PCB laser windowing device
The use of a laser windowing device enables precise laser cutting of PCB boards, solving the problem of extended time caused by traditional chemical windowing and improving production efficiency.
Patent Information
- Application Number
- CN202423019080.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-06
- Publication Date
- 2025-11-04
- Estimated Expiration
- 2034-12-06
AI Technical Summary
Traditional PCB windowing technology relies on chemical reagents, which leads to a longer windowing cycle and increases the time cost of the PCB production process.
A laser windowing device is used to move and position the PCB board between the loading/unloading station and the processing station through the PCB board positioning mechanism. Combined with the height adjustment component, the laser focal length is adjusted, and the laser beam is used to precisely cut the solder mask layer.
This significantly shortens the window opening time, making the PCB board processing flow more efficient and reducing production costs.
Smart Images

Figure CN223506432U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of circuit board processing equipment technology, and in particular to a laser window opening device for PCB boards. Background Technology
[0002] A circuit board, or PCB (Printed Circuit Board), is an indispensable component in modern electronic devices, carrying the electrical connections and signal transmissions between electronic components. A crucial step in PCB manufacturing is applying a solder mask layer to the board surface to protect the circuitry and prevent short circuits in component leads. This solder mask typically consists of a layer of solder resist ink (often referred to as green solder mask) applied to the etched circuit board using a specific process. However, to meet specific application requirements, such as heat dissipation and contact, the solder mask layer needs to be removed at certain soldering locations; this step is called "windowing."
[0003] Traditional PCB board windowing technology mainly relies on chemical reagents to dissolve or peel off solder resist ink through chemical reactions, thereby achieving the purpose of opening windows. However, the drawback of relying on chemical reagents for windowing is that the chemical reaction requires a certain amount of time to complete, which leads to an extended windowing cycle and thus increases the time cost of the entire PCB production process. Utility Model Content
[0004] The purpose of this invention is to overcome the shortcomings of the existing technology and provide a laser windowing device for PCB boards. This device addresses the problem that traditional PCB board windowing technology mainly relies on chemical reagents to dissolve or peel off solder resist ink through chemical reactions to achieve the purpose of windowing. However, chemical reactions require a certain amount of time to complete, which leads to an extended windowing cycle and increases the time cost of the entire circuit board production process.
[0005] To achieve the above objectives, the present invention adopts the following technical solution:
[0006] This utility model provides a PCB board laser windowing device, comprising: a base, on which a loading / unloading station and a processing station are provided; a PCB board positioning mechanism, which reciprocates between the loading / unloading station and the processing station; and a laser windowing mechanism, which is fixedly disposed above the processing station; wherein, the PCB board positioning mechanism includes a horizontal moving plate, a height adjustment component, and a bearing positioning plate, the horizontal moving plate being movably connected to the upper side of the base in a horizontal direction, the bearing positioning plate being connected to the upper side of the horizontal moving plate through the height adjustment component, the height adjustment component being used to adjust the height difference between the bearing positioning plate and the horizontal moving plate, and the bearing positioning plate being used to support and position the PCB board.
[0007] Furthermore, a linear motor is provided on the machine base. The stator of the linear motor is connected to the machine base, and the mover of the linear motor is connected to the horizontal moving plate. The linear motor is used to drive the horizontal moving plate to reciprocate horizontally between the loading / unloading station and the processing station.
[0008] Furthermore, the height adjustment component includes a vertical guide rail and a vertical slider, wherein the vertical slider is slidably connected to the vertical guide rail in the vertical direction; wherein the vertical guide rail is disposed on the upper side of the horizontal moving plate and the vertical slider is disposed on the lower side of the bearing positioning plate, or the vertical guide rail is disposed on the lower side of the bearing positioning plate and the vertical slider is disposed on the upper side of the horizontal moving plate.
[0009] Furthermore, the height adjustment assembly also includes: a drive cylinder, a first tilting slider, and a second tilting slider. The first tilting slider is slidably connected to the upper side of the horizontal moving plate, and the second tilting slider is fixedly connected to the lower side of the bearing positioning plate. The fixed end of the drive cylinder is connected to the horizontal moving plate, and the telescopic end of the drive cylinder is connected to the first tilting slider.
