of the large-size wafer body (10) and two second centering wheels (27) abutting against the outer circumferential wall of the small-size wafer body (20), and the base (1) is provided with a centering driving mechanism (3) for driving the clamping seat (2) to slide.

2. The dual size wafer compatible chuck and centering device of claim 1, wherein: The centering driving mechanism (3) comprises a linkage sliding seat (31) located between the two clamping seats (2) and slidably connected with the base (1), a linkage rod (32) hinged at one end to the linkage sliding seat (31), and a driving member for driving the linkage sliding seat (31) to slide, the sliding direction of the linkage sliding seat (31) is perpendicular to the sliding direction of the clamping seat (2), the linkage rod (32) is correspondingly provided with two, and the other end of the linkage rod (32) is hinged to the clamping seat (2).

3. The dual size wafer compatible chucking and centering device of claim 2, wherein: The driving member is a centering cylinder (33), the cylinder body of the centering cylinder (33) is fixedly connected with the base (1), the piston rod of the centering cylinder (33) is axially parallel to the sliding direction of the linkage sliding seat (31), and the piston rod of the centering cylinder (33) is fixedly connected with the linkage sliding seat (31).

4. The dual size wafer compatible chuck and centering device of claim 1, wherein: The base (1) is fixedly connected with a linear guide rail (15), and the clamping seat (2) is fixedly connected with a sliding block (21) slidably connected with the linear guide rail (15).

5. The dual size wafer compatible chuck and centering device of claim 1, wherein: The base (1) is provided with a limiting seat (16) located between the two clamping seats (2), and the limiting seat (16) is provided with an oil buffer (17) for abutting against the clamping seat (2).

6. The dual size wafer compatible chuck and centering device of claim 1, wherein: The outer wall of the large-size wafer body (10) has a first stop straight surface (101), and the clamping seat (2) is provided with at least two first stop wheels (25) abutting against the first stop straight surface (101).

7. The dual size wafer compatible chuck and centering device of claim 1, wherein: The outer wall of the small-size wafer body (20) has a second stop straight surface (201), and the clamping seat (2) is provided with at least two second stop wheels (28) abutting against the second stop straight surface (201).

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