Power module and electric control board
By integrating IGBT and diode into a power module, the problem of difficult layout of Boost PFC circuit on the electronic control board is solved, and a small size, high power density and strong electromagnetic compatibility performance are achieved. It is easy to install and improves production efficiency.
Patent Information
- Application Number
- CN202423045211.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-10
- Publication Date
- 2025-10-28
- Estimated Expiration
- 2034-12-10
AI Technical Summary
In the layout of the Boost PFC circuit on the electronic control board, the IGBT module and FRD are set up separately as discrete devices, which occupies a large area and increases the routing distance, making layout difficult and reducing production efficiency.
The IGBT and diode are integrated and packaged into a power module, which is connected through a packaging shell, a substrate and multiple pins to achieve integrated packaging of the IGBT and diode. Each pin is connected to the input, output or drive end of the device respectively, reducing the occupied area and enhancing the electromagnetic compatibility performance.
The power module has a small size and high power density, is easy to install on the electronic control board, reduces the layout difficulty of the PFC circuit, and improves production efficiency.
Smart Images
Figure CN223487054U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of power electronic devices, and more particularly to a power module and an electronic control board. Background Technology
[0002] To improve the power factor of AC power supplies, power factor correction (PFC) circuits are typically installed on the control boards of AC-powered equipment. PFC circuits come in various forms, such as Boost PFC circuits and totem-pole PFC circuits. Specifically, a Boost PFC circuit includes an inductor, an insulated-gate bipolar transistor (IGBT) module, and a fast recovery diode (FRD). When the IGBT module is on, the inductor stores energy; when the IGBT module is off, the inductor discharges to the device through the FRD. The Boost PFC circuit improves the power factor by controlling the on / off state of the IGBT module.
[0003] In related technologies, the layout of Boost PFC circuits on the control board typically employs a scheme where IGBT modules and FRDs are set up as discrete components. Setting up IGBT modules and FRDs as discrete components occupies a large layout area on the control board and increases the trace distance. Since the Boost PFC circuit also includes large-volume components such as inductors and filter capacitors, it leads to difficulties in the layout of the PFC circuit on the control board and low production efficiency of the control board. Utility Model Content
[0004] In view of this, embodiments of this application provide a power module and an electronic control board, which aim to provide a high-power-density IGBT and diode integrated package module.
[0005] The technical solution of this application embodiment is implemented as follows:
[0006] In a first aspect, embodiments of this application provide a power module, the power module comprising:
[0007] A package housing, on which multiple pins are provided;
[0008] A substrate, wherein the substrate is disposed within the packaging housing;
[0009] A first diode is disposed on the substrate;
[0010] A power device unit, including an IGBT and a second diode, is disposed on the substrate; wherein the emitter of the IGBT and the anode of the second diode are connected to a first pin among the plurality of pins; the collector of the IGBT and the cathode of the second diode are connected to a second pin among the plurality of pins; and the anode and cathode of the first diode and the gate of the IGBT are respectively connected to the remaining different pins among the plurality of pins.
[0011] In some implementations, the plurality of pins further includes a third pin, a fourth pin, and a fifth pin;
[0012] The third pin is connected to the anode of the first diode, the fourth pin is connected to the cathode of the first diode, and the fifth pin is connected to the gate of the IGBT.
[0013] In some implementations, the fifth pin, the first pin, the second pin, the third pin, and the fourth pin are arranged sequentially; all of the pins are bent to a set angle.
[0014] In some implementations, the spacing between the first pin and the second pin is greater than the spacing between the fifth pin and the first pin, and the spacing between the second pin and the third pin, respectively; the spacing between the third pin and the fourth pin is greater than the spacing between the fifth pin and the first pin, and the spacing between the second pin and the third pin, respectively.
[0015] In some implementations, the fifth pin, the first pin, and the fourth pin are of equal length, and the second pin and the third pin are of equal length.
[0016] In some implementations, the first diode is a fast recovery diode (FRD).
