Chip feeding device

Abstract

The utility model relates to a chip feeding device which comprises a storage mechanism, a conveying mechanism, a first processing mechanism, a second processing mechanism and a chip transferring mechanism, and the storage mechanism is used for storing wafers or empty films; the conveying mechanism is used for conveying the wafer in the storage mechanism to the chip transfer mechanism and conveying the empty film on the chip transfer mechanism to the storage mechanism; the first processing mechanism is used for cleaning the wafer conveyed by the conveying mechanism; the second processing mechanism is used for carrying out dispergation processing on the wafer conveyed by the conveying mechanism; the chip transfer mechanism comprises a workbench and a chip transfer module, and the workbench is used for bearing and processing the wafers conveyed by the conveying mechanism; and the chip transfer mechanism is used for picking up and transferring the chips on the wafer to obtain an empty film. Therefore, the risk of chip damage can be reduced, the labor cost is reduced, and the chip production efficiency is improved.

Description

Technical Field

[0001] This application relates to the field of chip technology, and in particular to a chip loading device. Background Technology

[0002] A wafer is a common chip "formula" in the semiconductor packaging and testing industry, and it is the most common semiconductor material. Chips are typically mounted on a blue film, which is then attached to a wafer ring. Wafers are generally available in 6-inch, 8-inch, and 12-inch sizes; 8-inch wafers are currently the most common, but 12-inch wafers are also becoming increasingly prevalent.

[0003] Currently, wafer cleaning, deresin removal, chip stripping, and chip transfer are all performed manually, which poses a significant risk of secondary contamination and damage to wafers and chips, resulting in high labor costs and low production efficiency. Utility Model Content

[0004] Based on this, this application provides a chip loading device that can reduce the risk of chip damage, reduce labor costs, and improve chip production efficiency.

[0005] A chip loading device, comprising:

[0006] Storage mechanism, used to store wafers or empty films;

[0007] A conveying mechanism is used to transfer wafers from the storage mechanism to the chip transfer mechanism, and to transfer empty films on the chip transfer mechanism to the storage mechanism.

[0008] A first processing unit is located on the transmission path of the transmission mechanism, and the first processing unit is used to clean the wafers transmitted by the transmission mechanism.

[0009] A second processing unit is located on the transmission path of the conveying mechanism and on the side of the first processing unit away from the storage mechanism; the second processing unit is used to perform deresin removal processing on the wafers conveyed by the conveying mechanism.

[0010] A chip transfer mechanism includes a worktable and a chip transfer module. The worktable is used to carry and process the wafer transmitted by the transfer mechanism. The chip transfer mechanism is used to pick up and transfer the chip on the wafer to obtain the empty film.

[0011] In one embodiment, the conveying mechanism includes a gripper assembly and a first moving assembly;

[0012] The gripper assembly is connected to the first moving assembly;

[0013] The first moving component is used to drive the gripper component to move between the storage mechanism and the chip transfer mechanism.

[0014] In one embodiment, the conveying mechanism further includes a limiting component, which includes two limiting plates disposed on both sides of the first moving component and extending along the movement direction of the first moving component; the limiting plate is provided with a support platform on the side of the first moving component, the support platform being used to support the edge of the wafer or the edge of the empty film.

[0015] In one embodiment, the gripper assembly includes a first gripper module and a second gripper module that are spaced apart and connected to the first moving component;

[0016] The chip loading device includes a first buffer mechanism and a second buffer mechanism spaced above the first moving component. The first buffer mechanism is used to buffer the wafer held by the gripper assembly; the second buffer mechanism is used to buffer the empty film held by the gripper assembly.

[0017] In one embodiment, the first cache mechanism and the second cache mechanism have the same structure, both including:

[0018] The connecting frame is connected to the first lifting assembly;

[0019] An adsorption assembly includes a first annular adsorption member and a second adsorption member. The first annular adsorption member is connected to the connecting frame. The second adsorption member is located in the middle of the first annular adsorption member and is connected to the connecting frame. The second adsorption member is capable of moving along the axial direction of the first annular adsorption member.

[0020] The first lifting component is used to move the connecting frame away from or towards the gripper component.

[0021] In one embodiment, the worktable includes a clamping assembly and a pin assembly; the clamping assembly is configured as a hollow structure and is used to clamp and fix the wafer; the pin assembly is located in the middle of the clamping assembly and is movable along the central axis of the clamping assembly to lift the chip on the wafer upward;

[0022] The chip transfer module includes two pick-and-flip components and two transfer components; the two pick-and-flip components are disposed on the same side of the worktable along a first direction; the two transfer components are disposed on opposite sides of the worktable along a second direction; each pick-and-flip component is used to pick up the ejected chip and rotate the chip 180°; each transfer component is used to receive and transfer the chip on the adjacent pick-and-flip component; the first direction and the second direction intersect.

[0023] In one embodiment, the worktable is provided with a rotating component, a second moving component, and a third moving component; the rotating component is used to drive the clamping component to rotate; the second moving component is used to drive the rotating component to move along the first direction; and the third moving component is used to drive the second moving component to move along the second direction.

