Chuck assembly and probe station

Abstract

The utility model provides a chuck assembly and a probe station. The chuck assembly comprises a supporting substrate, a side plate, a light transmitting part and a backlight assembly. The side plate is annularly arranged on the edge of the supporting substrate, a vacuum adsorption groove is formed in the side, away from the supporting substrate, of the side plate, and the vacuum adsorption groove corresponds to a to-be-detected wafer and is used for adsorbing and fixing the to-be-detected wafer. The light-transmitting part is used for bearing a wafer to be detected, the periphery of the light-transmitting part abuts against the side plate, and the light-transmitting part, the side plate and the supporting substrate define a containing space. The backlight assembly is arranged on the supporting substrate and arranged in the containing space, the light-transmitting piece is arranged corresponding to the light-emitting face of the backlight assembly, the backlight assembly is used for emitting visible light to the light-transmitting piece, and the visible light penetrates through the light-transmitting piece and is emitted to the wafer to be detected. For a wafer needing to be tested in an illumination environment, the backlight assembly is directly arranged in the chuck assembly, a backlight structure does not need to be additionally arranged, the structure of the chuck assembly is simplified, and meanwhile a backlight detection environment can be provided to detect the wafer to be detected.

Description

Technical Field

[0001] This application relates to the field of wafer inspection technology, and in particular to a chuck assembly and probe station. Background Art

[0002] Probe stations are widely used in the semiconductor, optoelectronic, integrated circuit, and packaging industries for testing. In a probe station, the chuck assembly is used to hold and hold wafers and chips during inspection.

[0003] However, in related technologies, for some wafers that need to be tested under illumination, the probe station needs to have a backlight structure set outside the chuck assembly, which makes the probe station structure more complex. Utility Model Content

[0004] The purpose of this application is to provide a chuck assembly and a probe station to solve the technical problem that for some wafers that need to be tested in an illuminated environment, the probe station needs to have a backlight structure set outside the chuck assembly, which makes the probe station structure more complex.

[0005] In a first aspect, this application provides a chuck assembly for carrying a wafer to be inspected, the chuck assembly comprising:

[0006] Support substrate;

[0007] The side plate is arranged around the edge of the supporting substrate. A vacuum adsorption groove is provided on the side of the side plate away from the supporting substrate. The vacuum adsorption groove is provided corresponding to the wafer to be tested and is used to adsorb and fix the wafer to be tested.

[0008] A light-transmitting element, used to support the wafer to be inspected, the outer periphery of the light-transmitting element abutting against the side plate, and the light-transmitting element, the side plate, and the supporting substrate enclosing a receiving space; and

[0009] A backlight assembly is disposed on the support substrate and within the receiving space. A light-transmitting element is disposed corresponding to the light-emitting surface of the backlight assembly. The backlight assembly is used to emit visible light to the light-transmitting element, and the visible light passes through the light-transmitting element and is emitted.

[0010] The chuck assembly provided in this application includes a support substrate, a side plate, a light-transmitting element, and a backlight assembly. The side plate surrounds the edge of the support substrate, and a vacuum adsorption groove is provided on the side of the side plate facing away from the support substrate. The vacuum adsorption groove is positioned corresponding to the wafer to be tested and is used to adsorb and fix the wafer to be tested. The light-transmitting element is used to support the wafer to be tested, and its outer periphery abuts against the side plate. The light-transmitting element, the side plate, and the support substrate together form a receiving space. The backlight assembly is disposed on the support substrate and within the receiving space. The light-transmitting element is positioned corresponding to the light-emitting surface of the backlight assembly, and the backlight assembly is used to emit visible light to the light-transmitting element. The visible light passes through the light-transmitting element and is emitted onto the wafer to be tested. For some wafers that need to be tested under illumination, this application directly places the backlight assembly within the chuck assembly, eliminating the need for an additional backlight structure. This simplifies the chuck assembly structure while ensuring that a backlit testing environment is provided for normal testing of the wafer to be tested.

[0011] The side plate has an air intake hole on the side away from the backlight assembly. The air intake hole is connected to the vacuum adsorption tank. The chuck assembly also includes a suction component, which is connected to the air intake hole and extracts air from the vacuum adsorption tank through the air intake hole, so that the air in the vacuum adsorption tank forms a negative pressure and adsorbs and fixes the wafer to be tested.

