Flange resistor with ceramic shell

Abstract

The utility model discloses a flange resistor with a ceramic shell, and relates to the field of resistors. The flange resistor comprises a ceramic substrate, a membrane resistor attached to the surface of the ceramic substrate by adopting a traditional screen printing process or magnetron sputtering process, a silver electrode and a lead-out wire welded on the silver electrode, and further comprises a flange plate welded on the back surface of the ceramic substrate and a ceramic shell covering the ceramic substrate, and a mixture of quartz sand and silicon resin is filled between the ceramic shell and the ceramic substrate. The chassis adopts the flange plate with high heat conductivity coefficient, can dissipate heat, is wider in resistance range, can reduce the volume by about 50%, and adopts the ceramic shell, thereby being safer.

Description

Technical Field

[0001] This utility model relates to the field of resistors, specifically to a flange resistor with a ceramic housing. Background Technology

[0002] As users increasingly demand smaller and higher resistance values ​​for their products, traditional aluminum-cased resistors are limited by the characteristics of wire-wound resistors and cannot be produced with medium to high resistance values. To meet user needs, film resistors are used for medium to high resistance values. However, film resistors have the disadvantage that they generally generate more heat than wire-wound resistors under equivalent energy, resulting in a higher failure rate. Utility Model Content

[0003] The purpose of this invention is to address the shortcomings of existing technologies by proposing a flange resistor with a ceramic shell, which significantly improves the lifespan of film resistors.

[0004] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0005] A flange resistor with a ceramic housing includes a ceramic substrate, a film resistor attached to the surface of the ceramic substrate using a conventional screen printing or magnetron sputtering process, a silver electrode, and leads soldered to the silver electrode. It also includes a flange soldered to the back of the ceramic substrate and a ceramic housing covering the ceramic substrate, wherein a mixture of quartz sand and silicone resin is filled between the ceramic housing and the ceramic substrate.

[0006] Furthermore, the flange is made of a metal material with high thermal conductivity and is heat-sealed to the ceramic substrate by reflow soldering.

[0007] Furthermore, the ceramic housing is snapped into the flange.

[0008] Furthermore, the ceramic substrate is a high-alumina ceramic substrate.

[0009] Furthermore, the lead wire is made of Teflon high-temperature wire, with one end welded to a silver electrode and the other end passing through a ceramic shell.

[0010] In the above scheme, the chassis uses a flange with a high thermal conductivity, which can dissipate heat and greatly improve the life of the film resistor. At the same time, the resistance range is wider, the volume can be reduced by about 50%, and a ceramic shell is used, which is safer. Attached Figure Description

[0011] Other features, objects, and advantages of this invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0012] Figure 1 This is a schematic diagram of the structure of a flange resistor with a ceramic shell according to an embodiment of the present invention;

[0013] Figure 2 for Figure 1 Side view.

[0014] In the diagram: 1. Flange; 2. Ceramic substrate; 3. Silver electrode; 4. Film resistor; 5. Ceramic housing; 6. Lead wire; 7. Mixture of quartz sand and silicone resin. Detailed Implementation

[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0016] To compensate for the inability of aluminum-cased resistors to achieve high resistance, it can also replace part of the blocking function of aluminum-cased resistors, such as... Figures 1-2 As shown, this utility model embodiment provides a flange resistor with a ceramic shell, which has the advantages of small size, wide resistance range, and high voltage resistance. The external ceramic shell design provides strong safety, and the flange design at the bottom allows for quick installation. Specifically, the flange resistor includes a ceramic substrate 2, a film resistor 4 attached to the surface of the ceramic substrate 2 using traditional screen printing or magnetron sputtering processes, a silver electrode 3, and leads 6 soldered to the silver electrode 3. To solve the problem of heat generation in the film resistor, a flange 1 is soldered to the back of the ceramic substrate 2 after metallization treatment. The flange 1 is made of a metal material with high thermal conductivity, and its size can be selected according to different needs. For example, a 400W flange can be 100mm×100mm×5mm. The flange 1 and the ceramic substrate 2 are heat-sealed together by reflow soldering, which can effectively reduce thermal resistance. During operation, the heat source is the film resistor generating heat when energized, which is transferred to the ceramic substrate, and then from the ceramic substrate to the flange, where heat is quickly dissipated.

[0017] To protect the resistive film layer and ensure the safety of surrounding devices and personnel during operation, a ceramic shell 5 is provided on the top surface of the ceramic substrate 2. The ceramic shell 5 is snapped into the flange 1. Specifically, the flange 1 has a groove into which the ceramic shell 5 is embedded, and the perimeter is glued with resin. The space between the ceramic shell 5 and the ceramic substrate 2 is filled with a mixture of quartz sand and silicone resin 7. In this embodiment, the quartz sand and silicone resin mixture 7 is obtained by mixing 70-140 mesh quartz sand and epoxy resin at a mass ratio of 2.3:1.

[0018] To address the issue of low resistance, this embodiment directly employs a film resistor. The low-resistance range utilizes a sputtered thin-film process, while the medium-to-high resistance range employs a thick-film printing process. The resistance range covers 1Ω to 100MΩ, providing a wider resistance range. The ceramic substrate 2 has a thickness of 1mm, and the flange 1 has a thickness of 1mm.

[0019] In this embodiment, the ceramic substrate 2 is a high-alumina ceramic substrate, and the lead wire 6 connects the positive and negative electrodes as the connection between the resistor chip and the circuit. The lead wire is made of Teflon high-temperature wire, which has the advantages of wear resistance and durability.

[0020] The specific implementation includes the following steps:

[0021] Step 1: Manufacturing resistor chips: A resistive film layer is formed on a high-alumina ceramic substrate using traditional screen printing or magnetron sputtering processes. The resistive film layer includes the high-alumina ceramic substrate, the film layer, and silver electrodes, etc.

[0022] Step 2, Reflow soldering: Solder the flange and resistor chip (the back of the resistor chip needs to be metallized) together by reflow soldering;

[0023] Step 3, Soldering: Solder one end of the lead wire to the silver electrode, and pass the other end through the ceramic shell;

[0024] Step 4: Install the ceramic housing: Connect the ceramic housing to the flange so that the ceramic housing covers the top surface of the ceramic substrate;

[0025] Step 5: Filling with filler: Fill the space between the ceramic shell and the ceramic substrate with a mixture of quartz sand and silicone resin.

[0026] Step 6: Seal and complete heat curing.

[0027] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any changes or substitutions conceived without inventive effort should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope defined in the claims.

Claims

1. A flange resistor with a ceramic housing, comprising a ceramic substrate, a film resistor attached to the surface of the ceramic substrate, a silver electrode, and leads soldered to the silver electrode, characterized in that: It also includes a flange welded to the back of the ceramic substrate and a ceramic shell covering the ceramic substrate, with a mixture of quartz sand and silicone resin filling the space between the ceramic shell and the ceramic substrate.

2. A flange resistor with a ceramic housing as described in claim 1, characterized in that: The flange is made of a metal material with high thermal conductivity and is heat-sealed to the ceramic substrate by reflow soldering.

3. A flange resistor with a ceramic housing as described in claim 1, characterized in that: The ceramic shell is snapped into the flange.

4. A flange resistor with a ceramic housing as described in claim 1, characterized in that: The ceramic substrate is a high-alumina ceramic substrate.

5. A flange resistor with a ceramic housing as described in claim 1, characterized in that: The lead wires are made of Teflon high-temperature wire.

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