[0024] The chip loading device includes a first imaging unit, which is used to acquire first position information of the chip on the wafer relative to the ejector assembly; the rotating assembly can drive the clamping assembly to rotate according to the first position information; the second moving assembly can drive the rotating assembly to move along the first direction according to the first position information; and the third moving assembly can drive the second moving assembly to move along the second direction according to the first position information, so that the chip on the wafer is moved to directly above the ejector assembly.

[0025] In one embodiment, each of the pickup and flipping components includes an adsorption head, a flipping drive, and a first drive module; the flipping drive is used to drive the adsorption head to flip 180°; the first drive module is used to drive the flipping drive to move along a third direction.

[0026] The chip transfer module also includes a second drive module, with the two pick-up and flip components connected to the second drive module. The second drive module is used to drive the two pick-up and flip components to move alternately along the second direction, the third direction being perpendicular to the first direction and the third direction being perpendicular to the second direction.

[0027] In one embodiment, each transfer component includes a linear rotation execution module, a third drive module, and a fourth drive module; the linear rotation execution module is used to pick up a chip and can drive the chip to rotate and move along a third direction; the third drive module is used to drive the linear rotation execution module to move along the first direction; the fourth drive module is used to drive the third drive module to move along the second direction; the third direction is perpendicular to both the first and second directions.

[0028] The chip loading device further includes a second imaging unit, which is used to acquire second position information of the chip received by the transfer component relative to the center of the nozzle of the linear rotary execution module; the linear rotary execution module can drive the chip to rotate according to the second position information; the third driving module can drive the linear rotary execution module to move along the first direction according to the second position information, and the fourth driving module can drive the third driving module to move along the second direction according to the second position information, so as to compensate for the positional deviation of the chip relative to the center of the nozzle on the linear rotary execution module; the second imaging unit is also used to perform appearance inspection on the chip received by the transfer component.

[0029] In one embodiment, the first processing mechanism includes a first support and a cleaning component, the first support being used to support the cleaning component above the conveying mechanism; the cleaning component being used to perform plasma cleaning on the wafer being conveyed by the conveying mechanism.

[0030] The second processing mechanism includes a second support and a desmearing assembly; the second support is used to support the desmearing assembly above the conveying mechanism; the desmearing assembly is used to perform ultraviolet desmearing treatment on the wafers conveyed by the conveying mechanism.

[0031] The aforementioned chip loading device includes a storage mechanism, a conveying mechanism, a first processing mechanism, a second processing mechanism, and a chip transfer mechanism. The conveying mechanism facilitates the transfer of wafers between the storage mechanism and the chip transfer mechanism. During this transfer process, the first and second processing mechanisms clean and de-adhesive from the wafers, while the chip transfer mechanism peels off and transfers the chips from the wafers. In other words, the aforementioned mechanisms work together to achieve wafer cleaning, de-adhesive removal, chip peeling, and transfer. The mechanisms are closely integrated, requiring no manual operation, which significantly reduces labor costs and the probability of wafer and chip contamination or damage, thereby reducing chip production costs and improving chip production efficiency. Attached Figure Description

[0032] Figure 1 This is a schematic diagram of the structure of a chip loading device provided in some embodiments of this application.

[0033] Figure 2 This is a schematic diagram of the material storage mechanism in a chip feeding device provided in some embodiments of this application.

[0034] Figure 3 This is a schematic diagram of the conveying mechanism in a chip loading device provided in some embodiments of this application.

[0035] Figure 4This is a schematic diagram of the structure of the first or second buffer mechanism in the chip loading device provided in some embodiments of this application.

[0036] Figure 5 This is a schematic diagram of the chip transfer mechanism in a chip loading device provided in some embodiments of this application.

[0037] Figure 6 This is a schematic diagram of the worktable structure of a chip transfer mechanism provided in some embodiments of this application.

[0038] Figure 7 This is a schematic diagram of the ejector pin assembly of a chip transfer mechanism provided in some embodiments of this application.

[0039] Figure 8 This is a schematic diagram of the structure of the pick-up and flip component of the chip transfer mechanism provided in some embodiments of this application;

[0040] Figure 9 This is a schematic diagram of the transfer component of a chip transfer mechanism provided in some embodiments of this application.

[0041] Figure 10 This is a schematic diagram of the structure of the first processing mechanism in a chip loading device provided in some embodiments of this application.

[0042] Figure 11 This is a schematic diagram of the structure of the second processing mechanism in the chip loading device provided in some embodiments of this application.

[0043] Figure 12 This is a schematic diagram of the wafer structure provided for some embodiments of this application.

