Camera module

Abstract

The camera module includes: a housing configured to accommodate a lens barrel; a first circuit board disposed under the housing and including a first ground pad; a shield cover configured to cover the housing; a second circuit board disposed on one side surface of the housing and including a second ground pad corresponding to the first ground pad; a first welding portion connecting the first ground pad and the second ground pad; and a second welding portion connecting the shield cover and the second ground pad. The second ground pad includes a first connection portion connected to the first ground pad through a first solder portion and a second connection portion connected to the shield cover through a second solder portion.

Description

Technical Field

[0001] The following description pertains to the camera module. Background Technology

[0002] Camera modules used in portable electronic devices such as smartphones, tablet PCs, and laptops may have many internal electronic components. It may be necessary to minimize the emission of electromagnetic waves from these internal electronic components. Furthermore, it may be necessary to mitigate damage to the internal electronic components due to external noise current flowing in from the outside. Electromagnetic wave leakage can be prevented for camera modules installed inside electronic devices by grounding the cover to the circuit board.

[0003] Traditional camera modules primarily use conductive strips for grounding. However, to avoid the thickness of the conductive strip affecting the overall thickness of the camera module, grounding methods have gradually shifted to soldering. The problem with soldering grounding is that the soldered portion protrudes beyond the circuit board and interferes with other components.

[0004] Meanwhile, there is a growing trend towards using larger 1-inch models for image sensors mounted on recent camera modules. As a result, the size and weight of lenses and actuators increase, thereby increasing the risk of cracks appearing in the welded parts of the camera module.

[0005] The above information is presented as background information and is intended to aid in understanding this disclosure. No determination or assertion is made as to whether any of the above content can be used as prior art with respect to this disclosure. Utility Model Content

[0006] This summary portion is provided to briefly introduce the selection of concepts, which will be further described in the detailed description portion below. This summary portion is not intended to identify key or essential features of the claimed subject matter, nor is it intended to help determine the scope of the claimed subject matter.

[0007] In one general aspect, the camera module includes: a housing configured to house a lens barrel; a first circuit board disposed below the housing and including a first ground pad; a shielding cover configured to cover the housing; a second circuit board disposed on a side surface of the housing and including a second ground pad corresponding to the first ground pad; a first solder joint connecting the first and second ground pads; and a second solder joint connecting the shielding cover and the second ground pad. The second ground pad includes a first connection portion connected to the first ground pad via the first solder joint and a second connection portion connected to the shielding cover via the second solder joint.

[0008] The shielding cover may have a surface and a through-hole extending through the surface to expose a portion of the second grounding pad.

[0009] The second welded part can be accommodated in the through hole.

[0010] The shielding cover and the first welded part can be spaced apart.

[0011] A separation space can be formed between the lower end of the first circuit board and the shielding cover, and the first solder joint can be disposed in the separation space.

[0012] The first weld and / or the second weld can be formed to be flush with the outer surface of the shielding cover.

[0013] The image sensor mounted on the first circuit board can be configured to convert light incident through the lens barrel into an electrical signal, and the second circuit board can be a flexible circuit board or a rigid-flexible circuit board.

[0014] The first circuit board may further include a first signal pad, and the second circuit board may further include a second signal pad. The camera module may further include a third solder joint connecting the first signal pad and the second signal pad.

[0015] The second grounding pad can be longer than the second signal pad.

[0016] In another general aspect, the camera module includes: a housing configured to house a lens barrel; a first circuit board disposed below the housing and including a first ground pad; a shielding cover configured to cover the housing and including a surface and a through-hole extending through the surface; and a second circuit board disposed on a side surface of the housing and including a second ground pad corresponding to the first ground pad. The second ground pad is configured to extend from a location connected to the first ground pad to a location corresponding to the through-hole.

[0017] The camera module may also include: a first soldering part connecting a first grounding pad and a second grounding pad; and a second soldering part housed in a through hole and connecting a shielding cover and a second grounding pad.

[0018] The first weld and the second weld can be spaced apart from each other.

[0019] The through hole can be set at a predetermined distance from the bottom of the shielding cover upwards along the optical axis of the lens barrel.

[0020] In another general aspect, the camera module includes: a housing configured to house a lens barrel; a first circuit board disposed below the housing and including a first ground pad; a shielding cover configured to cover the housing; a second circuit board disposed on a side surface of the housing and including a second ground pad corresponding to the first ground pad; a first solder joint connecting the first and second ground pads; and a second solder joint connecting the shielding cover and the second ground pad. The second ground pad includes a first connection portion connected to the first ground pad via the first solder joint and a second connection portion connected to the shielding cover via the second solder joint. The first and second solder joints are spaced apart from each other.

