Vacuum eutectic welding jig
By designing a vacuum eutectic welding fixture, the positioning problem of solder sheets and chips during eutectic welding is solved, achieving precise positioning and high-quality welding results.
Patent Information
- Application Number
- CN202422254522.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-14
- Publication Date
- 2025-10-28
- Estimated Expiration
- 2034-09-14
AI Technical Summary
During the ceramic packaging process, the positioning of the solder sheet and the chip is not precise and is prone to deviation. They are also prone to tilt or displacement when placed in the eutectic furnace, affecting the welding effect.
A vacuum eutectic soldering jig was designed, including a tube shell fixing jig and a solder sheet chip fixing jig. Through precise slot and hole design, the accurate positioning of the solder sheet and chip during eutectic reflow soldering was ensured to avoid tilting or displacement.
It improves the placement effect of solder sheets and chips, ensures precise positioning during eutectic reflow soldering, avoids tilting or displacement of solder sheets and chips, and improves soldering quality.
Smart Images

Figure CN223476529U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electrical component technology, specifically to a vacuum eutectic welding fixture. Background Technology
[0002] In the ceramic packaging process, graphite or ceramic fixtures are generally used to position the casing, and then solder pads and chips are placed in sequence. Finally, a vacuum reflow oven is used to perform eutectic bonding.
[0003] However, the size of both the solder pad and the chip is smaller than the size of the solder pad placement area on the package, which makes it impossible to accurately position the solder pad and the chip in the package, and deviations may occur. Furthermore, the chip needs to be placed very carefully and smoothly during the process of placing it into the eutectic furnace. If there is any shaking, the chip and solder pad may not be properly fixed in the mounting area.
[0004] Therefore, a vacuum eutectic bonding fixture for positioning solder pads and chips is needed. Summary of the Invention
[0005] This invention aims to solve the problem of solder pad and chip positioning during eutectic bonding. It provides a vacuum eutectic bonding fixture, which solves the positioning problem of chips smaller than 2cm*2cm during eutectic reflow bonding by using a solder pad and chip fixing fixture. During the process of placing the solder pad and chip into the eutectic furnace, there will be no tilting or displacement of the solder pad and chip, thus improving the chip and solder pad placement effect.
[0006] This utility model provides a vacuum eutectic welding fixture, including a tube shell fixing fixture and a solder chip fixing fixture;
[0007] The tube shell fixing fixture includes a tube shell fixing fixture body and a small groove connected to the tube shell fixing fixture body. The small groove is a recess.
[0008] The solder chip fixing fixture includes a solder chip fixing fixture body, a solder chip mounting hole connected in the solder chip fixing fixture body, and a first clearance groove connected outside the outer periphery of the solder chip mounting hole. The solder chip mounting hole is a through hole.
[0009] The tube shell to be welded includes a body, a first groove connected to the body, and a solder sheet assembly area recessed downward in the first groove;
[0010] The length and width of the main body are both smaller than the length and width of the small slot. The length and width of the solder chip fixing fixture body are both smaller than the length and width of the first groove. The length and width of the solder chip and the chip are both smaller than the length and width of the solder chip assembly area and the length and width of the solder chip mounting hole.
[0011] The tube shell to be welded is placed in the small slot, the solder chip fixing fixture is placed in the first groove, and the solder sheet and chip are placed in the solder chip mounting hole and the solder sheet assembly area in sequence.
[0012] In a preferred embodiment of the vacuum eutectic welding fixture described in this utility model, the body of the solder chip fixing fixture is a cuboid, the solder chip mounting hole is a square hole, and the first clearance groove is a circular through hole communicating with the solder chip mounting hole.
[0013] In a preferred embodiment of the vacuum eutectic welding fixture described in this utility model, the number of first clearance grooves is six: three at the top and three at the bottom.
[0014] In a preferred embodiment of the vacuum eutectic welding fixture described in this utility model, the material of the solder chip fixing fixture is graphite.
