Radiator module with novel vapor chamber structure

Abstract

The utility model discloses a radiator module with a novel vapor chamber structure, which comprises a radiating fin group, a radiating tube penetrating through the radiating fin group and a vapor chamber arranged on one side of the radiating fin group and used for contacting with an electronic component, and radiating air guide holes are arranged in the vapor chamber. The side edge of the vapor chamber is provided with an air guide cover which faces the heat dissipation fin group and is used for guiding heat dissipation air into the heat dissipation air guide holes, and the bottom of the vapor chamber is provided with an air outlet which is communicated with the heat dissipation air guide holes and blows hot air to the electronic element. Heat dissipation air is guided into the heat dissipation air guide holes through the air guide cover and is blown to the electronic element through the air outlet, so that heat generated by the electronic element is directly taken away, the heat dissipation efficiency can be greatly improved, the influence of the heat conduction performance of the heat dissipation fin group and the vapor chamber on heat dissipation can be reduced, and the service life of the electronic element is prolonged. The high temperature of the electronic component caused by the heat-conducting property change of the radiating fin group and the vapor chamber in the long-term use process is avoided, the service life of the electronic component is prolonged, and the operation performance stability of the electronic component is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to radiator technical field especially point to a radiator module with novel hot plate structure. BACKGROUND

[0002] In modern electronic products, especially high-performance graphics cards, the design of the radiator is particularly important. This is because electronic devices generate a large amount of heat when they are working, especially in high-load operations such as graphics processing and complex computing tasks. The main reason for generating heat is the power consumption of the components. When current passes through semiconductor materials, resistance will cause part of the electrical energy to be converted into heat energy. If the heat cannot be dissipated in time, the temperature rise will cause the performance of the components to decline, and even damage.

[0003] Currently, the traditional cooling methods mainly include air cooling, liquid cooling and heat pipe cooling. Air cooling relies on fans to remove heat from the surface of electronic components, which is a widely used and cost-effective method, but it often has the problem of insufficient cooling efficiency in high-performance products; liquid cooling removes heat through liquid circulation, which is more efficient and has lower noise, but the structure is complex, the cost is high and leakage prevention measures are required; heat pipe cooling uses materials with good thermal conductivity to quickly transfer heat to the heat sink area, but it is limited by the upper limit of heat absorption of the heat pipe. Especially in high-performance graphics cards, as the computing power increases, the heat generated rapidly rises. If the cooling system cannot quickly reduce the temperature, the graphics card will reduce the frequency to protect itself, resulting in performance degradation.

[0004] For example: China patent authorized announcement number CN 101605442B radiator, in the technical scheme disclosed in this patent, the radiator is mainly used for cooling the circuit board, the radiator includes a base, a radiator, a fan, and a cover. The base includes a base plate and a hot plate. When working, the fixing member passes through the base downward and cooperates with the back plate below the circuit board to fix the radiator on the circuit board. The bottom surface of the hot plate of the base can contact one or more electronic components. Heat-conducting glue can be applied between the bottom surface of the hot plate and the top surface of the electronic components to enhance the heat-conducting effect. Insulating sheets can be placed between the radiator and the circuit board to provide insulation and cushioning. Since the hot plate is a high-efficiency heat-conducting plate-shaped heat pipe, the heat generated by the electronic components can be absorbed by the hot plate and quickly and evenly distributed throughout the hot plate. The heat is then conducted to the entire radiator, and finally removed by the airflow generated by the fan through the airflow channel in the radiator, thereby achieving the effect of quickly cooling the electronic components.

[0005] As described in the above patent, since the heat dissipation devices on the market are all using the airflow generated by the fan to blow through the heat sink or the heat conductor to take away the heat, the heat dissipation efficiency is largely dependent on the heat conductivity of the heat sink or the heat conductor, when the heat conductivity of the heat sink or the heat conductor is reduced due to dust accumulation or other reasons, the electronic components are prone to instantaneous high temperature, which leads to the performance degradation or damage of the electronic components, therefore, ensuring the continuous and stable heat dissipation of the electronic components is an important factor for maintaining the performance of the electronic products and improving the service life.

