Wafer suction pen

Abstract

The utility model provides a wafer suction pen. The wafer suction pen comprises a suction pen body and an adsorption force monitoring unit. The adsorption force monitoring unit comprises a signal receiver, a drum membrane is arranged in the signal receiver, the size of the drum membrane changes along with the change of the size of the adsorption force between the suction pen body and a wafer to be adsorbed, and the signal receiver generates a drum membrane size change signal according to the change of the size of the drum membrane; the signal converter is connected with the signal receiver and is used for converting the tympanic membrane size change signal into an adsorption force value; and the adsorption force monitor is connected with the signal converter and is used for acquiring the adsorption force value and monitoring the adsorption force between the suction pen body and the wafer to be adsorbed according to the adsorption force value. According to the wafer suction pen, defects on the surface of a wafer caused by too large suction force can be avoided, and instability of the wafer in the carrying process caused by insufficient suction force can be avoided at the same time.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, specifically to a wafer pick-up pen. Background Technology

[0002] In semiconductor manufacturing plants, wafer pick-up pens are essential tools for handling wafers, commonly used in visual inspection, wafer transport, and equipment maintenance. Wafer pick-up pens typically generate negative pressure through a suction tube, creating an adhesive force between the pen tip and the wafer surface, thus enabling the pick-up and transport of the wafer.

[0003] Because the suction pen tip is in direct contact with the wafer surface during the process of using a wafer pick-up pen to pick up and transport wafers, the suction force of the wafer pick-up pen has a direct impact on the wafer surface. When the suction force is too large, it may cause defects on the wafer surface, affecting its surface quality and the yield of subsequent processes. When the suction force is insufficient, it may cause the wafer to become unstable during transport, increasing the risk of dropping or shifting.

[0004] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this application, and therefore may include information that does not constitute prior art known to those skilled in the art. Utility Model Content

[0005] Based on this, the present application provides a wafer suction pen that can monitor the suction force in a timely manner, avoiding excessive suction force that could cause defects on the wafer surface, affecting its surface quality and subsequent process yield. At the same time, it can also avoid insufficient suction force that could cause instability of the wafer during handling, reducing the risk of dropping or shifting.

[0006] The wafer pick-up pen includes: a pick-up pen body and a pick-up force monitoring unit;

[0007] The suction pen body is used to adsorb the wafer to be adsorbed; the adsorption force monitoring unit is installed on the suction pen body and is at least partially disposed inside the suction pen body, and is used to monitor the magnitude of the adsorption force between the suction pen body and the wafer to be adsorbed.

[0008] The adsorption force monitoring unit includes:

[0009] A signal receiver is provided with a diaphragm. The size of the diaphragm changes with the magnitude of the adsorption force between the suction pen body and the wafer to be adsorbed. The signal receiver generates a diaphragm size change signal based on the change in the size of the diaphragm.

[0010] A signal converter, connected to the signal receiver, is used to convert the tympanic membrane size change signal into a numerical value of the suction force.

[0011] An adsorption force monitor, connected to the signal converter, is used to acquire the magnitude of the adsorption force and monitor the magnitude of the adsorption force between the pen body and the wafer to be adsorbed based on the magnitude of the adsorption force.

[0012] In some embodiments, the adsorption force monitor internally stores a preset range of adsorption force and is configured to:

[0013] When the magnitude of the adsorption force exceeds the preset range of the adsorption force, the adsorption force monitor issues an alarm signal.

[0014] In some embodiments, the adsorption force monitor further includes a display connected to the signal converter and disposed outside the adsorption pen body, for displaying the magnitude of the adsorption force obtained by the signal converter.

[0015] In some embodiments, the display is also connected to the adsorption force monitor for displaying the preset range of adsorption force stored inside the adsorption force monitor.

[0016] In some embodiments, the adsorption force monitor further includes: an indicator light, connected to the adsorption force monitor and configured to:

[0017] When the magnitude of the adsorption force is within the preset range of the adsorption force, the indicator light operates in the first indication state; when the magnitude of the adsorption force exceeds the preset range of the adsorption force, the indicator light operates in the second indication state.

[0018] In some embodiments, the suction pen body includes: an air extraction tube, a suction force control valve, and a suction pen tip;

[0019] The adsorption force control valve abuts against the air extraction tube; the suction pen head is connected to the air extraction channel of the air extraction tube;

[0020] When the adsorption force control valve is in a preset control state, the adsorption force control valve opens the air extraction channel of the air extraction tube, causing the pen tip to generate adsorption force; when the adsorption force control valve is in a non-preset control state, the adsorption force control valve blocks the air extraction channel of the air extraction tube.