[0017] In some implementations, the power device unit is a reverse-conducting IGBT (RC-IGBT) module.
[0018] In some implementations, the second diode is a fast recovery diode.
[0019] In some implementations, the package housing and the substrate adopt the TO247 package structure size.
[0020] Secondly, embodiments of this application also provide an electronic control board, on which the power module described in the first aspect of embodiments of this application is arranged.
[0021] The power module provided in this application includes: a package housing, a substrate, a first diode, and a power device unit. The package housing has multiple pins; the substrate is disposed inside the package housing; the first diode is disposed on the substrate; the power device unit includes an IGBT and a second diode, disposed on the substrate; wherein the emitter of the IGBT and the anode of the second diode are connected to a first pin among the multiple pins; the collector of the IGBT and the cathode of the second diode are connected to a second pin among the multiple pins; the anode and cathode of the first diode and the gate of the IGBT are respectively connected to the remaining different pins among the multiple pins. Thus, the power module of this application integrates the IGBT and diode into a package, with each pin correspondingly connected to the input, output, or drive terminal of the device. The packaged power device has advantages such as small size, high power density, and strong electromagnetic compatibility performance, and is easy to install on an electronic control board, reducing the layout difficulty of the PFC circuit on the electronic control board. Attached Figure Description
[0022] Figure 1 This is a schematic diagram of the power module structure according to an embodiment of this application;
[0023] Figure 2 This is a schematic diagram of the circuit structure of the power module in an embodiment of this application;
[0024] Figure 3 This is a schematic diagram showing the dimensions of the power module in an embodiment of this application;
[0025] Figure 4 This is a schematic diagram of the packaged structure of a power module according to an embodiment of this application;
[0026] Figure 5 This is a schematic diagram of the power module packaged according to another embodiment of this application;
[0027] Figure 6 This is a schematic diagram of the packaged structure of a power module according to another embodiment of this application;
[0028] Figure 7 This is a schematic diagram of the assembly of the electronic control board according to an embodiment of this application.
[0029] Explanation of reference numerals in the attached figures:
[0030] 100. Power module; 110. Package housing; 120. Substrate; 131. First diode;
[0031] 132, Second diode; 133, IGBT; 141, First pin; 142, Second pin;
[0032] 143, Pin 3; 144, Pin 4; 145, Pin 5; 200, Control board;
[0033] 301, bracket; 302, radiator. Detailed Implementation
[0034] The present application will now be described in further detail with reference to the accompanying drawings and embodiments.
[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
[0036] In the description of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0037] This application provides a power module, such as... Figure 1 As shown, the power module 100 includes: a package housing 110, a substrate 120, a first diode 131, and a power device unit. The package housing 110 has multiple pins. The substrate 120 is disposed within the package housing 110. The first diode 131 is disposed on the substrate 120. The power device unit includes an IGBT 133 and a second diode 132, disposed on the substrate 120. The emitter of the IGBT 133 and the anode of the second diode 132 are connected to a first pin 141 among the multiple pins; the collector of the IGBT 133 and the cathode of the second diode 132 are connected to a second pin 142 among the multiple pins; the anode and cathode of the first diode 131 and the gate of the IGBT 133 are respectively connected to the remaining different pins among the multiple pins.
[0038] For example, such as Figure 1 As shown, the multiple pins also include a third pin 143, a fourth pin 144, and a fifth pin 145. The third pin 143 is connected to the anode of the first diode 131, the fourth pin 144 is connected to the cathode of the first diode 131, and the fifth pin 145 is connected to the gate of the IGBT 133.
[0039] here, Figure 2This is an electrical schematic diagram of the power module 100 according to an embodiment of this application. The anode of the second diode 132 is connected to the emitter of the IGBT 133, and the cathode of the second diode 132 is connected to the collector of the IGBT 133. That is, in the power module 100, the second diode 132 serves as the freewheeling diode (FWD) of the IGBT 133. The power module 100 includes five terminals: the anode A of the first diode 131, the cathode K of the first diode 131, the gate G of the IGBT 133, the collector C of the IGBT 133, and the emitter E of the IGBT 133.
