Wafer chuck mechanism with lifting and rotating functions

Abstract

The utility model belongs to the technical field of semiconductor processing, and relates to a wafer chuck mechanism with lifting and rotating functions, which comprises a carrying base movably connected to a carrying connecting plate; a lifting platform is connected to the carrying base in a sliding mode. The lifting platform further comprises a lifting supporting column which is rotationally connected to the lifting platform. The upper portion of the lifting supporting column movably penetrates through the carrying base. The lower end of the lifting supporting column is connected with the rotating unit, and the upper end of the lifting supporting column is connected with the vacuum suction cup unit. The middle of the lifting supporting column is rotationally connected to the carrying base. A vacuum shaft mounting plate is movably arranged at the upper part of the lifting support column in a penetrating manner; a vacuum hollow shaft is connected to the vacuum shaft mounting plate; the carrying base is connected with a vacuum shaft lifting unit. After the structure is adopted, the beneficial effects are that the wafer chuck can move left and right, lift up and down and rotate by 360 degrees, and wafers can be better applied to different working procedures.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of semiconductor processing, and concretely relates to a wafer chuck mechanism with lifting and rotating functions. BACKGROUND

[0002] With the progress of semiconductor technology, the requirement for product performance is higher and higher, and new packaging processes are emerging continuously. When wafers come out of wafer manufacturing plants, the thicknesses are relatively thick. Due to the requirement for packaging size, the wafers are thinned during packaging to adapt to smaller packaging sizes. In order to protect the circuit layer of the wafer during thinning, a film is pasted on the circuit layer of the wafer to protect the wafer from being scratched and contaminated during thinning and grinding. After the wafer is thinned, the protective film needs to be removed, and the wafer cannot be damaged during removal.

[0003] The wafer needs to be fixed before the film is torn. The existing wafer chuck can only be lifted up and down, and cannot be moved left and right and rotated by 360 degrees, so it cannot be applied to more processing procedures. Therefore, it is necessary to improve. CONTENT OF THE UTILITY MODEL

[0004] In order to solve the above problems of the prior art, the utility model provides a wafer chuck mechanism with lifting and rotating functions.

[0005] In order to achieve the above purpose, the utility model adopts the following technical scheme:

[0006] As an aspect of the utility model, a wafer chuck mechanism with lifting and rotating functions is provided, which comprises: a carrying base movably connected to a carrying connecting plate; a lifting platform slidably connected to the carrying base;

[0007] It also comprises a lifting support column rotatably connected to the lifting platform; the upper part of the lifting support column movably passes through the carrying base; the lower end of the lifting support column is connected to a rotating unit, and the upper end of the lifting support column is connected to a vacuum chuck unit for adsorbing a wafer; the middle part of the lifting support column is rotatably connected to the carrying base;

[0008] The upper part of the lifting support column movably passes through a vacuum shaft mounting plate, and at least one vacuum hollow shaft is connected to the vacuum shaft mounting plate, and the vacuum hollow shaft has a passage; one end of the vacuum hollow shaft is connected to a vacuum generator through a vacuum joint, and the other end of the vacuum hollow shaft is connected to a vacuum chuck in sequence after passing through a chuck mounting plate and a wafer chuck.

[0009] The carrying base is connected to a vacuum shaft lifting unit for lifting the vacuum shaft mounting plate.

[0010] As optional, the carrying base is connected with a lifting guide rail, the lifting guide rail is connected with a lifting sliding block, and the lifting platform is connected to the lifting sliding block; the lifting platform is lifted up and down on the carrying base; the carrying base is rotatably connected with a lifting screw rod, both ends of the lifting screw rod are rotatably connected to the carrying base through bearing seats; a lifting nut member is threadedly connected to the lifting screw rod, and the lifting platform is connected with the lifting nut member; one end of the lifting screw rod is connected with a lifting driven wheel, the carrying base is connected with a lifting motor, a movable end of the lifting motor is connected with a lifting driving wheel, and the lifting driving wheel and the lifting driven wheel are connected with a lifting synchronous belt.

[0011] The rotating unit comprises a rotating motor arranged on the lifting platform, a movable end of the rotating motor is connected with a rotating driving wheel, a lower end of the lifting support column is connected with a rotating driven wheel, and the rotating driving wheel and the rotating driven wheel are connected through a rotating synchronous belt.

[0012] As optional, the vacuum chuck unit comprises a chuck mounting block connected to the upper end of the lifting support column, a chuck mounting plate connected to the chuck mounting block, and a wafer chuck connected to the chuck mounting plate; the surface of the wafer chuck is connected with an adsorption layer.