[0044] Explanation of reference numerals in the attached figures:

[0045] 10. Chip loading device; 11. Frame; 12. Storage mechanism; 121. Material box; 122. Opening; 123. Second lifting assembly; 124. Guide rod; 13. Conveying mechanism; 131. Gripper assembly; 1311. First gripper module; 1312. Second gripper module; 132. First moving assembly; 1321. Guide component; 1322. Sliding component; 1323. First driving component; 133. Limiting assembly; 1331. Limiting plate; 1332. Support platform; 14a. First buffer mechanism; 14b. Second... 141. Buffer mechanism; 142. Connecting frame; 142. Adsorption assembly; 1421. First annular adsorption component; 1421a. Annular component; 1421b. First suction head; 1422. Second adsorption component; 1422a. Mounting component; 1422b. Second suction head; 1422c. Second driving component; 143. First lifting assembly; 15. First processing mechanism; 151. First support; 152. Cleaning assembly; 16. Second processing mechanism; 161. Second support; 162. Degumming assembly; 17. Chip transfer mechanism; 171 1711 Worktable; 17111 Clamping assembly; 17111 Cover; 17111a Connecting plate; 17111b Pressing plate; 17111c Window; 17111d Clearance opening; 17112 Pressing unit; 17113 Support base; 1712 Ejector pin assembly; 17121 Cylinder; 17122 Third drive unit; 1713 Rotation assembly; 1714 Second moving assembly; 17141 First guide rail assembly; 17142 Fourth drive unit; 1715 Third moving assembly; 1715 1. Second guide rail assembly; 17152. Fifth driving component; 172. Chip transfer module; 1721. Pick-up and flip assembly; 17211. Adsorption head; 17212. Flip driving component; 17213. First driving module; 1722. Transfer assembly; 17221. Linear rotation execution module; 17222. Third driving module; 17223. Fourth driving module; 1723. Second driving module; 18. First imaging unit; 19. Second imaging unit; X, First direction; Y, Second direction; Z, Third direction;

[0046] 20. Wafer; 21. Thin film; 22. Chip. Detailed Implementation

[0047] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0048] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0049] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0050] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0051] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0052] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0053] Please see Figure 1 , Figure 5 and Figure 12 One embodiment of this application provides a chip loading device 10, including a storage mechanism 12, a conveying mechanism 13, a first processing mechanism 15, a second processing mechanism 16, and a chip transfer mechanism 17; the storage mechanism 12 is used to store wafers 20 or empty films; the conveying mechanism 13 is used to transfer the wafers 20 in the storage mechanism 12 to the chip transfer mechanism 17, and to transfer the empty films on the chip transfer mechanism 17 to the storage mechanism 12; the first processing mechanism 15 is disposed on the conveying path of the conveying mechanism 13, and the first processing mechanism 15 is used to process the conveying mechanism 16. The wafer 20 transported by the conveying mechanism 13 is cleaned; the second processing mechanism 16 is located on the transport path of the conveying mechanism 13 and on the side of the first processing mechanism 15 away from the storage mechanism 12; the second processing mechanism 16 is used to de-adhesive process the wafer 20 transported by the conveying mechanism 13; the chip transfer mechanism 17 includes a worktable 171 and a chip transfer module 172, the worktable 171 is used to carry and process the wafer 20 transported by the conveying mechanism 13; the chip transfer module 172 is used to pick up and transfer the chip 22 on the wafer 20 to obtain an empty film.

[0054] It should be noted that, for reference Figure 12 The wafer 20 includes a thin film 21 and a plurality of chips 22 adhered to the thin film 21. The plurality of chips 22 can be arranged at intervals in a first direction X and a second direction Y, and the chips 22 can be generally rectangular. The empty thin film 21 after all the chips 22 on the wafer 20 are peeled off is called the empty film.

[0055] Understandably, see Figure 1 The chip loading device 10 includes a frame 11, on which a storage mechanism 12, a first processing mechanism 15, a second processing mechanism 16, a conveying mechanism 13, and a chip transfer mechanism 17 can all be mounted. The first processing mechanism 15 and the second processing mechanism 16 can be arranged along the transmission path of the conveying mechanism 13 and supported above the conveying mechanism 13 so as to clean and de-adhesive process the wafers 20 transported by the conveying mechanism 13 on the transmission path. The storage mechanism 12 can be located upstream of the conveying mechanism 13, and the chip transfer mechanism 17 can be located downstream of the conveying mechanism 13.

[0056] The chip loading device 10 provided in this application embodiment includes a storage mechanism 12, a conveying mechanism 13, a first processing mechanism 15, a second processing mechanism 16, and a chip transfer mechanism 17. The conveying mechanism 13 realizes the transfer of the wafer 20 between the storage mechanism 12 and the chip transfer mechanism 17. During the transfer process, the first processing mechanism 15 and the second processing mechanism 16 can clean and de-adhesive the wafer 20, and the chip transfer mechanism 17 can peel off and transfer the chips 22 on the wafer 20. That is to say, the cleaning, de-adhesive removal, peeling off and transfer of the chips 22 on the wafer 20 are realized through the cooperation of the aforementioned mechanisms. The mechanisms are closely connected and do not require manual operation, which can greatly reduce labor costs and reduce the probability of contamination and damage to the wafer 20 and chips 22, thereby reducing the production cost of the chips 22 and improving the production efficiency of the chips 22.

[0057] Please see Figure 2 In one embodiment, the storage mechanism 12 includes a second lifting component 123 and a material box 121. The second lifting component 123 is used to drive the material box 121 to rise or fall. The material box 121 may be provided with multiple accommodating layers, each accommodating layer being used to place a wafer 20. The material box 121 is provided with an opening 122 for moving the wafer 20 in and out.

