Functional board, preparation method thereof and medical detection equipment

Abstract

The invention provides a functional board, a preparation method thereof and medical detection equipment, the functional board comprises a base body, the base body comprises a glass substrate and a dielectric layer, and the dielectric layer is arranged on one side surface of the glass substrate; the electrode layer is arranged on at least one side surface of the substrate; the solder mask layer is arranged on the surface of the substrate and exposes the electrode layer; the dielectric layer is used for setting a circuit structure. The high flatness of the glass substrate provides a stable adhesion basis for the electrode layer, and the stability of the electrode structure and the detection accuracy are ensured. And the dielectric layer is located between the glass substrate and the solder mask layer, so that frequent contact between the circuit structure and a detection solution in the detection process is avoided, and the effectiveness of the circuit structure is ensured.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of medical detection, and in particular, the present application relates to a functional plate, a preparation method thereof and a medical detection device. BACKGROUND

[0002] In the field of medical detection, electrode detection is a key means to realize many detection functions, and its performance is crucial. The functional plate on which the electrodes are arranged is the basic carrier of electrode detection, and its reliability directly affects the accuracy of the detection results.

[0003] In the related art, FR4 circuit boards are generally used as functional plates on which electrodes are arranged, and heating or temperature measurement circuit structures are arranged on the functional plates. However, the FR4 circuit boards are prone to warping and deformation, which affects the stability of the electrode structure and the accuracy of the detection. Moreover, the heating or temperature measurement circuit structures need to be frequently contacted with the detection solution during the detection process, which increases the risk of failure of the heating or temperature measurement circuit structures. SUMMARY

[0004] An object of embodiments of the present application is to provide a new technical solution of a functional plate, a preparation method thereof and a medical detection device.

[0005] According to a first aspect of embodiments of the present application, a functional plate for a medical detection device is provided, comprising:

[0006] a base body, the base body comprising a glass substrate and a dielectric layer, the dielectric layer being arranged on one side surface of the glass substrate;

[0007] an electrode layer, the electrode layer being arranged on at least one side surface of the base body;

[0008] a solder resist layer, the solder resist layer being arranged on the surface of the base body and exposing the electrode layer;

[0009] the dielectric layer is used to arrange a circuit structure.

[0010] Optionally, a temperature measurement element is further included, and the temperature measurement element is embedded in the glass substrate.

[0011] the circuit structure comprises an electrical connector, the electrical connector is arranged through the dielectric layer, one end of the electrical connector is connected with the temperature measurement element, and the other end of the electrical connector is exposed from the dielectric layer.

[0012] Optionally, the circuit structure comprises a heating layer, and the heating layer is arranged between the glass substrate and the dielectric layer.

[0013] Optionally, at least part of the heating layer is opposite to the electrode layer in the thickness direction of the functional plate.

[0014] Optionally, the resistivity of the heating layer is greater than or equal to 5*10 -8 Ω·m.

[0015] Optionally, a temperature measuring element is embedded in the glass substrate, and a top of the temperature measuring element is arranged at the same height as a bottom of the heating layer.

[0016] In a plane of the functional board, a distance between the heating layer and the temperature measuring element is 300-500 μm.

[0017] Optionally, the solder resist layer has a first opening window area and a second opening window area, the first opening window area is used to expose the liquid path through hole structure, and the second opening window area is used to expose the electrode layer.

[0018] Optionally, the second opening window area forms an inverted trapezoidal opening for the detection solution to flow through.

[0019] Optionally, a side wall of the inverted trapezoidal opening is stepped; or,

[0020] The side wall of the inverted trapezoidal opening is planar.

[0021] Optionally, the liquid path through hole structure includes a first liquid path through hole and a second liquid path through hole, and the first liquid path through hole and the second liquid path through hole both penetrate through the glass substrate and are arranged at intervals.

[0022] Optionally, the thickness of the glass substrate is 0.1-5.0 mm, and the flatness of the glass substrate is 0.01-0.50 mm / m.

[0023] Optionally, the electrode layer includes a first electrode layer, a copper circuit layer and an isolation layer are sequentially arranged on the glass substrate, and the first electrode layer is arranged on a side of the isolation layer away from the copper circuit layer and covers the isolation layer.

[0024] Optionally, the first electrode layer is a gold plating layer or a silver plating layer, and the thickness of the first electrode layer is 0.5-2 μm.

[0025] Optionally, the electrode layer includes a second electrode layer, and the second electrode layer is arranged on a side of the first electrode layer away from the isolation layer and covers the first electrode layer.

[0026] Optionally, the second electrode layer is a platinum plating layer or a palladium plating layer, and the thickness of the second electrode layer is 0.05-0.5 μm.

[0027] According to a second aspect of the embodiment of the present application, a preparation method of a functional board is provided, including:

[0028] Forming a through liquid path via structure on a glass substrate, the liquid path via structure comprising a first liquid path via and a second liquid path via spaced apart from each other;

[0029] Providing an electrode layer on at least one side surface of the glass substrate;

[0030] Providing a dielectric layer on one side surface of the glass substrate, and providing a circuit structure in the dielectric layer;

[0031] Covering a solder resist layer on the surface of the glass substrate, and exposing the first liquid path via, the second liquid path via and the electrode layer.

[0032] Optionally, after forming the through liquid path via structure on the glass substrate, further comprising:

[0033] Providing a groove on the glass substrate, and embedding a temperature measuring element in the groove.

[0034] Optionally, after forming the through liquid path via structure on the glass substrate, further comprising:

[0035] Sputtering a heating layer on the glass substrate.

[0036] According to a third aspect of the embodiments of the present application, an electronic device is provided, comprising the functional board of the first aspect.

[0037] One technical effect of the present application is that:

[0038] The embodiments of the present application provide a functional board, which comprises a base body, the base body comprising a glass substrate and a dielectric layer, the dielectric layer being provided on one side surface of the glass substrate; an electrode layer, the electrode layer being provided on at least one side surface of the base body; a solder resist layer, the solder resist layer being provided on the surface of the base body and exposing the electrode layer; and the dielectric layer being used for providing a circuit structure. The high flatness of the glass substrate provides a stable adhesion basis for the electrode layer, and ensures the stability of the electrode structure and the accuracy of detection. The dielectric layer is located between the glass substrate and the solder resist layer, avoiding the frequent contact of the circuit structure with a detection solution during detection, and ensuring the effectiveness of the circuit structure.

[0039] Other features and advantages of the present application will become apparent from the following detailed description of exemplary embodiments thereof, taken in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0040] The accompanying drawings incorporated in and forming a part of the specification, illustrate embodiments of the present application and, together with the description, serve to explain the principles of the present application.