[0006] Therefore, the present inventors propose the following technical solutions. Content of the utility model:

[0007] The utility model discloses a heat spreader module with novel heat spreader structure.

[0008] In order to solve the above technical problems, the utility model adopts the following technical scheme: a heat spreader module with novel heat spreader structure, comprising: at least one heat dissipation fin group for heat conduction, at least one heat dissipation pipe penetrating through the heat dissipation fin group and a heat spreader arranged on one side of the heat dissipation fin group and used for contacting and conducting heat with the electronic components, a plurality of heat dissipation air guide holes extending through the side of the heat spreader are arranged in the heat spreader, a plurality of air guide covers are arranged on the side of the heat spreader and used for guiding the heat dissipation air into the heat dissipation air guide holes, and at least one air outlet is arranged on the bottom of the heat spreader and connected with the heat dissipation air guide holes and used for blowing the heat dissipation air to the electronic components.

[0009] Further, in the above technical solution, the air guide cover is fixed on the heat spreader, one end of the heat dissipation air guide hole corresponds to the air guide cover, and the other end of the heat dissipation air guide hole is connected with the air outlet.

[0010] Further, in the above technical solution, two heat dissipation air guide holes are arranged through the front and back of the heat spreader, and two air guide covers are arranged at the ends of the heat dissipation air guide holes and correspond to the front and back of the heat spreader; two heat dissipation air guide holes are also arranged through the left and right of the heat spreader, and two air guide covers are arranged at the ends of the heat dissipation air guide holes and correspond to the left and right of the heat spreader; and two air outlets are arranged on the bottom of the heat spreader and located in the middle of the heat dissipation air guide holes.

[0011] Further, in the above technical solution, two air outlets are arranged side by side and in a strip shape; two heat dissipation air guide holes cross the two air outlets side by side, and the other two heat dissipation air guide holes pass through the two air outlets respectively.

[0012] Further, in the above technical solution, the heat spreader comprises an upper plate body and a lower plate body, the heat dissipation air guide holes are located between the upper plate body and the lower plate body, the air outlets are located on the lower plate body, and the air guide covers are fixed on the lower plate body.

[0013] Further, in the above technical solution, the heat plate is a copper plate, and a heat conduction member is arranged beside the heat plate, the heat conduction member is a stamping folded plate, and at least two second positioning columns for fixing the PCB of the electronic component are arranged.

[0014] Further, in the above technical solution, the heat pipe is arranged in a plurality of forms, and the heat pipe is located between the heat plate and the heat dissipation fin group and is flush with the end surface of the heat plate; the heat dissipation fin group is arranged in two parallel forms, and the two heat dissipation fin groups are connected and fixed by a connecting plate, and the heat pipe penetrates the two heat dissipation fin groups.

[0015] Further, in the above technical solution, the heat dissipation fin group is provided with a first heat conduction surface in the contact area with the heat conduction member, the fins in the heat dissipation fin group are perpendicular to the first heat conduction surface, and a plurality of U-shaped grooves for positioning the heat pipe are arranged on the heat dissipation fin group and penetrate the first heat conduction surface.

[0016] Further, in the above technical solution, the connecting plate is arranged in two parallel forms, and the two heat dissipation fin groups are connected by welding, and the two connecting plates are located on the two sides of the heat dissipation fin group.

[0017] After the above technical solution is adopted, the present application has the following beneficial effects compared with the prior art: in the present application, a plurality of heat dissipation air guide holes are arranged in the heat plate, an air outlet is arranged in the middle area of the heat plate and aligned with the electronic component, the heat dissipation air is guided into the heat dissipation air guide hole through the air guide cover, and then blown to the electronic component through the air outlet, so as to directly take away the heat generated by the electronic component, which not only greatly improves the heat dissipation efficiency, but also reduces the influence of the heat dissipation performance of the heat dissipation fin group and the heat plate on the heat dissipation, avoids the high temperature of the electronic component caused by the change of the heat dissipation performance of the heat dissipation fin group and the heat plate during long-term use, and improves the service life and operation performance stability of the electronic component. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 is a perspective view of the present application;

[0019] Figure 2 is an exploded view of the present application Figure One ;

[0020] Figure 3 is an exploded view of the present application Figure Two ;

[0021] Figure 4 is an exploded view of the present application Figure Three ;

[0022] Figure 5 is a perspective view of the heat plate in the present application. DETAILED DESCRIPTION

[0023] The utility model is further illustrated below in combination with specific embodiments and drawings.

