Data unvarnished transmission device and data unvarnished transmission equipment

Abstract

The embodiment of the utility model discloses a data unvarnished transmission device and data unvarnished transmission equipment, in the data unvarnished transmission device, a USB interface module is used for receiving a parameter configuration signal sent by an upper computer; the signal conversion module is used for converting the parameter configuration signal into a transistor logic level; and the infrared emission module converts the transistor logic level into a first infrared signal, and transmits the first infrared signal to the to-be-configured device in a wireless transmission manner, so that the to-be-configured device completes corresponding parameter configuration based on the first infrared signal. The technical problems that in the prior art, when circuit board parameter configuration is carried out on a formed product, a circuit board needs to be detached from a whole machine, parameter configuration is inconvenient, configuration efficiency is low, and configuration cost is high are solved, the parameter configuration process is simplified, the parameter configuration efficiency is improved, and user experience is improved. And the parameter configuration cost is reduced.

Description

TECHNICAL FIELD

[0001] The embodiment of the utility model relates to data transmission technical field, especially relate to a data transparent transmission device and data transparent transmission equipment. BACKGROUND

[0002] When producing a large number of products, the configuration of product parameters often needs to be carried out in a wired connection mode, a PC (Personal Computer) is used to configure a circuit board, and then the whole machine is assembled and tested, if it is found that the parameter configuration is unreasonable during the testing process, the circuit board needs to be disassembled from the whole machine and then reconfigured and assembled, which invisibly reduces the efficiency and increases the configuration cost. CONTENT OF THE UTILITY MODEL

[0003] The embodiment of the utility model provides a data transparent transmission device and data transparent transmission equipment, solve the technical problem of inconvenient parameter configuration, low configuration efficiency and high configuration cost when the circuit board of the existing technology is configured for the product that has been formed.

[0004] The embodiment of the utility model provides a data transparent transmission device, the data transparent transmission device includes:

[0005] USB interface module, signal conversion module, infrared emission module;

[0006] The USB interface module is electrically connected with the host computer, the signal conversion module is electrically connected with the USB interface module, and the infrared emission module is electrically connected with the signal conversion module;

[0007] The USB interface module is used to receive the parameter configuration signal sent by the host computer;

[0008] The signal conversion module is used to convert the parameter configuration signal into a transistor logic level;

[0009] The infrared emission module converts the transistor logic level into a first infrared signal, and transmits the first infrared signal to the device to be configured in a wireless transmission mode, so that the device to be configured completes corresponding parameter configuration based on the first infrared signal.

[0010] Further, the data transparent transmission device further includes an infrared receiving module;

[0011] The infrared receiving module is electrically connected with the signal conversion module;

[0012] The infrared receiving module is used to receive the second infrared signal transmitted by the device to be configured, and convert the second infrared signal into a transistor logic level.

[0013] Further, the signal conversion module comprises a USB-to-serial chip, a first capacitor, a second capacitor and a third capacitor.

[0014] The ground end of the USB-to-serial chip is grounded, the data output end of the USB-to-serial chip is electrically connected with the infrared emission module, the first power supply end of the USB-to-serial chip is grounded through the third capacitor, the first signal end and the second signal end of the USB-to-serial chip are electrically connected with the USB interface module, and the second power supply end of the USB-to-serial chip is electrically connected with the first power supply.

[0015] The first end of the first capacitor is electrically connected with the second power supply end of the USB-to-serial chip, and the second end of the first capacitor is grounded.

[0016] The first end of the second capacitor is electrically connected with the second power supply end of the USB-to-serial chip, and the second end of the second capacitor is grounded.

[0017] Further, the infrared emission module comprises:

[0018] an infrared emission tube, a first resistor, a second resistor, a third resistor and a first triode.

[0019] The first end of the infrared emission tube is electrically connected with the first power supply, and the second end of the infrared emission tube is electrically connected with the emitter of the first triode through the first resistor.

[0020] The first end of the second resistor is electrically connected with the data receiving end of the USB-to-serial chip, and the second end of the second resistor is electrically connected with the base of the first triode.

[0021] The first end of the third resistor is electrically connected with the base of the first triode, and the second end of the third resistor is grounded.

[0022] The collector of the first triode is grounded.