[0058] Thus, the conveying mechanism 13 can clamp the wafer 20 through the opening 122. After the wafer 20 in the material box 121 is removed, the second lifting component 123 drives the material box 121 to rise to a set height so that the conveying mechanism 13 can clamp the wafer 20 at the same height.

[0059] Please see Figure 2 In one embodiment, the storage mechanism 12 further includes guide rods 124, which are disposed at the opening 122 of the material box 121 and used to guide the wafer 20 from the material box 121 into the transfer mechanism 13. The number of guide rods 124 can be one or more; specifically, there are two guide rods 124, spaced apart at the opening 122 of the material box 121. The plane containing the two guide rods 124 is parallel to the plane containing the wafer 20 inside the material box 121.

[0060] Please see Figure 1 and Figure 3 In one embodiment, the conveying mechanism 13 includes a gripper assembly 131 and a first moving assembly 132; the gripper assembly 131 is connected to the first moving assembly 132; the first moving assembly 132 is used to drive the gripper assembly 131 to move between the storage mechanism 12 and the chip transfer mechanism 17.

[0061] Thus, during use, the gripper assembly 131 grips the wafer 20 from the storage mechanism 12, and the first moving component 132 drives the gripper assembly 131 to move to the chip transfer mechanism 17 and puts the wafer 20 into the chip transfer mechanism 17; after all the chips 22 on the wafer 20 have been transferred, the gripper assembly 131 grips the empty film from the chip transfer mechanism 17, and the first moving component 132 drives the gripper assembly 131 to move to the storage mechanism 12 and places the empty film in the material box 121.

[0062] Understandably, please refer to Figure 3 The first moving component 132 may include a guide 1321, a slider 1322, and a first driving component 1323. The guide 1321 may be disposed between the storage mechanism 12 and the chip transfer mechanism 17. The slider 1322 is slidably connected to the guide 1321, and the gripper assembly 131 may be disposed on the slider 1322. The first driving component 1323 is used to drive the slider 1322 to move along the guide 1321, thereby facilitating the movement of the gripper assembly 131 between the storage mechanism 12 and the chip transfer mechanism 17. Specifically, the guide 1321 may be a slide rail, and the slider 1322 may be a sliding block slidably connected to the slide rail. The first driving component 1323 includes a drive motor.

[0063] In one embodiment, please refer to Figure 3 The conveying mechanism 13 also includes a limiting component 133, which includes two limiting plates 1331. The two limiting plates 1331 are disposed on both sides of the first moving component 132 and extend along the movement direction of the first moving component 132. A support platform 1332 is provided on the side of the limiting plate 1331 near the first moving component 132. The support platform 1332 is used to support the edge of the wafer 20 or the edge of the empty film.

[0064] Thus, when the first moving component 132 moves the wafer 20 or empty film between the storage mechanism 12 and the chip transfer mechanism 17, the edge of the wafer 20 or empty film can rest on the support platform 1332 on the two limiting plates 1331. The two limiting plates 1331 can limit the wafer 20 or empty film, preventing the wafer 20 or empty film from shifting position during movement, thereby facilitating the transfer of the wafer 20 to the chip transfer mechanism 17 and the transfer of the empty film to the storage mechanism 12, which helps to improve the working efficiency of the chip loading device 10.

[0065] In one embodiment, please refer to Figure 1 , Figure 3 and Figure 4The gripper assembly 131 includes a first gripper module 1311 and a second gripper module 1312 that are spaced apart and connected to the first moving assembly 132; the chip loading device 10 includes a first cache mechanism 14a and a second cache mechanism 14b that are spaced apart above the first moving assembly 132. The first cache mechanism 14a is used to cache the wafer 20 held by the gripper assembly 131; the second cache mechanism 14b is used to cache the empty film held by the gripper assembly 131.

[0066] Thus, when the wafer 20 is transferred from the storage mechanism 12 to the chip transfer mechanism, the first gripper module 1311 of the gripper assembly 131 can grip the wafer 20 from the storage mechanism 12. The first moving component 132 drives the gripper assembly 131 to move to the first buffer mechanism 14a. The first buffer mechanism 14a buffers the wafer 20 gripped by the first gripper module 1311. The first moving component 132 drives the gripper assembly 131 to move, so that the second gripper module 1312 in the gripper assembly 131 moves into position. The second gripper module 1312 grips the wafer 20 buffered by the first buffer mechanism 14a. The first moving component 132 drives the gripper assembly 131 to move to the worktable 171 of the chip transfer mechanism 17. The second gripper module 1312 places the gripped wafer 20 on the worktable 171. When the empty film on the worktable 171 is transferred from the chip transfer mechanism 17 to the storage mechanism 12, the second gripper module 1312 of the gripper assembly 131 can grip the empty film from the worktable 171. The first moving component 132 drives the gripper assembly 131 to move to the second buffer mechanism 14b. The second buffer mechanism 14b buffers the empty film gripped by the second gripper module 1312. The first moving component 132 drives the gripper assembly 131 to move, so that the first gripper module 1311 of the gripper assembly 131 moves into place. The first gripper module 1311 grips the empty film buffered by the second buffer mechanism 14b. The first moving component 132 drives the gripper assembly 131 to move to the storage mechanism 12. The first gripper module 1311 puts the gripped empty film back into the storage mechanism 12. In this embodiment, by setting a first buffer mechanism 14a and a second buffer mechanism 14b, the first gripper module 1311 and the second gripper film group are switched, which facilitates the transfer of wafer 20 or empty film and improves the working efficiency of chip loading device 10.

