Electronic equipment

Abstract

The electronic equipment comprises a shell and a heat dissipation assembly, the shell is provided with a containing space used for arranging functional parts, the heat dissipation assembly is arranged in the containing space, the heat dissipation assembly comprises a fan and a heat dissipation piece, the heat dissipation piece is in heat transfer connection with a target heating part, and the fan is arranged on the side, away from the target heating part, of the heat dissipation piece; blade root lines of fan blades of the fan incline to the rotation axis of the fan, and the exhaust direction of the fan blades is perpendicular to the rotation axis.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and in particular to an electronic device. Background Technology

[0002] Currently, all-in-one computers and other electronic devices typically use a cooling architecture that combines centrifugal fans with heat pipes. The drawbacks of this cooling architecture are that it not only takes up a lot of space but also has a high cost. Utility Model Content

[0003] This application provides the following technical solution:

[0004] An electronic device, comprising:

[0005] The housing has a space for accommodating functional components;

[0006] A heat dissipation assembly, disposed within the receiving space, includes a fan and a heat sink, the heat sink being thermally connected to a target heat-generating component, and the fan being disposed on the side of the heat sink away from the target heat-generating component;

[0007] The fan blades have their root lines inclined to the fan's rotation axis, and the exhaust direction of the fan blades is perpendicular to the rotation axis.

[0008] Optionally, in the above-described electronic device, the heat sink includes:

[0009] The plate body, wherein the first surface of the plate body is heat-transferringly connected to the target heating element;

[0010] The heat dissipation fins are protruding and disposed on the second surface of the plate body away from the first plate surface;

[0011] The heat dissipation fin assembly is provided with a clearance space, the fan is located within the clearance space, and the fins of the heat dissipation fin assembly guide the airflow from the fan to flow in a first direction.

[0012] Optionally, the above-mentioned electronic device includes an air guide disposed within the accommodating space, the air guide being used to guide the airflow from the heat dissipation fin assembly to flow in a second direction, the second direction being the same as or different from the first direction.

[0013] Optionally, in the above-mentioned electronic device, the second direction is different from the first direction, and the air guide is provided with a bend to guide the airflow.

[0014] Optionally, in the above-mentioned electronic device, the air guide is used to direct airflow to the side of the housing that is closer to the target heating component.

[0015] Optionally, in the above-mentioned electronic device, the plate body and the heat dissipation fin assembly are integrally formed.

[0016] Optionally, in the above-mentioned electronic device, the side of the fan away from the target heat-generating component faces the first wall of the housing, and the first wall has an air inlet corresponding to the position of the fan.

[0017] Optionally, the above-described electronic device includes a support bracket for supporting the housing, the support bracket comprising:

[0018] base;

[0019] A column, which connects the base and the first wall, wherein the orthogonal projection of the column onto the first wall covers at least a portion of the air inlet.

[0020] Optionally, in the above-mentioned electronic device, the housing has a second wall connected to the first wall and perpendicular to the outer surface of the first wall, and the second wall has an air outlet.

[0021] Optionally, in the above-mentioned electronic device, the second wall is provided with an interface for electrical connection with the target heating component, and the second wall is provided with air outlets on both sides of the interface along a third direction. The interface is used to connect external devices, and the third direction is perpendicular to the rotation axis. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of an electronic device according to an embodiment of this application;

[0024] Figure 2 yes Figure 1 A partial three-dimensional schematic diagram of the electronic device shown;

[0025] Figure 3 yes Figure 1 A schematic diagram of the internal structure of the housing of the electronic device shown.

[0026] Figure 4 yes Figure 1 A schematic diagram of the heat dissipation airflow inside the casing of the electronic device shown.

[0027] Figure 5 yes Figure 3A three-dimensional schematic diagram of the heat dissipation components in the structure shown;

[0028] Figure 6 yes Figure 5 A front view of the heat dissipation assembly shown;

[0029] Figure 7 Is Figure 6 A schematic diagram of the heat dissipation airflow from the perspective of arrow C in the diagram;

[0030] Figure 8 yes Figure 5 A schematic diagram of the structure after replacing the fan in the diagram with an axial fan;

[0031] Figure 9 yes Figure 8 A schematic diagram of the cooling airflow from the axial fan blowing air onto the board.