[0012] The suction port includes a first channel and a second channel that are connected to each other. The first channel is farther away from the receiving space than the second channel, and the second channel is connected to the first channel and the vacuum adsorption tank. The radial dimension of the second channel is smaller than that of the first channel. The inner walls of the first channel and the inner walls of the second channel form a limiting surface, which is used to limit the suction component.

[0013] The vacuum adsorption groove is arranged in a ring around the side plate, and the vacuum adsorption groove is at least partially disconnected to form a foolproof notch, which is used to align the wafer to be tested.

[0014] The distance α between the light-transmitting element and the backlight assembly satisfies: 5mm≤α≤15mm.

[0015] The thickness β of the light-transmitting element satisfies: 10mm≤β≤20mm, and the transmittance of the light-transmitting element is greater than or equal to 90%.

[0016] The side plate has a first stepped structure on the side facing the backlight assembly, and the stepped surface of the first stepped structure faces the supporting substrate. The stepped surface of the first stepped structure is used to limit the backlight assembly.

[0017] The side plate has a second stepped structure on the side facing the light-transmitting element. The stepped surface of the second stepped structure is away from the supporting substrate and is used to abut against and limit the light-transmitting element. A sealant is provided between the light-transmitting element and the second stepped structure.

[0018] The side plate is provided with multiple heat dissipation holes, which are respectively connected to the receiving space and the external environment. The heat dissipation holes are used to conduct heat in the receiving space to the external environment; and / or, the material of the supporting substrate includes a heat dissipation material, and the side of the supporting substrate away from the backlight assembly is provided with multiple heat sinks, which are used to conduct heat from the supporting substrate.

[0019] Secondly, this application provides a probe station, which includes the chuck assembly and a detection probe, the detection probe being used to detect the wafer to be tested on the chuck assembly.

[0020] The probe station provided in this application includes a chuck assembly comprising a support substrate, a side plate, a light-transmitting element, and a backlight assembly. The side plate surrounds the edge of the support substrate, and a vacuum adsorption groove is provided on the side of the side plate facing away from the support substrate. The vacuum adsorption groove is positioned corresponding to the wafer to be tested and is used to adsorb and fix the wafer to be tested. The light-transmitting element is used to support the wafer to be tested, and its outer periphery abuts against the side plate. The light-transmitting element, the side plate, and the support substrate together form a receiving space. The backlight assembly is disposed on the support substrate and within the receiving space. The light-transmitting element is positioned corresponding to the light-emitting surface of the backlight assembly, and the backlight assembly is used to emit visible light to the light-transmitting element. The visible light passes through the light-transmitting element and exits onto the wafer to be tested. For some wafers that need to be tested under illumination, this application directly places the backlight assembly within the chuck assembly, eliminating the need for an additional backlight structure. This simplifies the probe station structure while ensuring a backlit testing environment is provided for normal testing of the wafer to be tested. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of a chuck assembly structure provided in an embodiment of this application;

[0023] Figure 2 This is an exploded structural diagram of a chuck assembly provided in an embodiment of this application;

[0024] Figure 3This is a cross-sectional structural diagram of a chuck assembly provided in an embodiment of this application;

[0025] Figure 4 This is a schematic diagram of a chuck assembly including heat dissipation holes according to an embodiment of this application;

[0026] Figure 5 This is a schematic diagram of some key structural features of a chuck assembly provided in the embodiments of this application. Figure 1 ;

[0027] Figure 6 yes Figure 5 An enlarged view of the key structural diagram;

[0028] Figure 7 This is a schematic diagram of some key structural features of a chuck assembly provided in the embodiments of this application. Figure 2 ;

[0029] Figure 8 yes Figure 7 An enlarged view of the key structural diagram;

[0030] Figure 9 This is a schematic diagram of a probe station provided in an embodiment of this application.

[0031] Label Explanation:

[0032] Probe station-1, chuck assembly-100, support substrate-10, side plate-20, vacuum adsorption tank-21, suction hole-22, first channel-221, second channel-222, heat dissipation hole-23, first stepped structure-24, first stepped structure-25, light-transmitting element-30, backlight assembly-40. DETAILED DESCRIPTION

[0033] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0034] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.

[0035] In this specification, for convenience, terms such as "middle," "upper," "lower," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer" are used to indicate orientation or positional relationships in conjunction with the accompanying drawings. This is solely for the purpose of facilitating the description and simplification, and does not imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this disclosure. The positional relationships of the constituent elements may be appropriately varied depending on the orientation of the constituent elements being described. Therefore, the use of terms not limited to those described in the specification may be appropriately replaced as needed.