[0015] In a preferred embodiment of the vacuum eutectic welding fixture described in this utility model, the tube shell fixing fixture further includes a second clearance groove connected around and communicating with the small slot. The second clearance groove is a circular groove, and there are six of them.
[0016] In a preferred embodiment of the vacuum eutectic welding fixture described in this utility model, the material of the tube shell fixing fixture is graphite.
[0017] In a preferred embodiment of the vacuum eutectic welding fixture described in this utility model, the main body of the tube shell fixing fixture is a flat block shape, the number of small slots is at least two, and the number of solder chip fixing fixtures is the same as the number of small slots.
[0018] This utility model has the following advantages:
[0019] This invention solves the positioning problem of chips smaller than 2cm*2cm during eutectic reflow soldering by using a solder chip fixing fixture. During the process of placing the chip into the eutectic furnace, there will be no tilting or displacement of the solder chip or chip, thus improving the chip and solder chip placement effect. Attached Figure Description
[0020] Figure 1 A schematic diagram of a tube shell fixing fixture for a vacuum eutectic welding fixture;
[0021] Figure 2 This is an enlarged view of a small slot in a vacuum eutectic welding fixture;
[0022] Figure 3 A magnified view of a tube shell to be welded after it is placed into a tube shell fixing fixture for a vacuum eutectic welding fixture;
[0023] Figure 4 A schematic diagram of a solder chip fixing fixture for a vacuum eutectic welding fixture;
[0024] Figure 5 A partially enlarged view of a solder chip fixing fixture for a vacuum eutectic welding fixture being placed into a tube shell to be welded;
[0025] Figure 6 A cross-sectional view of a chip after welding a casing to be welded using a vacuum eutectic welding fixture;
[0026] Figure 7 This is a top-rear view of a chip being welded onto a tube shell using a vacuum eutectic welding fixture.
[0027] Figure label:
[0028] 1. Tube shell fixing fixture; 11. Tube shell fixing fixture body; 12. Small slot; 13. Second clearance slot; 2. Solder chip fixing fixture; 21. Solder chip fixing fixture body; 22. Solder chip mounting hole; 23. First clearance slot; 3. Tube shell to be welded; 31. Body; 32. First groove; 33. Solder assembly area; 4. Solder sheet; 5. Chip. Detailed Implementation
[0029] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.
[0030] Example 1
[0031] like Figures 1-7 As shown, a vacuum eutectic welding fixture includes a casing fixing fixture 1 and a solder chip fixing fixture 2.
[0032] The tube shell fixing fixture 1 includes a tube shell fixing fixture body 11, a small groove 12 connected to the tube shell fixing fixture body 11, and a second clearance groove 13 connected to and communicating with the small groove 12. The tube shell fixing fixture body 11 is flat and block-shaped, the small groove 12 is a groove arranged in 7 rows and 7 columns, and the second clearance groove 13 is a circular groove with six grooves. The tube shell fixing fixture 1 is made of graphite.
[0033] The solder chip fixing fixture 2 includes a solder chip fixing fixture body 21, a solder chip mounting hole 22 connected in the solder chip fixing fixture body 21, and a first clearance groove 23 connected outside the outer periphery of the solder chip mounting hole 22. The solder chip mounting hole 22 is a through hole.
[0034] The solder chip fixing fixture body 21 is a cuboid, the solder chip mounting hole 22 is a square hole, and the first clearance groove 23 is a circular through hole communicating with the solder chip mounting hole 22; there are six first clearance grooves 23, three at the top and three at the bottom; the solder chip fixing fixture 2 is made of graphite; there are 49 solder chip fixing fixtures 2;
[0035] The tube shell 3 to be welded includes a body 31, a first groove 32 connected to the body 31, and a solder sheet assembly area 33 recessed downward in the first groove 32;
[0036] The length and width of the body 31 are both smaller than the length and width of the small slot 12. The length and width of the solder chip fixing fixture body 21 are both smaller than the length and width of the first groove 32. The length and width of the solder sheet 4 and the chip 5 are both smaller than the length and width of the solder sheet assembly area 32 and the length and width of the solder chip mounting hole 22.