[0010] The first tilting slider has a first tilting surface with a gradually changing height on its upper side, and the second tilting slider has a second tilting surface that corresponds to and fits against the first tilting surface on its lower side. The first tilting surface and the second tilting surface are slidably connected. The driving cylinder is used to drive the first tilting slider to move in the direction of the height change of the first tilting surface, so that the second tilting slider drives the bearing positioning plate to rise or fall.
[0011] Furthermore, the first tilting slider is located at the center of the horizontal moving plate, the second tilting slider is located at the center of the bearing positioning plate, and the vertical guide rail and the vertical slider are respectively located at the four corners of the horizontal moving plate and the bearing positioning plate.
[0012] Furthermore, the upper side of the bearing positioning plate is provided with a plurality of adsorption holes, and the bearing positioning plate is provided with a negative pressure chamber connected to the adsorption holes, and the negative pressure chamber is connected to a vacuum pumping device through an air pipe.
[0013] Furthermore, a pressure strip is detachably provided on the upper side of the bearing positioning plate, the lower side of the pressure strip is parallel to the upper side of the bearing positioning plate, and a pressing gap for pressing the PCB board is formed between the lower side of the pressure strip and the upper side of the bearing positioning plate.
[0014] Furthermore, the bearing positioning plate is provided with a sliding groove, and a connecting column is slidably disposed in the sliding groove. The pressure strip is detachably connected to the connecting column through a connector.
[0015] Furthermore, the slide includes a first slide with its opening direction perpendicular to the movement direction of the PCB board positioning mechanism, and a second slide with its opening direction parallel to the movement direction of the PCB board positioning mechanism, and the connecting post is provided in both the first slide and the second slide.
[0016] Furthermore, the laser windowing mechanism includes a positioning CCD camera and several lasers. The positioning CCD camera is used to take pictures and position the PCB board located at the processing station, and the lasers are used to perform a preset laser windowing operation on the PCB board located at the processing station. The several lasers are evenly arranged in a horizontal straight line, and the arrangement direction of the several lasers is perpendicular to the movement direction of the PCB board positioning mechanism.
[0017] This utility model discloses a PCB board laser windowing device. The PCB board positioning mechanism realizes the movement and positioning of the PCB board between the loading / unloading station and the processing station through a horizontal moving plate. The height of the supporting positioning plate can be flexibly adjusted through a height adjustment component, thereby changing the laser irradiation focal length to adapt to the processing needs of PCB boards of different thicknesses and sizes. The laser windowing mechanism uses a laser beam to precisely cut the solder mask layer on the PCB board, which greatly shortens the windowing time and makes the entire PCB board processing process more efficient.
[0018] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model, it can be implemented according to the contents of the specification. In order to make the above and other objects, features and advantages of this utility model more obvious and easy to understand, the following are preferred embodiments, which are described in detail below. Attached Figure Description
[0019] Figure 1 This is a perspective view of the PCB board laser window opening device according to an embodiment of the present invention;
[0020] Figure 2 This is a side view of the PCB board laser window opening device according to an embodiment of the present invention;
[0021] Figure 3 This is a perspective view of the PCB board positioning mechanism in the PCB board laser windowing device according to an embodiment of the present invention;
[0022] Figure 4 This is a first-state side view of the PCB board positioning mechanism in the PCB board laser windowing device according to an embodiment of this utility model;
[0023] Figure 5 This is a second-state side view of the PCB board positioning mechanism in the PCB board laser windowing device according to an embodiment of the present invention;
[0024] Figure 6 This is a perspective view of the support positioning plate in the PCB board laser window opening device according to an embodiment of the present invention;
[0025] Figure 7 This is a schematic diagram of the cooperation structure between the connecting column and the transmission mechanism in the PCB board laser window opening device of this utility model embodiment.