[0032] The diagram is marked as follows:

[0033] 100, Base; 200, Column; 300, Housing; 310, First Wall; 311, Air Inlet; 320, Second Wall; 400, Air Guide Component; 500, Target Heat-generating Component; 600, Connector; 700, Heat Dissipation Assembly; 710, Fan; 711, Fan Blade; 720, Plate; 730, Fin; 740, Clearance Space; 800, Axial Fan; 810, Axial Fan Blade. Detailed Implementation

[0034] This application provides an electronic device that, through a reasonable structural design, reduces the space occupied by the heat dissipation architecture and has a lower cost compared to traditional centrifugal fan solutions.

[0035] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0036] See Figures 1-7 This application provides an electronic device, including a housing 300 and a heat dissipation assembly 700. The housing 300 has a accommodating space for arranging functional components. The heat dissipation assembly 700 is disposed within the accommodating space provided by the housing 300. The heat dissipation assembly 700 includes a fan 710 and a heat sink. The heat sink is heat-transferringly connected to a target heat-generating component 500. The fan 710 is disposed on the side of the heat sink away from the target heat-generating component 500. The root line of the fan blades 711 of the fan 710 is inclined to the rotation axis of the fan 710, and the exhaust direction of the fan blades 711 is perpendicular to the rotation axis.

[0037] Electronic devices can be of various types, such as all-in-one computers and laptops. The housing 300 provides space to house the functional components of the electronic device. These functional components are those used to perform the functions of the electronic device, such as the motherboard and display components. Heat-generating components are those that generate heat during operation. For example, the central processing unit on the motherboard generates heat during operation and therefore requires heat dissipation to improve operational stability. The target heat-generating component 500 is the primary target of heat dissipation by the heat sink 700. Since the heat sink is thermally connected to the target heat-generating component 500, heat is transferred from the target heat-generating component 500 to the heat sink. A fan 710, located on the side of the heat sink away from the target heat-generating component 500, directs airflow along the heat sink, thereby carrying away heat and achieving heat dissipation.

[0038] like Figure 5 As shown, the root line of the fan blade 711 is inclined to the rotation axis of the fan 710. The root line is the trajectory line of the end of the fan blade 711 closest to the rotation axis of the fan 710, which is the intersection line of the rotation axes of the fan blade 711 and the fan 710. It is easy to understand that since the root line is inclined to the rotation axis of the fan 710, a straight line parallel to the rotation axis drawn through any point on the root line will form a certain angle with the root line. That is, when the connection surface between the fan blade 711 and the rotation axis of the fan 710 is a cylindrical surface, the root line forms a certain angle with the generatrix of the cylindrical surface. The inclination angle of the root line relative to the rotation axis can be, for example, 30°, 45°, etc. Based on the inclination of the root line of the fan blade 711 to the rotation axis of the fan 710, the rotation of the fan 710 ensures that the exhaust direction of the fan blade 711 is perpendicular to the rotation axis. It should be noted that satisfying the perpendicular condition means that they are perpendicular or approximately perpendicular. Figure 5 As shown, in manufacturing fan 710, a feasible implementation is to reverse the blade design based on an axial fan, thereby changing the axial intake and exhaust method of the axial fan to the axial intake and radial exhaust method required by fan 710, while keeping the fan rotation direction unchanged. To better understand the difference between fan 710 and axial fans in this application, Figure 8 and Figure 9 Shown Figure 5 The situation after replacing the 710 fan with an axial fan 800, compared Figure 5 and Figure 8As can be seen, the reverse design between the fan blade 711 of the fan 710 and the axial fan blade 810 of the axial fan 800 can be understood as rotating the axial fan blade 810 at each location of the axial fan 800 by 180° around the radial line at that location to obtain the fan 710 with fan blade 711. Alternatively, it can be understood as rotating all the axial fan blades 810 of the axial fan 800 as a whole by 180° around any radial line of the axial fan 800 to obtain the fan 710 with fan blade 711. Since the fan blade 711 of the fan 710 and the axial fan blade 810 of the axial fan 800 are designed in reverse, in the axial fan 800, the concave side of the axial fan blade 810 faces the plate 720, and the convex side faces away from the plate 720. In the fan 710, the concave side of the fan blade 711 faces away from the plate 720, and the convex side faces the plate 720. Fan 710 and axial fan 800 rotate in the same direction, that is, axial fan 800 rotates along... Figure 8 The fan rotates counterclockwise, along the 710 Figure 5 The fan rotates counterclockwise, but because the blades 711 of fan 710 and the axial blades 810 of axial fan 800 are designed in opposite directions, the exhaust methods of fan 710 and axial fan 800 are different. The exhaust of axial fan 800 flows axially, while the exhaust of fan 710 flows radially. See [link to relevant documentation]. Figure 9 The exhaust air from the axial fan 800 will first impact the plate 720 in a direction perpendicular to the plate 720, bounce off, and then flow along the surface of the plate 720. In contrast, the exhaust air from the fan 710 of this application does not have the process of vertically impacting the plate 720 and bouncing off. Therefore, the fan 710 has a higher heat dissipation efficiency for heat sinks than the axial fan 800.