[0023] Further, the infrared emission module comprises a fourth resistor, a fifth resistor, a sixth resistor, a second triode and an infrared receiving tube.

[0024] The first end of the fourth resistor is grounded, the second end of the fourth resistor is electrically connected with the first end of the infrared receiving tube, the second end of the infrared receiving tube is electrically connected with the data receiving end of the USB-to-serial chip through the fifth resistor, and the second end of the infrared receiving tube is electrically connected with the first power supply.

[0025] The first end of the sixth resistor is electrically connected with the first end of the infrared receiving tube, and the second end of the sixth resistor is electrically connected with the base of the second triode.

[0026] The collector of the second triode is electrically connected with a data receiving end of the USB-to-serial chip, and the emitter of the second triode is grounded.

[0027] Further, the USB interface module comprises a USB interface.

[0028] The power supply end of the USB interface is used as the first power supply, the positive signal end of the USB interface is electrically connected with the first signal end of the USB-to-serial chip, the negative signal end of the USB interface is electrically connected with the second signal end of the USB-to-serial chip, and the three ground ends of the USB interface are all grounded.

[0029] The utility model embodiment further provides a kind of data transparent transmission equipment, and the data transparent transmission equipment includes the data transparent transmission device described in any embodiment above, and further include at least one external infrared receiving module;

[0030] One described external infrared receiving module is correspondingly arranged in one to be configured device, for receiving the first infrared signal transmitted by the data transparent transmission device.

[0031] Further, the data transparent transmission equipment further includes at least one external infrared transmitting module.

[0032] One described external infrared transmitting module is correspondingly arranged in one described to be configured device, for sending second infrared signal to the data transparent transmission device.

[0033] Further, the data transparent transmission equipment further includes the host computer.

[0034] The host computer is electrically connected with the data transparent transmission device, for sending parameter configuration signal to the data transparent transmission device, or receiving the transistor logic level transmitted by the data transparent transmission device.

[0035] The utility model embodiment discloses a kind of data transparent transmission device and data transparent transmission equipment, data transparent transmission device includes: USB interface module, signal conversion module, infrared emission module;USB interface module is used to receive the parameter configuration signal sent by host computer;Signal conversion module is used to convert parameter configuration signal into transistor logic level;Infrared emission module converts transistor logic level into first infrared signal, and first infrared signal is transmitted to the device to be configured with the mode of wireless transmission, to make the device to be configured complete corresponding parameter configuration based on first infrared signal.This application is connected host computer by using USB interface module, and parameter configuration signal transmitted by host computer is converted using signal conversion module, infrared emission module, finally parameter configuration signal is sent into the device to be configured with the mode of infrared signal, the technical problem of inconvenient parameter configuration, low configuration efficiency, higher configuration cost that the circuit board of existing technology needs to be disassembled from complete machine when carrying out line board parameter configuration to product that has been formed is solved, the technical effect of simplifying parameter configuration process, improving parameter configuration efficiency, reducing parameter configuration cost is realized. BRIEF DESCRIPTION OF DRAWINGS

[0036] Figure 1 It is the structure diagram of a kind of data transparent transmission device provided by the utility model embodiment;

[0037] Figure 2 It is the structure diagram of another data transparent transmission device provided by the utility model embodiment;

[0038] Figure 3 It is the circuit diagram of signal conversion module provided by the utility model embodiment;

[0039] Figure 4 It is the circuit diagram of infrared emission module provided by the utility model embodiment;

[0040] Figure 5 It is the circuit diagram of infrared receiving module provided by the utility model embodiment;

[0041] Figure 6 It is the circuit diagram of USB interface module provided by the utility model embodiment;

[0042] Figure 7 It is the structure diagram of a kind of data transparent transmission equipment provided by the utility model embodiment. DETAILED DESCRIPTION

[0043] The utility model will be further described in detail in combination with drawing and embodiment.It can be understood that the specific embodiment described here is only used to explain the utility model, and not limit the utility model.In addition, it needs to be explained that, for convenience of description, only part related to the utility model is shown in the drawing, not all structures.

[0044] It should be noted that the terms "first", "second" and the like in the description and claims of the utility model and the drawings are used to distinguish different objects, and are not used to limit a specific order. The various embodiments of the utility model described below can be executed independently, and the various embodiments can also be executed in combination with each other, and the utility model embodiments do not make specific limitations to this.

