Wafer positioning device of gluing developer

Abstract

The wafer positioning device comprises a developing machine and a wafer, a mounting seat is arranged in the developing machine, a fixed frame is fixedly mounted in the mounting seat, a rotating ring is rotatably mounted in the mounting seat, a mounting ring is sleeved on the rotating ring, inner teeth and outer teeth are arranged on the mounting ring, and the inner teeth and the outer teeth are arranged on the mounting ring. A plurality of groups of adjusting frames which are annularly distributed are arranged on the mounting seat, the plurality of groups of adjusting frames are rotationally connected with the mounting seat through mounting rods, the mounting rods are sleeved with gears, the gears are in meshed connection with the mounting rings through outer teeth, and mounting cylinders are rotationally mounted on the adjusting frames; the mounting cylinder is sleeved with two groups of torsion springs which are symmetrically distributed, the mounting cylinder is sleeved with a sleeve, the sleeve with large friction force and the torsion springs counteract the tendency of self-rotation of the wafer caused by centrifugal force, and the situation that the wafer slides relative to the sleeve, and then the outer ring of the wafer is abraded is avoided.

Description

Technical Field

[0001] This utility model relates to the field of coating and developing machine technology, specifically a wafer positioning device for a coating and developing machine. Background Technology

[0002] Photoresist coating and developing equipment is an important piece of equipment in the photolithography process, working in conjunction with the photolithography machine. Before exposure, the photoresist coating machine coats the photoresist; then the photolithography machine exposes the photoresist; after exposure, the developing equipment develops the photolithographic pattern. The photoresist coating and developing machine serves as the input and output of the photolithography machine, mainly using a robotic arm to transfer and process the wafer between various systems, thereby completing the photoresist coating, curing, developing, and hardening processes of the wafer. To ensure the processing quality of the wafer during each process, accurate positioning is required.

[0003] In the prior art, the wafer positioning device of the coating and developing machine is subject to wear during long-term use. When the wear is significant, the positioning force of the positioning device on the wafer differs from the set value, which can easily cause damage to the outer ring of the wafer during the wafer positioning process. Furthermore, after the wafer is positioned, it is prone to slippage under the centrifugal force during the coating process of the developing machine, which may cause potential rigid wear on the wafer. Utility Model Content

[0004] The purpose of this invention is to provide a wafer positioning device for a coating and developing machine to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a wafer positioning device for a coating and developing machine, comprising a developing machine and a wafer, wherein the developing machine is provided with a mounting base, a fixing frame is fixedly installed in the mounting base, a rotating ring is rotatably installed in the mounting base, a mounting ring is sleeved on the rotating ring, the mounting ring is provided with internal teeth and external teeth, the mounting base is provided with multiple sets of annularly distributed adjusting frames, the multiple sets of adjusting frames are rotatably connected to the mounting base through mounting rods, gears are sleeved on the mounting rods, the gears are meshed with the mounting rings through external teeth, a mounting cylinder is rotatably installed on the adjusting frame, two sets of symmetrically distributed torsion springs are sleeved on the mounting cylinder, sleeves are sleeved on the mounting cylinder, the multiple sets of sleeves are all in contact with the outer ring of the wafer, four sets of symmetrically distributed damping rods are provided between the sleeves and the mounting cylinder, and four sets of symmetrically distributed vacuum suction cups are provided in the fixing frame.

[0006] As a further preferred embodiment of this technical solution, a drive wheel is rotatably mounted on the mounting base, the drive wheel is connected to the mounting ring through internal teeth, and the two ends of the torsion spring are fixedly connected to the mounting cylinder and the adjusting bracket, respectively.

[0007] As a further preferred embodiment of this technical solution, the two ends of the damping rod are fixedly connected to the sleeve and the mounting sleeve, respectively, and a spring is sleeved on the damping rod, with the two ends of the spring being fixedly connected to the two ends of the damping rod, respectively.