[0067] In one embodiment, please refer to Figure 4The first buffer mechanism 14a and the second buffer mechanism 14b have the same structure, both including a connecting frame 141, an adsorption component 142 and a first lifting component 143. The adsorption component 142 includes a first annular adsorption member 1421 and a second adsorption member 1422. The first annular adsorption member 1421 is connected to the connecting frame 141. The second adsorption member 1422 is located in the middle of the first annular adsorption member 1421 and is connected to the connecting frame 141. The second adsorption member 1422 can move along the axial direction of the first annular adsorption member 1421. The first lifting component 143 is connected to the connecting frame 141 and is used to move the connecting frame 141 away from or closer to the gripper component 131.

[0068] Understandably, please refer to Figure 4 The first annular adsorption component 1421 is used to adsorb a wafer 20 or an empty film of the first size. The first annular adsorption component 1421 includes an annular part 1421a and a plurality of first adsorption heads 1421b. The annular part 1421a is connected to the connecting frame 141, and the plurality of first adsorption heads 1421b are distributed at intervals along the circumference of the annular part 1421a and pass through the annular part 1421a.

[0069] Please see Figure 4 The second adsorption component 1422 is used to adsorb a wafer 20 or a hollow film of a second size, which is smaller than the first size. The second adsorption component 1422 includes a mounting component 1422a and a plurality of second suction heads 1422b. The mounting component 1422a may be a circular component. The plurality of second suction heads 1422b are distributed at intervals along the circumference of the mounting component 1422a and pass through the mounting component 1422a. The mounting component 1422a can be connected to the connecting frame 141 through a second driving component 1422c. The second driving component 1422c is used to drive the mounting component 1422a to move along the axial direction of the annular component 1421a. For example, the second driving component 1422c includes a cylinder.

[0070] Thus, when the wafer 20 or empty film is of the first size, the first annular adsorption member 1421 adsorbs the wafer 20 or empty film of the first size, and the first lifting component 143 drives the adsorption component 142 to move closer to or away from the conveying mechanism 13, thereby achieving the buffering and release of the wafer 20 or empty film of the first size; when the wafer 20 or empty film is of the second size, the second adsorption member 1422 moves along the axial direction of the first annular adsorption member 1421, so that the second adsorption member 1422 is lower than the first annular adsorption member 1421, so that the second adsorption member 1422 adsorbs the second wafer 20 or empty film of the second size, and the first lifting component 143 drives the adsorption component 142 to move closer to or away from the conveying mechanism 13, thereby achieving the buffering and release of the wafer 20 or empty film of the second size. In other words, by setting up the connecting frame 141, the adsorption component 142 and the first lifting component 143, this embodiment can easily realize the buffering and release of the wafer 20 or the empty film. By making the adsorption component include the first annular adsorption component 1421 and the second adsorption component 1422, the buffering and release of wafers 20 of different sizes can be realized, thereby enabling the chip loading device 10 to realize the cleaning, debinding, chip peeling and transfer of wafers 20 of different sizes.

[0071] In one embodiment, please refer to Figures 5 to 7 The worktable 171 includes a clamping assembly 1711 and a ejector assembly 1712; the clamping assembly 1711 is constructed as a hollow structure and is used to clamp and fix the wafer 20; the ejector assembly 1712 is located in the middle of the clamping assembly 1711 and can move along the central axis of the clamping assembly 1711 to lift the chip 22 on the wafer 20 upward; the chip 22 loading module includes two pick-and-flip assemblies 1721 and two transfer assemblies 1722. 722; Two pick-and-flip components 1721 are arranged in parallel and positioned on the same side of the worktable 171 along the first direction X; Two transfer components 1722 are positioned on opposite sides of the worktable 171 along the second direction Y; Each pick-and-flip component 1721 is used to pick up the ejected chip 22 and rotate the chip 22 by 180°; Each transfer component 1722 is used to receive and transfer the chip 22 on the adjacent pick-and-flip component 1721; The first direction X and the second direction Y intersect.

[0072] Thus, by cooperating with the clamping component 1711 and the ejector component 1712, the chip 22 on the wafer 20 can be lifted upwards, thereby stripping the chip 22 from the wafer 20. By setting two pick-up flipping components 1721 and two transfer components 1722, with the two pick-up flipping components 1721 and the two transfer components 1722 corresponding to each other, the transfer efficiency of the chip 22 on the wafer 20 can be effectively improved, thereby effectively improving the working efficiency of the chip loading device 10.