[0045] Figure 1 It is a structural diagram of a data transparent transmission device provided by the utility model embodiment.

[0046] As Figure 1 Indicated, the data transparent transmission device specifically includes: USB interface module 10, signal conversion module 20, infrared emission module 30;USB interface module 10 is electrically connected with host computer 40, signal conversion module 20 is electrically connected with USB interface module 10, infrared emission module 30 is electrically connected with signal conversion module 20.

[0047] USB interface module 10 is used to receive the parameter configuration signal sent by host computer 40;Signal conversion module 20 is used to convert the parameter configuration signal into transistor logic level;Infrared emission module 30 converts the transistor logic level into the first infrared signal, and transmits the first infrared signal to the device to be configured in the mode of wireless transmission, so that the device to be configured completes the corresponding parameter configuration based on the first infrared signal.

[0048] Specifically, transparent transmission refers to that data is directly transmitted from a source node to a target node without the processing or modification of any intermediate node in the communication process. The core of transparent transmission is to guarantee the transparency of data transmission, that is, no matter what bit combination the transmitted data is, it can be correctly transmitted on the link, and it will not be misjudged due to control information. Infrared is a kind of non-visible light, with a wavelength of 0.75 μm to 1000 μm, belonging to the range of invisible light, which has the characteristics of low cost, simple equipment, convenient use, etc., and the infrared has strong anti-interference ability, and is not easy to be affected by electromagnetic interference in the transmission process, and is suitable for short-distance wireless transmission in a more complex environment.

[0049] Therefore, based on the principle of infrared transmission, the data transparent transmission device is connected with the host computer 40 by using the USB interface module 10, and then the parameter configuration signal sent by the host computer 40 is converted into a transistor-transistor logic (TTL) level by the signal conversion module 20 in the data transparent transmission device. After obtaining the transistor-transistor logic level, the signal conversion module 20 sends the transistor-transistor logic level to the infrared emission module 30, and the infrared emission tube in the infrared emission module 30 transmits the received transistor-transistor logic level to the to-be-configured device 50 in the form of an infrared signal, so as to realize the transparent transmission of data from the host computer 40 to the to-be-configured device 50.

[0050] Since the data transparent transmission device transmits data to the to-be-configured device 50 in the form of an infrared signal, the to-be-configured device 50 can be configured in the actual production process without the need for the tester to connect the wires.

[0051] The application connects the host computer by using the USB interface module, converts the parameter configuration signal transmitted by the host computer by using the signal conversion module and the infrared emission module, and finally sends the parameter configuration signal into the to-be-configured device in the form of an infrared signal, thereby solving the technical problems of inconvenient parameter configuration, low configuration efficiency and high configuration cost of the prior art when the circuit board of the product is disassembled from the whole machine for parameter configuration, achieving the technical effects of simplifying the parameter configuration process, improving the parameter configuration efficiency and reducing the parameter configuration cost.

[0052] Figure 2 is a structural diagram of another data transparent transmission device provided by the embodiment of the application.

[0053] Optionally, as shown in Figure 2 the data transparent transmission device further comprises an infrared receiving module 60; the infrared receiving module 60 is electrically connected with the signal conversion module 50; and the infrared receiving module 60 is used for receiving the second infrared signal transmitted by the to-be-configured device 50 and converting the second infrared signal into a transistor-transistor logic level.

[0054] Specifically, the infrared receiving module 60 is used for receiving an external infrared signal and converting the external infrared signal into a transistor logic level, the infrared receiving module 60 is electrically connected with the signal conversion module 20, the transistor logic level converted can be sent to the signal conversion module 20, the signal conversion module 20 converts it into a USB signal and finally sends it to the upper computer 40. Specifically, the receiving end on the side of the signal conversion module 20 converted into a transistor logic level is connected with an infrared receiving tube in the infrared receiving module 60, so that the infrared receiving module 60 can trigger the related circuit when receiving the external infrared induction, and the signal is transmitted to the upper computer 40 through the signal conversion module 20 without loss.