[0021] In some embodiments, the pen body further includes: a cushioning component;

[0022] The air extraction tube, the buffer component, and the suction pen tip are connected in sequence and communicate with each other.

[0023] In some embodiments, the adsorption force monitor internally stores a preset range of adsorption force and is configured such that when the magnitude of the adsorption force exceeds the preset range, the adsorption force monitoring unit undergoes a preset movement.

[0024] The wafer suction pen further includes a connecting rod, one end of which is connected to the adsorption force monitoring unit, and the other end of which is connected to the adsorption force control valve;

[0025] The connecting rod is used to drive the adsorption force control valve to switch to the non-preset control state when the adsorption force monitoring unit moves in the preset manner; when the adsorption force control valve is in the non-preset control state, it blocks the air extraction channel of the air extraction pipe.

[0026] In some embodiments, the pen-absorbing body includes: a pen-absorbing rod, sleeved on the outside of the air extraction tube;

[0027] The adsorption force control valve has one end located outside the pen suction rod and the other end located inside the pen suction rod and abutting against the air extraction tube.

[0028] In some embodiments, the material of the suction tube includes an elastic soft material.

[0029] The wafer pick-up pen provided in this application has, or at least has, the following advantages:

[0030] This application embodiment, by setting an adsorption force monitoring unit on the adsorption pen body, can monitor the magnitude of the adsorption force between the adsorption pen body and the wafer to be adsorbed in real time, thereby timely grasping the adsorption force situation, avoiding excessive adsorption force that may cause defects on the wafer surface, affecting its surface quality and subsequent process yield, and at the same time avoiding insufficient adsorption force that may cause instability of the wafer during handling, reducing the risk of dropping or displacement.

[0031] The adsorption force monitoring unit utilizes the combination of a signal receiver, a signal converter, and an adsorption force monitor to achieve precise detection of changes in adsorption force, thereby improving the accuracy and response speed of monitoring.

[0032] The signal receiver is equipped with a diaphragm that can sensitively respond to changes in pressure (i.e., adsorption force). Therefore, the diaphragm in the signal receiver can effectively capture minute changes in adsorption force, thereby providing a more accurate real-time reflection of the adsorption force state and preventing instability or damage to the wafer during adsorption and handling.

[0033] The signal receiver directly senses changes in the tympanic membrane, and the signal converter can rapidly convert the tympanic membrane size change signal into a numerical value of the adsorption force. The entire process is almost without delay, thus ensuring the real-time monitoring of the adsorption force. Furthermore, converting the tympanic membrane size change signal into a numerical form through the signal converter helps simplify and standardize the data reading and feedback process of the adsorption force.

[0034] Other advantages, objectives, and features of this application will be set forth in part in the description which follows, and in part will be apparent to those skilled in the art from the following examination and study, or may be learned from practice of the invention. The objectives and other advantages of the invention can be realized and obtained through the following description. Attached Figure Description

[0035] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings.

[0036] Figure 1 A three-dimensional structural schematic diagram of a wafer pick-up pen provided in some embodiments of this application;

[0037] Figure 2 for Figure 1 The diagram shows a side view of the wafer pick-up pen.

[0038] Figure 3 This is a structural block diagram of the adsorption force monitoring unit in a wafer suction pen provided in some embodiments of this application;

[0039] Figure 4 This is a schematic diagram of the display structure in a wafer pick-up pen provided in some embodiments of this application;

[0040] Figure 5 A partial three-dimensional structural schematic diagram of a wafer pick-up pen provided in some embodiments of this application;

[0041] Figure 6 This is a schematic diagram of the wiring of a wafer pick-up pen provided in some embodiments of this application.

[0042] Figure label:

[0043] 10. Adsorption force monitoring unit; 101. Signal receiver; 102. Signal converter; 102a. Connecting cable; 103. Adsorption force monitor; 104. Display; 104a. First sub-display; 104b. Second sub-display; 105. Indicator light;

[0044] 201. Suction tube; 202. Adsorption force control valve; 203. Pen tip; 204. Buffer component; 205. Connecting rod; 206. Pen handle. Detailed Implementation

[0045] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.