[0036] In this specification, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they may refer to a fixed connection, a detachable connection, or an integral connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection via an intermediate component, or a connection within two components. Those skilled in the art will understand the meaning of these terms in this disclosure as appropriate.

[0037] Probe stations are widely used in the semiconductor, optoelectronic, integrated circuit, and packaging industries for testing. In a probe station, the chuck assembly is used to hold and hold wafers and chips during inspection.

[0038] However, in related technologies, for some wafers that need to be tested under illumination, the probe station needs to have a backlight structure set outside the chuck assembly, which makes the probe station structure more complex.

[0039] Please refer to Figures 1 to 3 , Figure 1 This is a schematic diagram of a chuck assembly structure provided in an embodiment of this application. Figure 2 This is an exploded structural diagram of a chuck assembly provided in an embodiment of this application. Figure 3 This is a cross-sectional structural diagram of a chuck assembly provided in an embodiment of this application. This application provides a chuck assembly 100 and a probe station 1 to solve the technical problem that for some wafers that need to be tested under illumination, the probe station needs to have a backlight structure set outside the chuck assembly, making the probe station structure relatively complex.

[0040] In a first aspect, this application provides a chuck assembly 100 for carrying a wafer to be tested. The chuck assembly 100 includes a support substrate 10, a side plate 20, a light-transmitting element 30, and a backlight assembly 40. The side plate 20 surrounds the edge of the support substrate 10, and a vacuum adsorption groove 21 is provided on the side of the side plate 20 away from the support substrate 10. The vacuum adsorption groove 21 is disposed corresponding to the wafer to be tested and is used to adsorb and fix the wafer to be tested. The light-transmitting element 30 is used to carry the wafer to be tested. The outer periphery of the light-transmitting element 30 abuts against the side plate 20, and the light-transmitting element 30, the side plate 20, and the support substrate 10 enclose a receiving space. The backlight assembly 40 is disposed on the support substrate 10 and within the receiving space. The light-transmitting element 30 is disposed corresponding to the light-emitting surface of the backlight assembly 40, and the backlight assembly 40 is used to emit visible light to the light-transmitting element 30. The visible light passes through the light-transmitting element 30 and is emitted.

[0041] Specifically, the support substrate 10 can be used to support the backlight assembly 40, and the support substrate 10 can be used to fix the backlight assembly 40. In this embodiment, the backlight assembly 40 is fixed to the support substrate 10 by a plurality of fasteners, including but not limited to screws. The support substrate 10 is provided with a plurality of threaded holes that cooperate with the plurality of fasteners to thread the backlight assembly 40 onto the support substrate 10. In other embodiments, the backlight assembly 40 can also be fixed to the support substrate 10 by means of adhesive, snap-fit ​​connection, etc., and this application does not limit this.

[0042] It should be noted that when the backlight assembly 40 is operating and emitting visible light, it generates a certain amount of heat. If this heat is not conducted and dissipated, the temperature of the chuck assembly 100 may become too high, reducing the lifespan of the backlight assembly 40 and affecting its luminous efficiency and the detection effect of the wafer under test. In one embodiment, the support substrate 10 is made of a heat-dissipating material, which can be used to conduct the heat generated by the backlight assembly 40 during operation. Optionally, in this embodiment, the support substrate 10 is made of a copper alloy. In other embodiments, the support substrate 10 may be made of materials with good heat dissipation properties, including but not limited to copper, aluminum, silicon carbide, and alumina. This application does not impose any limitations on this.

[0043] Furthermore, in one embodiment, the supporting substrate 10 is provided with a plurality of heat sinks on the side opposite to the backlight assembly 40, and the plurality of heat sinks are spaced apart. The heat sinks are used to conduct heat from the supporting substrate 10 and conduct heat to the external environment, thereby reducing the heat of the supporting substrate 10 and the backlight assembly 40, so that the backlight assembly 40 can operate normally and stably, improving the service life of the backlight assembly 40, improving the luminous efficiency of the backlight assembly 40 and the detection effect of the wafer under test. Optionally, the number of heat sinks can be 1 to 200. For example, the number of heat sinks can be 1, 5, 10, 20, 30, 40, 50, 60, 80, 100, 110, 120, 140, 150, 170, 180, 190, 200, or other values ​​within the range of 1 to 200. This application does not limit this number.