[0039] like Figure 3 As shown, the heat dissipation component 700 and the target heat-generating component 500 are arranged along the rotation axis of the fan 710. Compared with the traditional fan and heat pipe combination, this reduces the space occupied inside the housing 300. At the same time, through the design of the fan blades 711 of the fan 710, the exhaust direction of the fan blades 711 is perpendicular to the rotation axis. Therefore, the fan 710 can be manufactured by purchasing components suitable for ordinary axial fans. This reduces costs compared to directly purchasing centrifugal fans (whose commercial prices are generally higher than those of axial fans of the same air volume).

[0040] In some embodiments, the heat sink may include a plate 720 and a heat sink fin assembly, wherein a first surface of the plate 720 is thermally connected to the target heat-generating component 500, and the heat sink fin assembly protrudes from a second surface of the plate 720 away from the first surface. The heat sink fin assembly is provided with a clearance space 740, and a fan 710 is located within the clearance space 740. The fins 730 of the heat sink fin assembly guide the airflow from the fan 710 to flow in a first direction.

[0041] like Figure 3 and Figure 5 As shown, the heat dissipation fin assembly includes multiple fins 730 for heat dissipation. The fins 730 are located on the side of the plate 720 away from the target heat-generating component 500, that is, the heat dissipation fin assembly is disposed on the second plate surface of the plate 720. The fins 730 of the heat dissipation fin assembly are arranged parallel to each other, and airflow channels are formed between adjacent fins 730. The heat dissipation fin assembly is provided with a clearance space 740 for mounting the fan 710 on the second plate surface of the plate 720. When the fan 710 rotates, the airflow leaves the fan 710 along the exhaust direction, that is, in a direction perpendicular to the axis of rotation, and then enters the airflow channel formed by the fins 730 of the heat dissipation fin assembly. Under the guidance of the airflow channel, the airflow moves along the first direction (i.e., Figure 6 The flow is in the left and right directions. It should be noted that... Figure 6 This is merely an example demonstrating that the extension direction of the fin 730 is set along... Figure 6 In other embodiments, the fin 730 may also be configured to extend in other directions, such as along the left and right directions. Figure 6 The fins extend in the vertical direction or in an oblique direction at an acute angle to the horizontal direction. In other words, this application does not limit the guiding direction of the fins 730 of the heat dissipation fin assembly, i.e., the aforementioned first direction.

