PCB circuit board structure

Abstract

The utility model belongs to the technical field of circuit boards, in particular to a PCB (printed circuit board) structure, which comprises a substrate, the substrate comprises a conductive layer used for connecting electronic elements and transmitting signals, and the conductive layer is connected with a mark solder mask used for preventing short circuit between the conductive layer and other metal parts and providing solder joints. The substrate further comprises a silk-screen layer used for identifying positions and identifications of elements, conductive path via holes used for being connected with different layers are formed in the substrate, and meanwhile element installation holes used for installing electronic elements are formed in the substrate. According to the utility model, the metal circuit is etched or printed on the conductive layer, so that circuit connection is realized, and accurate signal transmission between electronic elements is ensured; the design of the heat conduction plate, the heat conduction pipe and the heat dissipation fins is beneficial for rapidly dissipating heat generated by the circuit board, and the stability and reliability of the circuit board are improved; and the circuit board can be conveniently connected and combined with other parts due to the design that the workpieces are inserted into the connecting holes.

Description

TECHNICAL FIELD

[0001] The utility model relates to circuit board technical field, concretely is a kind of PCB circuit board structure. BACKGROUND

[0002] PCB (Printed Circuit Board), Chinese name is printed wiring board, is called printed board, and it is one of important components in electronic industry. Almost every kind of electronic equipment, small to electronic watch, calculator, large to computer, communication electronic equipment, military weapon system, as long as integrated circuit and other electronic components, in order to the electrical interconnection between them, printed board is used.

[0003] PCB circuit board is in sealed state when using, so the temperature is higher when working, so the heat dissipation of circuit board is required higher, if temperature is not dissipated, easy to cause the burnout of circuit board. UTILITY MODEL CONTENT

[0004] (One) technical problem solved

[0005] In view of the deficiencies of prior art, the utility model provides a kind of PCB circuit board structure, solve the problem raised in above background.

[0006] (Two) technical scheme

[0007] The utility model discloses a kind of PCB circuit board structure to achieve the above purposes specifically using the following technical solutions:

[0008] A kind of PCB circuit board structure, including substrate, the substrate includes the conductive layer for connecting electronic component and transmission signal, the conductive layer is connected for preventing the short circuit of conductive layer and other metal parts, and the marking solder resist layer for providing solder joint is marked, the substrate further includes the silk screen layer for identifying the position of element and identification, for connecting different layers of conductive path via hole on the substrate, while electronic component mounting hole for installing electronic component is equipped on the substrate, the substrate is etched or printed metal circuit on conductive layer, realizes circuit connection;The hollow hole is also opened in the substrate, heat conducting plate is equipped below the substrate, heat conducting tube is inlaid and inserted into the inside of heat conducting plate, heat dissipation fin is equipped below the heat conducting plate, connecting hole is opened in the inside of the side wall of heat conducting plate and substrate, workpiece is inserted and connected in the inside of the connecting hole.

[0009] Further, the processing hole for connection is also opened in the substrate.

[0010] Further, the hollow hole is arranged at each place of substrate without line position.

[0011] Further, the processing hole is not provided with heat dissipation fin.

[0012] Further, the interior of the heat conducting pipe is filled with water or refrigerant.

[0013] (III) Beneficial Effects

[0014] Compared with the prior art, the PCB circuit board structure has the following beneficial effects:

[0015] The utility model discloses, etching or printing metal circuit on the conductive layer, realize the connection of circuit, ensure the signal transmission between electronic component is accurate and correct, the design of heat conduction plate, heat conducting pipe and radiating fin helps the heat of circuit board to be quickly dissipated, improves the stability and reliability of circuit board, the design of the plug-in workpiece of connecting hole makes circuit board can conveniently connect and combine with other components. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is the structure schematic drawing of the utility model;

[0017] Figure 2 It is the structure schematic drawing of the utility model side;

[0018] Figure 3 It is the structure schematic drawing of the utility model Figure 2 It is the structure schematic drawing of the utility model A place.