[0055] By setting the infrared receiving module 60, the maintenance personnel can quickly establish a communication connection with the to-be-configured device 50 through the data transparent transmission device and obtain the related state and parameters of the to-be-configured device 50 during the actual field use of the to-be-configured device 50, which is very convenient, and solves the problem that the maintenance personnel needs to disassemble the shell of the to-be-configured device 50, connect the internal controller through a data line, and then obtain the parameters in order to quickly understand the related parameters of the equipment during the actual field use of the to-be-configured device 50.

[0056] Figure 3 is a circuit diagram of the signal conversion module provided in the embodiment of the utility model.

[0057] Optionally, as shown in Figure 3 The signal conversion module 20 includes a USB-to-serial chip U1, a first capacitor C1, a second capacitor C2 and a third capacitor C3.

[0058] The ground end GND1 of the USB-to-serial chip U1 is grounded GND, the data output end TXD of the USB-to-serial chip U1 is electrically connected with the infrared transmitting module 30 (IRDA_TX pin), the first power supply end V3.3 of the USB-to-serial chip U1 is grounded GND through the third capacitor C3, the first signal end UD+ and the second signal end UD- of the USB-to-serial chip U1 are both electrically connected with the USB interface module 10 (pin USB_DP and pin USB_DN), and the second power supply end VCC of the USB-to-serial chip U1 is electrically connected with the first power supply USB_+5V.

[0059] The first end of the first capacitor C1 is electrically connected with the second power supply end VCC of the USB-to-serial chip U1, and the second end of the first capacitor C1 is grounded GND; the first end of the second capacitor C2 is electrically connected with the second power supply end VCC of the USB-to-serial chip U1, and the second end of the second capacitor C2 is grounded GND.

[0060] Specifically, as shown in Figure 3As shown, the first capacitor C1 and the second capacitor C2 are filter capacitors, and generally, the first capacitor C1 can have a value of 0.1 μF, and the second capacitor C2 can have a value of 4.7 μF; the USB-to-serial chip U1 can select a CH340B chip, which is used to convert the USB signal from the host computer 40 into a TTL signal; the third capacitor C3 is a voltage stabilizing capacitor, and since the USB-to-serial chip U1 can output a 3.3V voltage internally, the first power supply end V3.3 of the USB-to-serial chip U1 needs to be connected to the voltage stabilizing capacitor, and the value of the capacitor can be 0.1 μF.

[0061] The data output end TXD of the USB-to-serial chip U1 is used for signal output, and when the USB-to-serial chip U1 receives the parameter configuration signal from the host computer 40, the USB-to-serial chip U1 automatically outputs a TTL signal from the data output end TXD, and the data output end TXD is connected to one end of the second resistor R2 of the infrared emission module 30, thereby controlling the transmission of the infrared signal; the data receiving end RXD (connected to the IRDA_RX pin of the infrared receiving module 60) of the USB-to-serial chip U1 is used for signal reception, and when the USB-to-serial chip U1 receives the TTL signal transmitted from the infrared receiving module 60, the USB-to-serial chip U1 converts the TTL signal into a USB signal and sends the USB signal to the host computer 40, thereby realizing non-contact signal transmission.

[0062] It should be noted that, as shown in Figure 3 , other pins of the USB-to-serial chip U1, such as RST#, NC1, NC2, RTS#, DTR#, DCD#, RI#, DSR#, CTS# and the like, can be connected to other peripheral circuits as needed, and the specific limitation is not made here.

[0063] Figure 4 is a circuit diagram of the infrared emission module provided by the embodiment of the utility model.

[0064] Optionally, as shown in Figure 4 , the infrared emission module 30 comprises an infrared emission tube D1, a first resistor R1, a second resistor R2, a third resistor R3 and a first triode Q1; a first end of the infrared emission tube D1 is electrically connected with a first power supply USB_+5V, a second end of the infrared emission tube D1 is electrically connected with an emitter electrode E of the first triode Q1 through the first resistor R1; a first end of the second resistor R2 is electrically connected with the data receiving end TXD of the USB-to-serial chip U1 as an IRDA_TX pin, and a second end of the second resistor R2 is electrically connected with a base electrode B of the first triode Q1; a first end of the third resistor R3 is electrically connected with the base electrode B of the first triode Q1, and a second end of the third resistor R3 is grounded GND; and a collector electrode C of the first triode Q1 is grounded GND.