[0008] As a further preferred embodiment of this technical solution, an adjusting block is fixedly installed below each of the four sets of vacuum suction cups. Two sets of symmetrically distributed first adjusting rods are slidably installed inside the fixed frame, and two sets of symmetrically distributed second adjusting rods are slidably installed inside the fixed frame. The first adjusting rods and the second adjusting rods are perpendicular to each other. The adjusting block is slidably sleeved with the two adjacent sets of first adjusting rods and the second adjusting rods, respectively.

[0009] As a further preferred embodiment of this technical solution, the fixed frame is provided with two sets of symmetrically distributed first bidirectional lead screws and second bidirectional lead screws. The first bidirectional lead screws and second bidirectional lead screws are vertically distributed, and the two ends of the first bidirectional lead screws and second bidirectional lead screws pass through the two sets of fixed frames respectively and are rotatably connected to the two sets of fixed frames respectively.

[0010] As a further preferred embodiment of this technical solution, the two ends of the first bidirectional lead screw pass through two sets of symmetrically distributed first adjusting rods and are threadedly connected to the two sets of first adjusting rods respectively. Synchronous pulleys are sleeved on both sets of the first bidirectional lead screws and the second bidirectional lead screw. Two sets of vertically distributed synchronous belts are provided in the fixed frame, and the synchronous belts are respectively connected to the corresponding two sets of synchronous pulleys for transmission.

[0011] As a further preferred embodiment of this technical solution, the two ends of the second bidirectional lead screw pass through two sets of symmetrically distributed second adjusting rods and are threadedly connected to the two sets of second adjusting rods respectively.

[0012] This utility model provides a wafer positioning device for a coating and developing machine, which has the following beneficial effects:

[0013] (1) This utility model uses a rotating ring, a mounting ring, and gears to adjust the angles of multiple mounting rods and adjustment frames, thereby adjusting the diameter of the enclosure between multiple mounting cylinders. This is used to fix wafers of different models. After the wafer is fixed, the outer ring of the wafer is in contact with the surface of the sleeve. During the process of the overall mounting base driving the wafer to rotate, the sleeve with high friction and the torsion spring counteract the tendency of the wafer to rotate due to centrifugal force, preventing the wafer from sliding relative to the sleeve and thus causing wear on the outer ring of the wafer. At the same time, the damping rod and spring prevent the adjustment frame from generating too much pressure on the wafer during the process of adjusting the enclosure of the sleeve, thus preventing damage to the outer ring of the wafer.

[0014] (2) This utility model uses the fixed frame and the two sets of first and second adjustment rods inside to adjust the distance between the four sets of adjustment blocks and the four sets of vacuum chucks, so that the four sets of vacuum chucks can adjust the position according to the actual size of the wafer. Under the action of the four sets of vacuum chucks, the mounting cylinder and sleeve are further fixed to the position of the wafer, and the centrifugal force during the wafer rotation will not cause relative sliding between the wafer and the mounting cylinder, resulting in rigid wear of the outer ring of the wafer. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0016] Figure 2 This is a schematic diagram of the mounting base of this utility model;

[0017] Figure 3 This is a schematic diagram of the structure of the adjustment frame of this utility model;

[0018] Figure 4 For the present utility model Figure 3 Enlarged view of the structure at point A;

[0019] Figure 5 This is a schematic diagram of the structure of the vacuum suction cup of this utility model;

[0020] Figure 6 For the present utility model Figure 5 Enlarged view of the structure at point -B;

[0021] In the diagram: 1. Developer; 2. Mounting base; 3. Wafer; 4. Fixing frame; 5. Vacuum chuck; 6. Rotary ring; 7. Mounting ring; 8. Internal gear; 9. External gear; 10. Drive wheel; 11. Mounting rod; 12. Gear; 13. Adjusting frame; 14. Mounting cylinder; 15. Torsion spring; 16. Sleeve; 17. Damping rod; 18. Spring; 19. Adjusting block; 20. First adjusting rod; 21. Second adjusting rod; 22. First double-acting lead screw; 23. Second double-acting lead screw; 24. Synchronous pulley; 25. Synchronous belt. Detailed Implementation