[0026] Explanation of reference numerals in the attached figures:
[0027] 1. Base; 11. Linear motor; 2. PCB board positioning mechanism; 21. Horizontal moving plate; 22. Height adjustment assembly; 221. Vertical guide rail; 222. Vertical slider; 223. Drive cylinder; 224. First tilt slider; 225. Second tilt slider; 23. Bearing positioning plate; 231. Slide groove; 232. Connecting column; 233. Pressure strip; 3. Laser window opening mechanism; 31. Positioning CCD camera; 32. Laser; 4. Transmission mechanism; 41. Drive motor; 42. Driving wheel; 43. Driven wheel; 44. Synchronous belt. Detailed Implementation
[0028] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.
[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.
[0030] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "resin", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0031] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.
[0032] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0033] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0034] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. The illustrative expressions of the above terms in this specification should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0035] Please see the appendix Figure 1 and Figure 2This utility model provides a PCB board laser windowing device, including: a base 1, on which a loading / unloading station and a processing station are provided; a PCB board positioning mechanism 2, which reciprocates between the loading / unloading station and the processing station; and a laser windowing mechanism 3, which is fixedly disposed above the processing station. The PCB board positioning mechanism 2 includes a horizontal moving plate 21, a height adjustment component 22, and a bearing positioning plate 23. The horizontal moving plate 21 is movably connected to the upper side of the base 1 in a horizontal direction. The bearing positioning plate 23 is connected to the upper side of the horizontal moving plate 21 through the height adjustment component 22. The height adjustment component 22 is used to adjust the height difference between the bearing positioning plate 23 and the horizontal moving plate 21. The bearing positioning plate 23 is used to support and position the PCB board.
[0036] In one operation of this embodiment, the operator places the PCB board to be processed on the support positioning plate 23 at the loading / unloading station. Then, the PCB board positioning mechanism 2 is activated, and the horizontal moving plate 21 moves the support positioning plate 23 and the PCB board on it horizontally to the processing station. The laser windowing mechanism 3 is activated to perform precise laser cutting on the PCB board on the support positioning plate 23, achieving the windowing operation. Simultaneously, according to the thickness of the PCB board and processing requirements, the height adjustment component 22 adjusts the height of the support positioning plate 23, thereby changing the laser irradiation focal length. After processing is completed, the PCB board positioning mechanism 2 is activated again, moving the support positioning plate 23 and the PCB board on it back to the loading / unloading station. The operator removes the processed PCB board and places a new PCB board to be processed on it.
[0037] Furthermore, a linear motor 11 is provided on the base 1. The stator of the linear motor 11 is connected to the base 1, and the mover of the linear motor 11 is connected to the horizontal moving plate 21. The linear motor 11 is used to drive the horizontal moving plate 21 to reciprocate in the horizontal direction between the loading / unloading station and the processing station.
[0038] For further details, please refer to Figures 3 to 5 The height adjustment component 22 includes a vertical guide rail 221 and a vertical slider 222, wherein the vertical slider 222 is slidably connected to the vertical guide rail 221 in the vertical direction; wherein the vertical guide rail 221 is disposed on the upper side of the horizontal moving plate 21 and the vertical slider 222 is disposed on the lower side of the bearing positioning plate 23, or the vertical guide rail 221 is disposed on the lower side of the bearing positioning plate 23 and the vertical slider 222 is disposed on the upper side of the horizontal moving plate 21.