[0041] Figure 1 A cross-sectional view of a functional board provided for one embodiment of the present application;

[0042] Figure 2 Provided in an embodiment of the present application is Figure 1 locally magnified Figure 1 ;

[0043] Figure 3 Provided in an embodiment of the present application is Figure 1 locally magnified Figure 2 ;

[0044] Figure 4 A flow chart of a method for preparing a functional board is provided in an embodiment of the present application.

[0045] Among them:

[0046] 100, base body; 1, glass substrate; 2, copper circuit layer; 3, isolation layer; 4, electrode layer; 41, first electrode layer; 42, second electrode layer; 5, solder resist layer; 51, inverted trapezoidal opening; 6, liquid path through hole structure; 61, first liquid path through hole; 62, second liquid path through hole; 7, dielectric layer; 8, circuit structure; 81, electrical connecting member; 82, heating layer; 9, temperature measuring element. DETAILED DESCRIPTION

[0047] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of the components and steps set forth in these embodiments, numerical expressions, and numerical values are not limiting to the scope of the present application unless specifically stated otherwise.

[0048] The embodiments of the present application will be described in detail below, examples of which are shown in the accompanying drawings. The embodiments described below by reference to the accompanying drawings are exemplary and are for the purpose of explanation only and are not to be understood as limiting the present application. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making creative efforts fall within the scope of the present application.

[0049] The terms "first", "second" in the specification and claims of the present application can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise specified. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / ", generally means that the front and rear associated objects are in an "or" relationship.

[0050] In the description of the present application, it needs to be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0051] In the description of the present application, it needs to be understood that the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0052] It should be noted that: similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0053] Referring to Figure 1 The embodiment of the present application provides a functional plate for medical detection equipment, which comprises:

[0054] A base body 100, the base body 100 comprises a glass substrate 1 and a dielectric layer 7, the dielectric layer 7 is arranged on one side surface of the glass substrate 1;

[0055] An electrode layer 4, the electrode layer 4 is arranged on at least one side surface of the base body 100;

[0056] A solder resist layer 5, the solder resist layer 5 is arranged on the surface of the base body 100 and exposes the electrode layer 4;

[0057] The dielectric layer 7 is used for arranging a circuit structure 8.

[0058] In the above embodiment, the high flatness of the glass substrate 1 provides a good adhesion basis for the electrode layer 4, so that the electrode layer 4 can be uniformly and flatly arranged on the surface of the base body 100, the volume of the calibration liquid on the surface of the electrode layer 4 is accurate, and the stability of the electrode structure and the accuracy of the detection are ensured.

[0059] In the medical detection process, the functional board will frequently contact the detection solution. The high density and non-water absorption characteristics of the glass substrate 1 can effectively prevent the detection solution from penetrating into the substrate 100, avoid the performance change of the substrate 100 caused by the penetration of the solution, and ensure the reliability of the entire functional board soaked in the detection solution.

[0060] Referring to Figure 1 In the functional board, good insulation performance is crucial to ensure the normal operation of the circuit. The dielectric layer 7 can be an insulating inner layer medium such as ABF resin or rubber. The good insulation performance of the dielectric layer 7 can effectively isolate different circuit structures 8 and prevent electrical faults such as short circuit between circuits, ensuring that the heating or temperature measuring circuit structure 8 can work stably and accurately, improving the electrical safety of the functional board, allowing the functional board to realize more functions in a smaller size, and improving the integration of the functional board. The solder resist layer 5 can be a surface ink layer, which can prevent water and soldering. During the manufacturing and use of the functional board, the solder resist layer 5 can prevent soldering materials such as solder from splashing onto areas that do not need to be soldered, protecting the circuits and components in the non-soldering area. At the same time, when the functional board is in contact with the detection solution, the solder resist layer 5 can prevent the detection solution from eroding the non-electrode area, preventing short circuit of the circuit or damage to the functional board caused by solution erosion.

[0061] Moreover, the dielectric layer 7 is located between the glass substrate 1 and the solder resist layer 5, and the heating or temperature measuring circuit structure 8 is arranged on the dielectric layer 7, avoiding the frequent contact of the circuit structure 8 with the detection solution during the detection process, effectively reducing the risk of corrosion, short circuit and other failures of the circuit structure 8 caused by contact with the detection solution, and ensuring the long-term effectiveness of the circuit structure 8.

[0062] Referring to Figure 1 The electrode layer 4 is arranged on the surface of the substrate 100, which is convenient for contact with the detection solution, so as to realize the electrochemical reaction between the electrode layer 4 and the detection solution, and then obtain the signal required for detection, ensuring the sensitivity and accuracy of the detection. For example, the electrode layer 4 can be a platinum electrode with biological recognition enzyme or antibody and can generate a measurable current / potential signal, or the electrode layer 4 can be a gold electrode with a reference potential for calibration, so as to detect various parameter indicators in blood analysis. The detected physicochemical parameters can provide timely medical auxiliary guidance for clinical treatment.

[0063] The functional board provided by the embodiment of the present application comprises a base body 100, the base body 100 comprises a glass substrate 1 and a dielectric layer 7, the dielectric layer 7 is arranged on one side surface of the glass substrate 1; an electrode layer 4, the electrode layer 4 is arranged on at least one side surface of the base body 100; a solder resist layer 5, the solder resist layer 5 is arranged on the surface of the base body 100 and exposes the electrode layer 4; the dielectric layer 7 is used for arranging a circuit structure 8. The high flatness of the glass substrate 1 provides a stable adhesion basis for the electrode layer 4, and ensures the stability of the electrode structure and the accuracy of detection. The dielectric layer 7 is located between the glass substrate 1 and the solder resist layer 5, which avoids the frequent contact of the circuit structure 8 with the detection solution in the detection process, and ensures the effectiveness of the circuit structure 8.

[0064] In some embodiments, referring to Figure 1 , the functional board further comprises a temperature measuring element 9, the temperature measuring element 9 is embedded in the glass substrate 1;

[0065] The circuit structure comprises an electrical connector 81, the electrical connector 81 is arranged through the dielectric layer 7, and one end of the electrical connector 81 is connected with the temperature measuring element 9, and the other end of the electrical connector 81 is exposed from the dielectric layer 7.

