Infrared receiving module packaging structure and PCB assembly

Abstract

The utility model is suitable for the technical field of semiconductor packaging, and discloses an infrared receiving module packaging structure and a PCB assembly. The infrared receiving module packaging structure comprises a wafer, a wire, a support and a colloid, the wafer, the wire and the support are packaged in the colloid, the top of the colloid is provided with a horizontal plane serving as a material suction platform, corners of two sides of the material suction platform are inclined planes, the top of the colloid is provided with a light gathering and receiving area, and the light gathering and receiving area is lower than the material suction platform. The corners of the light gathering and collecting area are smooth corners, and the bottom of the colloid is provided with a positioning notch step. In the feeding process, the chip mounter sucks materials through the material suction platform, the adsorption force is high, and the materials are not prone to falling off. And meanwhile, the corners on the two sides of the material suction platform are inclined planes, and the corners of the light condensation and collection area are smooth corners, so that the material collision force in the production process can be reduced, and material falling is prevented. And on the other hand, the part, staggered from the positioning notch step, of the bottom of the colloid is embedded into the hole of the PCB, so that the welding and assembling space can be reduced, and the effectiveness of material positioning is improved.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor packaging technology, specifically relating to an infrared receiving module packaging structure and PCB assembly. Background Technology

[0002] When soldering infrared receiving modules to a PCB board, the pick-and-place machine uses a material handling platform to pick up the infrared receiving module and then places it on the PCB board. In existing infrared receiving modules, the issue of components falling off due to collisions during production is common. Furthermore, in some applications with limited assembly space, the existing infrared receiving module's packaging structure, due to its relatively high material thickness, makes it difficult to install in such confined spaces. Utility Model Content

[0003] The purpose of this utility model embodiment is to provide an infrared receiving module packaging structure and PCB assembly, which can reduce material loss during the production process and can be assembled into a smaller space.

[0004] To achieve the above objectives, this utility model provides an infrared receiving module packaging structure, including a chip, wires, a bracket, and a colloid. The chip, wires, and bracket are encapsulated in the colloid. The chip is fixedly mounted on the bracket. The two ends of the wires are respectively connected to the chip and the bracket. The bracket has pins extending out of the colloid. The top of the colloid has a horizontal surface as a suction platform. The two sides of the suction platform are beveled. The area on the top of the colloid that is offset from the suction platform is a light-gathering area. The light-gathering area is lower than the suction platform. The corners of the light-gathering area are rounded. The bottom of the colloid has a positioning notch step.

[0005] Furthermore, the light-gathering area is provided with a lens that has a light-gathering and focusing function, and the lens is formed by hemispherical epoxy encapsulation.

[0006] Furthermore, the pin extends out from one side of the colloid, and the positioning notch step is located on the other side of the colloid away from the pin, with the step surface of the positioning notch step being flush with the soldering surface of the pin.

[0007] Furthermore, the bracket has multiple pins, which are spaced apart and insulated from each other.

[0008] Furthermore, the extension direction of the pin is perpendicular to the outer surface of the colloid, wherein the pin located on the outer side is bent outward.

[0009] Furthermore, the pin has a horizontal segment and a vertical segment, with the horizontal segment of the pin located on the outer side bent outward.

[0010] Furthermore, the pin also has a horizontal soldering section located at the bottom of the vertical section.

[0011] To achieve the above objectives, this utility model also provides a PCB assembly, including a PCB board with pads. The PCB assembly further includes an infrared receiving module packaging structure as described above. The PCB board has an opening, and the bottom of the colloid is embedded in the opening at a position offset from the positioning notch step. The positioning notch step abuts against the surface of the PCB board. The pins are soldered to the pads.

[0012] Compared with the prior art, the advantages of this utility model are as follows:

[0013] The infrared receiving module packaging structure of this utility model has a horizontal surface on the top of the colloid serving as a material suction platform. During the loading process, the pick-and-place machine uses this platform to suction the material. The large contact area between the material and the suction device results in strong adhesion and prevents the material from falling off. Simultaneously, the two sides of the suction platform are beveled, and the corners of the light-gathering area are rounded, which reduces the impact force during production and prevents material from falling off.

[0014] On the other hand, the bottom of the colloid is provided with a positioning notch step. The part of the bottom of the colloid that is offset from the positioning notch step is embedded in the opening, which effectively reduces the installation height of the material, prevents the material from falling, improves the effectiveness of material positioning, and reduces the space for welding assembly, so that the infrared receiving module can be used in occasions with small installation space. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the packaging structure of the infrared receiving module provided in Embodiment 1 of this utility model;

[0016] Figure 2 This is a schematic diagram of the PCB assembly provided in Embodiment 1 of this utility model;

[0017] Figure 3 This is a schematic diagram of the PCB board structure provided in Embodiment 1 of this utility model;

[0018] Figure 4 This is a cross-sectional schematic diagram of the PCB assembly provided in Embodiment 1 of this utility model;

[0019] Figure 5 This is a schematic diagram of the packaging structure of the infrared receiving module provided in Embodiment 2 of this utility model;

[0020] Figure 6 This is a schematic diagram of the infrared receiving module packaging structure and PCB board assembly provided in Embodiment 2 of this utility model;

[0021] Figure 7This is a schematic diagram of the packaging structure of the infrared receiving module provided in Embodiment 3 of this utility model;

[0022] Figure 8 This is a schematic diagram of the infrared receiving module packaging structure and PCB board assembly provided in Embodiment 3 of this utility model. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0024] In the description of this utility model, it should be noted that if terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" appear to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the utility model product is in use, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0025] Example 1:

[0026] Please see Figure 1 This embodiment shows an infrared receiving module packaging structure, including a chip, wires, a bracket, and a colloid 1. The chip, wires, and bracket are packaged in the colloid 1. The chip is fixedly mounted on the bracket. The two ends of the wires are respectively connected to the chip and the bracket. The bracket has multiple pins 2 extending out of the colloid 1. The multiple pins 2 are spaced apart and insulated from each other.