[0044] The chuck assembly 100 of this application further includes a side plate 20, which surrounds the edge of the support base plate 10 and extends along the axial direction of the support base plate 10. The side plate 20 is fixed to the support base plate 10. Optionally, in this embodiment, the side plate 20 is fixed to the support base plate 10 by a plurality of fasteners, including but not limited to screws. The support base plate 10 has a plurality of threaded holes that cooperate with the plurality of fasteners to thread the side plate 20 onto the support base plate 10. In other embodiments, the side plate 20 can also be fixed to the support base plate 10 by means of adhesive, snap-fit ​​connection, etc., and this application does not limit this. The side plate 20 is made of a material with high hardness and high stability. Optionally, in this embodiment, the side plate 20 is made of Invar 4J36 (low expansion iron-nickel alloy). In other embodiments, the side plate 20 can also be made of other metals or polymer materials, and this application does not limit this.

[0045] Please refer to Figure 4 , Figure 4This is a schematic diagram of a chuck assembly including heat dissipation holes according to an embodiment of this application. Further, in one embodiment, the side plate 20 is provided with a plurality of heat dissipation holes 23, and the heat dissipation holes 23 are respectively connected to the receiving space and the external environment. The heat dissipation holes 23 are used to conduct heat from the receiving space to the external environment, further reducing the heat of the support substrate 10 and the backlight assembly 40, so that the backlight assembly 40 can operate normally and stably, improving the service life of the backlight assembly 40, improving the luminous efficiency of the backlight assembly 40, and improving the detection effect of the wafer under test. Optionally, the number of heat dissipation holes 23 can be 1 to 50. For example, the number of heat dissipation holes 23 can be 1, 5, 10, 15, 17, 20, 22, 24, 28, 30, 35, 38, 40, 45, 50, or other values ​​within the range of 1 to 50. This application does not limit this number.

[0046] It should be noted that, in one embodiment, the material of the supporting substrate 10 may include a heat dissipation material. The supporting substrate 10 has multiple heat sinks on the side away from the backlight assembly 40, and the side plate 20 also has multiple heat dissipation holes 23, thereby maximizing the heat dissipation effect on the backlight assembly 40.

[0047] The chuck assembly 100 of this application further includes a light-transmitting element 30. The outer periphery of the light-transmitting element 30 abuts against and is fixed to the side plate 20. Specifically, a sealant can be applied between the light-transmitting element 30 and the side plate 20, and the light-transmitting element 30 is fixed to the side plate 20 by adhesive. The light-transmitting element 30 is spaced apart from the support substrate 10, and the side of the light-transmitting element 30 facing away from the support substrate 10 is used to carry the wafer to be tested. The light-transmitting element 30 can transmit visible light emitted by the backlight assembly 40 and illuminate the wafer to be tested, so that the wafer to be tested can be tested in a backlit environment.

[0048] Optionally, in this embodiment, the light-transmitting element 30 is tempered glass. In other embodiments, the light-transmitting element 30 may also be made of a material with high light transmittance, such as light-transmitting plastic or optical resin.

[0049] The chuck assembly 100 of this application further includes a backlight assembly 40. In this embodiment, the backlight assembly 40 is used to emit visible light, which is white light. In other embodiments, the visible light can also be other colors of light, such as blue light, red light, green light, etc., and this application does not impose any limitations on this. In this embodiment, the operating voltage of the backlight assembly 40 is 5V-24V. Optionally, the operating voltage of the backlight assembly 40 can be 5V, 6V, 7V, 8V, 10V, 12V, 15V, 17V, 19V, 20V, 22V, 23V, 24V, or other values ​​between 5V and 24V, and this application does not impose any limitations on this. In this embodiment, the output power of the backlight component 40 is 10W-60W. Optionally, the output power of the backlight component 40 can be 10W, 15W, 20W, 25W, 30W, 35W, 40W, 45W, 50W, 55W, 60W, or other values ​​within the range of 10W-60W. This application does not impose any restrictions on this.