[0019] In the drawing: 1, base plate, 2, conductive layer, 3, solder mask layer, 4, silk screen layer, 5, via, 6, mounting hole, 7, hollow hole, 8, processing hole, 9, heat conduction plate, 10, heat conducting pipe, 11, radiating fin, 12, connecting hole, 13, connecting workpiece. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0021] EMBODIMENT

[0022] As Figures 1-3As shown, an embodiment of the utility model discloses a kind of PCB circuit board structure, including substrate 1, the substrate 1 includes the conductive layer 2 for connecting electronic component and transmission signal, the conductive layer 2 is connected for preventing the short circuit of conductive layer 2 and other metal parts, and the marking solder resist layer 3 for providing solder point, the substrate 1 further include the silk screen layer 4 for identifying the position of component and identification, on the substrate 1 for connecting the conductive path via hole 5 of different layers, while on the substrate 1 is equipped for installing electronic component component mounting hole 6, realize circuit connection by etching or printing metal circuit on conductive layer 2 on the substrate 1;These parts jointly constitute the structure of PCB circuit board, it can provide physical support and electrical connection for electronic component, make the circuit design of electronic equipment more compact and reliable.Different types of PCB circuit board can have some special design and function to meet the needs of specific application, the substrate 1 is also provided with hollow hole 7, the substrate 1 below is equipped with heat conduction plate 9, the heat conduction plate 9 is inlaid with heat conduction pipe 10, the heat conduction plate 9 below is equipped with radiating fin 11, connecting hole 12 is formed in the sidewall of heat conduction plate 9 and substrate 1, workpiece 13 is inserted into connecting hole 12, in addition, substrate 1 can also have hollow hole 7, and the structure of connecting heat conduction plate 9, heat conduction pipe 10 and radiating fin 11, to help heat dissipation.

[0023] As Figure 1 Shown, in some embodiments, the substrate 1 is also provided with processing hole 8 for connection;Convenient for installation.

[0024] As Figure 1 Shown, in some embodiments, the hollow hole 7 is arranged at each place of substrate 1 without line position;By removing unnecessary substrate 1 material, the weight of entire circuit board can be reduced.

[0025] As Figure 2 Shown, in some embodiments, the processing hole 8 is not provided with radiating fin 11;Convenient for later installation.

[0026] As Figure 1 Shown, in some embodiments, the inside of heat conduction pipe 10 is filled with water or refrigerant;The working principle of heat conduction pipe 10 is to use heat conduction principle, quickly transfer the heat generated on substrate 1 into heat conduction pipe 10, then take away heat through liquid in pipe, finally dissipate to surrounding environment through radiating fin 11.

[0027] Finally, it should be noted that: the above only for the preferred embodiments of the present application, and is not intended to limit the present application, although the foregoing embodiments of the present application has been described in detail, for the skilled in the art, it still can be modified, or for the equivalent replacement of part of the technical features of the technical solutions recorded in the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application, shall be included within the scope of the present application.

Claims

1. A PCB circuit board structure comprising a substrate (1), characterized by: The substrate (1) includes a conductive layer (2) for connecting electronic components and transmitting signals, the conductive layer (2) is connected with a mark solder resist layer (3) for preventing the conductive layer (2) from short-circuiting with other metal components and providing a solder joint, the substrate (1) further includes a silk screen layer (4) for identifying the position and identification of components, a conductive via hole (5) for connecting different layers is arranged on the substrate (1), and a component mounting hole (6) for mounting electronic components is arranged on the substrate (1), circuit connection is realized by etching or printing metal lines on the conductive layer (2); a hollow hole (7) is further arranged on the substrate (1), a heat conduction plate (9) is arranged below the substrate (1), a heat conduction pipe (10) is embedded and connected in the heat conduction plate (9), a heat dissipation fin (11) is arranged below the heat conduction plate (9), a connecting hole (12) is arranged in the side wall of the heat conduction plate (9) and the substrate (1), and a workpiece (13) is connected in the connecting hole (12).

2. The PCB circuit board structure of claim 1, wherein: A processing hole (8) for connection is further arranged on the substrate (1).

3. The PCB circuit board structure of claim 1, wherein: The hollow hole (7) is arranged at a position where wires are not arranged on the substrate (1).

4. The PCB circuit board structure of claim 2, wherein: The heat dissipation fin (11) is not arranged at the processing hole (8).

5. The PCB circuit board structure of claim 1, wherein: The heat conduction pipe (10) is filled with water or refrigerant.

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