[0042] like Figure 6 and Figure 7 As shown, under the action of fan 710, external airflow enters the heat dissipation assembly 700 along the axial direction of fan 710 (i.e., the direction parallel to the axis of rotation), and is then discharged by fan 710 towards the heat dissipation fin assembly. The airflow flows along the extension direction of fins 730 across the second plate surface of plate 720 and the surface of fins 730, carrying away heat. By setting the heat dissipation fin assembly, not only is the heat dissipation surface area of ​​the heat dissipation component increased, but the airflow can also be guided to flow in a predetermined direction, allowing the airflow to flow more orderly and quickly, improving airflow efficiency, and thus achieving better heat dissipation. During the rotation of fan 710, the outer edge of fan blade 711 sweeps a circular trajectory away from the axis of rotation. To enable the airflow discharged by fan 710 to enter the airflow channel of the heat dissipation fin assembly more efficiently, the clearance space 740 can be... Figure 5The design shown is cylindrical, meaning the boundary outline of the clearance space 740 is circular. Based on this cylindrical shape, the circular trajectory swept by the outer edge of the fan blade 711 is concentrically aligned with the boundary outline of the clearance space 740. This increases the volume ratio of the fan 710 within the clearance space 740, thereby reducing the volume of other spaces within the clearance space 740 besides the area occupied by the fan 710. Therefore, after leaving the fan blade 711, the airflow can reach the boundary of the clearance space 740 more quickly and then enter the airflow channel of the heat dissipation fin assembly. Of course, the clearance space 740 can also be other shapes, such as a cuboid. In other embodiments, the heat sink can also be configured with other structural forms. For example, the heat sink may be composed of a plate without fins, or the heat sink may include a plate without fins, but the surface of the plate is provided with an n-shaped fan shroud forming an airflow channel with the plate. This airflow channel guides the airflow from the fan 710 along a first direction.

[0043] In some embodiments, the plate 720 and the heat dissipation fin assembly can be integrally formed. For example, the heat dissipation component is made of aluminum, and the finned aluminum heat dissipation component is manufactured by aluminum extrusion. Of course, in other embodiments, the plate 720 and the heat dissipation fin assembly can also be fixedly connected by means such as welding to form an integral unit. In this case, the material of the heat dissipation fin assembly and the material of the plate 720 can be the same or different, as long as heat can be conducted from the plate 720 to the heat dissipation fin assembly. The heat transfer connection structure between the first plate surface of the plate 720 and the target heat-generating component 500 can be either direct contact between the first plate surface of the plate 720 and the target heat-generating component 500, or a thermally conductive component such as thermal paste can be provided between the first plate surface of the plate 720 and the target heat-generating component 500. When the first surface of the plate 720 and the target heating element 500 are connected by a heat-conducting element, the heat-conducting element can be a heat pipe. The heat-absorbing part of the heat pipe is in contact with the target heating element 500, and the heat-dissipating part of the heat pipe is in contact with the first surface of the plate 720. The phase change working fluid inside the heat pipe transfers heat from the target heating element 500 to the plate 720. The heat pipe has high heat transfer efficiency, thus helping to improve heat dissipation efficiency.

[0044] In some embodiments, the electronic device may include an air guide 400 disposed within a receiving space. The air guide 400 is used to guide the airflow from the heat sink fin assembly to flow in a second direction, which may be the same as or different from the first direction. That is, the airflow from the airflow channel of the heat sink fin assembly continues to flow along the air guide 400, and the direction of the continued flow may be the same as or different from the first direction defined by the airflow channel of the heat sink fin assembly.

[0045] exist Figure 3In the exemplary embodiment, the air guide 400 is provided with a bend to guide the airflow, thereby changing the direction of the airflow; that is, the air guide 400 guides the airflow to flow in a second direction different from the first direction. By providing the air guide 400 within the receiving space of the housing 300, the airflow is prevented from wandering after leaving the heat dissipation assembly 700, which helps the airflow flow through the interior of the housing 300 in a more regular path, thereby improving heat dissipation efficiency. In other embodiments, the air guide 400 can also be configured to guide the airflow to flow in a second direction that is the same as the first direction, for example, by... Figure 3 The air guide 400 with the bend in the middle is changed to start from the outer edge of the target heating element 500 and follow the direction of the bend. Figure 3 The airflow extends straight to the sides of the housing 300 in a horizontal direction, so that the airflow will not change direction after leaving the heat dissipation component 700. In other words, the heat dissipation airflow on both sides of the heat dissipation component 700 will pass through the entire housing 300 in a straight line. To reduce costs, the air guide 400 can be made of polyester resin or plastic.