[0039] Specifically, the height adjustment assembly 22 further includes: a drive cylinder 223, a first tilting slider 224, and a second tilting slider 225. The first tilting slider 224 is slidably connected to the upper side of the horizontal moving plate 21, and the second tilting slider 225 is fixedly connected to the lower side of the bearing positioning plate 23. The fixed end of the drive cylinder 223 is connected to the horizontal moving plate 21, and the telescopic end of the drive cylinder 223 is connected to the first tilting slider 224. The upper side of the first tilting slider 224 is provided with a first tilting surface with gradually changing height, and the lower side of the second tilting slider 225 is provided with a second tilting surface that corresponds to and fits against the first tilting surface. The first tilting surface and the second tilting surface are slidably connected. The drive cylinder 223 is used to drive the first tilting slider 224 to move in the direction of the height change of the first tilting surface, so that the second tilting slider 225 drives the bearing positioning plate 23 to rise or fall. Preferably, the height of the first inclined surface gradually decreases from the loading / unloading station to the processing station. The drive cylinder 223 is located on the side of the first inclined slider 224 near the loading / unloading station, so that when the extension end of the drive cylinder 223 extends, the second inclined slider 225 is raised by the first inclined slider 224; when the extension end of the drive cylinder 223 shortens, the second inclined slider 225 descends along the first inclined surface.
[0040] Understandably, in this embodiment, the sliding connection between the vertical guide rail 221 and the vertical slider 222 provides the vertical freedom of movement for the bearing positioning plate 23, while the cooperation of the drive cylinder 223, the first tilting slider 224, and the second tilting slider 225 enables precise adjustment of the height of the bearing positioning plate 23. In the initial state, the extension end of the drive cylinder 223 is in the retracted state, and the first tilting slider 224 and the second tilting slider 225 remain relatively stationary due to the contact of their tilted surfaces, with the bearing positioning plate 23 positioned at the initial height. When the height of the bearing positioning plate 23 needs to be adjusted, the control system starts the drive cylinder 223. The telescopic end of the drive cylinder 223 begins to extend and retract, driving the first inclined slider 224 to move in the direction of the height change of the first inclined surface. Since the first inclined surface and the second inclined surface are in corresponding contact and sliding connection, the movement of the first inclined slider 224 will be converted into the lifting or lowering movement of the second inclined slider 225 and the bearing positioning plate 23. When the bearing positioning plate 23 reaches the target height, the control system stops the operation of the drive cylinder 223 and locks its position to maintain the stability of the bearing positioning plate 23.
[0041] Furthermore, the first tilting slider 224 is positioned at the center of the horizontal moving plate 21, and the second tilting slider 225 is positioned at the center of the bearing positioning plate 23. Vertical guide rails 221 and vertical sliders 222 are respectively positioned at the four corners of the horizontal moving plate 21 and the bearing positioning plate 23. By positioning the first tilting slider 224 and the second tilting slider 225 at the center of the horizontal moving plate 21 and the bearing positioning plate 23, this embodiment can more effectively achieve the smooth lifting or lowering of the bearing positioning plate 23. Simultaneously, the vertical guide rails 221 and vertical sliders 222 at the four corners provide stable support, preventing the bearing positioning plate 23 from tilting or swaying during height adjustment.
[0042] For further details, please refer to Figure 6 and Figure 7 The upper side of the support positioning plate 23 is provided with several adsorption holes, and a negative pressure chamber connected to the adsorption holes is provided inside the support positioning plate 23. The negative pressure chamber is connected to a vacuum pump through an air pipe. When the vacuum pump is started, the air in the negative pressure chamber is extracted through the air pipe to form a negative pressure environment. Due to the effect of atmospheric pressure, the adsorption holes on the support positioning plate 23 will generate an adsorption force on the PCB board, tightly adhering the PCB board to the support positioning plate 23.
[0043] Furthermore, a pressure strip 233 is detachably provided on the upper side of the bearing positioning plate 23. The lower side of the pressure strip 233 is parallel to the upper side of the bearing positioning plate 23, forming a pressure gap between the lower side of the pressure strip 233 and the upper side of the bearing positioning plate 23 for pressing the PCB board. It can be understood that a certain pressure gap is formed between the lower side of the pressure strip 233 and the upper side of the bearing positioning plate 23. The size of the pressure gap can be adjusted according to the thickness of the PCB board to ensure that the pressure strip 233 can tightly press the PCB board without causing damage. At the same time, the detachable design of the pressure strip 233 allows for quick installation or removal according to processing requirements, improving the flexibility and adaptability of the equipment. Specifically, after the PCB board is placed on the support positioning plate 23, a suitable pressure strip 233 is selected according to the size and shape of the PCB board and installed on the upper side of the support positioning plate 23. The pressure strip 233 applies additional mechanical pressure to the PCB board through the pressure gap between its lower side and the upper side of the support positioning plate 23, further fixing the PCB board so that the PCB board is flatly attached to the upper side of the support positioning plate 23.