[0040] Understandably, the power module 100 has five corresponding pins for each of the five terminals. Each pin is connected to the input, output, or drive terminal of an internal device of the power module 100. Specifically, the first pin 141 is connected to the emitter terminal E, the second pin 142 is connected to the collector terminal C, the third pin 143 is connected to the anode terminal A, the fourth pin 144 is connected to the cathode terminal K, and the fifth pin 145 is connected to the gate terminal G. The packaged power module 100 connects to other devices based on these five pins.
[0041] It should be noted that if the power module 100 of this application embodiment is applied to a PFC circuit, based on the circuit structure of the PFC circuit, the anode of the first diode 131, the collector of the IGBT 133, and the cathode of the second diode 132 are all connected to the inductor of the PFC circuit, that is, the anode of the first diode 131, the collector of the IGBT 133, and the cathode of the second diode 132 are at the same potential; considering the impact of the power module 100 on the electromagnetic compatibility performance of the IGBT 133 after packaging, this application embodiment does not connect the collector terminal C and the anode terminal A inside the power module 100.
[0042] It is understood that the power module 100 of this application embodiment integrates the IGBT 133 and the first diode 131 into a package, with each pin connected to the input terminal, output terminal or drive terminal of the device respectively. Compared with the IGBT 133 and the first diode 131 arranged as discrete devices, the packaged power device has the advantages of small size, high power density and strong electromagnetic compatibility performance, and is easy to install on the control board, reducing the layout difficulty of the PFC circuit on the control board.
[0043] In some embodiments, the power device unit is a reverse-conducting IGBT (RC-IGBT) module.
[0044] Here, IGBT 133 and the second diode 132 are pre-packaged RC-IGBT modules, that is, IGBT 133 and the second diode 132 are packaged and arranged on the substrate 120.
[0045] In some embodiments, the IGBT 133 and the second diode 132 are arranged as discrete devices on the substrate 120.
[0046] For example, if the second diode 132 is a discrete device, then the second diode 132 is a fast recovery diode (FRD).
[0047] It is understandable that FRD has the advantages of good switching characteristics and short reverse recovery time. In the embodiments of this application, whether an RC-IGBT module with built-in freewheeling diode is used or an FRD is used as the freewheeling diode of IGBT 133, the power module 100 sets the second diode 132 as the freewheeling diode of IGBT 133, which can shorten the reverse recovery time of IGBT 133, reduce the switching loss of IGBT 133, and improve the anti-interference performance of IGBT 133.
[0048] It should be noted that when the power module 100 of this application embodiment is applied to the PFC circuit, the anode of the first diode 131 is connected to the inductor, and the cathode of the first diode 131 is connected to the load. When the PFC circuit is running, the current through the inductor changes periodically. In order to improve the reverse recovery capability of the first diode 131, in some embodiments, the first diode 131 is an FRD.
[0049] For example, the fifth pin 145, the first pin 141, the second pin 142, the third pin 143 and the fourth pin 144 are arranged in sequence.
[0050] It is understandable that the fifth pin 145, the first pin 141, and the second pin 142 are connected to the power device unit, and the third pin 143 and the fourth pin 144 are connected to the first diode 131. The pins connected to the same device are arranged close together to facilitate the packaging of the power module 100 and the wiring design of the control board.
[0051] Here, there is no electrical connection between the multiple pins and they are electrically isolated.
[0052] It should be noted that, in order to enhance the electrical isolation between the pins, in this embodiment of the application, the spacing between adjacent pins of the power module 100 is greater than a set spacing, so as to avoid accidental soldering problems during the production of the power module 100.
[0053] In one application example of this application, the spacing between adjacent pins of the power module 100 is greater than 1.6 mm.