[0037] The tube shell 3 to be welded is placed in the small slot 12, the solder chip fixing fixture 2 is placed in the first groove 32, and the solder sheet 4 and chip 5 are placed in the solder chip mounting hole 22 and the solder sheet assembly area 33 in sequence.
[0038] In this embodiment, the length and width of the small slot 12 are 3.1cm, and the diameter of the second clearance slot 13 is 0.4cm; the solder chip fixing fixture body 21 is a 2.2cm*2.2cm cube with a depth of 0.7cm; the body 31 is 3.0cm*3.0cm, the first groove 32 is 2.3cm*2.3cm with a depth of 0.5cm, the solder assembly area 33 is 2.3cm*1.5cm with a depth of 0.7cm from the upper edge, the solder 4 is of type Au80Sn20 with a length of 1cm*1.5cm, and the chip 5 is 1cm*1.5cm long.
[0039] The method of use in this embodiment is as follows: place the tube shell 3 to be welded into the small slot 12, place the solder chip fixing fixture 2 into the first groove 32 of the tube shell 3 to be welded, and then place the solder chip 4 and the chip 5 in the solder chip mounting hole 22 in sequence. Then place it into the eutectic furnace for welding to obtain the finished product after welding the tube shell 3, solder chip 4 and chip 5.
[0040] The above is only a preferred specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the present invention can make equivalent replacements or changes based on the technical solution and utility model concept of the present invention, which should be covered by the protection scope of the present invention.
Claims
1. A vacuum eutectic welding fixture, characterized in that: Includes a casing fixing fixture (1) and a solder chip fixing fixture (2); The tube shell fixing fixture (1) includes a tube shell fixing fixture body (11) and a small groove (12) connected to the tube shell fixing fixture body (11), wherein the small groove (12) is a recess; The solder chip fixing fixture (2) includes a solder chip fixing fixture body (21), a solder chip mounting hole (22) connected in the solder chip fixing fixture body (21), and a first clearance groove (23) connected outside the outer periphery of the solder chip mounting hole (22). The solder chip mounting hole (22) is a through hole. The tube shell (3) to be welded includes a body (31), a first groove (32) connected to the body (31), and a solder sheet assembly area (33) recessed downward in the first groove (32); The length and width of the main body (31) are both smaller than the length and width of the small slot (12), the length and width of the solder chip fixing fixture body (21) are both smaller than the length and width of the first groove (32), and the length and width of the solder sheet (4) and the chip (5) are both smaller than the length and width of the solder sheet assembly area (33) and the length and width of the solder chip mounting hole (22). The tube shell to be welded (3) is placed in the small slot (12), the solder chip fixing fixture (2) is placed in the first groove (32), and the solder chip (4) and the chip (5) are placed in the solder chip mounting hole (22) and the solder chip assembly area (33) in sequence.
2. The vacuum eutectic welding fixture according to claim 1, characterized in that: The solder chip fixing fixture body (21) is a cuboid, the solder chip mounting hole (22) is a square hole, and the first clearance groove (23) is a circular through hole communicating with the solder chip mounting hole (22).
3. A vacuum eutectic welding fixture according to claim 2, characterized in that: The number of the first clearance grooves (23) is six, three at the top and three at the bottom.
4. The vacuum eutectic welding fixture according to claim 1, characterized in that: The solder chip fixing fixture (2) is made of graphite.
5. A vacuum eutectic welding fixture according to claim 1, characterized in that: The tube shell fixing fixture (1) further includes a second clearance groove (13) connected around the small slot (12) and communicating with the small slot (12). The second clearance groove (13) is a circular groove, and there are six of them.
6. A vacuum eutectic welding fixture according to claim 1, characterized in that: The tube shell fixing fixture (1) is made of graphite.
7. A vacuum eutectic welding fixture according to claim 1, characterized in that: The tube shell fixing fixture body (11) is flat and block-shaped, the number of the small slots (12) is at least two, and the number of the solder chip fixing fixtures (2) is the same as the number of the small slots (12).