[0044] Furthermore, the bearing positioning plate 23 is provided with a sliding groove 231, and a connecting column 232 is slidably arranged in the sliding groove 231. The pressure strip 233 is detachably connected to the connecting column 232 through a connector. Optionally, the sliding of the connecting column 232 in the slide 231 can be achieved by manual operation by the operator or by setting a transmission mechanism 4 on the bearing positioning plate 23. Specifically, taking a slide 231 and the connecting column 232 therein as an example, the transmission mechanism 4 includes a drive motor 41 installed on the bottom side of the bearing positioning plate 23 and close to one end of the slide 231, a drive wheel 42 connected to the output end of the drive motor 41, and a driven wheel 43 rotatably connected to the bottom side of the bearing positioning plate 23 and close to the other end of the slide 231. The drive wheel 42 and the driven wheel 43 are set at the same height and are connected by a synchronous belt 44. The bottom of the connecting column 232 passes through the slide 231 and is fixedly connected to the synchronous belt 44. When the drive motor 41 starts, it will drive the drive wheel 42, the driven wheel 43 and the synchronous belt 44 to rotate. The synchronous belt 44 will then drive the connecting column 232 to move linearly, so as to realize the movement of the connecting column 232 in the slide 231. Optionally, the connecting post 232 is provided with a slot, and a screw hole is provided in the slot. The pressure strip 233 is engaged in the slot on the connecting post 232 and screwed to the connecting post 232 by screws.
[0045] Furthermore, the slide 231 includes a first slide with its opening direction perpendicular to the movement direction of the PCB board positioning mechanism 2, and a second slide with its opening direction parallel to the movement direction of the PCB board positioning mechanism 2. Both the first slide and the second slide are provided with connecting posts 232.
[0046] In this embodiment, the slide groove 231 provides a linear motion track for the connecting post 232. The operator can move the connecting post 232 to a suitable position according to the size of the PCB board. After the connecting post 232 reaches the required position, the pressure strip 233 can be connected to the connecting post 232 through the connector. Through the cooperation of the slide groove 231 and the sliding connecting post 232, the position of the pressure strip 233 can be flexibly adjusted, which can adapt to PCB boards of different sizes and shapes.
[0047] For further information, please refer to [link / reference]. Figure 1 and Figure 2The laser windowing mechanism 3 includes a positioning CCD camera 31 and several lasers 32. The positioning CCD camera 31 is used to photograph and position the PCB board located at the processing station, and the lasers 32 are used to perform a preset laser windowing operation on the PCB board located at the processing station. The lasers 32 are arranged evenly in a horizontal straight line, and the arrangement direction of the lasers 32 is perpendicular to the movement direction of the PCB board positioning mechanism 2. It can be understood that the positioning CCD camera 31 acquires image information of the PCB board by taking pictures and sends it to the control system. The control system determines the precise location for windowing through image processing algorithms, and then, according to preset processing parameters, controls the lasers 32 to irradiate the designated area on the PCB board, thereby realizing the windowing operation. The arrangement of the lasers 32 ensures the consistency and efficiency of laser processing.
[0048] The above examples are merely illustrative of the technical content of this utility model to facilitate reader understanding, but do not imply that the implementation of this utility model is limited to these embodiments. Any technical extensions or re-creations made based on this utility model are protected by this utility model. The scope of protection of this utility model is defined by the claims.