[0027] The top of the colloid 1 has a horizontal surface as a suction platform 11, and the two sides of the suction platform 11 are inclined surfaces 12. The area on the top of the colloid 1 that is offset from the suction platform 11 is a light-gathering area. A lens 13 with light-gathering function is provided on the light-gathering area. The lens 13 is formed by hemispherical epoxy encapsulation.

[0028] The light-gathering area is lower than the material suction platform 11, and the corners 14 of the light-gathering area are rounded.

[0029] The pick-and-place machine uses the material suction platform 11 to pick up materials. During the feeding process, the material has a large contact area with the suction device, resulting in strong adhesion and preventing it from falling off. At the same time, the two sides of the material suction platform 11 are beveled 12, and the corners 14 of the light-gathering area are rounded, which can reduce the impact force on the material during production and thus prevent it from falling off.

[0030] In this embodiment, the extension direction of pin 2 is perpendicular to the outer side of colloid 1. The pin 2 located on the outer side is bent outward so that sufficient clearance space is formed between pins 2 to avoid short circuit between pins after soldering.

[0031] Pin 2 extends out from one side of colloid 1, and the other side of colloid 1 away from pin 2 is provided with a positioning notch step 15, the step surface of the positioning notch step 15 is flush with the soldering surface of pin 2.

[0032] Please see Figure 2 This embodiment also provides a PCB assembly, including a PCB board 200 and an infrared receiver module packaging structure 100. Please refer to [link to relevant documentation]. Figure 3 The PCB board 200 has pads 201 on its front side and openings 202 on its side. Please refer to [link / reference]. Figure 4 The part of the bottom of the colloid 1 that is offset from the positioning notch step 15 is embedded in the opening 202. The step surface of the positioning notch step 15 abuts against the board surface of the PCB board 200. The pin 2 is soldered to the pad 201. This soldering method is suitable for reflow soldering process production.

[0033] The bottom of the colloid 1 is staggered and the positioning notch step 15 is embedded in the opening 202, which effectively reduces the installation height of the material, prevents the material from falling, improves the effectiveness of material positioning, and reduces the space for welding assembly, so that the infrared receiving module can be used in occasions with limited installation space.

[0034] Example 2:

[0035] Please see Figure 5 This illustration shows an infrared receiver module packaging structure provided in this embodiment, which differs from Embodiment 1 in that:

[0036] In this embodiment, pin 2 has a horizontal segment 21 and a vertical segment 22. The horizontal segment 21 of the outer pin 2 bends outward to create sufficient clearance between the pins 2, thus preventing short circuits after soldering. The vertical segment 22 serves as a pin reference. When assembling the infrared receiving module, please refer to... Figure 6 The infrared receiving module is inserted into the PCB board 200 using an insertion machine and soldered to the pads on the back of the PCB board 200.

[0037] Example 3:

[0038] Please see Figure 7 This illustration shows an infrared receiver module packaging structure provided in this embodiment, which differs from Embodiment 1 in that:

[0039] In this embodiment, pin 2 has a horizontal segment 21, a vertical segment 22, and a horizontal soldering segment 23, wherein the horizontal soldering segment 23 is located at the bottom of the vertical segment 22. When assembling the infrared receiving module, please refer to... Figure 8 The horizontal welding section 23 is used for welding to the pads on the front side of the PCB board 200.

[0040] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An infrared receiving module packaging structure, comprising a chip, wires, a bracket, and a colloid, wherein the chip, wires, and bracket are encapsulated within the colloid, the chip is fixedly mounted on the bracket, and the two ends of the wires are respectively connected to the chip and the bracket, and the bracket is provided with pins extending beyond the colloid; characterized in that, The top of the colloid has a horizontal surface as a suction platform, the two sides of the suction platform are beveled, the area of ​​the top of the colloid that is offset from the suction platform is a light-gathering area, the light-gathering area is lower than the suction platform, the corners of the light-gathering area are rounded, and the bottom of the colloid is provided with a positioning notch step.

2. The infrared receiving module packaging structure according to claim 1, characterized in that, The light-gathering area is provided with a lens that has the function of gathering and concentrating light, and the lens is formed by hemispherical epoxy encapsulation.

3. The infrared receiving module packaging structure according to claim 1, characterized in that, The pin extends out from one side of the colloid, and the positioning notch step is located on the other side of the colloid away from the pin. The step surface of the positioning notch step is flush with the soldering surface of the pin.

4. The infrared receiving module packaging structure according to claim 1, characterized in that, The bracket has multiple pins, which are spaced apart and insulated from each other.

5. The infrared receiving module packaging structure according to claim 4, characterized in that, The pins extend perpendicularly to the outer surface of the colloid, wherein the pins located on the outer side are bent outward.

6. The infrared receiving module packaging structure according to claim 4, characterized in that, The pin has a horizontal segment and a vertical segment, with the horizontal segment of the pin located on the outer side bent outward.

7. The infrared receiving module packaging structure according to claim 6, characterized in that, The pin also has a horizontal solder section located at the bottom of the vertical section.

8. A PCB assembly, comprising a PCB board, wherein the PCB board is provided with solder pads, characterized in that, The PCB assembly further includes the infrared receiving module packaging structure as described in claim 5, wherein the PCB board has an opening, the bottom of the colloid is embedded in the opening at a position offset from the positioning notch step, the positioning notch step abuts against the surface of the PCB board; and the pin is soldered to the pad.

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