Beam welding alloy current detection chip resistor
By providing a shock-absorbing bracket, a buffer plate, and a spring structure on the current-sense chip resistor, combined with a rubber fastening plate, the problem of unstable connection of the current-sense chip resistor in a vibration environment is solved, and the stability and reliability of the resistor are improved.
Patent Information
- Application Number
- CN202422459916.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-11
- Publication Date
- 2025-10-28
- Estimated Expiration
- 2034-10-11
AI Technical Summary
Existing current-sense chip resistors have unstable connections under high-frequency vibration or strong impact environments, which affects the resistance value and stability.
A shock-absorbing bracket, buffer plate and spring structure, combined with a rubber fastening plate, form a buffer system to reduce vibration transmission and improve resistance stability.
Under high-frequency vibration or strong impact, the vibration between the resistor and the circuit board is significantly reduced, improving the stability and reliability of the resistor.
Smart Images

Figure CN223486770U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electronic components technology, and more specifically, it relates to a bundle-bonded alloy current-sensing chip resistor. Background Technology
[0002] Current-sensing surface mount resistors, as an important component of electronic components, are characterized by high precision, small size, high stability, and good temperature characteristics. They are widely used in various electronic devices for critical functions such as current detection, circuit protection, and signal conditioning. With the rapid development of electronic technology, the performance requirements for current-sensing surface mount resistors are also constantly increasing.
[0003] The environment in which current-sensing chip resistors are located is often complex and variable, and vibration is a factor that cannot be ignored. Vibration may cause slight changes in the internal structure of the resistor, thereby affecting its resistance value, accuracy and stability. This effect is particularly significant for electronic devices with high precision requirements.
[0004] The connection between the existing current sensing chip resistor and the circuit board is usually directly fixed, and there is no shock-absorbing structure between the current sensing chip resistor and the circuit board. In the environment of high-frequency vibration or strong impact, the vibration may be transmitted to the resistor through the circuit board, generating additional mechanical stress, which further affects the stability and reliability of the resistor. Utility Model Content
[0005] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a bonded alloy current sensing chip resistor that reduces vibration between the current sensing resistor and the circuit board and improves the stability and reliability of the current sensing resistor.
[0006] To achieve the above objectives, the present invention provides the following technical solution:
[0007] A wire-bonded alloy current-sensing chip resistor includes a current-sensing resistor with a vibration-damping bracket connected to it. The vibration-damping bracket has a buffer plate and a spring on its top surface, with the spring positioned between it and the buffer plate. Both ends of the spring abut against the buffer plate and the vibration-damping bracket.
[0008] The buffer plate is inclined, tilting from the shock-absorbing bracket towards the spring end; there are two springs.
[0009] There is a space between the shock absorber bracket, the buffer plate, and the spring for the buffer plate to move.
[0010] The present invention is further configured such that: the shock absorber bracket is also provided with a fastening plate, the fastening plate is placed on the bottom surface of the shock absorber bracket and connected to the shock absorber bracket, and the fastening plate is made of rubber.
[0011] The present invention is further configured such that a spring-loaded groove is provided on the fastening plate.
[0012] The present invention is further configured such that: a fixing plate is provided on the shock-absorbing bracket, the fixing plate is placed between the shock-absorbing bracket and the buffer plate, and the fixing plate is fixedly connected to both the shock-absorbing bracket and the buffer plate.
[0013] The present invention is further configured such that: the fixing plate is provided with a plurality of reinforcing ribs surrounding the outer wall of the fixing plate, and the reinforcing ribs are fixedly connected to the fixing plate.
[0014] By adopting the above technical solution, the beneficial effects of this utility model are as follows:
[0015] In environments with high-frequency vibration or strong impact, the circuit board first presses against the buffer plate. The buffer plate, along with the spring, moves towards the shock-absorbing bracket within the movement space. Through the shock-absorbing bracket, the inclined buffer plate, and the two springs, the vibration between the current sensing resistor and the circuit board is reduced, and the stability of the current sensing resistor is improved. Due to the installation of a rubber fastening plate, the vibration transmitted from the circuit board to the current sensing resistor is further reduced through the spring groove in the fastening plate. Attached Figure Description
[0016] Figure 1 This is an exploded view of an embodiment of the present utility model.
[0017] 1. Current sensing resistor; 2. Circuit board; 3. Shock absorber bracket; 4. Buffer plate; 5. Spring; 6. Movable space; 7. Fastening plate; 8. Spring groove; 9. Fixing plate. Detailed Implementation
[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0019] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0020] like Figure 1As shown, the beam-bonded alloy current-sensing chip resistor includes a current-sensing resistor 1 and a circuit board 2. A vibration damping bracket 3 is installed between the current-sensing resistor 1 and the circuit board 2. The vibration damping bracket 3 is connected to both the current-sensing resistor 1 and the circuit board 2.
