Cooling fan capable of improving space utilization rate

Abstract

The utility model discloses a cooling fan capable of improving space utilization rate, which comprises a base and an upper cover covered on the base, the upper cover is a metal-based printed circuit board, the upper cover is provided with a driving module, and the driving module is integrally welded with the upper cover through SMT (surface mount technology). Due to the fact that the whole upper cover is composed of the metal-based printed circuit board, the function of protecting the cooling fan is achieved, the whole upper cover is composed of the metal-based printed circuit board, the contact area between the metal-based printed circuit board and the air is greatly increased, the temperature rise of the driving module is effectively controlled, the driving module and the upper cover are integrally welded through the SMT technology, and the service life of the driving module is prolonged. The thickness and the overall size of the cooling fan are greatly reduced, the space utilization rate is greatly improved, and the product has the advantages of improving the space utilization rate, being small in overall size, good in cooling effect and the like.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic product technical field especially, relate to a heat dissipation fan of improving space utilization ratio. BACKGROUND

[0002] With the development of electronic industry, the development of electronic products gradually evolves towards high performance, high frequency, high speed and light and thin direction. With the continuous improvement of the performance of electronic products, the operation speed is faster and faster, the operation speed of the internal chip set is continuously improved, the number of chips is continuously increased, and the heat generated by the chip during operation is also increased accordingly. If these heat is not dissipated in time, it will greatly affect the performance of electronic products, reduce the operation speed of electronic products, and with the continuous accumulation of heat, it may burn the electronic products, so the electronic products must be cooled. Cooling fan (English name: cooling fans) plays an extremely important role in the present stage of electronic product cooling.

[0003] The existing cooling fan usually has a driving circuit board for driving the cooling fan, and the circuit board is usually a PCB board. In order to accommodate the PCB board, a chamber is arranged in the upper cover, which increases the overall thickness and overall volume of the cooling fan, and the cooling fan cannot be further reduced. Therefore, the applicant has made beneficial design and found a method to solve the above problems. The technical scheme to be introduced below is generated in this background. SUMMARY

[0004] The utility model discloses a product that improves space utilization, overall volume is small and has good heat dissipation effect to overcome the shortcoming of the prior art.

[0005] To solve the above problems, the utility model adopts the following technical scheme.

[0006] A heat dissipation fan for improving space utilization, comprising a base and an upper cover covering the base, wherein the upper cover is a metal-based printed circuit board, the upper cover is provided with a driving module, and the driving module is integrally made by welding the upper cover through SMT patch process.

[0007] Preferably, the driving module comprises a control chip, a wiring port, a resistor R1 and a capacitor C1, the 1 port of the control chip is electrically connected with the FG port of the wiring port, the 2 port of the control chip is electrically connected with the GND port of the wiring port, the 5 port of the control chip is electrically connected with the PWM port of the wiring port, the 6 port of the control chip is electrically connected with one end of the resistor R1, the other end of the resistor R1 is electrically connected with one end of the capacitor C1, the other end of the capacitor C1 is grounded, and the 6 port of the control chip is electrically connected with the VCC of the wiring port.

[0008] Preferably, the upper cover is provided with a connecting portion, the connecting portion is provided with a conductive piece corresponding to a wiring port, and the connecting portion is electrically connected with the wiring port.

[0009] Preferably, the upper cover is provided with a cooling fan, and an output end of the cooling fan is electrically connected with the 3rd and 4th ports of the control chip.

[0010] Preferably, the upper cover is uniformly provided with a plurality of air inlet holes with the cooling fan as a center.

[0011] Beneficial effects:

[0012] Compared with the prior art, the utility model has the beneficial effects that:

[0013] (1) The utility model discloses a cooling fan with improved space utilization, which comprises a base and an upper cover, wherein the upper cover is composed of a metal-based printed circuit board, the metal-based printed circuit board is composed of a circuit layer, an insulating layer and a metal-based layer, the metal-based printed circuit board is an MCPCB aluminum substrate, the entire upper cover is composed of the metal-based printed circuit board, the contact area of the metal-based printed circuit board and air is greatly improved, the temperature rise of the driving module is effectively controlled, and when the cooling fan operates, external air is sucked into the base and the upper cover, the temperature rise of the driving module is further reduced, and the product has the advantages of good heat dissipation effect.