[0046] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0047] It should be understood that when an element or device is referred to as "connected to" or "connected to", it can be directly connected to other elements or devices, or there can be intervening elements or devices.

[0048] It should be understood that although the terms first, second, etc., may be used to describe various features, these features should not be limited by these terms. These terms are merely used to distinguish one feature from another. Therefore, without departing from the teachings of this utility model, the first feature discussed below may also be referred to as the second feature. For example, a first indication state may be referred to as a second indication state, and similarly, a second indication state may be referred to as a first indication state; the first indication state and the second indication state are different indication states.

[0049] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising / including” or “having,” etc., specify the presence of the stated features, wholes, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, components, parts, or combinations thereof. Meanwhile, in this specification, the term “and / or” includes any and all combinations of the associated listed items.

[0050] During the process of using a wafer pick-up pen to pick up and transport wafers, the pen tip is in direct contact with the wafer surface. Therefore, the magnitude of the pick-up pen's adsorption force has a direct impact on the wafer surface. When the adsorption force is too large, it may cause defects on the wafer surface, affecting its surface quality and the yield of subsequent processes. When the adsorption force is insufficient, it may cause the wafer to become unstable during transport, increasing the risk of dropping or shifting.

[0051] In view of the above shortcomings, this application provides a wafer suction pen that can monitor the suction force in a timely manner, avoid excessive suction force that may cause defects on the wafer surface, affecting its surface quality and subsequent process yield, and at the same time avoid insufficient suction force that may cause instability of the wafer during handling, reducing the risk of dropping or displacement.

[0052] Please see Figure 1 and Figure 2 The wafer pick-up pen specifically includes: a pick-up pen body for picking up wafers to be picked up, and a pick-up force monitoring unit 10. Details of the pick-up pen body will be further described in subsequent embodiments. The pick-up force monitoring unit 10 is mounted on the pick-up pen body and is at least partially disposed inside the pick-up pen body, for monitoring the magnitude of the pick-up force between the pick-up pen body and the wafer to be picked up.

[0053] Please see Figure 3 The adsorption force monitoring unit 10 may specifically include: a signal receiver 101, a signal converter 102, and an adsorption force monitor 103.

[0054] The signal receiver 101 may include a diaphragm. The size of the diaphragm changes according to the magnitude of the adsorption force between the pen body and the wafer to be adsorbed. The signal receiver 101 generates a diaphragm size change signal based on the change in diaphragm size. The diaphragm is sensitive to changes in pressure (i.e., adsorption force). When the adsorption force between the pen body and the wafer to be adsorbed changes, the size of the diaphragm changes accordingly. Therefore, including a diaphragm in the signal receiver 101 can effectively capture minute changes in adsorption force, thereby generating a diaphragm size change signal reflecting the change in the magnitude of the adsorption force. Compared to traditional pens, using a diaphragm to characterize minute changes in adsorption force can more accurately reflect the state of adsorption force in real time, thus avoiding instability or damage to the wafer during adsorption and handling.

[0055] The signal receiver 101 can be, for example, a piezoelectric sensor, a capacitive pressure sensor, a thin-film strain gauge, and a MEMS (microelectromechanical system) pressure sensor, but is not limited to these.

[0056] The signal converter 102 is connected to the signal receiver 101 and is used to convert the tympanic membrane size change signal into a numerical value of the adsorption force. Since the signal receiver 101 directly senses changes in the tympanic membrane, and the signal converter 102 can rapidly convert the tympanic membrane size change signal into a numerical value of the adsorption force, the entire process is almost without delay. Therefore, using the signal converter 102 ensures the real-time monitoring of the adsorption force, meaning that operators can monitor the current changes in the adsorption force at any time, helping to prevent production accidents caused by insufficient or excessive adsorption force. Furthermore, converting the tympanic membrane size change signal into a numerical form through the signal converter 102 also simplifies and standardizes the data reading and feedback process of the adsorption force.

[0057] The signal converter 102 may be, for example, an analog-to-digital converter (ADC), but is not limited to this.

[0058] The adsorption force monitor 103 is connected to the signal converter 102 to obtain the magnitude of the adsorption force and monitor the magnitude of the adsorption force between the pen body and the wafer to be adsorbed based on the magnitude of the adsorption force.

[0059] The adsorption force monitor 103 can be, for example, a microcontroller (MCU), a programmable logic controller (PLC), a display control module, and a microcontroller with an alarm module, but is not limited to these.