[0073] In one embodiment, please refer to Figure 6 The worktable 171 is provided with a rotating component 1713, a second moving component 1714, and a third moving component 1715. The rotating component 1713 is used to drive the clamping component 1711 to rotate. The second moving component 1714 is used to drive the rotating component 1713 to move along a first direction X. The third moving component 1715 is used to drive the second moving component 1714 to move along a second direction Y. The chip loading device 10 includes a first imaging unit 18, which is used to acquire first position information of the chip 22 on the wafer 20 relative to the ejector component 1712. The rotating component 1713 can drive the clamping component 1711 to rotate according to the first position information. The second moving component 1714 can drive the rotating component 1713 to move along the first direction X according to the first position information. The third moving component 1715 can drive the second moving component 1714 to move along the second direction Y according to the first position information, so that the chip 22 on the wafer 20 is moved directly above the ejector component 1712.

[0074] Thus, when chip 22 is peeled off, the first imaging unit 18 obtains the first position information of chip 22 on wafer 20 relative to the ejector assembly 1712. The rotating assembly 1713 drives the clamping assembly 1711 to rotate a certain angle according to the first position information. The second moving assembly 1714 drives the rotating assembly 1713 to move along the first direction X according to the first position information. The third moving assembly 1715 drives the second moving assembly 1714 to move along the second direction Y according to the first position information. This allows the chip 22 on wafer 20 to be moved directly above the ejector assembly 1712, ensuring that each chip 22 lifted by the ejector assembly 1712 is placed neatly, so that the chip 22 can be picked up and transferred.

[0075] It should be noted that you should refer to [link / reference]. Figure 6 The clamping assembly 1711 includes a cover 17111, a pressing unit 17112, and a support base 17113; a clamping position for placing the wafer 20 is formed between the cover 17111 and the support base 17113; the pressing unit 17112 is used to drive the cover 17111 closer to the support base 17113 so that the thin film 21 of the wafer 20 is tensioned; the rotating assembly 1713 is used to drive the support base 17113 to rotate, so as to drive the wafer 20 to rotate.

[0076] In one example, see Figure 6The cover 17111 includes a connecting plate 17111a and a pressing plate 17111b. A gap is formed between the pressing plate 17111b and the connecting plate 17111a, allowing the wafer 20 to enter the clamping position through the gap. A window 17111c is formed in the middle of the pressing plate 17111b, through which the chip 22 can be exposed. The pressing plate 17111b also has a clearance opening 17111d communicating with the window 17111c, for the passage of the second gripper module 1312 that clamps the wafer 20.

[0077] In one example, see Figure 7 The ejector assembly 1712 includes a cylindrical body 17121 and several push pins (not shown in the figure). The end of the cylindrical body 17121 has a through hole (not shown in the figure) and a vacuum hole (not shown in the figure), allowing the push pins to move up and down within the through hole. A vacuum cavity is formed inside the cylindrical body 17121. When the adsorption head 17211 reaches above the chip 22 being lifted, the adsorption head 17211 adsorbs the chip 22 from above, while the cylindrical body 17121 adsorbs the film 21 from below, causing the chip 22 to peel off from the film 21.

[0078] Please see Figure 7 The ejector assembly 1712 also includes a third drive 17122, which drives the cylinder 17121 to move along a third direction Z so that the ejector assembly 1712 moves closer to or further away from the wafer 20 so that the ejector assembly 1712 lifts the chip 22.

[0079] In one example, see Figure 6 The second moving component 1714 includes a first guide rail assembly 17141 and a fourth driving member 17142. The first guide rail assembly 17141 is arranged along a first direction X. The clamping component 1711 is slidably disposed on the first guide rail assembly 17141. The fourth driving member 17142 is used to drive the rotating component 1713 to move along the first guide rail assembly 17141. The fourth driving member 17142 includes a linear motor.

[0080] In one example, see Figure 6 The third moving component 1715 includes a second guide rail assembly 17151 and a fifth driving member 17152. The second guide rail assembly 17151 is arranged along the second direction Y. The first guide rail assembly 17141 is slidably disposed on the second guide rail assembly 17151. The fifth driving member 17152 is used to drive the first guide rail assembly 17141 to move along the second guide rail assembly 17151. The fifth driving member 17152 includes a linear motor.

[0081] In one embodiment, please refer to Figure 8Each pickup-flipping assembly 1721 includes an adsorption head 17211, a flipping drive 17212, and a first drive module 17213. The flipping drive 17212 is used to drive the adsorption head 17211 to flip 180°. The first drive module 17213 is used to drive the flipping drive 17212 to move along the third direction Z. The chip transfer module 172 also includes a second drive module 1723. The two pickup-flipping assemblies 1721 are connected to the second drive module 1723. The second drive module 1723 is used to drive the two pickup-flipping assemblies 1721 to move alternately along the second direction Y. The third direction Z is perpendicular to the first direction X and the third direction Z is perpendicular to the second direction Y.

[0082] Thus, during use, the second drive module 17214 drives a pickup and flipping component 1721 to move along the second direction Y, causing the adsorption head 17211 to move directly above the lifted chip 22. The first drive module 17213 then drives the adsorption head 17211 downwards towards the lifted chip 22, where it adsorbs the chip 22. The first drive module 17213 then drives the adsorption head 17211 upwards, and the second drive module 17214... 14 drives the pick-up flipping component 1721 that picks up the chip 22 to move to the side where the corresponding transfer component 1722 is located. The flipping drive 17212 drives the adsorption head 17211 to flip 180° so that the chip 22 on the adsorption head 17211 faces upwards, allowing the corresponding transfer component 1722 to receive and transfer the chip 22. The second drive module 17214 drives another pick-up flipping component 1721, repeating the above process alternately to complete the stripping and transfer of all chips on the wafer. In summary, this embodiment, by driving two pick-up flipping components to move alternately along the second direction Y using the second drive module, and cooperating with two transfer components, can greatly improve the chip transfer efficiency on the wafer.