[0021] The shielding cover may have a surface and a through-hole extending through the surface to expose a portion of the second grounding pad.

[0022] Other features and aspects will become apparent from the accompanying drawings and the detailed description below. Attached Figure Description

[0023] Figure 1 This is a perspective view showing the appearance of the camera module according to an embodiment.

[0024] Figure 2 It is shown schematically. Figure 1 An exploded perspective view of the camera module shown.

[0025] Figure 3 This shows the second circuit board set in Figure 1 A magnified view of the state in part A.

[0026] Figure 4 This shows that the shielding cover is installed. Figure 1 A magnified view of the state in part A.

[0027] Figure 5 It is shown in Figure 1 A magnified view of the welded section in part A.

[0028] Figure 6 It is along Figure 1 A partial cross-sectional view taken from line V-V' in the diagram.

[0029] Figure 7 This is an enlarged cross-sectional view of the welded portion of the camera module according to the embodiment.

[0030] Throughout the accompanying drawings and detailed embodiments, unless otherwise described, the same reference numerals refer to the same elements. For purposes of clarity, illustration, and convenience, the drawings may not be drawn to scale, and the relative dimensions, scale, and depiction of elements in the drawings may be exaggerated. Detailed Implementation

[0031] In the following description, although examples of this disclosure will be described in detail with reference to the accompanying drawings, it should be noted that the examples are not limited thereto.

[0032] The following detailed embodiments are provided to aid the reader in gaining a comprehensive understanding of the methods, apparatus, and / or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatus, and / or systems described herein will become apparent upon understanding this disclosure. For example, the order of operations described herein is merely illustrative and is not limited to the order set forth herein, except for operations that must occur in a specific order, as will become apparent upon understanding this disclosure. Furthermore, for clarity and brevity, descriptions of features well-known in the art may be omitted.

[0033] The features described herein may be implemented in various forms and should not be construed as being limited to the examples described herein. Rather, the examples described herein are provided merely to illustrate some of the many possible ways in which the methods, apparatuses, and / or systems described herein will become apparent upon understanding this disclosure.

[0034] Throughout this specification, when an element such as a layer, region, or substrate is described as being "on," "connected to," or "attached to" another element, the element may be directly "on," directly "connected to," or directly "attached to" the other element, or there may be one or more other elements between the element and the other element. Conversely, when an element is described as being "directly on," "directly connected to," or "directly attached to" another element, there are no other elements between the element and the other element.

[0035] As used herein, the term “and / or” includes any one of the associated listed items and any combination of any two or more items; similarly, “at least one” includes any one of the associated listed items and any combination of any two or more items.

[0036] Although terms such as “first,” “second,” and “third” may be used herein to describe various components, parts, regions, layers, or sections, these components, parts, regions, layers, or sections are not limited by these terms. Rather, these terms are used only to distinguish one component, part, region, layer, or section from another. Therefore, without departing from the teachings of the examples described herein, the first component, first part, first region, first layer, or first section mentioned in these examples may also be referred to as a second component, second part, second region, second layer, or second section.

[0037] Spatial relative terms such as “above,” “above,” “below,” and “under” may be used herein for descriptive convenience to describe the relationship of one element relative to another, as shown in the accompanying drawings. In addition to covering the orientation depicted in the drawings, these spatial relative terms are intended to also cover different orientations of the device in use or operation. For example, if the device in the drawings is flipped, an element described as being “above” or “above” another element would be located “below” or “under” that other element. Thus, depending on the spatial orientation of the device, the term “above” covers both orientations of “above” and “below”. The device may also be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relative terms used herein should be interpreted accordingly.

[0038] The terminology used herein is for the purpose of describing various examples only and is not intended to limit this disclosure. Unless the context clearly indicates otherwise, the terms “a,” “an,” and “the” are intended to include the plural form as well. The terms “comprising,” “including,” and “having” indicate the presence of the stated features, numbers, operations, components, elements, and / or combinations thereof, but do not preclude the presence or addition of one or more other features, numbers, operations, components, elements, and / or combinations thereof.

[0039] Variations in the shapes shown in the figures may occur due to manufacturing techniques and / or tolerances. Therefore, the examples described herein are not limited to the specific shapes shown in the figures, but include shape variations that may occur during manufacturing.

