Coated abrasive tool for low-bulk-density ceramic microcrystal abrasive material

Abstract

The utility model is applicable to the technical field of ceramic coated abrasive tools, and provides a coated abrasive tool for low-stacking-density ceramic microcrystal abrasive materials, which comprises an abrasive material layer structure, an adhesion base body fixedly connected to the upper end of the abrasive material layer structure, and a heat insulation layer structure fixedly connected to the upper end of the adhesion base body. First heat dissipation holes are formed in the outer wall face of the heat insulation layer structure, a mounting base body is fixedly connected to the upper end of the heat insulation layer structure, second heat dissipation holes are formed in the inner wall face of the abrasive material layer structure, ceramic abrasive material structures are fixedly connected to the lower end of the abrasive material layer structure, and chip removal channels are formed in adjacent gaps of the multiple sets of ceramic abrasive material structures. Through the arrangement of the heat insulation layer structure, the first heat dissipation holes and the second heat dissipation holes, the contact area of the abrasive material layer structure and the heat insulation layer structure with air is increased, the heat dissipation conduction area is large, and therefore heat dissipation of the coated abrasive tool is accelerated, and through the arrangement of the chip removal channel, waste chips generated during object grinding can be discharged.

Description

Technical Field

[0001] This utility model belongs to the field of ceramic coated abrasive technology, and particularly relates to a coated abrasive for low bulk density ceramic microcrystalline abrasives. Background Technology

[0002] Ceramic microcrystalline abrasive is a high-hardness, wear-resistant abrasive primarily used for precision grinding and polishing. Composed of tiny ceramic crystals, it possesses excellent wear resistance and stability, making it suitable for processing materials such as metals, glass, and ceramics. Due to its high hardness and durability, it plays a vital role in industrial manufacturing, surface treatment, and repair. Coated abrasives come in sheet-like (rectangular), disc-like, ring-like, and other special shapes (see color illustrations). The main types include abrasive cloth (paper) and abrasive belts. They are commonly used mechanically or manually and are widely applied to grinding, polishing, and sanding of metals, wood, ceramics, plastics, leather, rubber, and non-metallic materials such as paint and putty.

[0003] Existing ceramic microcrystalline coated abrasives have advantages such as wear resistance and high cutting efficiency, and are used for high-precision grinding operations.

[0004] When ceramic-coated abrasives are used for a long time, the temperature will rise due to friction, which will affect the grinding effect of the mold. In addition, the accumulation of grinding waste particles will also affect the grinding effect. Utility Model Content

[0005] The purpose of this invention is to provide a coated abrasive for low bulk density ceramic microcrystalline abrasives, aiming to solve the problems that when ceramic coated abrasives are used for a long time, the temperature rises due to friction, which affects the grinding effect of the mold, and the accumulation of grinding waste particles also affects the grinding effect.

[0006] This invention is implemented as follows: a coated abrasive for low-density ceramic microcrystalline abrasives includes an abrasive layer structure, an adhesive substrate fixedly connected to the upper end of the abrasive layer structure, a heat insulation layer structure fixedly connected to the upper end of the adhesive substrate, a first heat dissipation hole formed on the outer wall of the heat insulation layer structure, an mounting substrate fixedly connected to the upper end of the heat insulation layer structure, a second heat dissipation hole formed on the inner wall of the abrasive layer structure, and a ceramic abrasive structure fixedly connected to the lower end of the abrasive layer structure. Chip removal channels are provided between adjacent gaps of multiple sets of ceramic abrasive structures.

[0007] Preferably, a plurality of first heat dissipation holes are equidistantly distributed on the lower wall surface, end surface and free end surface of the heat insulation layer structure, and a plurality of second heat dissipation holes are distributed in a hierarchical manner on the inner wall surface, end surface and free end surface of the abrasive layer structure.

[0008] Preferably, the ceramic abrasive structure is wavy in shape, and the outer wall surface of the ceramic abrasive structure is provided with protruding sections and recessed sections respectively. The chip removal channel is rectangular in shape.

[0009] Preferably, the width of the plurality of ceramic abrasive structures is 2-5 mm, and the width of the plurality of chip removal channels is 2-4 mm.

[0010] Preferably, the abrasive layer structure and the mounting substrate are made of one of the following: paper substrate, cotton cloth, synthetic fiber cloth, nylon mesh, polyester fiber, and polyester film; the adhesive substrate is made of synthetic resin adhesive; and the heat insulation layer structure is made of polyethylene foam.

[0011] Preferably, the adhesive substrate is connected to the abrasive layer structure by spraying, and the heat insulation layer structure is connected to the adhesive substrate by spraying.