[0083] In one embodiment, please refer to Figure 9Each transfer component 1722 includes a linear rotation execution module 17221, a third drive module 17222, and a fourth drive module 17223. The linear rotation execution module 17221 is used to pick up the chip 22 and can drive the chip 22 to rotate and move along a third direction Z. The third drive module 17222 is used to drive the linear rotation execution module 17221 to move along a first direction X. The fourth drive module 17223 is used to drive the third drive module 17222 to move along a second direction Y. The third direction Z is perpendicular to the first direction X and perpendicular to the second direction Y. The chip loading device 10 also includes a second imaging unit 19, which is used to acquire the transfer component 17222. The second position information of the chip 22 received by the transfer assembly 17221 relative to the center of the nozzle of the linear rotary execution module 17221; the linear rotary execution module 17221 can drive the chip 22 to rotate according to the second position information; the third drive module 17222 can drive the linear rotary execution module 17221 to move along the first direction X according to the second position information, and the fourth drive module 17223 can drive the third drive module 17222 to move along the second direction Y according to the second position information, so as to compensate for the positional deviation of the chip 22 relative to the center of the nozzle on the linear rotary execution module 17221; the second imaging unit 19 is also used to perform appearance inspection on the chip 22 received by the transfer assembly 1722.

[0084] Thus, during the transfer of chip 22, the third drive module 17222 and the fourth drive module 17223 drive the linear rotation execution module 17221 to move along the first direction X and the second direction Y, respectively. This causes the linear rotation execution module 17221 to move above the pickup and flipping assembly 1721, so that the linear rotation execution module 17221 can dock with the suction head 17211 of the pickup and flipping assembly 1721 and pick up chip 22. Before transferring chip 22 to the next station, the second imaging unit 19 uses the image of chip 22 received by the transfer assembly 17222 relative to the linear rotation execution module 17222. The second position information of the nozzle center of chip 21 is used so that the linear rotation execution module 17221 can drive chip 22 to rotate according to the second position information. The third drive module 17222 drives the linear rotation execution module 17221 to move along the first direction X according to the second position information. The fourth drive module 17223 drives the third drive module 17222 to move along the second direction Y according to the second position information. This can compensate for the positional and angular deviations of chip 22 relative to the nozzle center on the linear rotation execution module 17221, realize the position calibration of chip 22, so that chip 22 can be accurately transferred to the next station. In addition, the second imaging unit 19 can be used to realize the appearance inspection of chip 22, and timely eliminate defective chips 22, which helps to improve the yield rate.

[0085] It should be noted that the linear rotary actuator module 17221, also known as the ZR module, includes a nozzle, encoder, vacuum tubing, built-in guide rail, voice coil motor, and servo motor. The voice coil motor controls the nozzle to move along the third direction Z (that is, the Z-axis direction), and the servo motor controls the nozzle to rotate.

[0086] In one embodiment, please refer to Figure 10 The first processing mechanism 15 includes a first support 151 and a cleaning component 152. The first support 151 is used to support the cleaning component 152 above the conveying mechanism 13. The cleaning component 152 is used to perform plasma cleaning on the wafer 20 conveyed by the conveying mechanism 13.

[0087] This allows for convenient cleaning of the wafer 20 along the transmission path of the conveying mechanism 13, improving cleaning effect and efficiency. In addition, it reduces the space occupied by the first processing mechanism 15, thereby helping to reduce the floor space of the chip loading device 10.

[0088] It should be noted that the cleaning component 152 includes a plasma cleaning component.

[0089] In one embodiment, please refer to Figure 11 The second processing mechanism 16 includes a second support 161 and a desmearing assembly 162; the second support 161 is used to support the desmearing assembly 162 above the conveying mechanism 13; the desmearing assembly 162 is used to perform ultraviolet desmearing treatment on the wafer 20 conveyed by the conveying mechanism 13.

[0090] This allows for convenient debonding of the wafer 20 along the transmission path of the conveying mechanism 13, improving the debonding effect and efficiency. In addition, it reduces the space occupied by the second processing mechanism 16, thereby helping to reduce the floor space of the chip loading device 10.

[0091] It should be noted that the debonding component 162 includes an ultraviolet light source.

[0092] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0093] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A chip loading device, characterized in that, include: Storage mechanism, used to store wafers or empty films; A conveying mechanism is used to transfer wafers from the storage mechanism to the chip transfer mechanism, and to transfer empty films on the chip transfer mechanism to the storage mechanism. A first processing unit is located on the transmission path of the transmission mechanism, and the first processing unit is used to clean the wafers transmitted by the transmission mechanism. A second processing unit is located on the transmission path of the conveying mechanism and on the side of the first processing unit away from the storage mechanism; the second processing unit is used to perform deresin removal processing on the wafers conveyed by the conveying mechanism. A chip transfer mechanism includes a worktable and a chip transfer module. The worktable is used to carry and process the wafer transmitted by the transfer mechanism. The chip transfer mechanism is used to pick up and transfer the chip on the wafer to obtain the empty film.