[0040] It should be noted that in this document, the term "may" is used relative to examples, such as regarding what an example may include or implement, meaning that there exists at least one example that includes or implements such a feature, but not all examples are limited to this.

[0041] The features of the examples described herein can be combined in various ways that will become apparent upon understanding this disclosure. Furthermore, although the examples described herein have multiple configurations, other configurations that will become apparent upon understanding this disclosure are also possible.

[0042] Figure 1 This is a perspective view showing the appearance of the camera module according to an embodiment. Figure 2 It is shown schematically. Figure 1 An exploded perspective view of the camera module shown.

[0043] Reference Figure 1 and Figure 2According to an embodiment, the camera module 100 includes a first circuit board 110, an optical unit 120, and a shielding cover 130. The first circuit board 110 may be disposed below the optical unit 120, and the shielding cover 130 may be disposed to cover the optical unit 120.

[0044] The first circuit board 110, electrically connected to a motherboard (not shown), includes a first ground pad 111 on one side surface of the first circuit board 110 for grounding the shielding cover 130 and a first signal pad 112 for transmitting various types of signals. The first signal pad 112 may include multiple pads depending on the signal type. The first circuit board 110 may include a circuit board with an electrically connectable wiring pattern, such as a rigid circuit board, a flexible circuit board, or a rigid-flex circuit board.

[0045] Additionally, an image sensor 113, which converts light incident through the multiple lenses of the optical unit 120 into electrical signals, can be disposed on the first circuit board 110. The image sensor 113 can be electrically connected to the first circuit board 110 and may include, but is not limited to, a charge-coupled device (CCD), complementary metal-oxide-semiconductor (CMOS), charge-initiating device (CPD), and charge-injecting device (CID). The electrical signals converted by the image sensor 113 are output as an image through a display unit of the electronic device. Furthermore, circuit patterns can be formed on the first circuit board 110 to allow electrical signals to enter and exit, and various components such as capacitors and resistors for driving the image sensor 113 can be disposed thereon.

[0046] The optical unit 120 includes a lens barrel 121, a lens driving device 122 for moving the lens barrel 121, a housing 123 for housing the lens barrel 121, and a second circuit board 124 disposed on at least one side surface of the housing 123.

[0047] The lens barrel 121 can have a hollow cylindrical shape, allowing multiple lenses for imaging an object to be housed within it, with the lenses mounted along the optical axis within the lens barrel 121. Here, the optical axis can be set as the central axis of the lenses housed within the lens barrel 121, and the direction of the optical axis refers to a direction parallel to the central axis. Depending on the design of the lens barrel 121, multiple lenses can be arranged as needed, and each lens can have optical properties such as the same or different refractive indices. An image sensor 113 is positioned below the lens barrel 121 along the optical axis to convert light incident through the lens barrel 121 into electrical signals. These electrical signals can be sent to a first circuit board 110 and then to an electronic device such as a mobile phone.

[0048] Although not shown, an optical filter can be disposed between the lens barrel 121 and the image sensor 113. The optical filter can block light within a specific frequency bandwidth from passing through the lens and entering the image sensor 113. The optical filter can be disposed parallel to a direction perpendicular to the optical axis. The optical filter may include an IR cutoff filter.

[0049] The lens driving device 122 includes a means for moving the lens barrel 121, which includes an autofocus (AF) driver (not shown) and an optical image stabilization (OIS) driver (not shown). For example, the AF driver includes an AF drive magnet and an AF drive coil, and can achieve focus adjustment or zoom functions by moving the lens barrel 121 along the optical axis under the electromagnetic influence between the AF drive magnet and the AF drive coil. Furthermore, the OIS driver includes an OIS drive magnet and an OIS drive coil, and can achieve the function of correcting shake (e.g., user hand tremors or other movements) by moving the lens barrel 121 in a direction perpendicular to the optical axis under the electromagnetic influence between the OIS drive magnet and the OIS drive coil.

[0050] The housing 123 houses the lens barrel 121 and the lens driving device 122 within its internal space. For example, the housing 123 may have a box shape with open upper and lower sections. A first circuit board 110 is disposed below the housing 123.

[0051] The second circuit board 124 may be disposed on at least one side surface of the housing 123 and connected to the housing 123. The second circuit board 124 may be a circuit board with a wiring pattern, such as a flexible circuit board or a rigid-flexible circuit board. The second circuit board 124 may have a laterally curved shape. For example, when the housing 123 has a frame shape with four corners, the second circuit board 124 may cover two or more of the four side surfaces of the housing 123.