[0014] (2) The utility model discloses a cooling fan with improved space utilization, which comprises a base and an upper cover, wherein the upper cover is composed of a metal-based printed circuit board, the metal-based printed circuit board is composed of a circuit layer, an insulating layer and a metal-based layer, the metal-based printed circuit board is an MCPCB aluminum substrate, the entire upper cover is composed of the metal-based printed circuit board, the contact area of the metal-based printed circuit board and air is greatly improved, the temperature rise of the driving module is effectively controlled, and when the cooling fan operates, external air is sucked into the base and the upper cover, the temperature rise of the driving module is further reduced, and the product has the advantages of good heat dissipation effect. BRIEF DESCRIPTION OF DRAWINGS

[0015] Fig. 1 It is a structural schematic view of the utility model discloses a kind of cooling fan with improved space utilization;

[0016] Fig. 2 It is an explosion view of the utility model discloses a kind of cooling fan with improved space utilization;

[0017] Fig. 3 It is a driving module circuit schematic view of the utility model discloses a kind of cooling fan with improved space utilization;

[0018] The corresponding relationship between the annotations of each figure and the component names in the drawings is as follows:

[0019] Reference signs: 1, base;2, upper cover;3, driving module;4, conductive piece;5, cooling fan;21, connecting portion;22, air inlet hole;31, control chip;32, wiring port. DETAILED DESCRIPTION

[0020] The technical solutions of the present application will be described clearly and completely in combination with the embodiments. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.

[0021] In the description of the present application, it should be understood that the positions or location relationships indicated by the terms "upper", "lower", "left", "right" and the like are based on the positions or location relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular position, be constructed and operated in a particular position, and therefore cannot be understood as a limitation on the present application.

[0022] In the embodiments of the present application, "and / or" is only a description of the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B, which can represent the three cases of A alone, A and B together, and B alone. In addition, the character " / " in this paper generally represents that the front and rear associated objects have an "or" relationship.

[0023] Reference example Figs. 1 to 3 A space utilization rate improving heat dissipation fan, comprising a base 1 and an upper cover 2 covering the base 1, the upper cover 2 is a metal-based printed circuit board, the upper cover 2 is provided with a driving module 3, the driving module 3 is integrally made by being welded with the upper cover 2 through an SMT patch process, since the entire upper cover 2 is composed of a metal-based printed circuit board, not only the function of protecting a heat dissipation fan 5 is achieved, and since the metal-based printed circuit board is composed of a circuit layer, an insulating layer and a metal-based layer, a good heat dissipation effect is achieved, the metal-based printed circuit board is an MCPCB aluminum substrate, and the entire upper cover 2 is composed of a metal-based printed circuit board, the contact area of the metal-based printed circuit board and air is greatly improved, the temperature rise of the driving module 3 is effectively controlled, and when the heat dissipation fan 5 is operated, external air is sucked into the base 1 and the upper cover 2, and the temperature rise of the driving module 3 is further reduced; the driving module 3 is integrally made by being welded with the upper cover 2 through an SMT patch process, the thickness and the overall volume of the heat dissipation fan are greatly reduced, the space utilization rate is greatly improved, and the processing procedure is reduced, and the production cost is effectively reduced;