[0022] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0023] This utility model provides a technical solution: such as Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, in this embodiment, a wafer positioning device for a coating and developing machine includes a developing machine 1 and a wafer 3. The developing machine 1 has a mounting base 2, a fixed frame 4 is fixedly installed inside the mounting base 2, and a rotating ring 6 is rotatably installed inside the mounting base 2. A mounting ring 7 is sleeved on the rotating ring 6, and the mounting ring 7 has internal teeth 8 and external teeth 9. The mounting base 2 has multiple sets of annularly distributed adjusting frames 13, all of which are rotatably connected to the mounting base 2 via mounting rods 11. Gears 12 are sleeved on the mounting rods 11, and the gears 12 mesh with the mounting ring 7 via external teeth 9. The adjusting frames 13... A mounting cylinder 14 is rotatably mounted, with two sets of symmetrically distributed torsion springs 15 fitted onto it. Sleeves 16 are fitted onto the mounting cylinder 14, and multiple sets of sleeves 16 are in contact with the outer ring of the wafer 3. Four sets of symmetrically distributed damping rods 17 are provided between the sleeves 16 and the mounting cylinder 14. Four sets of symmetrically distributed vacuum suction cups 5 are provided inside the fixing frame 4. The motor inside the mounting base 2 drives the drive wheel 10 to rotate, which, in conjunction with the internal gear 8, causes the mounting ring 7 to drive the rotating ring 6 to rotate. Under the cooperation of the external gear 9 and the gear 12, multiple sets of mounting rods 11 drive the adjusting frame 13 to rotate. The cylinder 14 rotates synchronously with the adjusting frame 13, adjusting the radius of the area enclosed by the multiple sets of sleeves 16, so that the sleeves 16 on each set of mounting cylinders 14 are fully fitted with the outer surface of the wafer 3 to be fixed, thus completing the fixation of the wafer 3. A drive wheel 10 is rotatably mounted on the mounting base 2, and the drive wheel 10 is connected to the mounting ring 7 through the internal teeth 8. The two ends of the torsion spring 15 are fixedly connected to the mounting cylinder 14 and the adjusting frame 13 respectively. The two ends of the damping rod 17 are fixedly connected to the sleeves 16 and the mounting cylinder 14 respectively, and a spring 18 is sleeved on the damping rod 17. The two ends of the spring 18 are fixedly connected to the two ends of the damping rod 17, respectively. The sleeve 16 is made of a material with high frictional resistance. During the process of the overall mounting base 2 driving the wafer 3 to rotate, the sleeve 16 with high friction and the torsion spring 15 counteract the tendency of the wafer 3 to rotate due to centrifugal force, so as to prevent the wafer 3 from sliding relative to the sleeve 16, which would lead to wear on the outer ring of the wafer 3. At the same time, under the action of the damping rod 17 and the spring 18, the adjustment frame 13 avoids the excessive pressure on the wafer 3 during the process of adjusting the range of the sleeve 16, which would lead to damage to the outer ring of the wafer 3.