[0052] A shielding cover 130 can be attached to a housing 123 to cover it. The shielding cover 130 has an open lower portion and may have a frame shape with four corners. The shielding cover 130 protects the internal components of the camera module 100. The shielding cover 130 may be made of a metal plate or a material with a low corrosion rate (e.g., stainless steel). Additionally, the shielding cover 130 can serve to shield electromagnetic waves. For example, the shielding cover 130 can shield electromagnetic waves to prevent electromagnetic waves generated inside the camera module 100 from affecting other electronic components within the electronic device, or to prevent noise current flowing in from outside the camera module 100 from affecting the interior of the camera module 100. The shielding cover 130 can be grounded to the first circuit board 110 to shield electromagnetic waves inside and outside the camera module 100.

[0053] The shielding cover 130 includes an upper surface portion 131 and a side surface portion 132. The upper surface portion 131 is disposed upward in the optical axis direction and perpendicular to the optical axis, and the side surface portion 132 extends downward from the upper surface portion 131 along the optical axis direction. The upper surface portion 131 may have a quadrilateral shape and may have an opening 133 formed in the center. The middle portion of the lens barrel 121 may be exposed through the opening 133, and the lens may also be exposed to allow light to pass through. The side surface portion 132 may extend downward from the edge of the upper surface portion 131 along the optical axis direction. For example, the side surface portion 132 may have four surfaces, and adjacent surfaces may be perpendicular to each other. The side surface portion 132 may have a quadrilateral prism shape with an open upper portion and an open lower portion. However, the shape of the side surface portion 132 is not limited to this. For example, the side surface portion 132 may have a cylindrical shape or a hemispherical shape with an open lower portion.

[0054] Figure 3 This shows the second circuit board set in Figure 1 A magnified view of the state in part A. Figure 4 This shows that the shielding cover is installed. Figure 1 A magnified view of the state in part A. Figure 5 It is shown in Figure 1 A magnified view of the welded section in part A. Figure 6 It is along Figure 1 A partial cross-sectional view taken from line V-V' in the diagram.

[0055] Reference Figures 3 to 6 The shielding cover 130 has a through hole 134 formed on one surface of the side surface portion 132. The through hole 134 can be formed to be spaced upward from the lower end of the side surface portion 132 by a predetermined distance in the optical axis direction. The through hole 134 is a hole that penetrates the shielding cover 130 in the thickness direction and can have various shapes such as circular, elliptical or quadrilateral.

[0056] The second circuit board 124 includes a second ground pad 140 and a second signal pad 150. The second ground pad 140 may be disposed at a position corresponding to the first ground pad 111 of the first circuit board 110, and the second signal pad 150 may be disposed at a position corresponding to the first signal pad 112 of the first circuit board 110. The second ground pad 140 and the second signal pad 150 may be disposed in a direction opposite to the direction in which the second circuit board 124 faces the housing 123. The second ground pad 140 and the second signal pad 150 may be disposed on the second circuit board 124, or may be disposed not exceeding the thickness of the second circuit board 124. In the latter case, a groove may be formed on a surface of the second circuit board 124 facing the shielding cover 130, and the second ground pad 140 and the second signal pad 150 may be disposed in the groove.

[0057] The second ground pad 140 may be configured to extend from a position connected to the first ground pad 111 to a position corresponding to the through hole 134. Therefore, the second ground pad 140 may be formed to be longer than the second signal pad 150. The second ground pad 140 includes a first connection portion 140a disposed at a position corresponding to the first ground pad 111 and a second connection portion 140b disposed at a position corresponding to the through hole 134 of the shielding cover 130. When the shielding cover 130 is attached to the housing 123, a portion of the second ground pad 140 may be exposed. A portion including the first connection portion 140a of the second ground pad 140 may be exposed in the partition space 135 formed between the first circuit board 110 and the lower end of the shielding cover 130, and a portion of the second connection portion 140b may be exposed from the through hole 134.