[0024] It is worth mentioning that the driving module 3 comprises a control chip 31, a wiring port 32, a resistor R1 and a capacitor C1, the 1 port of the control chip 31 is electrically connected with the FG port of the wiring port 32, the 2 port of the control chip 31 is electrically connected with the GND port of the wiring port 32, the 5 port of the control chip 31 is electrically connected with the PWM port of the wiring port 32, the 6 port of the control chip 31 is electrically connected with one end of the resistor R1, the other end of the resistor R1 is electrically connected with one end of the capacitor C1, the other end of the capacitor C1 is grounded, the 6 port of the control chip 31 is electrically connected with the VCC of the wiring port 32, the wiring port 32 outputs a stable voltage and current to the VCC port, the VCC port outputs a voltage and current to the control chip 31, and the control chip 31 is supplied with power to operate, and the resistor R1 and the capacitor C1 are connected in series to prevent a surge voltage protection mechanism, the surge voltage protection mechanism refers to a protection measure, which aims to prevent the heat dissipation fan 5 from being damaged or malfunctioning due to abnormal voltage (too high or too low), and ensure the stable operation of the heat dissipation fan 5 and prolong the service life, FG is the abbreviation of frequency generator, which is a square wave or F00 wave, and the waveform is a high-low rectangular signal generated by the fan in one cycle, and the signal frequency is synchronized with the fan speed, and the electric appliance control loop can detect the fan speed at any time, and the rotation speed of the heat dissipation fan 5 can be changed through the PWM duty ratio;

[0025] It is worth mentioning that the upper cover 2 is provided with a connecting portion 21, the connecting portion 21 is provided with a conductive piece 4 corresponding to the wiring port 32 and is electrically connected with the wiring port 32, and the connecting portion 21 provides support for the conductive piece 4, and the heat dissipation fan is electrically connected with the port of the power PCB through the conductive piece 4;

[0026] It is worth mentioning that the upper cover 2 is provided with a heat dissipation fan 5, and the output end of the heat dissipation fan 5 is electrically connected with the 3 and 4 ports of the control chip 31, the control chip 31 outputs different voltages through the 3 and 4 ports to change the rotation speed of the heat dissipation fan 5;

[0027] It is worth mentioning that the upper cover 2 is provided with a plurality of air inlet holes 22 which are evenly distributed around the heat dissipation fan 5, and the air inlet holes 22 facilitate the heat dissipation fan 5 to suck external air into the base 1 and the upper cover 2.

[0028] The above design scheme can improve the space utilization, reduce the overall volume and improve the heat dissipation effect.

[0029] The above content is further described in detail in combination with the specific embodiments, and cannot be regarded as being limited to the description, and for ordinary skilled in the art to which the present application belongs, some simple deductions or substitutions can be made without departing from the concept of the present application, and all of them should be regarded as belonging to the protection scope determined by the claims of the present application.

Claims

1. A heat dissipation fan with improved space utilization, comprising a base (1) and a cover (2) covering the base (1), characterized in that: The upper cover (2) is provided as a metal-based printed circuit board, and the upper cover (2) is provided with a driving module (3) which is integrally formed by welding with the upper cover (2) through an SMT patch process.

2. The space utilization improving heat dissipation fan according to claim 1, characterized in that: The driving module (3) comprises a control chip (31), a wiring port (32), a resistor R1 and a capacitor C1, the 1 port of the control chip (31) is electrically connected with the FG port of the wiring port (32), the 2 port of the control chip (31) is electrically connected with the GND port of the wiring port (32), the 5 port of the control chip (31) is electrically connected with the PWM port of the wiring port (32), the 6 port of the control chip (31) is electrically connected with one end of the resistor R1, the other end of the resistor R1 is electrically connected with one end of the capacitor C1, the other end of the capacitor C1 is grounded, and the 6 port of the control chip (31) is electrically connected with the VCC of the wiring port (32).

3. The space utilization improving heat dissipation fan according to claim 2, characterized in that: The upper cover (2) is provided with a connecting portion (21), the connecting portion (21) is provided with a conductive part (4) corresponding to the wiring port (32) and is electrically connected with the wiring port (32).

4. The space utilization efficiency improving cooling fan according to claim 2, characterized by: The upper cover (2) is provided with a cooling fan (5), and the output end of the cooling fan (5) is electrically connected with the 3 and 4 ports of the control chip (31).

5. The space utilization efficiency improving heat dissipation fan according to claim 4, characterized in that: The upper cover (2) is uniformly provided with a plurality of air inlet holes (22) with the cooling fan (5) as the axis.

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