Surface mount press for reflow soldering

Abstract

The utility model relates to a surface mounting pressing piece for reflow soldering. The surface mounting pressing piece is provided with a pressing tool and at least one counter weight. The pressing tool is provided with a bottom surface and a pressing groove. The bottom surface is used for being attached to a circuit board, and the pressing and abutting groove is formed in the bottom surface in a sunken mode. And the counter weight is arranged on the pressing tool. The long connector is flattened on the surface of the circuit board by using the long connector flattening device, so that the pins of the long connector can be fully contacted with the surface of the circuit board. And after the solder paste flows back, the pins of the long connector are completely welded with the circuit board through the solder paste. Therefore, all the pins of the connector can be completely attached to the surface of the bonding pad of the circuit board, and the problem of missing solder caused by deformation is solved.

Description

Technical Field

[0001] This utility model relates to the field of circuit board processing tools, and in particular to a surface mount pressure piece for long connectors during reflow soldering. Background Technology

[0002] In the surface mount technology (SMT) process for flexible printed circuit boards (FPCs), long connectors are sometimes required to be mounted on the FPC. During reflow soldering, both the long connector and the FPC may undergo thermal deformation due to heat, causing the two ends of the long connector to fail to adhere to the surface of the pads on the FPC, resulting in open solder joints and defective products.

[0003] Therefore, it is necessary to propose a method to ensure that the surfaces of the long connector and the FPC flexible board are in contact during reflow soldering in order to avoid open solder joints. Utility Model Content

[0004] The main objective of this invention is to provide a technical means for attaching long connectors to circuit boards during the reflow soldering process, so as to avoid open circuits caused by heat deformation of the long connectors or circuit boards during the reflow soldering process.

[0005] To achieve the aforementioned objectives, this utility model proposes a surface mount molding compound for reflow soldering, characterized in that the surface mount molding compound for reflow soldering has:

[0006] A press has the following features:

[0007] A bottom surface, which is used to attach to a circuit board; and

[0008] A pressure groove, the recess of which is formed on the bottom surface; and

[0009] At least one counterweight is disposed on the press.

[0010] Therefore, the advantages of this utility model are that it can ensure that all the pins of the connector are fully attached to the surface of the circuit board pads, thus solving the problem of empty solder joints caused by deformation. By using this utility model, the long connector can be pressed flat on the surface of the circuit board as much as possible, so that the pins of the long connector can fully contact the surface of the circuit board. When the solder paste reflows, the pins of the long connector and the circuit board are fully soldered together by the solder paste.

[0011] Furthermore, the surface mount press for reflow soldering is characterized in that the press has a through groove that extends through the bottom surface of the pressing groove.

[0012] Furthermore, the surface mount press for reflow soldering is characterized in that the press has a suction part, the two ends of which are respectively connected to the opposite walls of the through slot, and the suction part has a suction surface, the suction surface facing in a direction opposite to the bottom surface.

[0013] Furthermore, the surface mount press for reflow soldering is characterized in that the press has a positioning block connected to the bottom surface and protruding from the bottom surface.

[0014] Furthermore, the surface mount pressure piece for reflow soldering is characterized in that the counterweight is detachably disposed on the pressure piece.

[0015] Furthermore, the surface mount press for reflow soldering is characterized in that the press has a top surface, the top surface and the bottom surface are opposite sides of the press, and the at least one counterweight is disposed on the top surface.

[0016] Furthermore, the surface mount press for reflow soldering is characterized in that the number of the at least one counterweight is two, the two counterweights are spaced apart from each other in the press, and the pressing groove is located between the two counterweights.

[0017] Furthermore, the surface mount press for reflow soldering is characterized in that each of the counterweights is rod-shaped, and each of the counterweights is disposed in contact with the press on its outer peripheral surface.

[0018] Furthermore, the surface mount fitting for reflow soldering is characterized in that the two counterweights have different weights.

[0019] Furthermore, the surface mount fitting for reflow soldering is characterized in that the fitting has a notch on one side, which is recessed in the bottom surface and laterally penetrates the groove wall of the pressing groove. Attached Figure Description

[0020] Figure 1 This is a three-dimensional appearance diagram of the present utility model.