[0060] Therefore, this embodiment of the application, by setting an adsorption force monitoring unit 10 on the suction pen body, can monitor the magnitude of the adsorption force between the suction pen body and the wafer to be adsorbed in real time, thereby timely grasping the adsorption force situation, avoiding excessive adsorption force that may cause defects on the wafer surface, affecting its surface quality and subsequent process yield, and avoiding insufficient adsorption force that may cause instability of the wafer during handling, reducing the risk of dropping or displacement. The adsorption force monitoring unit 10, through the cooperation of a signal receiver 101, a signal converter 102, and an adsorption force monitor 103, achieves accurate detection of changes in adsorption force, improving the accuracy and response speed of monitoring.

[0061] In some embodiments, the adsorption force monitor 103 may store a preset range of adsorption force. When the adsorption force value obtained by the signal converter 102 exceeds the preset range, the adsorption force monitor 103 issues an alarm signal.

[0062] As mentioned earlier, converting the diaphragm size change signal into a numerical form via signal converter 102 simplifies and standardizes the data reading and feedback process of the adsorption force. Furthermore, the numerical adsorption force information facilitates setting a preset range for the adsorption force. If the adsorption force value exceeds this preset range, the adsorption force monitor 103 can quickly issue an alarm signal. This not only improves the intelligence level of the wafer pick-up pen but also reduces the probability of false alarms or missed alarms, ensuring the reliability of the wafer pick-up pen.

[0063] Please see Figure 4 In some embodiments, the adsorption force monitor 103 may further include a display 104 disposed outside the pen body.

[0064] For example, the display 104 can be connected to the signal converter 102 to display the magnitude of the adsorption force obtained by the signal converter 102.

[0065] For example, the display 104 may also be connected to the adsorption force monitor 103 to display the preset range of adsorption force stored inside the adsorption force monitor 103.

[0066] In some embodiments, as Figure 4 As shown, the display 104 may include a first sub-display 104a and a second sub-display 104b. The first sub-display 104a may be used to display a preset range of adsorption force stored inside the adsorption force monitor 103, and the second sub-display 104b may be used to display the magnitude of the adsorption force obtained by the signal converter 102.

[0067] Please continue reading. Figure 4 In some embodiments, the adsorption force monitor 103 may further include an indicator light 105. The indicator light 105 is connected to the adsorption force monitor 103, and the indicator light 105 can switch the indication state according to the alarm signal issued by the adsorption force monitor 103.

[0068] When the adsorption force value is within the preset range, the indicator light 105 operates in the first indication state; for example, when the adsorption force value is within the preset range, the indicator light 105 displays green.

[0069] When the adsorption force exceeds the preset range, the indicator light 105 can switch to the second indication state according to the alarm signal issued by the adsorption force monitor 103; for example, when the adsorption force exceeds the preset range, the indicator light 105 will display red.

[0070] Furthermore, in some embodiments, the adsorption force monitor 103 may also issue an audible alarm signal (alarm sound) to remind the operator that the current adsorption force exceeds a preset range. The audible signal helps the operator to take timely action to prevent excessive adsorption force from causing defects on the wafer surface, affecting its surface quality and subsequent process yield.

[0071] As an example, when the adsorption force exceeds the preset range, the adsorption force control valve 202 can switch to a non-preset control state. At this time, the adsorption force control valve 202 blocks the air extraction channel of the extraction pipe 201, and the wafer pick-up pen immediately stops adsorption to avoid excessive adsorption force causing defects on the wafer surface, affecting its surface quality and the yield of subsequent processes.

[0072] To more clearly illustrate the wafer pick-up pen provided in the embodiments of this application, the following is combined with... Figure 1 , Figure 2 as well as Figure 5 The pen itself will be described in further detail.

[0073] In some embodiments, the suction pen body may include: an air extraction tube 201, an adsorption force control valve 202, and a suction pen tip 203. The adsorption force control valve 202 abuts against the air extraction tube 201, and the suction pen tip 203 is connected to the air extraction channel of the air extraction tube 201.

[0074] When the adsorption force control valve 202 is in the preset control state, it opens the suction channel of the suction pipe 201, causing the suction pen head 203 to generate adsorption force. When the adsorption force control valve 202 is in a non-preset control state, such as... Figure 5 As shown, the adsorption force control valve 202 blocks the air extraction channel of the air extraction tube 201, and at this time the suction pen head 203 will not generate adsorption force.