[0066] In the above embodiment, the temperature measuring element 9 can be a temperature sensor such as an electric couple, a resistance temperature detector (RTD), a thermistor, an infrared temperature sensor or an integrated temperature chip, and the temperature measuring element 9 is embedded in the glass substrate 1. Since the glass substrate 1 is closely connected with the overall structure of the functional board, on the one hand, the temperature measuring element 9 can more accurately measure the temperature of the environment where the functional board is located; on the other hand, the glass substrate 1 protects the temperature measuring element 9, can detect the direct contact corrosion of the temperature measuring element 9 by the detection solution, ensures that the temperature measuring element 9 works in a relatively stable environment, and improves the accuracy of temperature measurement.

[0067] Referring to Figure 1 , the electrical connector 81 can be a copper column arranged through the dielectric layer 7, or the electrical connector 81 is a copper plating layer on the inner wall of a through hole in the dielectric layer 7; by arranging the electrical connector 81 through the dielectric layer 7 and connecting the electrical connector 81 with the temperature measuring element 9 and the exposed part of the dielectric layer 7 respectively, the temperature signal collected by the temperature measuring element 9 can be transmitted to the control circuit or other processing unit of the functional board through the electrical connector 81, so as to realize the collection, processing and analysis of the temperature data, and ensure that the temperature measuring element 9 can effectively transmit the temperature information to the subsequent circuit system. The dielectric layer 7 has good insulation performance, and the electrical connector 81 is arranged through the dielectric layer 7, which can avoid short circuit or signal interference between the electrical connector 81 and other circuit structures 8.

[0068] In some embodiments, referring to Figure 1 , the circuit structure comprises a heating layer 82, the heating layer 82 is arranged between the glass substrate 1 and the dielectric layer 7.

[0069] In the medical detection device, the detection process may need to be carried out under certain temperature conditions, and the heating layer 82 can meet these temperature requirements by heating to ensure that the detection process is carried out in a suitable temperature environment, thereby ensuring the accuracy and reliability of the detection results. The heating amount of the heating layer 82 can be changed by controlling parameters such as the current size or energization time of the heating layer 82, and the temperature of the functional plate and its surrounding environment can be adjusted.

[0070] In the above embodiments, the heating layer 82 can be arranged on the side of the glass substrate 1 close to the medium layer 7, or the heating layer 82 can be arranged on the side of the medium layer 7 close to the glass substrate 1, so that the heating layer 82 is embedded between the glass substrate 1 and the medium layer 7. The glass substrate 1 and the medium layer 7 protect the heating layer 82. On the one hand, the glass substrate 1 has high flatness and density, which can provide a stable support platform for the heating layer 82 to prevent the heating layer 82 from being damaged by direct action of external mechanical force; on the other hand, the medium layer 7 has good insulation performance, which can avoid short circuit and other electrical faults between the heating layer 82 and other circuit structures 8, and also can prevent the erosion of the heating layer 82 by external detection solution, prolong the service life of the heating layer 82, make the functional plate work in a relatively stable temperature condition, and improve the stability and repeatability of the detection.

[0071] In some embodiments, referring to Figure 1 In the thickness direction of the functional plate, that is, in the up-down direction of Figure 1 At least part of the heating layer 82 is opposite to the electrode layer 4.

[0072] In the above embodiments, the electrode layer 4 participates in the detection reaction, and these reactions are sensitive to temperature. At least part of the heating layer 82 is arranged opposite to the electrode layer 4, which can improve the heating efficiency of the heating layer 82 on the region where the electrode layer 4 is located, so that the temperature of the electrode layer 4 and the region near it quickly and accurately reaches the required value for detection. This local and accurate temperature control method avoids the energy waste caused by large-area heating of the entire functional plate, and improves the efficiency of temperature control. Moreover, the heating layer 82 is opposite to the electrode layer 4 in the thickness direction of the functional plate, which fully utilizes the vertical space inside the functional plate, and does not need to increase the planar size of the functional plate to arrange the heating layer 82, which is beneficial to the miniaturization and integration of the medical detection device, and makes the device more portable and easy to use.

[0073] In the above embodiments, the heating layer 82 is controlled in linkage with the temperature measuring element 9. The temperature information detected by the temperature measuring element 9 is transmitted to the control device, and the control device adjusts the heating power of the heating layer 82 to control the heating amount of the heating layer, so as to control the temperature environment of the electrode layer 4 within the set range.

[0074] In some embodiments, the resistivity of the heating layer 82 is greater than or equal to 5*10- 8 Ω·m.

[0075] In the above embodiments, the area where the electrode layer 4 is located is directly below or above the sputtered high-resistance metal, such as nickel or titanium, to form a heating layer 82 of the resistance wire structure; the heating layer 82 with high resistivity has high heating efficiency, and the heating layer 82 only needs a small area of winding to ensure the heating performance, which ensures that the heating performance of the heating layer 82 remains stable for a long time, reduces the temperature control error caused by the performance change of the heating layer 82, and improves the reliability and service life of the functional plate in the medical detection equipment.

[0076] In some embodiments, referring to Figure 1 , the functional plate further comprises a temperature measuring element 9, and the temperature measuring element 9 is embedded in the glass substrate 1, and the top of the temperature measuring element 9 is arranged at the same height as the bottom of the heating layer 82.

[0077] In the plane of the functional plate, the distance between the heating layer 82 and the temperature measuring element 9 is 300-500 μm, for example, the distance between the heating layer 82 and the temperature measuring element 9 is 330 μm, 360 μm, 400 μm or 450 μm.

[0078] In the above embodiments, the temperature measuring element 9 is embedded in the glass substrate 1, which tightly combines the temperature measuring element 9 with the glass substrate 1, and can accurately perceive the temperature change of the glass substrate 1 and its surrounding area. The top of the temperature measuring element 9 is arranged at the same height as the bottom of the heating layer 82, which means that the temperature measuring element 9 and the heating layer 82 are located at similar positions, which can shorten the distance between the heating layer 82 and the temperature measuring element 9, and thus more accurately reflect the actual working temperature of the heating layer 82, providing accurate data support for temperature control.

[0079] If the distance between the heating layer 82 and the temperature measuring element 9 is too close, the heat generated by the heating layer 82 may directly interfere with the temperature measuring element 9, resulting in an overestimated temperature measured by the temperature measuring element 9, which cannot accurately reflect the actual environmental temperature. If the distance between the heating layer 82 and the temperature measuring element 9 is too far, the temperature measuring element 9 may not be able to timely and accurately perceive the temperature change near the heating layer 82, resulting in a lag in temperature measurement. The distance of 300-500 μm can reduce the direct heat influence of the heating layer 82 on the temperature measuring element 9, while ensuring that the temperature measuring element 9 can timely and accurately measure the temperature change in the area near the heating layer 82.