[0021] Figure 2 This is a three-dimensional view of the present invention from another angle.

[0022] Figure 3 This is a three-dimensional exploded view of the present invention.

[0023] Figure 4 This is a side view of the present invention.

[0024] Figure 5 This is a top view of the present invention.

[0025] Figure 6 This is a cross-sectional view of the present invention in use. Detailed Implementation

[0026] The following, in conjunction with the accompanying drawings and preferred embodiments of the present invention, further illustrates the technical means adopted by the present invention to achieve its intended purpose.

[0027] Please refer to the following first. Figure 1 This utility model proposes a surface mount pressure piece for reflow soldering, which includes a pressure tool 10 and at least one counterweight 20.

[0028] Please refer to Figures 1 to 3 and Figure 6 The press 10 has a bottom surface 101 and a top surface 102 facing each other. The bottom surface 101 and the top surface 102 are two opposing surfaces of the press 10. The bottom surface 101 is used to attach to a circuit board A. In this embodiment, the circuit board A can be a flexible printed circuit board, but is not limited thereto. The press 10 has a pressing groove 11, a through groove 12, a suction part 13, a positioning block 14, and a notch 15 on one side. In this embodiment, the press 10 can be made of high-temperature resistant synthetic stone by integral molding, but is not limited thereto.

[0029] Please refer to Figures 2 to 6 The pressing groove 11 is recessed in the bottom surface 101 of the presser 10, and the through groove 12 is formed through the bottom surface 111 of the pressing groove 11, thereby connecting the top surface 102 and the bottom surface 101 of the presser 10.

[0030] The suction part 13 is connected at both ends to the opposite walls of the through groove 12. The suction part 13 has a suction surface 131, which faces in a direction opposite to the bottom surface 101. In this embodiment, the suction surface 131 is flush with the top surface 102 of the press 10, but it is not limited thereto.

[0031] The positioning block 14 is connected to and protrudes from the bottom surface 101. The positioning block 14 is used to pass through the positioning hole A1 on the circuit board A, thereby fixing the presser 10 at a specific position on the circuit board A, so that the bottom surface 101 will not slide relative to the surface of the circuit board A. In this embodiment, there are two positioning blocks 14. Specifically, the bottom surface 101 has a large area on each of the opposite sides of the pressing groove 11, and the two positioning blocks 14 protrude from the aforementioned areas of the bottom surface 101, but this is not a limitation.

[0032] The side notch 15 is recessed in the bottom surface 101 and laterally penetrates the groove wall of the pressing groove 11. In this embodiment, the presser 10 has four side notches 15, with two side notches 15 formed on each of two opposing groove walls of one set of pressing grooves 11.

[0033] Please refer to Figure 2 , Figure 3 and Figure 5 The counterweights 20 are disposed on the presser 10. In this embodiment, there are two counterweights 20, and the counterweights 20 are disposed at intervals on the top surface 102 of the presser 10, and the pressing groove 11 is located between the two counterweights 20.

[0034] Specifically, in this embodiment, the top surface 102 has a rectangular outline with a length direction D1 and a width direction D2. A mounting groove 16 is recessed in the top surface 102 along the length direction D1, outside the opposite sides of the pressing groove 11. The mounting groove 16 extends along the width direction D2. Two counterweights 20 are rod-shaped and are respectively embedded in the mounting groove 16, with each counterweight 20 contacting the mounting groove 16 with its outer peripheral surface. In other words, the counterweights 20 are positioned horizontally along the width direction D2 of the top surface 102, but this is not a limitation. Furthermore, the weights of the two counterweights 20 can be different, and the counterweights 20 can also be mounted on the presser 10 in other forms, such as being separable, thereby facilitating the user to replace different counterweights 20 to adjust the weight to meet different usage needs.

