Display module structure for improving bonding anomaly detection effect
By etching solid copper lines in the bonding contact area between the module FPC and the display glass, the problem of inaccurate detection of module bonding abnormalities was solved, achieving efficient detection and improved product yield.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN TXD TECH CO LTD
- Filing Date
- 2025-05-12
- Publication Date
- 2026-05-05
AI Technical Summary
In existing technologies, the detection of bonding anomalies in FPC modules is inaccurate, resulting in the inability to effectively detect bonding defects. Both manual sampling and AOI inspection have shortcomings.
Solid copper lines with a width of 0.06 mm and a length of no less than 0.5 mm are etched at the lower edge of the bonding contact area between the module FPC and the display glass. This is used to determine whether the green solder mask has invaded the bonding area, and to assist AOI automatic equipment and manual inspection.
This improved the accuracy and efficiency of bonding anomaly detection, increased product yield, and prevented defective products from flowing downstream.
Smart Images
Figure CN224203792U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of display module technology, and in particular to a display module structure that improves the bonding anomaly detection effect. Background Technology
[0002] In existing FPC modules, a process of printing green ink is performed on the bonding bending area of the FPC to reduce bending stress. Conventional green ink printing uses screen printing technology, and the tolerance of green ink printing is usually 0.2mm. Due to the instability of the process, green ink may be brushed into the bonding area of the display glass, resulting in bonding defects and affecting the module function. In the existing methods, such defects cannot be effectively detected by either manual sampling or AOI inspection, resulting in inaccurate and insufficient detection.
[0003] Therefore, existing technologies have shortcomings and need to be improved. Utility Model Content
[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a display module structure that improves the bonding anomaly detection effect.
[0005] The technical solution of this utility model is as follows: This utility model provides a display module structure that improves the bonding anomaly detection effect, including: a display glass and a module FPC, wherein the bonding connection end of the module FPC is bonded to a single layer area of the display glass, and solid copper lines formed by etching are formed on the left and right sides of the bonding connection end of the module FPC, and the solid copper lines are closely attached to the lower edge of the pressing contact area between the module FPC and the display glass, and the solid copper lines have a preset width and a preset length.
[0006] Furthermore, the width of the solid copper wire is 0.06 mm.
[0007] Furthermore, the length of the solid copper wire is greater than or equal to 0.5 mm.
[0008] The beneficial effects of this utility model by adopting the above solution are as follows: by etching solid copper lines at the lower edge of the bonding contact area between the module FPC and the display glass, it can be used to judge whether the green solder mask is suitable and qualified after screen printing a single layer area of green solder mask, which facilitates AOI automatic equipment and manual inspection, improves inspection efficiency and product yield, and prevents products with bonding defects from flowing downstream. Attached Figure Description
[0009] Figure 1 This is a schematic diagram of the structure of a module FPC according to an embodiment of the present invention. Detailed Implementation
[0010] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
[0011] Please see Figure 1 In this embodiment, the present invention provides a display module structure for improving the detection effect of bonding anomalies, comprising: a display glass and a module FPC 1, wherein the bonding connection end of the module FPC 1 is bonded to a single layer area of the display glass, and solid copper lines 12 formed by etching are respectively formed on the left and right sides of the bonding connection end of the module FPC 1, and the solid copper lines 12 are closely attached to the lower edge of the pressing contact area 11 between the module FPC 1 and the display glass, the width W of the solid copper lines 12 is 0.06mm, and the length L of the solid copper lines 12 is greater than or equal to 0.5mm.
[0012] Please continue reading. Figure 1 In this solution, solid copper lines 12 are set on both the left and right sides of the module FPC 1. Since the etching tolerance is very small, generally ±0.015mm, it can be ensured that the accuracy of these two solid copper lines 12 meets the requirements. After the single-layer area is brushed with green solder mask, if the green solder mask layer 13 extends beyond the upper edge of the solid copper line 12, it means that the green solder mask layer 13 has invaded the bonding contact area 11 between the module FPC 1 and the display glass, and the product is defective. This is because the problem can be found very intuitively by both AOI automatic equipment and manual inspection.
[0013] In summary, the beneficial effects of this utility model are as follows: by etching solid copper lines at the lower edge of the bonding contact area between the module FPC and the display glass, it can be used to determine whether the green solder mask is suitable and qualified after screen printing a single layer area of green solder mask. This facilitates inspection by AOI automatic equipment and manual inspection, improves inspection efficiency and product yield, and prevents products with bonding defects from flowing downstream.
[0014] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A display module structure for improving the detection effect of bonding anomalies, characterized in that, include: The display glass and the module FPC are bonded to a single layer area of the display glass. Solid copper lines are formed on the left and right sides of the bonding connection end of the module FPC, and the solid copper lines are close to the lower edge of the pressing contact area between the module FPC and the display glass. The solid copper lines have a preset width and a preset length.
2. The display module structure for improving the detection effect of bonding anomalies according to claim 1, characterized in that, The width of the solid copper wire is 0.06 mm.
3. The display module structure for improving the detection effect of bonding anomalies according to claim 1 or 2, characterized in that, The length of the solid copper wire is greater than or equal to 0.5 mm.