[0058] The first solder portion 141 and the second solder portion 142 can be formed in the first connecting portion 140a and the second connecting portion 140b of the second grounding pad 140, respectively. The first solder portion 141 can be formed on the first connecting portion 140a and the first grounding pad 111 to connect the first grounding pad 111 and the second grounding pad 140. The first solder portion 141 can be disposed in the partition space 135 and can be formed to cover the portion of the second grounding pad 140 exposed in the partition space 135. Therefore, the first solder portion 141 is spaced apart from the shielding cover 130. The second solder portion 142 can be formed on the second connecting portion 140b to connect the shielding cover 130 and the second grounding pad 140. The second solder portion 142 can be formed to be received in the through hole 134. Therefore, the first solder portion 141 and the second solder portion 142 can be spaced apart from each other.

[0059] For example, the first solder portion 141 and the second solder portion 142 can be formed using a soldering process such as a soldering iron. In this case, the first solder portion 141 and the second solder portion 142 can be formed within the outer surface of the shielding cover 130. Furthermore, the first solder portion 141 and the second solder portion 142 can be formed so that they do not protrude outside the first circuit board 110. Thus, the camera module 100 according to the embodiment is formed such that the first solder portion 141 and the second solder portion 142 do not protrude outside the first circuit board 110 or the shielding cover 130, thereby reducing the impact on other components.

[0060] In an exemplary embodiment, the first weld portion 141 or the second weld portion 142 may be formed flush with the outer surface of the shielding cover 130.

[0061] By forming a first solder portion 141 and a second solder portion 142 on the second ground pad 140, the second ground pad 140 can be connected to the first ground pad 111 on the first connection portion 140a via the first solder portion 141, and can be connected to the shielding cover 130 on the second connection portion 140b via the second solder portion 142. Therefore, the first circuit board 110 and the shielding cover 130 can be connected to each other via the second circuit board 124. The second ground pad 140 can be insulated from other circuits on the second circuit board 124. Therefore, the shielding cover 130 is grounded to the first circuit board 110 and can be used to shield electromagnetic waves from the camera module 100.

[0062] Thus, the solder joints for connecting the first circuit board 110, the second circuit board 124, and the shielding cover 130 include a first solder joint 141 and a second solder joint 142, allowing the stress applied to the solder joints to be distributed compared to a case where the solder joint is made of a single solder joint. Therefore, the risk of cracks appearing in the solder joints can be reduced. Furthermore, by forming solder joints at multiple locations, the number of solder joints can be reduced compared to forming a single solder joint. Therefore, the thickness of the solder joints can be reduced, preventing them from protruding beyond the shielding cover 130 or the first circuit board 110.

[0063] One or more second signal pads 150 may be provided corresponding to the first signal pads 112 of the first circuit board 110, and a third solder joint 151 may be formed to connect the first signal pads 112 and the second signal pads 150. When there are multiple first signal pads 112 and second signal pads 150, a corresponding multiple third solder joints 151 may be formed on the first signal pads 112 and the second signal pads 150. The third solder joints 151 may be disposed in the partition space 135 and may be spaced apart from the shielding cover 130. For example, the third solder joints 151 may be formed by a soldering process using a soldering iron or the like. The third solder joints 151 may also not protrude outside the first circuit board 110 or the shielding cover 130, thereby minimizing the impact on other components.

[0064] The first circuit board 110 and the second circuit board 124 can be connected to each other via a third solder joint 151 formed on the first signal pad 112 and the second signal pad 150. This connection includes not only a physical connection but also an electrical connection.

[0065] Figure 7 This is an enlarged cross-sectional view of the welded portion of the camera module according to the embodiment.

[0066] Reference Figure 7 In the case of the camera module according to the embodiment, the first weld portion 141 and / or the second weld portion 142 may be formed within the outer surface of the shielding cover 130. That is, the first weld portion 141 and / or the second weld portion 142 may be formed so as not to protrude beyond the outer surface of the shielding cover 130. In addition, the first weld portion 141 and / or the second weld portion 142 may be formed to be disposed inward at a predetermined distance from the outer surface of the first circuit board 110. Conversely, when a weld portion 141' is formed according to the comparative example, since the weld portion 141' is formed on the shielding cover 130, the weld portion 141' protrudes outward from the shielding cover 130.

[0067] Thus, the camera module according to the embodiment forms a first weld portion 141 and a second weld portion 142, thereby reducing the amount of each weld portion compared to the case where only one weld portion 141' is formed according to the comparative example, and the thickness of the weld portions is reduced by a distance d. Furthermore, because the first weld portion 141 and the second weld portion 142 are formed on the second ground pad 140 provided on the second circuit board 124, the first weld portion 141 and the second weld portion 142 can be formed inward by a distance d compared to the weld portion 141' formed on the shielding cover 130. Therefore, the extent to which the first weld portion 141 and the second weld portion 142 protrude beyond the first circuit board 110 or the shielding cover 130 can be controlled, thereby reducing the impact on other components.