[0012] This invention provides a coated abrasive for low-density ceramic microcrystalline abrasive. The inclusion of ceramic microcrystalline abrasive enhances the wear resistance of the coated abrasive, resulting in better grinding performance on other materials, reducing material wear and replacement frequency. Furthermore, the ceramic microcrystalline abrasive exhibits good heat resistance, preventing deformation or thermal degradation even after prolonged grinding. It also possesses excellent corrosion resistance and oxidation resistance. Due to its low density, the ceramic microcrystalline abrasive reduces weight, lowers equipment load, and improves grinding efficiency. The inclusion of a heat insulation layer structure, first heat dissipation holes, and second heat dissipation holes increases the contact area between the abrasive layer and the air, maximizing heat dissipation and accelerating heat dissipation. The chip removal channel effectively discharges waste chips generated during grinding, preventing excessive accumulation between the coated abrasive and the workpiece, thus improving grinding efficiency. Attached Figure Description

[0013] Figure 1 A three-dimensional schematic diagram of a coated abrasive for low bulk density ceramic microcrystalline abrasive provided for an embodiment of this utility model;

[0014] Figure 2 A bottom perspective view of a coated abrasive for low bulk density ceramic microcrystalline abrasive provided for an embodiment of this utility model;

[0015] Figure 3 A side view of a coated abrasive for low-density ceramic microcrystalline abrasives provided for an embodiment of this utility model;

[0016] Figure 4A front view of a coated abrasive for low bulk density ceramic microcrystalline abrasive provided in an embodiment of this utility model;

[0017] Figure 5 An exploded view of a coated abrasive for low-density ceramic microcrystalline abrasives, provided as an embodiment of this utility model.

[0018] In the attached diagram: 1. Abrasive layer structure; 2. Adhesive substrate; 3. Heat insulation layer structure; 4. First heat dissipation hole; 5. Mounting substrate; 6. Second heat dissipation hole; 7. Ceramic abrasive structure; 8. Chip removal channel. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0020] The specific implementation of the present invention is described in detail below with reference to specific embodiments.

[0021] like Figures 1 to 5 As shown, an embodiment of the present invention provides a coated abrasive tool for low bulk density ceramic microcrystalline abrasives, including an abrasive layer structure 1, an adhesive substrate 2 fixedly connected to the upper end of the abrasive layer structure 1, a heat insulation layer structure 3 fixedly connected to the upper end of the adhesive substrate 2, a first heat dissipation hole 4 opened on the outer wall surface of the heat insulation layer structure 3, an mounting substrate 5 fixedly connected to the upper end of the heat insulation layer structure 3, a second heat dissipation hole 6 opened on the inner wall surface of the abrasive layer structure 1, a ceramic abrasive structure 7 fixedly connected to the lower end of the abrasive layer structure 1, and chip removal channels 8 provided between adjacent gaps of multiple sets of ceramic abrasive structures 7.

[0022] This utility model provides a coated abrasive for low-density ceramic microcrystalline abrasive. The inclusion of ceramic microcrystalline abrasive enhances the wear resistance of the coated abrasive, resulting in better grinding performance on other materials, reducing material wear and replacement frequency. Furthermore, the ceramic microcrystalline abrasive exhibits good heat resistance, preventing deformation or thermal degradation after prolonged grinding. It also possesses excellent corrosion resistance and oxidation resistance. Due to its low density, the ceramic microcrystalline abrasive reduces weight, lowers equipment load, and improves grinding efficiency. The inclusion of a heat insulation layer structure 3, a first heat dissipation hole 4, and a second heat dissipation hole 6 increases the contact area between the abrasive layer structure 1 and the heat insulation layer structure 3 and the air, maximizing heat dissipation and accelerating heat dissipation from the coated abrasive. The chip removal channel 8 effectively discharges waste chips generated during grinding, preventing excessive accumulation between the coated abrasive and the workpiece, thus improving grinding efficiency.

[0023] In this embodiment of the invention, during use, the ceramic abrasive structure 7 contacts the surface of the workpiece being ground and grinds it. Due to the function of the chip removal channel 8, the waste chips generated during grinding move along the chip removal channel 8 and eventually fall out, reducing friction between the coated abrasive and the ground product, improving the grinding effect on the product, and making its surface smooth. Moreover, the ceramic abrasive structure 7 has good high-temperature resistance and will not easily deform. The first heat dissipation hole 4 and the second heat dissipation hole 6 can increase the contact area between the abrasive layer structure 1 and the heat insulation layer structure 3 and the air, which has a good overall heat dissipation effect on the coated abrasive and reduces the probability of the coated abrasive deforming and breaking due to high temperature.