[0024] In the embodiment, the fan A is arranged on one side of the heat dissipation fin group 1 and is fixedly installed with the heat dissipation fin group 1 through a support 9, and when the heat dissipation fin group 1 is relatively long, multiple fans A can be installed side by side on the support 9.

[0025] As shown in Figures 1 to 5 The heat dissipation fin group 1 is used for heat conduction, the heat dissipation pipe 2 penetrates the heat dissipation fin group 1, and the heat plate 4 is arranged on one side of the heat dissipation fin group 1 and is used for contacting and conducting heat with the electronic element 3. The heat plate 4 is internally provided with multiple heat dissipation air guide holes 41 extending to the side edge. The side edge of the heat plate 4 is provided with multiple air guide covers 7 facing the heat dissipation fin group 1 and used for guiding the heat dissipation air into the heat dissipation air guide hole 41. The bottom of the heat plate 4 is provided with at least one air outlet 42 communicating with the heat dissipation air guide hole 41 and blowing the heat dissipation air to the electronic element 3. Multiple heat dissipation air guide holes 41 penetrating the heat plate 4 are arranged in the heat plate 4. The air outlet 42 is arranged in the middle area of the heat plate 4 and is aligned with the electronic element 3. The heat dissipation air is guided into the heat dissipation air guide hole 41 through the air guide cover 7 and is blown to the electronic element 3 through the air outlet 43. Thus, the heat generated by the electronic element 3 can be directly taken away. This can not only greatly improve the heat dissipation efficiency but also reduce the influence of the heat conduction performance of the heat dissipation fin group 1 and the heat plate 4 on heat dissipation. The high temperature of the electronic element 3 caused by the change of the heat conduction performance of the heat dissipation fin group 1 and the heat plate 4 during long-term use is avoided. The service life and the operation performance stability of the electronic element 3 are improved.

[0026] The air deflector 7 is fixed on the heat sink 4, one end of the heat dissipation air deflector hole 41 corresponds to the air deflector 7, and the other end of the heat dissipation air deflector hole 41 communicates with the air outlet 42. The heat dissipation air deflector hole 41 is provided through the front and back of the heat sink 4, and the front end and the rear end of the heat sink 4 correspondingly provide two air deflectors 7 located at the end of the heat dissipation air deflector hole 41; the heat dissipation air deflector hole 41 is also provided through the left and right of the heat sink 4, and the left side and the right side of the heat sink 4 correspondingly provide two air deflectors 7 located at the end of the heat dissipation air deflector hole 41; and the bottom of the heat sink 4 is provided with two air outlets 42, and is located in the middle of the heat dissipation air deflector hole 41. The air outlet 42 is provided with two parallel air outlets, and is in a strip shape; wherein, two heat dissipation air deflector holes 41 are provided through two air outlets 42 in parallel, and the other two heat dissipation air deflector holes 41 pass through the two air outlets 42 respectively. By parallel and cross through the heat dissipation air deflector hole 41 of the heat sink 4, the air deflector 7 can be symmetrically installed on the front, rear, left and right sides of the heat sink 4, when the heat dissipation air generated by the fan A passes through the heat dissipation fin group 1, the heat dissipation air is guided by the air deflector 7 into the heat dissipation air deflector hole 41 in the heat sink 4, and is convected and blown into at the air outlet 42, thereby realizing the direct blowing heat dissipation of the electronic element 3. The air deflector 7 is symmetrically arranged at the two ends of the heat dissipation air deflector hole 41, so that the heat dissipation air can be blown into from the two sides of the air outlet 42, which not only can improve the air volume, but also can avoid the heat dissipation air from blowing out from the side of the heat sink 4. Of course, the heat dissipation air deflector hole 41 can also be not relative, and can be inclined at any angle to enter the air outlet 42, and the heat dissipation air guided into the heat dissipation air deflector hole 41 by the air deflector 7 can blow to the air outlet 42, which can realize the heat dissipation of the electronic element 3.