[0065] Specifically, the IRDA_TX pin of the infrared emission module 30 is connected with the data output end TXD of the USB-to-serial chip U1, when the data output end TXD outputs a high level signal to the IRDA_TX pin, the first triode Q1 is cut off, and then the infrared emission tube D1 cannot work and cannot emit infrared signals; when the data output end TXD outputs a low level signal to the IRDA_TX pin, the first triode Q1 is turned on, and then the infrared emission tube D1 starts to work and emits infrared signals.

[0066] Referring to Figure 4 , the first resistor R1 is a current limiting resistor, used for limiting the current flowing through the infrared emission tube D1, and the distance of the space transmission can be adjusted by adjusting the resistance value of the first resistor R1; the second resistor R2 is a current limiting resistor, used for limiting the current flowing into the base B of the first triode Q1, and the speed of the sending signal can be controlled by adjusting the resistance value of the second resistor R2; the third resistor R3 is a pull-down resistor, used for stabilizing the level, when the data transparent transmission device is in the initial stage of power-on or is interfered to cause the level at the IRDA_TX pin to abnormally change, the third resistor R3 is used for providing a stable level for the first triode Q1; the first triode Q1 is used as an electronic switch, when saturated conduction, the conduction voltage drop of the first triode Q1 is very small, and is approximately grounded, thereby providing a current loop for the infrared emission tube D1.

[0067] Figure 5 is the circuit diagram of the infrared receiving module provided by the embodiment of the utility model.

[0068] Optionally, as Figure 5 shown, the infrared receiving module 60 comprises a fourth resistor R4, a fifth resistor R5, a sixth resistor R6, a second triode Q2 and an infrared receiving tube D2.

[0069] The first end of the fourth resistor R4 is grounded GND, the second end of the fourth resistor R4 is electrically connected with the first end of the infrared receiving tube D2, the second end of the infrared receiving tube D2 is electrically connected with the data receiving end RXD of the USB-to-serial chip U1 through the fifth resistor R5 (namely as the IRDA_RX pin); the second end of the infrared receiving tube D2 is electrically connected with the first power supply USB_+5V; the first end of the sixth resistor R6 is electrically connected with the first end of the infrared receiving tube D2, and the second end of the sixth resistor R6 is electrically connected with the base B of the second triode Q2; the collector C of the second triode Q2 is electrically connected with the data receiving end RXD of the USB-to-serial chip U1, and the emitter E of the second triode Q2 is grounded GND.

[0070] Specifically, the IRDA_RX pin of the infrared receiving module 60 is connected with the data receiving end RXD of the USB-to-serial chip U1, when the infrared receiving tube D2 receives the second infrared signal (i.e., the infrared signal sent by the to-be-configured device 50), the second triode Q2 is turned on, at this time, the IRDA_RX pin is at low level, when the infrared receiving tube D2 does not receive the second infrared signal, the second triode Q2 is turned off, at this time, the IRDA_RX pin is at high level.

[0071] Referring to Figure 5 , the fourth resistor R4 is a pull-down resistor, which is used to provide a stable low level for the second triode Q2 when no second infrared signal is received; the fifth resistor R5 is a pull-up resistor, which is used to provide a stable high level for the IRDA_RX pin when no second infrared signal is received, and the speed of the received signal can be controlled by adjusting the resistance value of the fifth resistor R5; the sixth resistor R6 is a current-limiting resistor, which is used to limit the current flowing into the base B of the second triode Q2 when the second infrared signal is received.

[0072] When the infrared receiving tube D2 receives the second infrared signal, it will present a low resistance state, at this time, current will flow into the base B of the second triode Q2, causing the second triode Q2 to be saturated and turned on, so that the IRDA_RX pin is approximately grounded and at low level. When no second infrared signal is received, the infrared receiving tube D2 presents a high resistance state, at this time, no current flows into the base B of the second triode Q2, causing the second triode Q2 to be turned off, so that the IRDA_RX pin is at high level.