[0024] like Figure 1 and Figure 2 As shown, in a preferred embodiment of the present invention, a plurality of first heat dissipation holes 4 are equidistantly distributed on the lower wall surface, end surface and free end surface of the heat insulation layer structure 3, and a plurality of second heat dissipation holes 6 are distributed in order on the inner wall surface, end surface and free end surface of the abrasive layer structure 1.

[0025] Increasing the surface area in contact with air improves the efficiency of heat conduction, resulting in better heat dissipation for coated abrasives. This reduces the occurrence of high temperatures in coated abrasives and lowers the probability of cracking and deformation.

[0026] like Figure 2 and Figure 3 As shown, in a preferred embodiment of the present invention, the ceramic abrasive structure 7 is wavy in shape, and the outer wall surface of the ceramic abrasive structure 7 is provided with protruding sections and recessed sections respectively, and the chip removal channel 8 is rectangular in shape.

[0027] Specifically, in a preferred embodiment of this utility model, the width of the plurality of ceramic abrasive structures 7 is 2-5 mm, and the width of the plurality of chip removal channels 8 is 2-4 mm;

[0028] The ceramic abrasive structure 7, with its protruding and recessed sections, provides a large contact area with the workpiece, resulting in good stability during grinding. It also reduces the frictional resistance between the grinding chips and waste materials and the coated abrasive and the workpiece. The chip removal channel 8 effectively discharges the chips and waste materials, preventing the accumulation of large amounts of chips and waste materials from interfering with the coated abrasive and the ground product.

[0029] like Figure 1 , Figure 2 and Figure 5As shown, in a preferred embodiment of this utility model, the abrasive layer structure 1 and the mounting substrate 5 are made of one of the following: paper substrate, cotton cloth, synthetic fiber cloth, nylon mesh, polyester fiber, and polyester film; the adhesive substrate 2 is made of synthetic resin adhesive; and the heat insulation layer structure 3 is made of polyethylene foam.

[0030] Specifically, in a preferred embodiment of this utility model, the adhesive substrate 2 is connected to the abrasive layer structure 1 by spraying, and the heat insulation layer structure 3 is connected to the adhesive substrate 2 by spraying.

[0031] This allows ceramic microcrystalline abrasive coated abrasives to be used for grinding different products, and the overall structure is more firmly connected and has better stability.

[0032] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A coated abrasive for low bulk density ceramic microcrystalline abrasives, characterized in that, The abrasive layer structure (1) is fixedly connected to an adhesive substrate (2) at its upper end, and a heat insulation layer structure (3) is fixedly connected to the upper end of the adhesive substrate (2). A first heat dissipation hole (4) is opened on the outer wall surface of the heat insulation layer structure (3), and an installation substrate (5) is fixedly connected to the upper end of the heat insulation layer structure (3). A second heat dissipation hole (6) is opened on the inner wall surface of the abrasive layer structure (1). A ceramic abrasive structure (7) is fixedly connected to the lower end of the abrasive layer structure (1), and a chip removal channel (8) is provided between the adjacent gaps of multiple sets of ceramic abrasive structures (7).

2. The coated abrasive tool for low bulk density ceramic microcrystalline abrasives according to claim 1, characterized in that, Multiple first heat dissipation holes (4) are equidistantly distributed on the lower wall surface, end surface and free end surface of the heat insulation layer structure (3), and multiple second heat dissipation holes (6) are distributed in order on the inner wall surface, end surface and free end surface of the abrasive layer structure (1).

3. A coated abrasive for low-density ceramic microcrystalline abrasives according to claim 1, characterized in that, The ceramic abrasive structure (7) is wavy in shape, and the outer wall of the ceramic abrasive structure (7) is provided with protruding sections and recessed sections respectively. The chip removal channel (8) is rectangular in shape.

4. A coated abrasive for low-density ceramic microcrystalline abrasives according to claim 1, characterized in that, The width of the plurality of ceramic abrasive structures (7) is 2-5 mm, and the width of the plurality of chip removal channels (8) is 2-4 mm.

5. A coated abrasive for low-density ceramic microcrystalline abrasives according to claim 1, characterized in that, The abrasive layer structure (1) and the mounting substrate (5) are made of one of the following: paper substrate, cotton cloth, synthetic fiber cloth, nylon mesh, polyester fiber, and polyester film. The adhesive substrate (2) is made of synthetic resin adhesive. The heat insulation layer structure (3) is made of polyethylene foam.

6. A coated abrasive for low-density ceramic microcrystalline abrasives according to claim 1, characterized in that, The adhesive substrate (2) is connected to the abrasive layer structure (1) by spraying, and the heat insulation layer structure (3) is connected to the adhesive substrate (2) by spraying.

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