[0080] In some embodiments, referring to Figure 1 , the solder resist layer 5 has a first opening window area and a second opening window area, the first opening window area is used to expose the liquid path through hole structure 6, and the second opening window area is used to expose the electrode layer 4.

[0081] In the above embodiments, the first and second windowing regions can be openings etched on the solder resist layer 5. The first windowing region is opposite to the liquid path through-hole structure 6, ensuring that the liquid path through-hole structure 6 is not covered by the solder resist layer 5, so that the solution can smoothly pass through the through-hole of the liquid path through-hole structure 6, improving the smoothness of the detection solution flowing on the functional board. Referring to Figure 1 , the second windowing region ensures that the electrode layer 4 can be directly in contact with the detection solution, thereby realizing the electrochemical detection function.

[0082] The solder resist layer 5 provided by the embodiments of the present application ensures the smooth flow of the detection solution and the effective contact between the electrode layer 4 and the detection solution through the design and cooperation of the first and second windowing regions, thereby realizing accurate and rapid electrochemical detection.

[0083] In some embodiments, referring to Figure 1 , the second windowing region forms an inverted trapezoidal opening 51 for the detection solution to flow through.

[0084] In the above embodiments, since the second windowing region is used to expose the electrode layer 4, the upper wide and lower narrow structure of the inverted trapezoidal opening 51 can more smoothly receive the detection solution when the detection solution flows in, reducing the resistance of the solution flow and making it easier for the solution to enter the opening region. As the detection solution flows into the opening, the opening gradually narrows, which can converge the solution to some extent and guide the solution to flow in a predetermined direction, ensuring that the detection solution can accurately reach the reaction area where the electrode layer 4 is located, effectively controlling the volume of the detection solution and the flatness of the surface of the electrode layer 4, and improving the accuracy and detection precision of the detection. Moreover, the slope design of the inverted trapezoidal opening 51 helps to reduce the residue of the detection solution at the edge of the opening, avoiding the accumulation of the solution at the edge, thereby reducing the interference on the subsequent detection and ensuring the reliability of the detection result.

[0085] At the same time, the inverted trapezoidal opening 51 can increase the contact area between the detection solution and the electrode layer 4 while ensuring the full exposure of the electrode layer 4, which is conducive to improving the rate and efficiency of the electrochemical reaction and enhancing the strength of the detection signal, thereby improving the sensitivity of the detection. Moreover, due to the symmetry of the inverted trapezoidal opening 51, the detection solution can be relatively uniformly distributed on the surface of the electrode layer 4 after flowing into the opening, avoiding uneven distribution of the solution on the electrode surface, reducing the detection error caused by local reaction differences, and improving the accuracy and repeatability of the detection result.

[0086] In some embodiments, referring to Figure 1 , the side wall of the inverted trapezoidal opening 51 is stepped; or,

[0087] The side wall of the inverted trapezoidal opening 51 is planar.

[0088] In the above embodiments, the stepped sidewall of the inverted trapezoidal opening 51 can play a certain buffering and guiding role for the flow of the detection solution. When the detection solution flows into the inverted trapezoidal opening 51, the stepped structure can change the flow speed and direction of the solution, so that the solution can be more uniformly distributed on the surface of the electrode layer 4, avoiding the situation that the local flow speed is too fast or too slow, improving the uniformity of the contact between the detection solution and the electrode layer 4, and further improving the accuracy and stability of the detection.

[0089] The planar sidewall of the inverted trapezoidal opening 51 is relatively simple to process and can be easily realized by using conventional mechanical processing, laser cutting, chemical etching and other processes. It can reduce the processing difficulty and cost, improve the production efficiency, and is suitable for large-scale production. Moreover, the planar sidewall of the inverted trapezoidal opening 51 reduces the residue of the detection solution on the sidewall, reduces the pollution risk of the residue to the subsequent detection, and ensures the accuracy of the detection result.

[0090] In some embodiments, referring to Figure 1 , the functional board further comprises a liquid path through-hole structure 6, and the liquid path through-hole structure 6 comprises a first liquid path through-hole 61 and a second liquid path through-hole 62, both of which penetrate through the glass substrate 1 and are arranged at intervals.

[0091] In the above embodiments, the glass substrate 1 is used as the basic material of the functional board, and compared with the traditional FR4 circuit board, the glass substrate 1 has better chemical stability and corrosion resistance. The glass substrate 1 made of glass material is not easy to react with the detection solution, thereby avoiding the erosion of the solution to the substrate material, ensuring the stability and reliability of the functional board in the long-term use process.

[0092] In addition, the glass substrate 1 also has good insulation performance and is not easy to absorb moisture, avoiding the decline of circuit performance and abnormal measurement results caused by moisture absorption. The through-hole processing on the glass substrate 1 ensures the long-term reliability of the liquid path through-hole structure 6 in the detection process.

[0093] Referring to Figure 2 , the electrode layer 4 is arranged on the surface of the glass substrate 1, which can form a stable electrochemical interface for detecting specific components or parameters in the solution. For example, the electrode layer 4 forms a platinum electrode with biological recognition enzyme or antibody and generates a measurable current / potential signal, or the electrode layer 4 forms a gold electrode with a reference potential for calibration. By matching the working electrode of the platinum electrode with the reference electrode of the gold electrode, the characteristic values of various physicochemical parameters of the solution can be obtained when the electrode contacts the detection solution. The glass substrate 1 provides a stable support platform for the electrode layer 4, ensuring the uniformity and structural stability of the electrode layer 4, thereby improving the accuracy and repeatability of the detection.

[0094] Referring to Figure 1When the functional board detects the detection solution, the detection solution flows in from the first liquid path through hole 61, and then flows out from the second liquid path through hole 62 after contacting the electrode layer 4 on the surface of the glass substrate 1. When the detection solution flows through the electrode layer 4, the electrode layer 4 detects the characteristic values of the physicochemical parameters of the detection solution. The stable structure of the glass substrate 1 can effectively ensure the purity of the detection solution.

[0095] The liquid path through hole structure 6 on the functional board provided by the embodiments of the present application does not need to be subjected to metalization treatment compared with the conventional metalized liquid path through hole, so that the problems of solution pollution by metal ions and corrosion of the metalized treatment layer are avoided. At the same time, due to the moisture resistance and chemical stability of the glass substrate 1, the liquid path through hole structure 6 can maintain reliable sealing and flowability in a multiple solution immersion environment, ensuring the reusability and long-term stability of the functional board and improving the accuracy and reliability of detection.