[0013] As optional, the adsorption layer is made of porous ceramic material.

[0014] As optional, a heating groove is formed in the bottom of the chuck mounting plate, a heating ring is connected in the heating groove, and a heating ring baffle is arranged at the bottom of the chuck mounting plate to press and fix the heating ring.

[0015] As optional, a stop ring is arranged on the lifting support column for limiting the vacuum shaft mounting plate.

[0016] As optional, a mounting bushing is connected to the chuck mounting block, and the vacuum hollow shaft is movably arranged through the mounting bushing.

[0017] As optional, the vacuum shaft lifting unit comprises a vacuum shaft lifting part arranged on the carrying base; a movable end of the vacuum shaft lifting part is connected with a vacuum shaft lifting block, and the vacuum shaft lifting block is located below the vacuum shaft mounting plate.

[0018] As optionally, the carrying connecting plate is provided with a carrying guide rail, a carrying sliding block is slidably connected to the carrying guide rail, and the carrying base is connected to the carrying sliding block; the carrying base is movable relative to the carrying connecting plate through cooperation of the carrying sliding block and the carrying guide rail; the carrying connecting plate is rotatably connected with a carrying lead screw, both ends of the carrying lead screw are rotatably connected to the carrying connecting plate through carrying bearing seats respectively; one end of the carrying lead screw is connected with a movable end of a carrying motor arranged on the carrying connecting plate, and a carrying nut member is threadedly connected to the carrying lead screw, and the carrying base is connected with the carrying nut member.

[0019] As optionally, the carrying lead screw is parallel to the moving direction of the carrying guide rail in the axial direction.

[0020] The wafer chuck mechanism with lifting and rotating functions has the following advantages: 1. The wafer chuck can move left and right, lift up and down, and rotate by 360 degrees, so that the wafer can be better used in different processes. 2. The adsorption layer of the wafer chuck is made of porous ceramic material, which can better adsorb the wafer, increase the adsorption force, effectively prevent the wafer from warping, and improve the flatness of the wafer. 3. There is a heating ring below the wafer chuck, which can heat the wafer film to make the film soft, so that it is easier to peel off from the wafer surface, thereby improving the processing efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0021] The drawings accompanying the specification of this application serve to provide a further understanding of the present application, and the illustrative embodiments of the present application and their descriptions serve to explain the present application, and do not constitute an improper limitation on the present application.

[0022] Figure 1 It is a structure perspective view of the wafer chuck mechanism with lifting and rotating functions of the present application;

[0023] Figure 2 It is a structure bottom view of the wafer chuck mechanism with lifting and rotating functions of the present application;

[0024] Figure 3 It is a structure front view of the wafer chuck mechanism with lifting and rotating functions of the present application;

[0025] Figure 4 It is a structure side view of the wafer chuck mechanism with lifting and rotating functions of the present application;

[0026] Figure 5 It is a structure rear view of the wafer chuck mechanism with lifting and rotating functions of the present application;

[0027] Figure 6 It is a structure sectional view of the wafer chuck mechanism with lifting and rotating functions of the present application;

[0028] Figure 7 This is a cross-sectional view of the structure of the vacuum suction cup unit of the present invention;

[0029] Figure 8 This is a structural sectional view of the vacuum shaft lifting unit of the present invention. DETAILED DESCRIPTION

[0030] To make the objectives, technical solutions, and advantages of the present invention more clearly apparent, the following will provide a clear and complete description of the technical solutions of the present invention in conjunction with specific embodiments of the present invention and the corresponding drawings. Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without inventive effort are also within the scope of protection of the present invention.

[0031] An embodiment of the present application provides a wafer chuck mechanism with lifting and rotating functions, such as Figures 1-8 As shown, it includes: a transport base 41, the transport base 41 is connected to the transport connecting plate 42; the transport connecting plate 42 is provided with a transport guide rail 43, the transport guide rail 43 is slidably connected to a transport slider 44, the transport base 41 is connected to the transport slider 44; the transport base 41 can move relative to the transport connecting plate 42 through the cooperation of the transport slider 44 and the transport guide rail 43; the transport connecting plate 42 is rotatably connected to a transport screw 45, the axial direction of the transport screw 45 is parallel to the moving direction of the transport guide rail 43; both ends of the transport screw 45 They are respectively rotatably connected to the transport connecting plate 42 through the transport bearing seat 46; one end of the transport screw 45 is connected to the movable end of the transport motor 47 provided on the transport connecting plate 42, and a transport nut 48 is threadedly connected to the transport screw 45. The transport base 41 is connected to the transport nut 48. When the transport motor 47 is operated, it drives the transport screw 45 to rotate relative to the transport connecting plate 42, so that the transport nut 48 moves on the transport screw 45, thereby realizing the movement of the transport base 41 connected to the transport nut 48 on the transport connecting plate 42;