[0024] like Figure 5 and Figure 6As shown, adjusting blocks 19 are fixedly installed below each of the four sets of vacuum suction cups 5. Two sets of symmetrically distributed first adjusting rods 20 are slidably installed inside the fixed frame 4, and two sets of symmetrically distributed second adjusting rods 21 are slidably installed inside the fixed frame 4. The first adjusting rods 20 and second adjusting rods 21 are perpendicularly distributed. The adjusting blocks 19 are slidably sleeved with adjacent sets of first adjusting rods 20 and second adjusting rods 21. Two sets of symmetrically distributed first bidirectional lead screws 22 and second bidirectional lead screws 23 are provided inside the fixed frame 4. The first bidirectional lead screws 22 and second bidirectional lead screws 23 are perpendicularly distributed. The two ends of the first bidirectional lead screws 22 and second bidirectional lead screws 23 pass through the two sets of fixed frames 4 and are rotatably connected to them. The two ends of the first bidirectional lead screw 22 pass through the two sets of symmetrically distributed first adjusting rods 20 and are threadedly connected to them. Synchronous pulleys 24 are sleeved on both sets of first bidirectional lead screws 22 and second bidirectional lead screws 23. The fixed frame 4 is equipped with two sets of vertically distributed synchronous belts 25, which are respectively connected to the corresponding two sets of synchronous pulleys 24. The two ends of the second bidirectional lead screw 23 pass through two sets of symmetrically distributed second adjusting rods 21 and are respectively threaded to the two sets of second adjusting rods 21. When the wafer 3 is installed and fixed, according to the actual size of the wafer 3, the motor in the fixed frame 4 is started to drive the rotation of the first bidirectional lead screw 22 and the second bidirectional lead screw 23. Under the action of the synchronous belt 25 and the synchronous pulley 24, the two sets of first bidirectional lead screws 22 and the two sets of second bidirectional lead screws 23 are rotated synchronously, thereby causing the two sets of first adjusting rods 20 and the two sets of second adjusting rods 21 to slide synchronously inward or outward, adjusting the distance between the four sets of adjusting blocks 19, and then adjusting the position of the four sets of vacuum chucks 5. This further ensures that the centrifugal force during the rotation of the wafer 3 will not cause relative sliding between the wafer 3 and the mounting cylinder 14, resulting in rigid wear of the outer ring of the wafer 3.

[0025] This utility model provides a wafer positioning device for a coating and developing machine. The specific working principle is as follows: The motor inside the mounting base 2 drives the drive wheel 10 to rotate. This, in conjunction with the internal gear 8, causes the mounting ring 7 to drive the rotating ring 6 to rotate. The external gear 9, in conjunction with the gear 12, causes multiple sets of mounting rods 11 to drive the adjusting frame 13 to rotate. The mounting cylinder 14 rotates synchronously with the adjusting frame 13, adjusting the radius of the area enclosed by the multiple sets of sleeves 16. This ensures that the sleeves 16 on each set of mounting cylinders 14 are fully fitted to the outer surface of the wafer 3 to be fixed, thus completing the fixation of the wafer 3. The sleeves 16 are made of a material with high frictional resistance. During the rotation of the wafer 3 driven by the overall mounting base 2, the high frictional force of the sleeves 16 and the torsion spring 15 counteract the tendency of the wafer 3 to rotate due to centrifugal force, preventing the wafer 3 from sliding relative to the sleeves 16, thereby preventing the wafer 3 from slipping. The wear of the outer ring, and the damping rod 17 and spring 18 prevent the adjustment frame 13 from exerting too much pressure on the wafer 3 during the process of adjusting the sleeve 16 to form a range, which would cause damage to the outer ring of the wafer 3. When the wafer 3 is installed and fixed, according to the actual size of the wafer 3, the motor of the fixing frame 4 is started to drive the rotation of the first bidirectional lead screw 22 and the second bidirectional lead screw 23. Under the action of the synchronous belt 25 and the synchronous pulley 24, the two sets of first bidirectional lead screws 22 and two sets of second bidirectional lead screws 23 are rotated synchronously, thereby causing the two sets of first adjusting rods 20 and two sets of second adjusting rods 21 to slide synchronously inward or outward, adjusting the distance between the four sets of adjusting blocks 19, and then adjusting the position of the four sets of vacuum chucks 5. This further ensures that the centrifugal force during the rotation of the wafer 3 will not cause relative sliding between the wafer 3 and the mounting cylinder 14, resulting in rigid wear of the outer ring of the wafer 3.