[0096] In actual detection, after the functional board completes single test on the detection solution, the cleaning solution is replaced to pass through the liquid path through hole structure 6 to realize cleaning of the liquid path through hole structure 6, so as to ensure the multiple use of the functional board.

[0097] In some embodiments, the thickness of the glass substrate 1 is 0.1-5.0 mm, and the flatness of the glass substrate 1 is 0.01-0.50 mm / m. The flatness of the glass substrate 1 is the height difference per meter length.

[0098] In the above embodiments, the thickness of the glass substrate 1 is set to 0.1-5.0 mm, for example, the thickness of the glass substrate 1 is selected to be 0.8 mm, 1.5 mm, 2.0 mm or 2.5 mm, which can provide sufficient mechanical strength for the functional board. During the manufacturing, transportation and use of the medical detection equipment, the glass substrate 1 can withstand these external forces without being easily broken or damaged, thereby protecting the integrity of the copper circuit layer, the isolation layer and the electrode layer 4 and other structures thereon.

[0099] Moreover, the glass substrate 1 has good electrical insulation, which can avoid the corrosion of the solution to the metal layer in the functional board, reduce the leakage and interference between different circuit layers in the glass substrate 1, and improve the electrical performance and stability of the functional board.

[0100] In the medical detection device, the copper circuit layer and the electrode layer 4 on the functional board need to accurately transmit and process electrical signals. If the flatness of the glass substrate 1 is poor, it will cause the circuit layer to appear undulations, bending and other phenomena, increase the resistance and inductance of the circuit, and thus produce signal interference and attenuation. The flatness of the glass substrate 1 provided by the embodiments of the present application is in the range of 0.01-0.50mm / m, for example, the flatness of the glass substrate 1 is set to be in the range of 0.05mm / m, 0.1mm / m, 0.2mm / m, 0.3mm / m or 0.4mm / m, which can ensure the accurate transmission and processing of electrical signals in the functional board, and improve the sensitivity and accuracy of detection.

[0101] Moreover, when the functional board detects the solution to be tested, the flatness of the glass substrate 1 will also affect the surface flatness of the electrode layer 4, and thus affect the contact area and contact quality of the electrode and the solution. The glass substrate 1 with good flatness can make the surface of the electrode layer 4 more uniform, ensure the full contact of the electrode and the solution, improve the efficiency and stability of the electrochemical reaction, and thus improve the reliability of the detection result.

[0102] In some embodiments, the glass transition temperature (Tg) of the glass substrate 1 is 520-730℃, for example, the glass transition temperature of the glass substrate 1 is set to be 550℃, 580℃, 610℃, 630℃ or 650℃; the coefficient of thermal expansion (CTE) of the glass substrate 1 is 3.0-7.0ppm / ℃, for example, the coefficient of thermal expansion of the glass substrate 1 is set to be 3.1ppm / ℃, 4.2ppm / ℃, 5.4ppm / ℃ or 6.5ppm / ℃.

[0103] In a specific embodiment, the glass substrate 1 is Schott glass BF33, the glass transition temperature of Schott glass BF33 is 525℃, and the coefficient of thermal expansion is 3.25ppm / ℃; in another specific embodiment, the glass substrate 1 is Corning glass EAGLE XG, the glass transition temperature of Corning glass EAGLE XG is 669℃, and the coefficient of thermal expansion is 3.17ppm / ℃; in yet another specific embodiment, the glass substrate 1 is Schott glass AF32, the glass transition temperature of Schott glass AF32 is 717℃, and the coefficient of thermal expansion is 3.2ppm / ℃; in still another specific embodiment, the glass substrate 1 is Japanese AGC glass, the glass transition temperature of Japanese AGC glass is 725℃, and the coefficient of thermal expansion is 6.8ppm / ℃.

[0104] In the manufacturing process of the functional board of the medical detection device, some high-temperature processes may be involved. The glass substrate 1 with a glass transition temperature in the range of 520-730℃ can maintain the stability of its physical and chemical properties under high-temperature conditions, thereby ensuring the smooth progress of the functional board manufacturing process and the stability of product quality.

[0105] When the glass substrate 1 is subjected to rapid temperature changes, if its glass transition temperature is low, it is easy to produce large thermal stress, leading to the substrate cracking or damage. The glass transition temperature of 520-730℃ enables the glass substrate 1 to better maintain its structural integrity under thermal shock, reducing the generation and accumulation of thermal stress, and improving the thermal shock resistance of the device.

[0106] In some embodiments, referring to Figure 2 and Figure 1 , the electrode layer 4 comprises a first electrode layer 41, which is arranged on the side of the isolation layer 3 away from the copper circuit layer 2 and covers the isolation layer 3.

[0107] In the above embodiments, the barrier between the first electrode layer 41 and the copper circuit layer 2 through the isolation layer 3 avoids the direct contact of the copper circuit layer 2 with the test solution, thereby preventing the electrochemical corrosion or short circuit phenomenon of the copper circuit layer 2. Not only protects the integrity of the copper circuit layer 2, but also ensures the stability and accuracy of the electrical signal transmission on the first electrode layer 41. At the same time, arranging the first electrode layer 41 on the outside of the isolation layer 3 also facilitates the full contact of the first electrode layer 41 with the test solution, improving the sensitivity and response speed of the detection.

[0108] Moreover, the complete coverage of the first electrode layer 41 on the isolation layer 3 ensures the integrity of the functional board surface, enhances the bonding force between the first electrode layer 41 and the isolation layer 3, and improves the overall mechanical strength and durability of the functional board.

[0109] In some embodiments, the first electrode layer 41 is a gold-plated layer or a silver-plated layer, and the thickness of the first electrode layer 41 is 0.5-2μm.

[0110] In the above embodiments, when the first electrode layer 41 is a gold-plated layer, the gold-plated layer can form a gold electrode, which has good stability and can form a stable interface, such as a self-assembled monolayer or an oxide layer, to ensure the rapid and accurate transmission of electrical signals between the electrode and the test solution, reduce signal loss and delay, and help improve the accuracy and reliability of the detection results.

[0111] When the first electrode layer 41 is a silver-plated layer, the silver-plated layer forms a silver electrode, which can provide an efficient electrical signal transmission channel to ensure accurate acquisition and transmission of detection signals, helping to improve the sensitivity and response speed of the medical detection device. Moreover, the price of silver is relatively low compared to the price of gold-plated layer, and under the premise of meeting the detection performance requirements, the manufacturing cost of the functional board can be reduced, while still ensuring that the electrode has good electrical conductivity and certain chemical stability.