[0046] The target heat-generating component 500 is located within the housing 300's accommodating space. The heat from the target heat-generating component 500 is transferred to the fan 710 of the heat dissipation assembly 700 and carried away by the cooling airflow generated by the fan 710. After leaving the heat dissipation assembly 700, the cooling airflow is guided to the target location by the air guide 400. The target location can be flexibly set as needed; for example, the target location can be any side of the housing 300. Furthermore, the air guides 400 on both sides of the heat dissipation assembly 700 can be configured as follows: Figure 3 The airflow is directed to the same side of the housing 300, as shown, but can also be directed to different sides of the housing 300. In some embodiments, the air guide 400 is used to direct airflow to the side of the housing 300 that is closer to the target heat-generating component 500. Figure 1 and Figure 3 In the exemplary embodiment shown, the housing 300 is rectangular with four sides, and the target heating element 500 is located away from... Figure 3 The airflow is directed towards the lower side of the housing 300 by the air guide 400, as the target heat-generating component 500 is located closer to it. In other words, when setting the air guide 400, the side of the housing 300 closest to the target heat-generating component 500 can be selected as the side to which the airflow is guided, based on the position of the target heat-generating component 500 within the housing 300. To conceal the air outlet on the housing 300, the outlet is typically located on the side of the housing 300. The air guide 400 directs the airflow towards the side of the housing 300 closest to the target heat-generating component 500. This allows for a shorter airflow path within the housing 300, meaning the airflow can reach the outlet along a relatively short path after leaving the heat dissipation component 700. A shorter airflow path within the housing 300 facilitates rapid airflow exit from the housing 300, thereby improving heat dissipation efficiency.

[0047] See Figures 1 to 3 The side of the fan 710 furthest from the target heat-generating component 500 faces the first wall 310 of the housing 300. In some embodiments, the first wall 310 may have an air inlet 311 at the position corresponding to the fan 710. Since the first wall 310 of the housing 300 is close to the fan 710, placing the air inlet 311 at the position corresponding to the fan 710 on the first wall 310 shortens the air intake distance from the air inlet 311 to the fan 710, thus facilitating the rapid entry of external air into the heat dissipation assembly 700. Figure 2 and Figure 3 In the exemplary embodiment shown, the air outside the housing 300 flows along... Figure 4 Arrow A in the diagram indicates that the path enters the housing 300 and reaches the heat dissipation assembly 700, and after leaving the heat dissipation assembly 700, it follows... Figure 4 Arrow B in the diagram shows the path that leads to the air outlet and exits the housing by 300 degrees.

[0048] In some embodiments, the electronic device may include a support bracket for the housing 300, the bracket including a base 100 and a column 200, wherein the column 200 connects the base 100 and a first wall 310 of the housing 300, and the orthographic projection of the column 200 onto the first wall 310 at least covers a portion of the air inlet 311, that is, the orthographic projection of the column 200 onto the first wall 310 overlaps with the air inlet 311, the overlapping portion being part or all of the air inlet 311. Figure 1 and Figure 2 In the exemplary embodiment, the orthographic projection of the column 200 onto the first wall 310 completely covers the air inlet 311, which improves the concealment of the air inlet 311 and makes the appearance of the electronic device cleaner. In some embodiments, the fan 710 and the air inlet 311 can be set to be 2 mm to 3 mm apart along a direction that satisfies the perpendicular condition to the first wall 310. This allows for a larger air intake while making the overall structure more compact, thereby achieving higher heat dissipation efficiency.