[0075] For example Figure 5 As shown, when the adsorption force control valve 202 is pressed down, it is in a non-preset control state, blocking the air extraction channel of the suction pipe 201. Therefore, the suction pen tip 203 does not generate adsorption force, and the wafer suction pen cannot remove the wafer. When the adsorption force control valve 202 is adjusted to the preset control state (the adsorption force control valve 202 is in its natural state), it opens the air extraction channel of the suction pipe 201, and the suction pen tip 203 generates adsorption force, allowing the wafer suction pen to remove the wafer.

[0076] This application does not specifically limit the material of the suction tube 201. In some embodiments, the suction tube 201 may include an elastic soft material. The elastic soft material may be, for example, silicone or rubber, but is not limited thereto.

[0077] The material of the pen tip 203 is not specifically limited in this application embodiment. For example, the pen tip 203 can be a silicone pen tip or a rubber pen tip, etc., but is not limited to this.

[0078] Please continue reading. Figure 1 and Figure 2 In some embodiments, the suction pen body may further include a buffer component 204. In this wafer suction pen, the air extraction tube 201, the buffer component 204, and the suction pen head 203 are connected in sequence and communicate with each other.

[0079] In the above embodiments, the buffer component 204 can buffer instantaneous pressure fluctuations during the adsorption process, avoiding wafer adsorption instability caused by sudden increases or decreases in adsorption force. This helps maintain wafer stability during handling and reduces the risk of instability caused by changes in adsorption force. By providing the buffer component 204, the wafer pick-up pen can form a buffer zone between the pen tip and the wafer surface, allowing the adsorption force to be transmitted to the wafer surface more smoothly, thereby reducing the possibility of damage to the wafer surface due to excessive or uneven adsorption force.

[0080] In some embodiments, when the magnitude of the adsorption force exceeds a preset range, the adsorption force monitoring unit 10 may move in a preset manner. For example, when the magnitude of the adsorption force exceeds the preset range, the adsorption force monitoring unit 10 may move downwards.

[0081] Furthermore, if Figure 1 , Figure 2 and Figure 5 As shown, the wafer pick-up pen may further include a connecting rod 205. One end of the connecting rod 205 is connected to the adsorption force monitoring unit 10, and the other end is connected to the adsorption force control valve 202.

[0082] like Figure 5 As shown, while the adsorption force monitoring unit 10 undergoes the aforementioned preset movement, the connecting rod 205 is used to switch the adsorption force control valve 202 to a non-preset control state. When the adsorption force control valve 202 is in the non-preset control state, the adsorption force control valve 202 blocks the air extraction channel of the air extraction pipe 201, and at this time the suction pen head 203 will not generate adsorption force.

[0083] Please continue reading Figure 1 and Figure 2 In some embodiments, the pen-absorbing body may further include a pen-absorbing rod 206. The pen-absorbing rod 206 may be sleeved on the outside of the air extraction tube 201.

[0084] In the above embodiment, one end of the adsorption force control valve 202 is located outside the pen suction rod 206, and the other end is located inside the pen suction rod 206 and abuts against the air extraction pipe 201.

[0085] When the adsorption force control valve 202 is in the preset control state, the end of the adsorption force control valve 202 located inside the pen rod 206 opens the air extraction channel of the air extraction pipe 201, causing the pen tip 203 to generate adsorption force. When the adsorption force control valve 202 is in the non-preset control state, the end of the adsorption force control valve 202 located inside the pen rod 206 blocks the air extraction channel of the air extraction pipe 201. At this time, the pen tip 203 will not generate adsorption force, causing the wafer pen to stop adsorption immediately, so as to avoid excessive adsorption force causing defects on the wafer surface, affecting its surface quality and subsequent process yield.

[0086] Please see Figure 6 In some embodiments of this application, when the suction tube 201 is drawing air, the size of the tympanic membrane in the signal receiver 101 changes. The signal of the change in tympanic membrane size is transmitted to the signal converter 102 through the connecting line 102a. The signal converter 102 converts the signal of the change in tympanic membrane size into a value of the adsorption force, and then transmits it to the display 104 through the connecting line 102a. The display 104 displays the value of the adsorption force obtained by the signal converter 102.

[0087] For example, when the magnitude of the adsorption force is within the preset range of the adsorption force, the adsorption force monitor 103 will not issue an alarm signal, the indicator light 105 will show green, no alarm sound will be heard, and the wafer pick-up pen can be used normally.