[0021] A buffer plate 4 and a spring 5 are installed on the shock absorber bracket 3. Both the buffer plate 4 and the spring 5 are located on the top surface of the shock absorber bracket 3. The spring 5 is positioned between the shock absorber bracket 3 and the buffer plate 4, and both ends of the spring 5 are in contact with the buffer plate 4 and the shock absorber bracket 3.
[0022] The buffer plate 4 is inclined, tilting from the shock-absorbing bracket 3 towards one end of the spring 5. There are two springs 5.
[0023] There is a movable space 6 between the shock-absorbing bracket 3, the buffer plate 4 and the spring 5, which allows the buffer plate 4 to move. Through the movable space 6 and the spring 5, the buffering speed between the circuit board 2 and the current sensing resistor 1 is slowed down, thereby reducing the vibration between the current sensing resistor 1 and the circuit board 2.
[0024] The shock absorber bracket 3 is also provided with a fastening plate 7, which is placed on the bottom surface of the shock absorber bracket 3 and connected to the shock absorber bracket 3. The fastening plate 7 is made of rubber and has a spring groove 8.
[0025] The buffer plate 4 is fixedly connected to the circuit board 2 by screws, and the fastening plate 7 and the shock-absorbing bracket 3 are fixed to the current sensing resistor 1 by screws.
[0026] The shock absorber bracket 3 is provided with a fixing plate 9, which is placed between the shock absorber bracket 3 and the buffer plate 4. The fixing plate 9 is integrally formed with the shock absorber bracket 3 and the buffer plate 4. Several reinforcing ribs are installed on the fixing plate 9, which are surrounded by the outer wall of the fixing plate 9. The reinforcing ribs are integrally formed with the fixing plate 9.
[0027] Working principle: In the environment of high frequency vibration or strong impact, the circuit board 2 first squeezes the buffer plate 4. The buffer plate 4, with the spring 5, moves towards the shock-absorbing bracket 3 in the activity space 6. Through the shock-absorbing bracket 3, the inclined buffer plate 4 and the two springs 5, the vibration between the current sensing resistor 1 and the circuit board 2 is reduced and the stability of the current sensing resistor 1 is improved. Since a rubber fastening plate 7 is installed, the spring groove 8 in the fastening plate 7 is used for buffering, which further reduces the vibration transmitted from the circuit board 2 to the current sensing resistor 1.
[0028] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any ordinary changes and substitutions made by those skilled in the art within the scope of the technical solution of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A bundle-bonded alloy current-sensing chip resistor, characterized in that, It includes a current sensing resistor (1), and a shock-absorbing bracket (3) is provided on the current sensing resistor (1). The shock absorber bracket (3) is connected to the current sensing resistor (1). The shock absorber bracket (3) is equipped with a buffer plate (4) and a spring (5). Both the buffer plate (4) and the spring (5) are placed on the top surface of the shock absorber bracket (3). The spring (5) is placed between the shock-absorbing bracket (3) and the buffer plate (4), and both ends of the spring (5) are in contact with the buffer plate (4) and the shock-absorbing bracket (3). The buffer plate (4) is inclined, tilting from the shock-absorbing bracket (3) towards the spring (5). There are two springs (5). There is a space (6) between the shock absorber bracket (3), the buffer plate (4) and the spring (5) for the buffer plate (4) to move.
2. The bundle-bonded alloy current-sensing chip resistor according to claim 1, characterized in that, The shock absorber bracket (3) is also provided with a fastening plate (7), which is placed on the bottom surface of the shock absorber bracket (3) and connected to the shock absorber bracket (3). The fastening plate (7) is made of rubber.
3. The bundle-bonded alloy current-sensing chip resistor according to claim 2, characterized in that, The fastening plate (7) is provided with a spring groove (8).
4. The bundle-bonded alloy current-sensing chip resistor according to claim 1, characterized in that, The shock absorber bracket (3) is provided with a fixing plate (9), which is placed between the shock absorber bracket (3) and the buffer plate (4). The fixing plate (9) is fixedly connected to both the shock absorber bracket (3) and the buffer plate (4).
5. The bundle-bonded alloy current-sensing chip resistor according to claim 4, characterized in that, The fixing plate (9) is provided with a number of reinforcing ribs that surround the outer wall of the fixing plate (9) and are fixedly connected to the fixing plate (9).