[0073] Therefore, the second infrared signal exists and does not exist, and the level state of the IRDA_RX pin is different, so that the second infrared signal transmitted from the outside can be accurately acquired. When the USB-to-serial chip U1 receives the signal of the host computer 40, the IRDA_TX pin of the infrared transmitting module 30 will also present different states, thereby controlling the emission state of the infrared transmitting tube D1. Through the above principle, the transparent transmission of the parameter configuration signal can be realized, and the intervention of the MCU (Microcontroller Unit) is not required, and the whole process is automatically completed by the circuit in the data transparent transmission device.

[0074] Figure 6 is a circuit diagram of the USB interface module provided by the embodiment of the present application.

[0075] Optionally, as shown in Figure 6 , the USB interface module 10 includes a USB interface J1;

[0076] The power terminal VBUS of the USB interface J1 is used as a first power supply USB_+5V, the positive signal terminal D+ of the USB interface J1 is electrically connected with the first signal terminal UD+ of the USB-to-serial chip U1 as a pin USB_DP, the negative signal terminal D- of the USB interface J1 is electrically connected with the second signal terminal UD- of the USB-to-serial chip U1 as a pin USB_DN, and the three ground terminals GND of the USB interface J1 are all grounded GND.

[0077] Specifically, the USB_DP and the USB_DN are positive and negative signal pins of the USB interface module 10 and are connected with the USB-to-serial chip U1, and the first power supply USB_+5V is a power supply from the USB interface J1 and is used for supplying power for the data transparent transmission device.

[0078] Figure 7 is a structural diagram of a data transparent transmission device provided by the embodiment of the utility model.

[0079] The embodiment of the utility model further provides a data transparent transmission device, as shown in the figure, the data transparent transmission device comprises the data transparent transmission device 70 in any embodiment above, and further comprises at least one external infrared receiving module 71;One external infrared receiving module is correspondingly arranged in one to be configured device 50 and is used for receiving the first infrared signal transmitted by the data transparent transmission device 70. Figure 7 The embodiment of the utility model further provides a data transparent transmission device, as shown in the figure, the data transparent transmission device comprises the data transparent transmission device 70 in any embodiment above, and further comprises at least one external infrared receiving module 71;One external infrared receiving module is correspondingly arranged in one to be configured device 50 and is used for receiving the first infrared signal transmitted by the data transparent transmission device 70. Figure 7 The embodiment of the utility model further provides a data transparent transmission device, as shown in the figure, the data transparent transmission device comprises the data transparent transmission device 70 in any embodiment above, and further comprises at least one external infrared receiving module 71;One external infrared receiving module is correspondingly arranged in one to be configured device 50 and is used for receiving the first infrared signal transmitted by the data transparent transmission device 70.

[0080] Optionally, the data transparent transmission device further comprises at least one external infrared transmitting module 72;

[0081] One external infrared transmitting module 72 is correspondingly arranged in one to be configured device 50 and is used for sending the second infrared signal to the data transparent transmission device 70.

[0082] Optionally, the data transparent transmission device further comprises a host computer 40;

[0083] The host computer 40 is electrically connected with the data transparent transmission device 70 and is used for sending a parameter configuration signal to the data transparent transmission device 70 or receiving the transistor logic level transmitted by the data transparent transmission device 70.

[0084] The data transparent transmission device provided by the embodiment of the utility model comprises the data transparent transmission device in the above embodiment, so the data transparent transmission device provided by the embodiment of the utility model also has the beneficial effects described in the above embodiment, which will not be repeated here.

[0085] In the description of the embodiments of the present application, unless otherwise expressly defined and limited, the terms "mounting", "connecting", "jointing" should be understood in a broad sense, for example, can be fixedly connected, can also be detachably connected, or integrally connected; can be mechanically connected, can also be electrically connected; can be directly connected, can also be indirectly connected through an intermediate medium, can be the communication inside two elements. For ordinary skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0086] Finally, it should be noted that the above is only the preferred embodiment of the present application and the technical principles used. Those skilled in the art will understand that the present application is not limited to the specific embodiments described herein, and those skilled in the art can make various obvious changes, readjustments and substitutions without departing from the scope of the present application. Therefore, although the present application has been described in more detail through the above embodiments, the present application is not limited to the above embodiments, and can include more other equivalent embodiments without departing from the concept of the present application, and the scope of the present application is determined by the scope of the appended claims.