[0049] In some embodiments, the housing 300 has a second wall 320 connected to the first wall 310 and perpendicular to the outer surface of the first wall 310, and the second wall 320 has an air outlet. For example... Figure 1 and Figure 4As shown, the second wall 320 extends from the edge of the first wall 310 into the interior of the housing 300, perpendicular to the outer surface of the first wall 310. Airflow travels along the inner surface of the first wall 310 to the second wall 320, and then smoothly exits the housing 300 from the air outlet on the second wall 320. This arrangement of the air outlet improves its concealment, making it less visible to the user from the exterior of the housing 300, thus enhancing the cleanliness of the electronic device's appearance. To further improve the concealment of the air outlet, the second wall 320 can be connected to the side of the housing 300 via a third wall, for example, in… Figure 1 In the illustrated embodiment, the second wall 320 is connected to the lower side of the housing 300 via a third wall. It should be noted that, because the outer surfaces of the second wall 320 and the first wall 310 are perpendicular, the second wall 320... Figure 1 It is represented by a line. Figure 1 In the illustrated embodiment, the second wall 320 faces the side where the base 100 is located, that is, the air outlet on the second wall 320 exhausts air downwards, and the second wall 320 and the third wall form a groove structure located between the lower side of the first body and the housing 300.

[0050] In some embodiments, the second wall 320 may be provided with an interface for electrical connection to the target heating element 500, and the second wall 320 has air outlets on both sides of the interface along a third direction. The interface is used to connect external devices, and the third direction is perpendicular to the rotation axis of the fan 710. See also Figure 2 and Figure 3 The second wall 320 of the housing 300 has an interface at the corresponding connector 600. External devices, such as USB flash drives, are inserted into the interface and electrically connected to the target heat-generating component 500 via the connector 600. Air outlets on the second wall 320 are located on both sides of the interface along a third direction, achieving a bidirectional airflow design for heat dissipation within the housing 300. Figure 3 As shown by the hollow arrow, this allows more airflow to pass quickly through the heat dissipation component 700, thereby improving heat dissipation efficiency.

[0051] This specification describes the structure of each part in a progressive manner, with each part's structure highlighting its differences from existing structures. The electronic device, the overall structure of the electronic device, and the structure of some parts can be obtained by combining the structures of the above-mentioned multiple parts.

[0052] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An electronic device, characterized in that, include: The housing has a space for accommodating functional components; A heat dissipation assembly, disposed within the receiving space, includes a fan and a heat sink, the heat sink being thermally connected to a target heat-generating component, and the fan being disposed on the side of the heat sink away from the target heat-generating component; The fan blades have their root lines inclined to the fan's rotation axis, and the exhaust direction of the fan blades is perpendicular to the rotation axis.

2. The electronic device according to claim 1, characterized in that, The heat sink includes: The plate body, wherein the first surface of the plate body is heat-transferringly connected to the target heating element; The heat dissipation fins are protruding and disposed on the second surface of the plate body away from the first plate surface; The heat dissipation fin assembly is provided with a clearance space, the fan is located within the clearance space, and the fins of the heat dissipation fin assembly guide the airflow from the fan to flow in a first direction.

3. The electronic device according to claim 2, characterized in that, Includes an air guide disposed within the accommodating space, the air guide being used to guide the airflow from the heat dissipation fin assembly to flow in a second direction, the second direction being the same as or different from the first direction.

4. The electronic device according to claim 3, characterized in that, The second direction is different from the first direction, and the air guide is provided with a bend to guide the airflow.

5. The electronic device according to claim 3, characterized in that, The air guide is used to direct airflow to the side of the housing that is closer to the target heating element.

6. The electronic device according to claim 2, characterized in that, The plate body and the heat dissipation fin assembly are integrally formed.

7. The electronic device according to any one of claims 1 to 6, characterized in that, The side of the fan away from the target heat-generating component faces the first wall of the housing, and the first wall has an air inlet corresponding to the position of the fan.

8. The electronic device according to claim 7, characterized in that, Includes a support bracket for supporting the housing, the support bracket comprising: base; A column, which connects the base and the first wall, wherein the orthogonal projection of the column onto the first wall covers at least a portion of the air inlet.

9. The electronic device according to claim 8, characterized in that, The housing has a second wall that is connected to the first wall and is perpendicular to the outer surface of the first wall, and the second wall has an air outlet.

10. The electronic device according to claim 9, characterized in that, The second wall is provided with an interface for electrical connection to the target heating component, and the second wall is provided with air outlets on both sides of the interface along a third direction. The interface is used to connect external devices, and the third direction is perpendicular to the rotation axis.

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