[0032] The lifting platform 49 is slidably connected to the carrying base 41, the lifting guide rail 410 is connected to the carrying base 41, the lifting guide rail 410 is connected to the lifting sliding block 411, and the lifting platform 49 is connected to the lifting sliding block 411; the lifting platform 49 is lifted up and down on the carrying base 41 through cooperation of the lifting guide rail 410 and the lifting sliding block 411; the lifting screw rod 412 is rotatably connected to the carrying base 41, and the two ends of the lifting screw rod 412 are rotatably connected to the carrying base 41 through bearing seats; the lifting nut member 413 is threadedly connected to the lifting screw rod 412, and the lifting platform 49 is connected to the lifting nut member 413; one end of the lifting screw rod 412 is connected to the lifting driven wheel 414, the lifting motor 415 is connected to the carrying base 41, the movable end of the lifting motor 415 is connected to the lifting driving wheel 416, the lifting driving wheel 416 and the lifting driven wheel 414 are connected through the lifting synchronous belt 417, the lifting motor 415 works to drive the lifting driving wheel 416 to rotate, the lifting driving wheel 416 drives the lifting driven wheel 414 to work synchronously through the lifting synchronous belt 417, the lifting driven wheel 414 drives the lifting screw rod 412 to rotate, the lifting screw rod 412 drives the lifting nut member 413 to move, and the lifting platform 49 is lifted up and down relative to the carrying base 41.

[0033] The lifting support column 418 is rotatably connected to the lifting platform 49, the upper part of the lifting support column 418 is movably arranged through the carrying base 41, the lower end of the lifting support column 418 is connected to the rotating unit 419, the upper end of the lifting support column 418 is connected to the vacuum chuck unit 420 for adsorbing a wafer, the middle part of the lifting support column 418 is rotatably connected to the carrying base 41 through a bearing, and the lifting support column 418 can rotate relative to the carrying base 41.

[0034] The rotating unit 419 comprises the rotating motor 421 arranged on the lifting platform 49, the movable end of the rotating motor 421 is connected to the rotating driving wheel 422, the lower end of the lifting support column 418 is connected to the rotating driven wheel 423, and the rotating driving wheel 422 and the rotating driven wheel 423 are connected through the rotating synchronous belt 424; the rotating motor 421 works to drive the rotating driving wheel 422 to rotate, the rotating driving wheel 422 drives the rotating driven wheel 423 to work through the rotating synchronous belt 424, and the lifting support column 418 is rotated relative to the carrying base 41.

[0035] As Figure 7As shown, the vacuum chuck unit 420 includes a chuck mounting block 425 connected to the upper end of the lifting support column 418, a chuck mounting plate 426 connected to the chuck mounting block 425, and a wafer chuck 427 connected to the chuck mounting plate 426; the surface of the wafer chuck 427 is connected with an adsorption layer 428 made of porous ceramic material, which has dense pores and can better adsorb the wafer and increase the adsorption force;

[0036] The bottom of the chuck mounting plate 426 is provided with a heating groove, and a heating ring 429 is connected in the heating groove; the bottom of the chuck mounting plate 426 is provided with a heating ring baffle 430 for tightly fixing the heating ring 429; the wafer film can be more conveniently torn after being heated by the heating ring 429;

[0037] The upper part of the lifting support column 418 is movably provided with a vacuum shaft mounting plate 431, at least one vacuum hollow shaft 432 is connected to the vacuum shaft mounting plate 431, and the vacuum hollow shaft 432 has a passage; one end of the vacuum hollow shaft 432 is connected with a vacuum generator through a vacuum joint, and the other end of the vacuum hollow shaft 432 is sequentially movably connected with a vacuum chuck 433 after passing through the chuck mounting block 425, the chuck mounting plate 426 and the wafer chuck 427, and the adsorption port of the vacuum chuck 433 is slightly higher than the surface of the wafer chuck 427, so as to facilitate the adsorption of the wafer; the lifting support column 418 is provided with a stop ring 434 for limiting the vacuum shaft mounting plate 431, so as to prevent the vacuum shaft mounting plate 431 from falling onto the carrying base 41;