2. The chip loading device according to claim 1, characterized in that, The conveying mechanism includes a gripper assembly and a first moving assembly; The gripper assembly is connected to the first moving assembly; The first moving component is used to drive the gripper component to move between the storage mechanism and the chip transfer mechanism.

3. The chip loading device according to claim 2, characterized in that, The conveying mechanism further includes a limiting component, which includes two limiting plates disposed on both sides of the first moving component and extending along the movement direction of the first moving component; a support platform is provided on the side of the limiting plate near the first moving component, and the support platform is used to support the edge of the wafer or the edge of the empty film.

4. The chip loading device according to claim 2, characterized in that, The gripper assembly includes a first gripper module and a second gripper module that are spaced apart and connected to the first moving component; The chip loading device includes a first buffer mechanism and a second buffer mechanism spaced above the first moving component. The first buffer mechanism is used to buffer the wafer held by the gripper assembly; the second buffer mechanism is used to buffer the empty film held by the gripper assembly.

5. The chip loading device according to claim 4, characterized in that, The first cache mechanism and the second cache mechanism have the same structure, both including: The connecting frame is connected to the first lifting assembly; An adsorption assembly includes a first annular adsorption member and a second adsorption member. The first annular adsorption member is connected to the connecting frame. The second adsorption member is located in the middle of the first annular adsorption member and is connected to the connecting frame. The second adsorption member is capable of moving along the axial direction of the first annular adsorption member. The first lifting component is used to move the connecting frame away from or towards the gripper component.

6. The chip loading device according to claim 1, characterized in that, The worktable includes a clamping assembly and a pin assembly; the clamping assembly is constructed as a hollow structure and is used to clamp and fix the wafer; the pin assembly is located in the middle of the clamping assembly and can move along the central axis of the clamping assembly to lift the chip on the wafer upward. The chip transfer module includes two pick-and-flip components and two transfer components; the two pick-and-flip components are disposed on the same side of the worktable along a first direction; the two transfer components are disposed on opposite sides of the worktable along a second direction; each pick-and-flip component is used to pick up the ejected chip and rotate the chip 180°; each transfer component is used to receive and transfer the chip on the adjacent pick-and-flip component; the first direction and the second direction intersect.

7. The chip loading device according to claim 6, characterized in that, The worktable is provided with a rotating component, a second moving component, and a third moving component; the rotating component is used to drive the clamping component to rotate; the second moving component is used to drive the rotating component to move along the first direction; the third moving component is used to drive the second moving component to move along the second direction. The chip loading device includes a first imaging unit, which is used to acquire first position information of the chip on the wafer relative to the ejector assembly; the rotating assembly can drive the clamping assembly to rotate according to the first position information; the second moving assembly can drive the rotating assembly to move along the first direction according to the first position information; and the third moving assembly can drive the second moving assembly to move along the second direction according to the first position information, so that the chip on the wafer is moved to directly above the ejector assembly.

8. The chip loading device according to claim 6, characterized in that, Each of the aforementioned pickup and flipping components includes an adsorption head, a flipping drive component, and a first drive module; The flipping drive is used to drive the adsorption head to flip 180°; the first drive module is used to drive the flipping drive to move along a third direction. The chip transfer module also includes a second drive module, with the two pick-up and flip components connected to the second drive module. The second drive module is used to drive the two pick-up and flip components to move alternately along the second direction, the third direction being perpendicular to the first direction and the third direction being perpendicular to the second direction.

9. The chip loading device according to claim 6, characterized in that, Each transfer component includes a linear rotation execution module, a third drive module, and a fourth drive module; the linear rotation execution module is used to pick up the chip and can drive the chip to rotate and move along a third direction; the third drive module is used to drive the linear rotation execution module to move along the first direction; the fourth drive module is used to drive the third drive module to move along the second direction; the third direction is perpendicular to both the first and second directions. The chip loading device further includes a second imaging unit, which is used to acquire second position information of the chip received by the transfer component relative to the center of the nozzle of the linear rotary execution module; the linear rotary execution module can drive the chip to rotate according to the second position information; the third driving module can drive the linear rotary execution module to move along the first direction according to the second position information, and the fourth driving module can drive the third driving module to move along the second direction according to the second position information, so as to compensate for the positional deviation of the chip relative to the center of the nozzle on the linear rotary execution module; the second imaging unit is also used to perform appearance inspection on the chip received by the transfer component.

10. The chip loading device according to claim 1, characterized in that, The first processing mechanism includes a first support and a cleaning component. The first support is used to support the cleaning component above the conveying mechanism. The cleaning component is used to perform plasma cleaning on the wafers conveyed by the conveying mechanism. The second processing mechanism includes a second support and a desmearing assembly; the second support is used to support the desmearing assembly above the conveying mechanism; the desmearing assembly is used to perform ultraviolet desmearing treatment on the wafers conveyed by the conveying mechanism.

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