[0112] The thickness of the first electrode layer 41 is 0.5-2 μm, for example, the thickness of the first electrode layer 41 is 0.7 μm, 1.2 μm or 1.5 μm. In this thickness range, the gold plating layer or silver plating layer can form a continuous and uniform conductive film, ensuring that the electrode has good electrical conductivity. If the thickness is too thin, it may cause the conductive film to be discontinuous, resulting in local resistance increase, unstable signal transmission and other problems; while the thickness is too thick, it will increase the material cost and manufacturing difficulty, and may affect the contact effect between the electrode and the to-be-measured solution.

[0113] Moreover, the thickness of 0.5-2 μm can ensure the adhesion between the first electrode layer 41 and the isolation layer 3, so that the first electrode layer 41 is firmly attached to the functional board. At the same time, the first electrode layer 41 also has a certain mechanical strength, which can withstand a certain external force and friction, ensuring the stability and reliability of the electrode in the long-term use process.

[0114] In some embodiments, referring to Figure 3 and Figure 3 , the electrode layer 4 includes a second electrode layer 42, which is arranged on the side of the first electrode layer 41 away from the isolation layer 3 and covers the first electrode layer 41.

[0115] In the above embodiments, the introduction of the second electrode layer 42 can work synergistically with the first electrode layer 41 to optimize the electrochemical performance of the electrode. For example, different metals or material combinations make the second electrode layer 42 have specific electrocatalytic activity, which can promote specific electrochemical reactions and improve the detection sensitivity and selectivity of the electrode to target substances.

[0116] Arranging the second electrode layer 42 on the outside of the first electrode layer 41 can provide a physical barrier for the first electrode layer 41 through the second electrode layer 42, maintaining the integrity and performance of the first electrode layer 41; on the other hand, the first electrode layer 41 can separate the second electrode layer 42 and the copper circuit layer 2, avoiding migration and diffusion of the copper circuit layer 2.

[0117] Referring to Figure 2 , the second electrode layer 42 completely covers the first electrode layer 41, which can ensure that the electrochemical properties of the electrode surface are uniform. In the electrochemical detection process, it avoids signal interference or deviation on the surface of the second electrode layer 42, ensuring the accuracy of the detection results.

[0118] In some embodiments, the second electrode layer 42 is a platinum plating layer or a palladium plating layer, and the thickness of the second electrode layer 42 is 0.05-0.5 μm, for example, the thickness of the second electrode layer 42 is set to 0.1 μm, 0.2 μm, 0.3 μm or 0.4 μm.

[0119] In the above embodiments, when the second electrode layer 42 is a platinum plating layer, in the electrochemical reaction involved in medical detection, platinum can promote the electrochemical reaction of the target analyte, and the platinum electrode with the platinum plating layer formed on the surface of the glass substrate 1 can effectively identify the surface enzyme and antibody, etc., to generate a measurable signal current or potential; and since platinum has stable chemical properties and is resistant to corrosion in biological or harsh environments, the platinum electrode can well detect special parameters in the solution, making the electrode more sensitive to the detection of target substances, enabling the detection of biomarkers at a lower concentration, improving the detection lower limit of the medical detection equipment, and helping the early detection and diagnosis of diseases.

[0120] When the second electrode layer 42 is a palladium plating layer, palladium also has certain electrocatalytic activity, which can promote the oxidation-reduction reaction when detecting certain biological molecules or small molecule substances, improve the selectivity and sensitivity of the electrode, and enable the medical detection equipment to more accurately identify and detect target substances, reducing the influence of interference factors.

[0121] The thickness of the second electrode layer 42 is in the range of 0.05-0.5 μm, and the platinum plating layer or palladium plating layer can form sufficient active sites to play its electrocatalytic role. If the thickness of the second electrode layer 42 is too thin, such as less than 0.05 μm, it will cause the uniformity of the second electrode layer 42 to decrease, which cannot provide sufficient active sites, resulting in insufficient electrocatalytic performance, affecting the detection sensitivity and response speed of the electrode; if the thickness of the second electrode layer 42 is too thick, such as greater than 0.5 μm, it will increase the material cost and manufacturing difficulty, and at the same time, it may affect the contact effect between the electrode and the to-be-detected solution.

[0122] Moreover, the thickness of 0.05-0.5 μm can ensure the adhesion between the second electrode layer 42 and the first electrode layer 41, so that the second electrode layer 42 is firmly attached to the functional plate and is not easy to fall off, ensuring the stability and reliability of the electrode in the long-term use process. If the second electrode layer 42 is too thick, it may cause the second electrode layer 42 to crack or peel off due to excessive internal stress.

[0123] After the electrode pads on all the copper circuit layers 2 are covered by the isolation layer 3, the first electrode layer 41 can be uniformly processed on all the isolation layers 3, and the second electrode layer 42 can be selectively plated on the first electrode layer 41 to form a working electrode for detection. The first electrode layer 41 not covered by the second electrode layer 42 can serve as a reference electrode to provide a stable reference potential for calibrating the potential of the working electrode and ensuring the accuracy of the signal.

[0124] In some embodiments, referring to Figure 3 and Figure 1 the functional plate comprises:

[0125] A copper circuit layer 2 is disposed on at least one side surface of the glass substrate 1.

[0126] A separation layer 3 is disposed on the glass substrate 1 and covers the copper circuit layer 2. The electrode layer 4 is disposed on a side of the separation layer 3 away from the copper circuit layer 2 and covers the separation layer 3.

[0127] In the above embodiment, the glass substrate 1 serves as a support structure of the functional board, and is made of glass. The glass has high flatness, which ensures the consistency of the solution volume contacted by the electrodes on the surface of the functional board, thereby ensuring the accuracy of the electrode test. Therefore, the high flatness of the glass substrate 1 helps to improve the accuracy and reliability of the medical detection equipment.

[0128] Referring to Figure 1 , the copper circuit layer 2 is disposed on at least one side surface of the glass substrate 1, and serves as an outer circuit layer of the functional board. The copper circuit layer 2 is a key part for realizing the transmission of electrical signals in the functional board. The copper circuit layer 2 can ensure the rapid and stable transmission of electrical signals in the functional board, thereby ensuring the normal operation of the functional board and providing reliable data support for medical detection.

[0129] However, due to the activity of the copper metal in the outer circuit, copper ions are prone to migrate to the interface of the electrode layer in the surface layer. Moreover, due to the thinness of the electrode layer, the migration and diffusion of copper ions can cause abnormalities in the electrode layer, affecting the density and uniformity of the electrode layer, and causing inaccurate electrode test data.