Claims
1. A laser windowing device for PCB boards, characterized in that, include: A machine base, wherein the machine base is provided with a loading / unloading station and a processing station; A PCB board positioning mechanism, which reciprocates between the loading / unloading station and the processing station; A laser window opening mechanism, which is fixedly installed above the processing station; The PCB board positioning mechanism includes a horizontal moving plate, a height adjustment component, and a bearing positioning plate. The horizontal moving plate is movably connected to the upper side of the base in a horizontal direction. The bearing positioning plate is connected to the upper side of the horizontal moving plate through the height adjustment component. The height adjustment component is used to adjust the height difference between the bearing positioning plate and the horizontal moving plate. The bearing positioning plate is used to support and position the PCB board.
2. The PCB board laser windowing device according to claim 1, characterized in that, A linear motor is installed on the machine base. The stator of the linear motor is connected to the machine base, and the mover of the linear motor is connected to the horizontal moving plate. The linear motor is used to drive the horizontal moving plate to reciprocate horizontally between the loading / unloading station and the processing station.
3. The PCB board laser windowing device according to claim 1, characterized in that, The height adjustment assembly includes a vertical guide rail and a vertical slider, wherein the vertical slider is slidably connected to the vertical guide rail in the vertical direction; wherein the vertical guide rail is disposed on the upper side of the horizontal moving plate and the vertical slider is disposed on the lower side of the bearing positioning plate, or the vertical guide rail is disposed on the lower side of the bearing positioning plate and the vertical slider is disposed on the upper side of the horizontal moving plate.
4. The PCB board laser windowing device according to claim 3, characterized in that, The height adjustment assembly further includes: a drive cylinder, a first tilting slider, and a second tilting slider. The first tilting slider is slidably connected to the upper side of the horizontal moving plate, and the second tilting slider is fixedly connected to the lower side of the bearing positioning plate. The fixed end of the drive cylinder is connected to the horizontal moving plate, and the telescopic end of the drive cylinder is connected to the first tilting slider. The first tilting slider has a first tilting surface with a gradually changing height on its upper side, and the second tilting slider has a second tilting surface that corresponds to and fits against the first tilting surface on its lower side. The first tilting surface and the second tilting surface are slidably connected. The driving cylinder is used to drive the first tilting slider to move in the direction of the height change of the first tilting surface, so that the second tilting slider drives the bearing positioning plate to rise or fall.
5. A PCB board laser windowing device according to claim 4, characterized in that, The first tilting slider is located at the middle of the horizontal moving plate, the second tilting slider is located at the middle of the bearing positioning plate, and the vertical guide rail and the vertical slider are respectively located at the four corners of the horizontal moving plate and the bearing positioning plate.
6. The PCB board laser windowing device according to claim 1, characterized in that, The upper side of the bearing positioning plate is provided with a number of adsorption holes, and the bearing positioning plate is provided with a negative pressure chamber connected to the adsorption holes. The negative pressure chamber is connected to a vacuum pumping device through an air pipe.
7. The PCB board laser windowing device according to claim 1, characterized in that, A pressure strip is detachably provided on the upper side of the bearing positioning plate. The lower side of the pressure strip is parallel to the upper side of the bearing positioning plate, and a pressing gap for pressing the PCB board is formed between the lower side of the pressure strip and the upper side of the bearing positioning plate.
8. A PCB board laser windowing device according to claim 7, characterized in that, The bearing positioning plate is provided with a sliding groove, and a connecting column is slidably disposed in the sliding groove. The pressure strip is detachably connected to the connecting column through a connector.
9. A PCB board laser windowing device according to claim 8, characterized in that, The slide includes a first slide with its opening direction perpendicular to the movement direction of the PCB board positioning mechanism, and a second slide with its opening direction parallel to the movement direction of the PCB board positioning mechanism. The connecting post is provided in both the first slide and the second slide.
10. A PCB board laser windowing device according to claim 1, characterized in that, The laser windowing mechanism includes a positioning CCD camera and several lasers. The positioning CCD camera is used to take pictures and position the PCB board located at the processing station. The lasers are used to perform a preset laser windowing operation on the PCB board located at the processing station. The several lasers are evenly arranged in a horizontal straight line, and the arrangement direction of the several lasers is perpendicular to the movement direction of the PCB board positioning mechanism.