[0050] The chuck assembly 100 provided in this application includes a support substrate 10, a side plate 20, a light-transmitting element 30, and a backlight assembly 40. The side plate 20 surrounds the edge of the support substrate 10, and a vacuum adsorption groove 21 is provided on the side of the side plate 20 away from the support substrate 10. The vacuum adsorption groove 21 is positioned corresponding to the wafer to be tested and is used to adsorb and fix the wafer to be tested. The light-transmitting element 30 is used to support the wafer to be tested, and the outer periphery of the light-transmitting element 30 abuts against the side plate 20. The light-transmitting element 30, the side plate 20, and the support substrate 10 together form a receiving space. The backlight assembly 40 is disposed on the support substrate 10 and within the receiving space. The light-transmitting element 30 is positioned corresponding to the light-emitting surface of the backlight assembly 40, and the backlight assembly 40 is used to emit visible light to the light-transmitting element 30. The visible light passes through the light-transmitting element 30 and is emitted onto the wafer to be tested. For some wafers that need to be tested under illumination, this application directly sets the backlight component 40 inside the chuck component 100, without the need for an additional backlight structure. This simplifies the structure of the chuck component 100 while ensuring that a backlit testing environment can be provided for normal testing of the wafer to be tested.

[0051] Furthermore, the backlight assembly 40 includes, but is not limited to, a surface light source or a point light source. In this embodiment, the backlight assembly 40 is a surface light source so that the light emitted by the backlight assembly 40 can illuminate the entire wafer to be tested, so that the difference in illumination intensity between any position, any adjacent position, or any different position of the wafer to be tested is small, thereby improving the detection effect of the wafer to be tested.

[0052] It should be noted that the visible light emitted by the backlight assembly 40 needs to directly hit the light-transmitting element 30 and then onto the wafer to be tested. If the distance between the backlight assembly 40 and the light-transmitting element 30 is greater than 15mm, the visible light emitted by the backlight assembly 40 is prone to refraction and scattering, which is not conducive to providing a uniform light source for the wafer to be tested. If the distance between the backlight assembly 40 and the light-transmitting element 30 is less than 5mm, it is not conducive to the uniformity of the visible light emitted by the backlight assembly 40. Therefore, in this embodiment, the distance α between the light-transmitting element 30 and the backlight assembly 40 satisfies: 5mm ≤ α ≤ 15mm. This avoids the problems of refraction and scattering of the visible light emitted by the backlight assembly 40 and also ensures a certain degree of uniformity in the visible light emitted by the backlight assembly 40. Optionally, the distance α between the light-transmitting element 30 and the backlight assembly 40 can be 5mm, 6mm, 7mm, 8mm, 9mm, 10mm, 11mm, 12mm, 13mm, 14mm, 15mm, or other values ​​within the range of 5mm-15mm.

[0053] It should be noted that the visible light emitted by the backlight assembly 40 needs to pass through the thickness of the light-transmitting element 30 and be projected onto the wafer to be tested. If the thickness of the light-transmitting element 30 is greater than 20 mm, the light transmittance of the light-transmitting element 30 is low, affecting the efficiency of the visible light emitted by the backlight assembly 40 passing through the light-transmitting element 30; if the thickness of the light-transmitting element 30 is less than 10 mm, the hardness of the light-transmitting element 30 is low, which is not conducive to improving the stability of supporting the wafer to be tested. Therefore, in this embodiment, the thickness β of the light-transmitting element 30 satisfies: 10 mm ≤ β ≤ 20 mm, which can avoid low light transmittance of the light-transmitting element 30 and ensure high stability for supporting the wafer to be tested. Optionally, the thickness β of the light-transmitting element 30 can be 10mm, 11mm, 12mm, 13mm, 14mm, 15mm, 16mm, 17mm, 19mm, 20mm, or other values ​​within the range of 10mm≤β≤20mm.

[0054] In this embodiment, the transmittance of the light-transmitting element 30 is greater than or equal to 90%. Optionally, the transmittance of the light-transmitting element 30 can be 90%, 91%, 92%, 93%, 94%, 95%, 96%, 97%, 98%, 99%, or other values ​​greater than or equal to 90%.

[0055] Please refer to Figure 5 and Figure 6 , Figure 5This is a schematic diagram of some key structural features of a chuck assembly provided in the embodiments of this application. Figure 1 , Figure 6 yes Figure 5 Enlarged view of the key structural schematic diagram. In one embodiment, the side plate 20 has a first stepped structure 24 on the side facing the backlight assembly 40, the stepped surface of the first stepped structure 24 facing the support substrate 10, and the stepped surface of the first stepped structure 24 is used to limit the backlight assembly 40.