Claims

1. A data pass-through device, characterized by, The data transparent transmission device comprises: a USB interface module, a signal conversion module, and an infrared emission module; the USB interface module is electrically connected to an upper computer, the signal conversion module is electrically connected to the USB interface module, and the infrared emission module is electrically connected to the signal conversion module; the USB interface module is configured to receive a parameter configuration signal sent by the upper computer; the signal conversion module is configured to convert the parameter configuration signal into a transistor logic level; the infrared emission module converts the transistor logic level into a first infrared signal and transmits the first infrared signal to a device to be configured in a wireless manner, so that the device to be configured completes corresponding parameter configuration based on the first infrared signal.

2. The data pass-through device of claim 1, wherein, The data transparent transmission device further comprises an infrared receiving module; the infrared receiving module is electrically connected to the signal conversion module; the infrared receiving module is configured to receive a second infrared signal transmitted by the device to be configured and convert the second infrared signal into a transistor logic level.

3. The data pass-through device of claim 2, wherein, The signal conversion module comprises a USB-to-serial chip, a first capacitor, a second capacitor, and a third capacitor; a ground end of the USB-to-serial chip is grounded, a data output end of the USB-to-serial chip is electrically connected to the infrared emission module, a first power supply end of the USB-to-serial chip is grounded through the third capacitor, a first signal end and a second signal end of the USB-to-serial chip are electrically connected to the USB interface module, and a second power supply end of the USB-to-serial chip is electrically connected to the first power supply; a first end of the first capacitor is electrically connected to the second power supply end of the USB-to-serial chip, and a second end of the first capacitor is grounded; a first end of the second capacitor is electrically connected to the second power supply end of the USB-to-serial chip, and a second end of the second capacitor is grounded.

4. The data pass-through device of claim 3, wherein, The infrared emission module comprises: an infrared emission tube, a first resistor, a second resistor, a third resistor, and a first triode; a first end of the infrared emission tube is electrically connected to the first power supply, and a second end of the infrared emission tube is electrically connected to an emitter of the first triode through the first resistor; a first end of the second resistor is electrically connected to a data receiving end of the USB-to-serial chip, and a second end of the second resistor is electrically connected to a base of the first triode; a first end of the third resistor is electrically connected to the base of the first triode, and a second end of the third resistor is grounded; a collector of the first triode is grounded.

5. The data pass-through device of claim 3, wherein, The infrared receiving module comprises a fourth resistor, a fifth resistor, a sixth resistor, a second triode, and an infrared receiving tube; a first end of the fourth resistor is grounded, a second end of the fourth resistor is electrically connected to a first end of the infrared receiving tube, a second end of the infrared receiving tube is electrically connected to the data receiving end of the USB-to-serial chip through the fifth resistor, and the second end of the infrared receiving tube is electrically connected to the first power supply; a first end of the sixth resistor is electrically connected to the first end of the infrared receiving tube, and a second end of the sixth resistor is electrically connected to a base of the second triode; The collector of the second triode is electrically connected with a data receiving end of the USB-to-serial chip, and the emitter of the second triode is grounded.

6. The data pass-through device of claim 3, wherein, The USB interface module comprises a USB interface; The power supply end of the USB interface is used as the first power supply, the positive signal end of the USB interface is electrically connected with the first signal end of the USB-to-serial chip, the negative signal end of the USB interface is electrically connected with the second signal end of the USB-to-serial chip, and the three ground ends of the USB interface are all grounded.

7. A data transparent transmission device, characterized in that: The data transparent transmission device comprises the data transparent transmission apparatus in any one of claims 1-6, and further comprises at least one external infrared receiving module. One external infrared receiving module is arranged in one to-be-configured apparatus, and is used for receiving the first infrared signal transmitted by the data transparent transmission apparatus.

8. The data pass-through device of claim 7, wherein, The data transparent transmission device further comprises at least one external infrared transmitting module. One external infrared transmitting module is arranged in one to-be-configured apparatus, and is used for transmitting the second infrared signal to the data transparent transmission apparatus.

9. The data pass-through device of claim 7, wherein, The data transparent transmission device further comprises the upper computer. The upper computer is electrically connected with the data transparent transmission apparatus, and is used for transmitting a parameter configuration signal to the data transparent transmission apparatus, or receiving the transistor logic level transmitted by the data transparent transmission apparatus.

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