[0035] Please refer to Figure 5 and Figure 6 When a user solders a long connector B onto circuit board A during the reflow soldering process, the bottom surface 101 of this invention faces circuit board A, and the positioning block 14 is aligned with the positioning hole A1 on circuit board A. The bottom surface 101 contacts circuit board A, the positioning block 14 passes through the positioning hole A1, and the long connector B is positioned within the pressing groove 11. In this embodiment, the length direction D1 of the long connector B is the same as the length direction D1 of the top surface 102, but this is not a limitation. When the setup of this invention is complete, the bottom surface 111 of the pressing groove 11 contacts and presses the long connector B against circuit board A, thus preventing the pins of the long connector B (not shown) from floating during the reflow soldering process. The user can inspect the contact between the bottom surface 111 of the pressing groove 11 and the long connector B through the side notch 15, and can also observe the reflow soldering result through the through-groove 12 to determine whether to remove this invention from circuit board A.

[0036] In this embodiment, the counterweights 20 on both sides of the pressing groove 11 can apply pressing force to both ends of the long connector B, preventing one end of the long connector B from floating and affecting the welding result. In addition, in this embodiment, the rod-shaped counterweights 20 are arranged horizontally along the width direction D2 of the top surface 102, which can make the overall weight distribution of this utility model more uniform and reduce the long connector B from floating due to uneven force.

[0037] Furthermore, in this embodiment, the suction part 13 can be sucked up by the processing equipment during processing. For example, the processing equipment can contact the suction surface 131 to freely suck up and put the present invention on or remove it from the circuit board A. Therefore, the present invention can achieve full automation in conjunction with the reflow soldering process and equipment operation.

[0038] This invention ensures that all connector pins are fully aligned with the solder pads on circuit board A, solving the problem of open solder joints caused by deformation. Simultaneously, the fixture 10 has a suction surface 131, allowing the placement equipment in the SMT process to automatically pick up the connector and automatically mount it onto the long connector B. Furthermore, this invention can accommodate different product models of long connector B by adding counterweights of varying weights. Using this invention, the long connector B is pressed as flat as possible onto the surface of circuit board A, ensuring full contact between the connector B pins and the circuit board A surface. After the solder paste reflows, the pins of the long connector B are fully soldered to the circuit board A, achieving product functionality.

[0039] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model's technical solution. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the content of the present utility model's technical solution shall still fall within the scope of the present utility model's technical solution.

Claims

1. A surface mount fitting for reflow soldering, characterized in that, The surface mount fitting for reflow soldering has the following features: A press has the following features: A bottom surface, which is used to attach to a circuit board; and A pressure groove, the recess of which is formed on the bottom surface; and At least one counterweight is disposed on the press.

2. The surface mount pressure piece for reflow soldering according to claim 1, characterized in that, The press further has: A through groove is formed through the bottom surface of the pressing groove.

3. The surface mount fitting for reflow soldering according to claim 2, characterized in that, The press further has: A suction part has two ends connected to the opposite walls of the through groove, and the suction part has a suction surface facing in a direction opposite to the bottom surface.

4. The surface mount press-fit component for reflow soldering according to any one of claims 1 to 3, characterized in that, The press further has: A positioning block is connected to the bottom surface and protrudes from the bottom surface.

5. The surface mount fitting for reflow soldering according to any one of claims 1 to 3, characterized in that, in: The counterweight can be detachably mounted on the press.

6. The surface mount fitting for reflow soldering according to any one of claims 1 to 3, characterized in that: The press further has a top surface, the top surface and the bottom surface being two opposite surfaces of the press, and the at least one counterweight is disposed on the top surface.

7. The surface mount fitting for reflow soldering according to any one of claims 1 to 3, characterized in that, The number of the at least one counterweight is two, the two counterweights are spaced apart from each other on the press, and the pressing groove is located between the two counterweights.

8. The surface mount fitting for reflow soldering according to claim 7, characterized in that, Each of the counterweights is rod-shaped, and each of the counterweights is disposed in contact with the presser on its outer peripheral surface.

9. The surface mount fitting for reflow soldering according to claim 7, characterized in that, The two counterweights have different weights.

10. The surface mount fitting for reflow soldering according to any one of claims 1 to 3, characterized in that, The press further has: A notch is formed on one side, the recess being formed on the bottom surface and extending laterally through the wall of the pressing groove.

Images