[0056] Please refer to Figure 5 and Figure 6 In one embodiment, the side plate 20 is provided with a second stepped structure 25 on the side facing the light-transmitting member 30. The stepped surface of the second stepped structure 25 is away from the supporting substrate 10, and the stepped surface of the second stepped structure 25 is used to abut against and limit the light-transmitting member 30. The sealant is provided between the light-transmitting member 30 and the second stepped structure 25.

[0057] In this embodiment, the light-transmitting element 30 is fixed to the side plate 20 by means of a sealing element. In other embodiments, the light-transmitting element 30 can also be tightly fitted to the side plate 20 for fixation. This application does not limit this.

[0058] It should be noted that, in this embodiment, the installation steps of the chuck assembly 100 are as follows: first, the backlight assembly 40 is fixed to the support substrate 10; then, the side plate 20 is fixed to the support substrate 10 and the backlight assembly 40 is limited. The backlight assembly 40 is fixed to the support substrate 10 and limited by the side plate 20, which can further improve the fixing stability of the backlight assembly 40; finally, the light-transmitting element 30 is fixed to the side plate 20 to realize the overall installation of the chuck assembly 100.

[0059] Please refer to Figure 7 and Figure 8 , Figure 7 This is a schematic diagram of some key structural features of a chuck assembly provided in the embodiments of this application. Figure 2 , Figure 8 yes Figure 7 An enlarged view of the key structural schematic diagram. In one embodiment, the side plate 20 has an air suction hole 22 on the side opposite to the backlight assembly 40. The air suction hole 22 is connected to the vacuum adsorption tank 21. The chuck assembly 100 also includes a suction member, which is connected to the air suction hole 22 and extracts air from the vacuum adsorption tank 21 through the air suction hole 22, so that the air in the vacuum adsorption tank 21 forms a negative pressure and adsorbs and fixes the wafer to be tested.

[0060] It should be noted that, in this embodiment, the radial dimension of the wafer to be tested is larger than the radial dimension of the vacuum adsorption tank 21, so that the vacuum adsorption tank 21 can adsorb and fix the wafer to be tested. Furthermore, the radial dimension of the side plate 20 is larger than the radial dimension of the wafer to be tested, to protect the wafer from damage caused by impacts from external objects. Optionally, this application does not impose specific limitations on the radial dimensions of the wafer to be tested, the vacuum adsorption tank 21, or the side plate 20.

[0061] Please refer to Figure 7 and Figure 8 In one embodiment, the vacuum adsorption groove 21 is arranged around the side plate 20, and the vacuum adsorption groove 21 is at least partially disconnected to form a foolproof notch, which is used to align the wafer to be tested.

[0062] Please refer to Figure 7 and Figure 8 In one embodiment, the suction port 22 includes a first channel 221 and a second channel 222 that are connected. The first channel 221 is away from the receiving space relative to the second channel 222, and the second channel 222 is connected to the first channel 221 and the vacuum adsorption groove 21 respectively. The radial dimension of the second channel 222 is smaller than that of the first channel 221. The inner wall of the first channel 221 and the inner wall of the second channel 222 form a limiting surface, which is used to limit the suction component.

[0063] Please refer to Figure 9 , Figure 9 This is a schematic diagram of a probe station provided in an embodiment of this application. This application also provides a probe station 1, which includes the chuck assembly 100 and a detection probe, the detection probe being used to detect the wafer to be tested on the chuck assembly 100.

[0064] In the probe station 1 provided in this application, the chuck assembly 100 includes a support substrate 10, a side plate 20, a light-transmitting element 30, and a backlight assembly 40. The side plate 20 surrounds the edge of the support substrate 10, and a vacuum adsorption groove 21 is provided on the side of the side plate 20 away from the support substrate 10. The vacuum adsorption groove 21 is provided corresponding to the wafer to be tested and is used to adsorb and fix the wafer to be tested. The light-transmitting element 30 is used to support the wafer to be tested. The outer periphery of the light-transmitting element 30 abuts against the side plate 20, and the light-transmitting element 30, the side plate 20, and the support substrate 10 enclose a receiving space. The backlight assembly 40 is disposed on the support substrate 10 and within the receiving space. The light-transmitting element 30 is provided corresponding to the light-emitting surface of the backlight assembly 40. The backlight assembly 40 is used to emit visible light to the light-transmitting element 30, and the visible light passes through the light-transmitting element 30 and is emitted onto the wafer to be tested. For some wafers that need to be tested under illumination, this application directly sets the backlight component 40 inside the chuck component 100, without the need for an additional backlight structure. This simplifies the structure of the probe station 1 while ensuring that a backlit testing environment can be provided for normal testing of the wafer to be tested.