[0027] The heat sink 4 includes an upper plate body 401 and a lower plate body 402, wherein the heat dissipation air deflector hole 41 is located between the upper plate body 401 and the lower plate body 402, the air outlet 42 is located on the lower plate body 402, the air deflector 7 is fixed on the lower plate body 402 by welding, and a plurality of first positioning columns 43 for fixing the PCB 30 are arranged on the lower plate body 402. In an embodiment, the heat sink 4 is arranged in a combined manner of the upper plate body 401 and the lower plate body 402, and the structure of the two plate bodies is more conducive to the processing of the heat dissipation air deflector hole 41 and the air outlet 42. Of course, the heat sink 4 can also adopt a whole structure, and the heat dissipation air deflector hole 41 and the air outlet 42 can be processed by means of turning hole and milling groove.

[0028] The heat sink 4 is a copper plate, and the side of the heat sink 4 is further provided with a heat conducting piece 5, which is a stamping folded plate and is provided with at least two second positioning columns 51 for fixing the PCB 30 of the electronic element 3.

[0029] The heat dissipation pipes 2 are arranged in plurality, and the heat dissipation pipes 2 are located between the heat dissipation fin groups 1 and the vapor chamber 4 and are flushly contacted with the end surface of the vapor chamber 4; the heat dissipation fin groups 1 are arranged in parallel in two, and the connecting plates 6 are arranged between the two heat dissipation fin groups 1 for connecting and fixing, and the heat dissipation pipes 2 penetrate the two heat dissipation fin groups 1. The heat dissipation fin groups 1 are provided with the first heat conduction surface 11 in the contact area with the heat conduction member 5, the fins in the heat dissipation fin groups 1 are perpendicular to the first heat conduction surface 11, and the heat dissipation fin groups 1 are provided with a plurality of U-shaped grooves 12 penetrating the first heat conduction surface 11 and used for positioning the heat dissipation pipes 2. The connecting plates 6 are arranged in parallel in two, and the two connecting plates 6 are connected with the two heat dissipation fin groups 1 by welding, and the two connecting plates 6 are located on the two sides of the heat dissipation fin groups 1 respectively.

[0030] The vapor chamber 4 and the heat conduction member 5 are both stamping parts, and the two side surfaces are uneven; the fins on the bottom surface of the heat dissipation fin group 1 are uneven, so as to match the contact surfaces with different unevenness on the vapor chamber 4 and the heat conduction member 5, and the fins are provided with heat conduction surfaces in the contact areas with the vapor chamber 4 and the heat conduction member 5; the fins on the top surface of the heat dissipation fin group 1 are flat, and are fixed with the connecting plates 6 by welding.

[0031] In summary, the heat dissipation air guiding hole 41 is arranged in the vapor chamber, the air outlet 42 is arranged on the bottom of the vapor chamber 4 and communicates with the heat dissipation air guiding hole 41 and faces the electronic element 3, the large air guiding cover 7 is welded on the side of the vapor chamber 4, the heat dissipation wind generated by the fan A is guided to the heat dissipation air guiding hole 41, the heat dissipation wind can be directly blown to the electronic element 3 from the air outlet 42 through the heat dissipation air guiding hole 41, so as to take away the heat generated by the electronic element 3, thereby realizing the direct heat dissipation of the electronic element 3 and improving the heat dissipation efficiency of the electronic element 3.

[0032] Of course, the above only describes the specific embodiments of the present application, and does not limit the scope of the present application, and equivalent changes or modifications made according to the structure, features and principles described in the patent application of the present application shall be included in the patent application of the present application.