[0026] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer positioning device for a coating and developing machine, comprising a developing machine (1) and a wafer (3), characterized in that: The developing machine (1) is provided with a mounting base (2), and a fixed frame (4) is fixedly installed in the mounting base (2). A rotating ring (6) is rotatably installed in the mounting base (2), and a mounting ring (7) is sleeved on the rotating ring (6). The mounting ring (7) is provided with internal teeth (8) and external teeth (9). The mounting base (2) is provided with multiple sets of annularly distributed adjusting frames (13). The multiple sets of adjusting frames (13) are rotatably connected to the mounting base (2) through mounting rods (11). Gears (12) are sleeved on the mounting rods (11). The gear (12) is connected to the mounting ring (7) by meshing with the external teeth (9). The mounting sleeve (14) is rotatably mounted on the adjusting frame (13). Two sets of symmetrically distributed torsion springs (15) are sleeved on the mounting sleeve (14). A sleeve (16) is sleeved on the mounting sleeve (14). Multiple sets of sleeves (16) are in contact with the outer ring of the wafer (3). Four sets of symmetrically distributed damping rods (17) are provided between the sleeve (16) and the mounting sleeve (14). Four sets of symmetrically distributed vacuum suction cups (5) are provided in the fixing frame (4).

2. The wafer positioning device for a coating and developing machine according to claim 1, characterized in that: A drive wheel (10) is rotatably mounted on the mounting base (2). The drive wheel (10) is connected to the mounting ring (7) by internal teeth (8). The two ends of the torsion spring (15) are fixedly connected to the mounting cylinder (14) and the adjusting bracket (13) respectively.

3. The wafer positioning device for a coating and developing machine according to claim 1, characterized in that: The two ends of the damping rod (17) are fixedly connected to the sleeve (16) and the mounting sleeve (14) respectively. A spring (18) is sleeved on the damping rod (17), and the two ends of the spring (18) are fixedly connected to the two ends of the damping rod (17) respectively.

4. The wafer positioning device for a coating and developing machine according to claim 1, characterized in that: Adjustment blocks (19) are fixedly installed below each of the four sets of vacuum suction cups (5). Two sets of symmetrically distributed first adjustment rods (20) are slidably installed inside the fixed frame (4). Two sets of symmetrically distributed second adjustment rods (21) are slidably installed inside the fixed frame (4). The first adjustment rods (20) and the second adjustment rods (21) are vertically distributed. The adjustment blocks (19) are slidably sleeved with the two adjacent sets of first adjustment rods (20) and second adjustment rods (21).

5. The wafer positioning device for a coating and developing machine according to claim 1, characterized in that: The fixed frame (4) is provided with two sets of symmetrically distributed first bidirectional lead screws (22) and second bidirectional lead screws (23). The first bidirectional lead screws (22) and second bidirectional lead screws (23) are vertically distributed. The two ends of the first bidirectional lead screws (22) and second bidirectional lead screws (23) pass through the two sets of fixed frames (4) respectively and are rotatably connected to the two sets of fixed frames (4) respectively.

6. The wafer positioning device for a coating and developing machine according to claim 5, characterized in that: The two ends of the first bidirectional lead screw (22) pass through two sets of symmetrically distributed first adjusting rods (20) and are threaded to the two sets of first adjusting rods (20) respectively. Synchronous pulleys (24) are sleeved on both sets of the first bidirectional lead screws (22) and the second bidirectional lead screw (23). Two sets of vertically distributed synchronous belts (25) are provided in the fixed frame (4). The synchronous belts (25) are respectively connected to the corresponding two sets of synchronous pulleys (24) for transmission.

7. The wafer positioning device for a coating and developing machine according to claim 5, characterized in that: The two ends of the second bidirectional lead screw (23) pass through two sets of symmetrically distributed second adjusting rods (21) and are threadedly connected to the two sets of second adjusting rods (21).

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