[0065] In this application, the terms "embodiment" and "implementation" mean that a specific feature, structure, or characteristic described in connection with an embodiment can be included in at least one embodiment of this application. The appearance of these phrases in various locations throughout the specification does not necessarily refer to the same embodiment, nor are they independent or alternative embodiments mutually exclusive with other embodiments. Those skilled in the art will understand, explicitly and implicitly, that the embodiments described in this application can be combined with other embodiments. Furthermore, it should be understood that the features, structures, or characteristics described in the various embodiments of this application can be arbitrarily combined to form another embodiment that does not depart from the spirit and scope of the technical solution of this application, provided there is no contradiction between them.

[0066] The above description represents some embodiments of this application. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of this application, and these improvements and modifications are also considered to be within the scope of protection of this application.

Claims

1. A chuck assembly for carrying a wafer to be inspected, characterized in that, The chuck assembly includes: Support substrate; The side plate is arranged around the edge of the supporting substrate. A vacuum adsorption groove is provided on the side of the side plate away from the supporting substrate. The vacuum adsorption groove is provided corresponding to the wafer to be tested and is used to adsorb and fix the wafer to be tested. A light-transmitting element, used to support the wafer to be inspected, the outer periphery of the light-transmitting element abutting against the side plate, and the light-transmitting element, the side plate, and the supporting substrate enclosing a receiving space; and A backlight assembly is disposed on the support substrate and within the receiving space. A light-transmitting element is disposed corresponding to the light-emitting surface of the backlight assembly. The backlight assembly is used to emit visible light to the light-transmitting element, and the visible light passes through the light-transmitting element and is emitted.

2. The chuck assembly according to claim 1, characterized in that, The side plate is provided with an air intake hole on the side opposite to the backlight assembly. The air intake hole is connected to the vacuum adsorption tank. The chuck assembly also includes a suction component, which is connected to the air intake hole and extracts air from the vacuum adsorption tank through the air intake hole, so that the air in the vacuum adsorption tank forms a negative pressure and adsorbs and fixes the wafer to be tested.

3. The chuck assembly according to claim 2, characterized in that, The suction port includes a first channel and a second channel that are connected. The first channel is farther away from the receiving space than the second channel, and the second channel is connected to the first channel and the vacuum adsorption tank. The radial dimension of the second channel is smaller than that of the first channel. The inner walls of the first channel and the inner walls of the second channel form a limiting surface, which is used to limit the suction component.

4. The chuck assembly according to claim 2, characterized in that, The vacuum adsorption groove is arranged in a ring around the side plate, and the vacuum adsorption groove is at least partially disconnected to form a foolproof notch, which is used to align the wafer to be tested.

5. The chuck assembly according to claim 1, characterized in that, The distance α between the light-transmitting element and the backlight assembly satisfies: 5mm≤α≤15mm.

6. The chuck assembly according to claim 1, characterized in that, The thickness β of the light-transmitting element satisfies: 10mm≤β≤20mm, and the transmittance of the light-transmitting element is greater than or equal to 90%.

7. The chuck assembly according to claim 1, characterized in that, The side plate has a first stepped structure on the side facing the backlight assembly, the stepped surface of the first stepped structure facing the supporting substrate, and the stepped surface of the first stepped structure is used to limit the backlight assembly.

8. The chuck assembly according to claim 1, characterized in that, The side plate has a second stepped structure on the side facing the light-transmitting element. The stepped surface of the second stepped structure is away from the supporting substrate, and the stepped surface of the second stepped structure is used to abut against and limit the light-transmitting element. A sealant is provided between the light-transmitting element and the second stepped structure.

9. The chuck assembly according to claim 1, characterized in that, The side plate is provided with a plurality of heat dissipation holes, and the heat dissipation holes are respectively connected to the receiving space and the external environment. The heat dissipation holes are used to conduct heat in the receiving space to the external environment; and / or, the material of the supporting substrate includes a heat dissipation material, and the side of the supporting substrate away from the backlight assembly is provided with a plurality of heat sinks, the heat sinks being used to conduct heat from the supporting substrate.

10. A probe station, characterized in that, The probe station includes a chuck assembly and a detection probe as described in any one of claims 1-9, wherein the detection probe is used to detect the wafer to be tested on the chuck assembly.

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