[0054] Here, to further enhance the electrical isolation effect, for example, such as Figure 3As shown, the distance e2 between the first pin 141 and the second pin 142 is greater than the distance e1 between the fifth pin 145 and the first pin 141 and the distance e3 between the second pin 142 and the third pin 143, respectively; the distance e4 between the third pin 143 and the fourth pin 144 is greater than the distance e1 between the fifth pin 145 and the first pin 141 and the distance e3 between the second pin 142 and the third pin 143, respectively.
[0055] It should be noted that, since the first pin 141 is connected to the emitter terminal E and the second pin 142 is connected to the collector terminal C, the distance e2 between the first pin 141 and the second pin 142 is increased to ensure electrical isolation in order to avoid a connection between the collector and emitter of the IGBT 133; since the third pin 143 is connected to the anode terminal A and the fourth pin 144 is connected to the cathode terminal K, the distance e4 between the third pin 143 and the fourth pin 144 is increased to ensure electrical isolation in order to avoid a connection between the anode and cathode of the second diode 132.
[0056] In one application example of this application, the distance e2 between the first pin 141 and the second pin 142 is equal to the distance e4 between the third pin 143 and the fourth pin 144; the distance e1 between the fifth pin 145 and the first pin 141 is equal to the distance e3 between the second pin 142 and the third pin 143.
[0057] In one application example of this application, the distance e2 between the first pin 141 and the second pin 142, and the distance e4 between the third pin 143 and the fourth pin 144 are all greater than or equal to 2.5 mm; the distance e1 between the fifth pin 145 and the first pin 141, and the distance e3 between the second pin 142 and the third pin 143 are all greater than 1.6 mm and less than 2.5 mm.
[0058] In order to enhance the current carrying capacity of each pin, in one application example of this application, the width of each pin is set in the range of 0.9 to 1.2 mm, and the thickness of each pin is greater than 0.5 mm.
[0059] Here, in the embodiments of this application, multiple power module packaging schemes with different pin configurations are also specifically provided, as follows: Figures 4-6 As shown.
[0060] For example, multiple pins are bent to a set angle.
[0061] Understandably, bending multiple pins to a set angle reduces the height of the power module 100, thereby lowering the installation space requirements of the control board for mounting the power module 100.
[0062] In one application example of this application, multiple pins are bent to 90°.
[0063] For example, the fifth pin 145, the first pin 141 and the fourth pin 144 are of equal length, and the second pin 142 and the third pin 143 are of equal length.
[0064] In some embodiments, such as Figure 4 As shown, the first pin 141, the second pin 142, the third pin 143, the fourth pin 144, and the fifth pin 145 have the same length.
[0065] It should be noted that, for scenarios with low creepage distance and electrical isolation requirements, the spacing e2 between the first pin 141 and the second pin 142 and the spacing e4 between the third pin 143 and the fourth pin 144 already meet the electrical isolation requirements. Therefore, each pin is set to an equal length, and the bent pins are arranged side by side to facilitate the opening of mounting holes on the control board.
[0066] In some embodiments, for scenarios with high requirements for creepage distance and electrical isolation, the bent pins of the power module 100 are arranged in two rows by increasing the length of some pins to further enhance the electrical isolation effect.
[0067] For example, such as Figure 5 As shown, the lengths of the fifth pin 145, the first pin 141, and the fourth pin 144 are greater than the lengths of the second pin 142 and the third pin 143.
[0068] Here, by increasing the length of the fifth pin 145, the first pin 141, and the fourth pin 144, the bent pins are arranged in two rows to increase the electrical clearance between the first pin 141 and the second pin 142, as well as the electrical clearance between the third pin 143 and the fourth pin 144. That is, the fifth pin 145, the first pin 141, and the fourth pin 144 are arranged side by side in the row away from the package housing, while the second pin 142 and the third pin 143 are arranged side by side in the row closer to the package housing.
[0069] For example, such as Figure 6 As shown, the lengths of the second pin 142 and the third pin 143 are greater than the lengths of the fifth pin 145, the first pin 141 and the fourth pin 144.