[0038] The carrying base 41 is also provided with a mounting bushing 435 connected to the chuck mounting block 425, and the vacuum hollow shaft 432 movably passes through the mounting bushing 435, so that the mounting bushing 435 can protect the vacuum hollow shaft 432 and make the vacuum hollow shaft 432 more stable during lifting;

[0039] The carrying base 41 is also provided with a vacuum shaft lifting unit 436 for lifting the vacuum shaft mounting plate 431, as shown in Figure 8 The vacuum shaft lifting unit 436 includes a vacuum shaft lifting part 437 provided on the carrying base 41, and the vacuum shaft lifting part 437 is a motor or a pneumatic cylinder, which will not be described in detail; the movable end of the vacuum shaft lifting part 437 is connected with a vacuum shaft lifting block 438, and the vacuum shaft lifting block 438 is located below the vacuum shaft mounting plate 431; the vacuum shaft lifting part 437 drives the vacuum shaft lifting block 438 to rise or fall, so that the vacuum hollow shaft 432 rises relative to the wafer chuck 427 or returns to the initial position; the wafer adsorbed by the vacuum chuck 433 can be separated from the wafer chuck 427 by the vacuum shaft lifting unit 436, which facilitates subsequent operations.

[0040] The wafer carrying manipulator unit carries the wafer to the wafer chuck 427, and the wafer chuck 427 adsorbs the wafer to perform film tearing work.

[0041] The wafer chuck mechanism with lifting and rotating functions has the following advantages: 1. The wafer chuck can move left and right, lift up and down, and rotate 360 degrees, so that the wafer can be better used in different processes. 2. The adsorption layer of the wafer chuck is made of porous ceramic material, which can better adsorb the wafer, increase the adsorption force, effectively prevent the wafer from warping, and improve the flatness of the wafer. 3. There is a heating ring below the wafer chuck, which can heat the wafer film to make the film soft, so that it is easier to peel off from the wafer surface, thereby improving the processing efficiency.

[0042] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments in accordance with the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising," when used in this specification, specify the presence of stated features, steps, operations, elements, components, and / or groups thereof, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or groups thereof.

[0043] The relative arrangement of parts and steps, numerical expressions, and numerical values set forth in the examples are not intended to limit the scope of the present application, unless otherwise specifically stated. At the same time, it should be understood that the sizes of the various parts shown in the drawings are not drawn in proportion to the actual proportions. Techniques, methods and devices known to those skilled in the relevant art can not be discussed in detail, but should be considered as part of the specification where appropriate. In all examples shown and discussed herein, any specific value should be interpreted as merely exemplary, and not as a limitation. Therefore, other examples of the example embodiments can have different values. It should be noted that similar reference numbers and letters represent similar items in the following drawings, so further discussion is not necessary if an item is defined in one drawing.

[0044] In the description of the present application, it should be understood that the orientation words such as "front, back, up, down, left, right", "horizontal, vertical, perpendicular, horizontal" and "top, bottom" and the like indicate the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate and imply that the indicated device or element must have a specific orientation or be constructed and operated in a specific orientation, therefore it cannot be understood as a limitation on the scope of protection of the present application; the orientation words "inner, outer" refer to the inner and outer of the contour of the parts themselves.

[0045] For purposes of the description hereinafter, spatial terms, such as "above", "below", "upper", "lower", and the like, can be used with reference to the illustrated embodiment. It will be understood, however, that spatial terms are used herein as a convenience to describe the orientation of the device or component as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly. For example, if the device in the figures is turned over, so that the bottom surface faces the viewer, the device described as "above" or "up" other devices or structures would then be oriented "below" or "down" the other devices or structures. Accordingly, the exemplary term "above" can encompass both an "above" and "below" orientation. The devices can also be oriented in other ways (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0046] In addition, it needs to be explained that the use of the words "first", "second" and the like to define parts, only for the convenience of the corresponding parts are distinguished, such as no other declaration, the above words have no special meaning, therefore can not be understood as limiting the scope of protection of the present application.

[0047] In the description of the present application, it should be noted that, unless otherwise explicitly provided and limited, the terms "installation", "provided with", "connection" and the like should be understood in a broad sense, for example, "connection", can be fixedly connected, can also be detachably connected, or integrally connected; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be the communication between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0048] The above is only the preferred embodiment of the present application, any changes and modifications made within the scope of the application for patent of the present application shall be included in the scope of the present application.