[0088] When the adsorption force exceeds the preset range, the adsorption force monitor 103 issues an alarm signal, the indicator light 105 turns red, and an alarm sound is heard. Simultaneously, the adsorption force monitoring unit 10 moves downwards, causing the adsorption force control valve 202 to switch to a non-preset control state via the connecting rod. The adsorption force control valve 202 blocks the air extraction channel of the extraction pipe 201, resulting in no pressure difference between the suction pen head 203 and the wafer surface. In other words, the suction pen head 203 does not generate adsorption force, and the wafer suction pen cannot remove the wafer at this time.

[0089] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features of the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0090] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A wafer pick-up pen, characterized in that, include: The suction pen body and suction force monitoring unit; The suction pen body is used to adsorb the wafer to be adsorbed; The adsorption force monitoring unit is installed on the suction pen body and is at least partially disposed inside the suction pen body, for monitoring the magnitude of the adsorption force between the suction pen body and the wafer to be adsorbed; The adsorption force monitoring unit includes: A signal receiver is provided with a diaphragm. The size of the diaphragm changes with the magnitude of the adsorption force between the suction pen body and the wafer to be adsorbed. The signal receiver generates a diaphragm size change signal based on the change in the size of the diaphragm. A signal converter, connected to the signal receiver, is used to convert the tympanic membrane size change signal into a numerical value of the suction force. An adsorption force monitor, connected to the signal converter, is used to acquire the magnitude of the adsorption force and monitor the magnitude of the adsorption force between the pen body and the wafer to be adsorbed based on the magnitude of the adsorption force.

2. The wafer pick-up pen according to claim 1, characterized in that, The adsorption force monitor internally stores a preset range of adsorption force and is configured as follows: When the magnitude of the adsorption force exceeds the preset range of the adsorption force, the adsorption force monitor issues an alarm signal.

3. The wafer pick-up pen according to claim 2, characterized in that, The adsorption force monitor further includes a display, which is connected to the signal converter and disposed outside the adsorption pen body, for displaying the magnitude of the adsorption force obtained by the signal converter.

4. The wafer pick-up pen according to claim 3, characterized in that, The display is also connected to the adsorption force monitor and is used to display the preset range of adsorption force stored inside the adsorption force monitor.

5. The wafer pick-up pen according to claim 2, characterized in that, The adsorption force monitor further includes an indicator light, connected to the adsorption force monitor and configured to: When the magnitude of the adsorption force is within the preset range of the adsorption force, the indicator light operates in the first indication state; when the magnitude of the adsorption force exceeds the preset range of the adsorption force, the indicator light operates in the second indication state.

6. The wafer pick-up pen according to claim 1, characterized in that, The suction pen body includes: an air extraction tube, a suction force control valve, and a suction pen tip; The adsorption force control valve abuts against the air extraction tube; the suction pen head is connected to the air extraction channel of the air extraction tube; When the adsorption force control valve is in a preset control state, the adsorption force control valve opens the air extraction channel of the air extraction tube, causing the pen tip to generate adsorption force; when the adsorption force control valve is in a non-preset control state, the adsorption force control valve blocks the air extraction channel of the air extraction tube.

7. The wafer pick-up pen according to claim 6, characterized in that, The pen-absorbing body also includes: a buffer component; The air extraction tube, the buffer component, and the suction pen tip are connected in sequence and communicate with each other.

8. The wafer pick-up pen according to claim 6, characterized in that, The adsorption force monitor stores a preset range of adsorption force and is configured such that when the magnitude of the adsorption force exceeds the preset range, the adsorption force monitoring unit moves in a preset manner. The wafer suction pen further includes a connecting rod, one end of which is connected to the adsorption force monitoring unit, and the other end of which is connected to the adsorption force control valve; The connecting rod is used to drive the adsorption force control valve to switch to the non-preset control state when the adsorption force monitoring unit moves in the preset manner; when the adsorption force control valve is in the non-preset control state, it blocks the air extraction channel of the air extraction pipe.

9. The wafer pick-up pen according to claim 6, characterized in that, The pen-absorbing body includes: a pen-absorbing rod, which is sleeved on the outside of the air extraction tube; The adsorption force control valve has one end located outside the pen suction rod and the other end located inside the pen suction rod and abutting against the air extraction tube.

10. The wafer pick-up pen according to claim 6, characterized in that, The material of the extraction tube includes an elastic soft material.

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