[0130] Referring to Figure 4 , the separation layer 3 is disposed on the glass substrate 1 and covers the copper circuit layer 2. The separation layer 3 forms a full package structure with the copper circuit layer 2, effectively isolating the copper circuit layer 2 from the external environment and preventing performance degradation or failure of the copper circuit layer 2 caused by oxidation, corrosion, etc. At the same time, the separation layer 3 also protects the copper circuit layer 2, avoiding physical damage to the copper circuit layer 2 during use or maintenance of the functional board.

[0131] The electrode layer 4 is disposed on a side of the separation layer 3 away from the copper circuit layer 2 and covers the separation layer 3. The electrode layer 4 forms a full package structure with the separation layer 3. The electrode layer 4 is the part of the functional board that directly contacts the solution to be tested. The electrode layer 4 can convert the chemical signals in the solution into electrical signals for transmission. The full package structure of the electrode layer 4 with the separation layer 3 not only protects the separation layer 3, but also ensures the effective area of the electrode, thereby improving the detection sensitivity and accuracy of the electrode in the medical detection equipment.

[0132] It is worth noting that the isolation layer 3 of the present application forms a full package structure to the copper circuit layer 2, that is, the isolation layer 3 fully covers the surface of the outermost copper circuit layer 2, such as through the whole plate soaking method to obtain the full package structure of the isolation layer 3 to the copper circuit layer 2, and the isolation layer 3 forms effective isolation copper protection; at the same time, the electrode layer 4 forms a full package structure to the isolation layer 3, and the electrode layer 4 fully covers the surface of the isolation layer 3, such as through the whole plate soaking method to obtain the full package structure of the electrode layer 4 to the isolation layer 3, and the electrode layer 4 plays a role in double protection of the copper circuit layer 2 and detection of connection.

[0133] The functional plate provided by the embodiment of the present application can be prepared by first manufacturing the inner layer architecture and circuit of the glass substrate 1, and then manufacturing the outermost copper circuit layer 2 of the glass substrate 1, and then fully packaging the outermost copper circuit layer 2 through the isolation layer 3 and the electrode layer 4, effectively blocking the migration of copper ions, achieving effective protection of the electrode, improving the reliability, sensitivity and accuracy of the electrode detection on the functional plate, and the preparation process is simple, effectively solving the failure problem of the electrode.

[0134] Referring to ​ The embodiment of the present application provides a preparation method of a functional plate, which comprises the following steps:

[0135] S101, forming a through liquid path through hole structure on the glass substrate, the liquid path through hole structure comprising a first liquid path through hole and a second liquid path through hole spaced from each other;

[0136] The through liquid path through hole structure formed on the glass substrate provides a channel for the flow of the detection solution on the functional plate. In medical detection equipment, the detection solution needs to flow through a specific path to complete various detection reactions. The design of the first liquid path through hole and the second liquid path through hole spaced from each other can form a liquid path for the solution to enter and exit the functional plate, so that the detection solution can flow inside the functional plate according to the predetermined process, realize different detection steps or carry out multiple detections at the same time, and meet the diversified detection needs.

[0137] After forming the through liquid path through hole structure on the glass substrate, the surface copper circuit of the glass substrate can be processed, and the circuit interconnection full through hole can be processed, and the full through hole copper plating treatment can be carried out, so as to connect the two side circuits of the glass substrate and form the communication of the circuit.

[0138] S102, providing an electrode layer on at least one side surface of the glass substrate;

[0139] In medical detection, many detection processes involve electrochemical reactions, such as detecting the concentration, activity, etc. of biomolecules by measuring the current, potential, etc. between electrodes. The electrode layer is arranged on the glass substrate, so that the functional board can have an electrochemical reaction with the substances in the detection solution, and convert the chemical signal into an electrical signal, so as to achieve the detection purpose.

[0140] S103, a medium layer is arranged on one side surface of the glass substrate, and a line structure is arranged in the medium layer;

[0141] The medium layer arranged on one side surface of the glass substrate can be ABF resin covering and pressing on one side surface of the glass substrate. The medium layer is arranged between the glass substrate and the line structure, which plays an electrical isolation role, can prevent short circuit between the line structure and the glass substrate or other conductive components, and ensure the normal work of the circuit. At the same time, the medium layer can also protect the line structure, prevent the erosion and damage of the detection solution to the line structure, and improve the reliability and service life of the functional board.

[0142] S104, a solder resist layer is arranged on the surface of the glass substrate, and the first liquid path through hole, the second liquid path through hole and the electrode layer are exposed.

[0143] In the above embodiment, the solder resist layer can prevent water and solder from damaging the functional board. In the manufacturing and use process of the functional board, water and solder may penetrate into the non-welding area, causing circuit short circuit, corrosion and other problems. The solder resist layer covers the surface of the glass substrate, which can effectively prevent the invasion of water and solder, and protect the electrical performance and structural integrity of the functional board.

[0144] The solder resist layer exposes the first liquid path through hole, the second liquid path through hole and the electrode layer, which ensures that the liquid path through hole can guide the detection solution to flow normally, and the electrode layer can fully contact with the detection solution and have electrochemical reaction. The solder resist layer does not affect the normal function of the liquid path and the electrode, and can also protect other areas that do not need to be exposed, improving the reliability and stability of the functional board.

[0145] In some embodiments, after forming the through liquid path through hole structure on the glass substrate, further comprising:

[0146] The recess is arranged on the glass substrate, and the temperature measuring element is embedded in the recess.

[0147] In the above embodiment, the recess can be a sink or a through slot, which is used to embed and adapt different sizes of temperature measuring elements such as thermistors, to ensure that the temperature measuring element can be accurately embedded therein, avoid the erosion of the temperature measuring element on the surface of the functional board by the detection solution, and ensure the stability and accuracy of the temperature measuring element installation.

[0148] In one embodiment, the medium layer is precisely slotted by laser hole at the position of the embedded temperature measuring element terminal surface, and the laser hole notch penetrates through the medium layer and opens to the temperature measuring element terminal surface, then copper is filled in the laser hole, so that the temperature measuring element terminal is in communication with the outside through the medium layer, and the circuit and pad connected with the temperature measuring element can be further processed in the outer layer, to ensure the accuracy of the transmission of the temperature measuring information of the temperature measuring element.

[0149] In one embodiment, when the temperature measuring element is embedded in the groove, a bridging method can be used, specifically, the temperature measuring element is treated in advance by a special tool, and the temperature measuring element is fixed and inverted in the groove, then the medium layer is poured into the groove, and the medium layer fills the remaining cavity in the groove, and only the outermost terminal of the temperature measuring element is exposed, the medium layer is solidified to form a fixation for the temperature measuring element, so that the temperature measuring element and the medium layer are integrally formed to fill the entire groove, and only the terminal on the surface of the temperature measuring element is exposed, thereby simplifying the embedding process of the temperature measuring element.