[0068] One aspect of the disclosed embodiments is intended to provide a camera module that can reduce the risk of cracks in the camera module by improving the weld shape used for grounding.

[0069] While specific examples have been shown and described above, it will be apparent upon understanding this disclosure that various changes in form and detail may be made to these examples without departing from the spirit and scope of the claims and their equivalents. The examples described herein are to be understood in a descriptive sense only and not for limiting purposes. The description of features or aspects in each example should be considered applicable to similar features or aspects in other examples. Suitable results may still be achieved if the described techniques are performed in a different order, and / or if components in the described system, architecture, device, or circuit are combined in different ways and / or replaced or supplemented by other components or their equivalents. Therefore, the scope of this disclosure is not limited by the specific embodiments but by the claims and their equivalents, and all variations within the scope of the claims and their equivalents should be understood to be included in this disclosure.

Claims

1. A camera module, characterized in that, The camera module includes: The housing is configured to accommodate the lens barrel; A first circuit board is disposed below the housing and includes a first grounding pad; A shielding cover, configured to cover the housing; A second circuit board is disposed on one side surface of the housing and includes a second grounding pad corresponding to the first grounding pad; A first welding part connects the first grounding pad and the second grounding pad; and The second welding part connects the shielding cover and the second grounding pad. The second grounding pad includes a first connection portion connected to the first grounding pad via the first welding portion and a second connection portion connected to the shielding cover via the second welding portion.

2. The camera module according to claim 1, characterized in that, The shielding cover has a surface and a through-hole extending through the surface to expose a portion of the second grounding pad.

3. The camera module according to claim 2, characterized in that, The second welded portion is accommodated in the through hole.

4. The camera module according to claim 1, characterized in that, The shielding cover and the first welded part are spaced apart.

5. The camera module according to claim 1, characterized in that, A separation space is formed between the first circuit board and the lower end of the shielding cover, and The first welded part is disposed in the partition space.

6. The camera module according to claim 1, characterized in that, The first welded portion and / or the second welded portion are formed flush with the outer surface of the shielding cover.

7. The camera module according to claim 1, characterized in that, An image sensor disposed on the first circuit board is configured to convert light incident through the lens barrel into an electrical signal, and The second circuit board is a flexible circuit board or a rigid-flexible circuit board.

8. The camera module according to claim 1, characterized in that, The first circuit board also includes a first signal pad. The second circuit board also includes a second signal pad, and The camera module also includes a third solder joint that connects the first signal pad and the second signal pad.

9. The camera module according to claim 8, characterized in that, The second grounding pad is longer than the second signal pad.

10. A camera module, characterized in that, The camera module includes: The housing is configured to accommodate the lens barrel; A first circuit board is disposed below the housing and includes a first grounding pad; A shielding cover, configured to cover the housing, and including a surface and a through-hole extending through the surface; and A second circuit board is disposed on one side surface of the housing and includes a second ground pad corresponding to the first ground pad. The second grounding pad is configured to extend from the location connected to the first grounding pad to the location corresponding to the through hole.

11. The camera module according to claim 10, characterized in that, The camera module also includes: A first welding part connects the first grounding pad and the second grounding pad; and The second welding part is accommodated in the through hole and connects the shielding cover and the second grounding pad.

12. The camera module according to claim 11, characterized in that, The first welded portion and the second welded portion are spaced apart from each other.

13. The camera module according to claim 10, characterized in that, The through hole is positioned at a predetermined distance from the lower end of the shielding cover upwards along the optical axis of the lens barrel.

14. A camera module, characterized in that, The camera module includes: The housing is configured to accommodate the lens barrel; A first circuit board is disposed below the housing and includes a first grounding pad; A shielding cover, configured to cover the housing; A second circuit board is disposed on one side surface of the housing and includes a second grounding pad corresponding to the first grounding pad; A first welding part connects the first grounding pad and the second grounding pad; and The second welding part connects the shielding cover and the second grounding pad. The second grounding pad includes a first connection portion connected to the first grounding pad via the first soldering portion and a second connection portion connected to the shielding cover via the second soldering portion. The first welded portion and the second welded portion are spaced apart from each other.

15. The camera module according to claim 14, characterized in that, The shielding cover has a surface and a through-hole extending through the surface to expose a portion of the second grounding pad.

Images