Claims

1. A radiator module with a novel vapor chamber structure, comprising at least one heat dissipation fin group (1) for heat conduction, at least one heat dissipation pipe (2) penetrating through the heat dissipation fin group (1), and a vapor chamber (4) arranged on one side of the heat dissipation fin group (1) and used for contacting and conducting heat with an electronic component (3), characterized in that: the vapor chamber (4) is provided with a plurality of heat dissipation air guide holes (41) extending through the side edge, the side edge of the vapor chamber (4) is provided with a plurality of air guide covers (7) facing the heat dissipation fin group (1) and used for guiding the heat dissipation air into the heat dissipation air guide holes (41), and the bottom of the vapor chamber (4) is provided with at least one air outlet (42) communicating with the heat dissipation air guide holes (41) and blowing the heat dissipation air to the electronic component (3). The air guide cover (7) is fixed on the vapor chamber (4), one end of the heat dissipation air guide hole (41) corresponds to the air guide cover (7), and the other end of the heat dissipation air guide hole (41) communicates with the air outlet (42).

2. The heat spreader module of claim 1, wherein: The heat dissipation air guide holes (41) are provided with two through-holes at the front and back of the vapor chamber (4), and the front end and the rear end of the vapor chamber (4) are correspondingly provided with two air guide covers (7) located at the end of the heat dissipation air guide hole (41); the heat dissipation air guide holes (41) are also provided with two through-holes at the left and right of the vapor chamber (4), and the left side and the right side of the vapor chamber (4) are correspondingly provided with two air guide covers (7) located at the end of the heat dissipation air guide hole (41); and the bottom of the vapor chamber (4) is provided with two air outlets (42) and located in the middle of the heat dissipation air guide hole (41).

3. The heat spreader module of claim 2, wherein: The air outlet (42) is provided with two parallel air outlets (42), which are in strip shape; wherein two heat dissipation air guide holes (41) are arranged in parallel across two air outlets (42), and the other two heat dissipation air guide holes (41) pass through the two air outlets (42) respectively.

4. The heat spreader module of claim 3, wherein: The vapor chamber (4) comprises an upper plate body (401) and a lower plate body (402), wherein the heat dissipation air guide hole (41) is located between the upper plate body (401) and the lower plate body (402), the air outlet (42) is located on the lower plate body (402), and the air guide cover (7) is fixed on the lower plate body (402).

5. The radiator module with a novel vapor chamber structure according to claim 1, characterized in that: The vapor chamber (4) is a copper plate, and the side of the vapor chamber (4) is further provided with a heat conduction member (5), which is a stamping folded plate and is provided with at least two second positioning columns (51) for fixing the PCB (30) of the electronic component (3).

6. The heat spreader module of any one of claims 1-5, wherein: The heat dissipation pipe (2) is arranged in a plurality of rows, and the heat dissipation pipe (2) is located between the heat dissipation fin group (1) and the vapor chamber (4) and is flush with the end face of the vapor chamber (4); the heat dissipation fin group (1) is provided with two parallel heat dissipation fin groups (1), and the two heat dissipation fin groups (1) are connected and fixed by a connecting plate (6), and the heat dissipation pipe (2) penetrates through the two heat dissipation fin groups (1).

7. The heat spreader module of claim 6, wherein: The heat dissipation fin group (1) is provided with a first heat conduction surface (11) in the contact area with the heat conduction member (5), the fins in the heat dissipation fin group (1) are perpendicular to the first heat conduction surface (11), and the heat dissipation fin group (1) is provided with a plurality of U-shaped grooves (12) penetrating through the first heat conduction surface (11) and used for positioning the heat dissipation pipe (2).

8. The heat spreader module of claim 7 having a novel vapor chamber structure, wherein: ​ 9. The heat spreader module of claim 8, wherein: The connecting plates (6) are arranged in parallel and connect two heat dissipation fin groups (1) by welding, and the two connecting plates (6) are located on the two sides of the heat dissipation fin group (1) respectively.

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