Claims

1. A wafer chuck mechanism with a lift and rotation function, characterized by, It includes: The carrying base is movably connected to the carrying connecting plate; the lifting platform is slidably connected to the carrying base; It also includes a lifting support column rotatably connected to the lifting platform; the upper part of the lifting support column movably passes through the carrying base; the lower end of the lifting support column is connected to the rotating unit, and the upper end of the lifting support column is connected to a vacuum chuck unit; the middle part of the lifting support column is rotatably connected to the carrying base, and the lifting support column can rotate relative to the carrying base; The upper part of the lifting support column movably passes through a vacuum shaft mounting plate, at least one vacuum hollow shaft is connected to the vacuum shaft mounting plate, and the vacuum hollow shaft has a channel therein; one end of the vacuum hollow shaft is connected to a vacuum generator through a vacuum joint, and the other end of the vacuum hollow shaft is connected to a vacuum chuck after sequentially movably passing through a chuck mounting plate and a wafer chuck. The carrying base is connected to a vacuum shaft lifting unit for driving the vacuum shaft mounting plate to lift.

2. The wafer chuck mechanism with lift and rotation functions according to claim 1, wherein, The carrying base is connected to a lifting guide rail, the lifting guide rail is connected to a lifting sliding block, and the lifting platform is connected to the lifting sliding block; the lifting platform is lifted up and down on the carrying base; a lifting lead screw is rotatably connected to the carrying base, both ends of the lifting lead screw are rotatably connected to the carrying base through bearing seats; a lifting nut part is threadedly connected to the lifting lead screw, and the lifting platform is connected to the lifting nut part; one end of the lifting lead screw is connected to a lifting driven wheel, a lifting motor is connected to the carrying base, a movable end of the lifting motor is connected to a lifting driving wheel, and a lifting synchronous belt is connected between the lifting driving wheel and the lifting driven wheel.

3. The wafer chuck mechanism with lift and rotation functions according to claim 1, wherein, The rotating unit includes a rotating motor arranged on the lifting platform, a movable end of the rotating motor is connected to a rotating driving wheel, a lower end of the lifting support column is connected to a rotating driven wheel, and the rotating driving wheel and the rotating driven wheel are connected through a rotating synchronous belt.

4. The wafer chuck mechanism with lift and rotation functions according to claim 2, wherein, The vacuum chuck unit includes a chuck mounting plate connected to the upper end of the lifting support column, a wafer chuck connected to the chuck mounting plate, and an adsorption layer connected to the surface of the wafer chuck; the adsorption layer is made of porous ceramic material.

5. The wafer chuck mechanism with lift and rotation functions according to claim 4, wherein, A heating groove is formed in the bottom of the chuck mounting plate, a heating ring is connected in the heating groove, and a heating ring baffle is arranged on the bottom of the chuck mounting plate to tightly fix the heating ring.

6. The wafer chuck mechanism with lift and rotation functions as recited in claim 1, wherein, A stop ring is arranged on the lifting support column to limit the vacuum shaft mounting plate.

7. The wafer chuck mechanism with lift and rotation functions as recited in claim 1, wherein, A mounting bushing is connected to the chuck mounting plate, and the vacuum hollow shaft movably passes through the mounting bushing.

8. The wafer chuck mechanism with lift and rotation functions as recited in claim 1, wherein, The vacuum shaft lifting unit includes a vacuum shaft lifting part arranged on the carrying base; a movable end of the vacuum shaft lifting part is connected to a vacuum shaft lifting block, and the vacuum shaft lifting block is located below the vacuum shaft mounting plate.

9. The wafer chuck mechanism with lift and rotation functions as recited in claim 1, wherein, The carrying connecting plate is provided with a carrying guide rail, and a carrying sliding block is slidably connected to the carrying guide rail; the carrying base is connected to the carrying sliding block; the carrying base is movable relative to the carrying connecting plate through cooperation of the carrying sliding block and the carrying guide rail; a carrying screw rod is rotatably connected to the carrying connecting plate; two ends of the carrying screw rod are rotatably connected to the carrying connecting plate through carrying bearing seats; one end of the carrying screw rod is connected to a movable end of a carrying motor arranged on the carrying connecting plate; a carrying nut member is threadedly connected to the carrying screw rod; and the carrying base is connected to the carrying nut member.

10. The wafer chuck mechanism with lift and rotation functions according to claim 9, wherein, The axial direction of the carrying screw rod is parallel to the moving direction of the carrying guide rail.

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