[0070] Here, by increasing the length of the second pin 142 and the third pin 143, the bent pins are arranged in two rows to increase the electrical clearance between the first pin 141 and the second pin 142, as well as the electrical clearance between the third pin 143 and the fourth pin 144. That is, the fifth pin 145, the first pin 141 and the fourth pin 144 are arranged side by side in the row closer to the package housing, and the second pin 142 and the third pin 143 are arranged side by side in the row farther away from the package housing.
[0071] For example, the package housing 110 and the substrate 120 adopt the TO247 package structure size.
[0072] It is understood that, except for the number of pins and related dimensions which are inconsistent with the standard TO247 package structure dimensions, the power module 100 of this application embodiment is consistent with the TO247 package structure dimensions, such as the dimensions of the package housing 110 and the substrate 120.
[0073] This application embodiment also provides an electronic control board, on which the aforementioned power module 100 is arranged.
[0074] In some embodiments, at least a PFC circuit is arranged on the electronic control board 200, and the aforementioned power module 100 is arranged on the electronic control board 200 as a component of the PFC circuit.
[0075] In one application example of this application, the control board 200 is the control board of an air conditioner. The control board 200 improves the power factor of the input power supply of the air conditioner based on the on / off state of the IGBT 133 of the control power module 100.
[0076] This application embodiment also provides an assembly diagram of the electronic control board 200, such as... Figure 7 As shown. The control board 200 is provided with a bracket 301 for fixing the heat sink 302. The power module 100 is fixed on the heat sink 302. The combination of the bracket 301 and the heat sink 302 allows the power module 100 to be arranged on the control board 200.
[0077] Understandably, fixing the power module 100 to the heat sink 302 can improve the heat dissipation effect of the power module 100 during operation.
[0078] Here, the power module 100 can be arranged on either the front or the back of the PCB board of the electronic control board 200. This embodiment does not specifically limit the installation position of the power module 100.
[0079] It should be noted that terms such as "first" and "second" are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.
[0080] Furthermore, the technical solutions described in the embodiments of this application can be combined arbitrarily without conflict.
[0081] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. A power module, characterized in that, The power module includes: A package housing, on which multiple pins are provided; A substrate, wherein the substrate is disposed within the packaging housing; A first diode is disposed on the substrate; A power device unit, including an IGBT and a second diode, is disposed on the substrate; The emitter of the IGBT and the anode of the second diode are connected to the first pin of the plurality of pins; the collector of the IGBT and the cathode of the second diode are connected to the second pin of the plurality of pins; and the anode and cathode of the first diode and the gate of the IGBT are respectively connected to the remaining different pins of the plurality of pins.
2. The power module according to claim 1, characterized in that, The plurality of pins also includes a third pin, a fourth pin, and a fifth pin; The third pin is connected to the anode of the first diode, the fourth pin is connected to the cathode of the first diode, and the fifth pin is connected to the gate of the IGBT.
3. The power module according to claim 2, characterized in that, The fifth pin, the first pin, the second pin, the third pin, and the fourth pin are arranged in sequence; all the pins are bent to a set angle.
4. The power module according to claim 3, characterized in that, The distance between the first pin and the second pin is greater than the distance between the fifth pin and the first pin, and the distance between the second pin and the third pin, respectively; the distance between the third pin and the fourth pin is greater than the distance between the fifth pin and the first pin, and the distance between the second pin and the third pin, respectively.
5. The power module according to claim 3, characterized in that, The fifth pin, the first pin, and the fourth pin are of equal length, and the second pin and the third pin are of equal length.
6. The power module according to claim 1, characterized in that, The first diode is a fast recovery diode (FRD).
7. The power module according to claim 1, characterized in that, The power device unit is a reverse-conducting IGBT module.
8. The power module according to claim 1, characterized in that, The second diode is a fast recovery diode.
9. The power module according to any one of claims 1 to 8, characterized in that, The package housing and the substrate adopt the TO247 package structure size.
10. An electronic control board, characterized in that, The power module as described in any one of claims 1 to 9 is arranged on the electronic control board.