[0150] In some embodiments, after forming the through liquid path via structure on the glass substrate, further comprising:

[0151] Sputtering a heating layer on the glass substrate.

[0152] In the above embodiment, a high-resistance metal can be sputtered on the glass substrate to form a heating layer of the resistance wire structure. In medical detection equipment, many detection processes need to be carried out under specific temperature conditions, for example, some biochemical reactions are extremely sensitive to temperature, and appropriate temperature can ensure the smooth progress of the reaction and the accuracy of the result. The sputtered heating layer can generate heat through current to provide a stable heat source for the area where the functional board is located, to meet the temperature requirements of different detection projects.

[0153] Moreover, the sputtering process can realize uniform deposition of the heating layer on the glass substrate, so that the resistance values and heating performance of each part of the heating layer are relatively consistent, which helps to improve the accuracy of temperature control and reduce local temperature differences.

[0154] The embodiments of the present application also provide an electronic device, which comprises the functional board described above.

[0155] In the above embodiment, the medical detection device can be a blood gas analyzer. The medical detection device provided in the embodiment of the application includes a base body 100, the base body 100 includes a glass substrate 1 and a dielectric layer 7, the dielectric layer 7 is arranged on one side surface of the glass substrate 1; an electrode layer 4, the electrode layer 4 is arranged on at least one side surface of the base body 100; a solder resist layer 5, the solder resist layer 5 is arranged on the surface of the base body 100 and exposes the electrode layer 4; and the dielectric layer 7 is used to arrange a circuit structure 8. The high flatness of the glass substrate 1 provides a stable adhesion basis for the electrode layer 4, and ensures the stability of the electrode structure and the accuracy of detection. The dielectric layer 7 is located between the glass substrate 1 and the solder resist layer 5, which avoids the frequent contact of the circuit structure 8 with the detection solution in the detection process, and ensures the effectiveness of the circuit structure 8 and the accuracy of the electronic device detection.

[0156] Although some specific embodiments of the application have been described in detail by examples, those skilled in the art should understand that the above examples are only for illustration, and are not intended to limit the scope of the application. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the application. The scope of the application is defined by the appended claims.

Claims

1. A functional board for a medical testing device, characterized in that, The functional board comprises: a base body (100) comprising a glass substrate (1) and a dielectric layer (7) arranged on one side surface of the glass substrate (1); an electrode layer (4) arranged on at least one side surface of the base body (100); a solder resist layer (5) arranged on the surface of the base body (100) and exposing the electrode layer (4); the dielectric layer (7) is used to arrange a circuit structure (8).

2. The functional board according to claim 1, characterized in that The functional board further comprises a temperature measuring element (9) embedded in the glass substrate (1). The circuit structure comprises an electrical connector (81) penetrating the dielectric layer (7), one end of the electrical connector (81) being connected with the temperature measuring element (9), and the other end of the electrical connector (81) being exposed from the dielectric layer (7).

3. The functional board of claim 1, wherein, The circuit structure comprises a heating layer (82) arranged between the glass substrate (1) and the dielectric layer (7).

4. The functional board according to claim 3, characterized in that At least part of the heating layer (82) is opposite to the electrode layer (4) in the thickness direction of the functional board.

5. The functional board of claim 3, wherein, The resistivity of the heating layer (82) is greater than or equal to 5 x 10 -8 Ω-m.

6. The functional board of claim 4, wherein, The functional board further comprises a temperature measuring element (9) embedded in the glass substrate (1), the top of the temperature measuring element (9) being arranged at the same height as the bottom of the heating layer (82). In the plane of the functional board, the distance between the heating layer (82) and the temperature measuring element (9) is 300-500 µm.

7. The functional board of claim 1, wherein The functional board further comprises a liquid path through-hole structure (6) comprising a first liquid path through-hole (61) and a second liquid path through-hole (62), both of which penetrate the glass substrate (1) and are arranged at intervals.

8. The functional board of claim 7, wherein, The solder resist layer (5) has a first windowed area and a second windowed area, the first windowed area being used to expose the liquid path through-hole structure (6), and the second windowed area being used to expose the electrode layer (4).

9. The functional board of claim 8, wherein, The second windowed area forms an inverted trapezoidal opening (51) for the detection solution to flow through.

10. The functional board of claim 9, wherein, The side wall of the inverted trapezoidal opening (51) is stepped; or The side wall of the inverted trapezoidal opening (51) is planar.

11. The functional board of claim 1, wherein, The thickness of the glass substrate (1) is 0.1-5.0 mm, and the flatness of the glass substrate (1) is 0.01-0.50 mm / m.

12. The functional board of claim 1, wherein, The electrode layer (4) comprises a first electrode layer (41), the glass substrate (1) sequentially has a copper circuit layer (2) and a separation layer (3), and the first electrode layer (41) is arranged on the side of the separation layer (3) away from the copper circuit layer (2) and covers the separation layer (3).

13. The functional board of claim 12, wherein, The first electrode layer (41) is a gold plating layer or a silver plating layer, and the thickness of the first electrode layer (41) is 0.5-2 µm.

14. The functional board of claim 12, wherein, The electrode layer (4) comprises a second electrode layer (42) arranged on the side of the first electrode layer (41) away from the separation layer (3) and covering the first electrode layer (41).

15. The functional board of claim 14, wherein, The second electrode layer (42) is a platinized layer or a palladinized layer, and the thickness of the second electrode layer (42) is 0.05-0.5μm.

16. A method of producing a functional board, characterized by, The method comprises: forming a through liquid path via structure on the glass substrate, the liquid path via structure comprising a first liquid path via and a second liquid path via spaced apart from each other; providing an electrode layer on at least one side surface of the glass substrate; providing a dielectric layer on one side surface of the glass substrate, and providing a circuit structure in the dielectric layer; covering a solder resist layer on the surface of the glass substrate, and exposing the first liquid path via, the second liquid path via and the electrode layer.

17. The preparation method according to claim 16, characterized in that, After forming the through liquid path via structure on the glass substrate, the method further comprises: providing a recess on the glass substrate, and embedding a temperature measuring element in the recess.

18. The method of claim 16, wherein, After forming the through liquid path via structure on the glass substrate, the method further comprises: sputtering a heating layer on the glass substrate.

19. An electronic device, comprising: The functional board comprises any one of claims 1-15.

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