Semiconductor silicon component plane machining and polishing device

Abstract

The utility model relates to the technical field of semiconductor processing, and discloses a semiconductor silicon component plane processing and polishing device which comprises a polishing carrier plate, a sinking groove is arranged above the polishing carrier plate, a plurality of limiting hole seats are fixedly arranged in the sinking groove, a bottom plate is connected below the polishing carrier plate through a plurality of supporting legs, and a plurality of vacuum adsorption pumps are arranged on the bottom plate. An adsorption groove for a vacuum adsorption pump to pass through is formed in the grinding carrier plate, a support is movably arranged on the bottom plate, a motor is arranged on the support and located above the grinding carrier plate, a grinding disc is detachably arranged at the output end of the motor, the motor is driven by an air cylinder fixedly arranged on the support to ascend and descend, and dust collection blocks are symmetrically arranged on the portions, located on the two sides of the grinding disc, above the grinding carrier plate. The dust collection block is driven by a first electric push rod fixedly arranged on the support to ascend and descend, and a dust collection opening is formed in the side, close to the grinding disc, of the dust collection block. The polishing device has the advantages that the polishing device can be suitable for semiconductor silicon components of different specifications and shapes, shaking is avoided, and the polishing effect is guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, specifically to a semiconductor silicon component planar processing and polishing device. Background Technology

[0002] The need for surface polishing of semiconductor silicon components has multiple key implications. During the manufacturing process, silicon components inevitably develop minute imperfections, such as scratches and small bumps. These uneven areas may seem insignificant, but they have a significant impact in the microscopic world. Once in use, these imperfections can interfere with the normal distribution of current, causing signal transmission disorder, significantly reduced operating efficiency, and severely affecting the performance of semiconductor devices.

[0003] In the polishing process of semiconductor silicon components, stable positioning is extremely crucial. Currently, slotted positioning plates are commonly used, but their drawbacks are obvious. The slot shape is customized according to the specific silicon component specifications, and one type of positioning plate can only be used for one type of component, resulting in poor versatility. If the component model changes, it must be replaced, which is both time-consuming and costly. Moreover, the gaps left for easy insertion cause the component to wobble during polishing, resulting in uneven force distribution, which seriously affects polishing accuracy and surface quality, making it difficult to achieve the ideal process effect. Utility Model Content

[0004] To solve the above-mentioned problems, this utility model proposes a semiconductor silicon component planar processing and polishing device that can be applied to semiconductor silicon components of different specifications and shapes, avoids shaking, and ensures polishing effect.

[0005] To solve the above-mentioned technical problems, the technical solution proposed by this utility model is as follows: a planar processing and polishing device for semiconductor silicon components, including a polishing carrier plate, a recessed groove provided above the polishing carrier plate, a plurality of limiting hole seats fixedly provided in the recessed groove, a base plate connected to the bottom of the polishing carrier plate by a plurality of legs, a plurality of synchronously lifting vacuum adsorption pumps provided on the base plate directly below the polishing carrier plate, an adsorption groove provided on the polishing carrier plate for the vacuum adsorption pumps to pass through, a support movably provided on the base plate, a motor provided on the support above the polishing carrier plate, a polishing disc detachably provided at the output end of the motor, the motor being driven to lift and lower by a cylinder fixed on the support, dust collection blocks symmetrically provided on both sides of the polishing disc above the polishing carrier plate, the dust collection blocks being driven to lift and lower by an electric push rod fixed on the support, and a dust collection port provided on the side of the dust collection block near the polishing disc.

[0006] Furthermore, the grinding carrier plate has chip removal holes on its sidewall that connect to the sinking groove.

[0007] Furthermore, the limiting hole seats are evenly spaced and neatly arranged in the sinking groove.

[0008] Furthermore, an electric push rod two is fixedly installed above the base plate, and a lifting plate is fixedly installed above the electric push rod two. The vacuum adsorption pump is fixedly installed on the lifting plate, and each vacuum adsorption pump is arranged in a square around the center of the grinding carrier plate directly below it.

[0009] Furthermore, the bracket is inverted U-shaped, with a slide bar at the lower end of the bracket, and sliding grooves on both sides of the upper part of the base plate to match the slide bar. Handles are fixedly provided on both sides of the upper end of the bracket.

[0010] Furthermore, a connecting plate is fixedly provided at the output end of the motor, and the grinding disc is connected and fixed to the connecting plate by several screws.

[0011] Furthermore, the dust suction port is an arc shape that bulges out from the center towards the side away from the grinding disc.

[0012] Compared with existing technologies, this invention has the following advantages: the uniformly arranged limiting holes in the sink groove can effectively limit and fix semiconductor silicon components of different shapes and specifications, offering high flexibility. Simultaneously, multiple vacuum adsorption pumps arranged in a square around the center of the grinding carrier can be synchronously lifted by electric push rods, quickly approaching and stabilizing the adsorption components, ensuring stable fixation and effectively preventing component shaking during grinding, thus ensuring the grinding effect. Furthermore, the bracket adopts an inverted shape with a lower sliding strip cooperating with the base plate's sliding groove, allowing for smooth and stable movement. The upper handle allows for quick and accurate adjustment of the grinding position, better adapting to the grinding needs of different components. The dust collection block can adsorb dust generated during grinding over a large area, keeping the grinding area clean, which is beneficial to the operator's health and prevents dust from affecting the grinding effect, further ensuring effective grinding of semiconductor silicon components of different specifications and shapes. Attached Figure Description

[0013] Figure 1 This is a perspective view of the present invention;

[0014] Figure 2 This is the front view of this utility model;

[0015] Figure 3 This is a top view of the present invention;

[0016] Figure 4 This is a side view of the present invention;

[0017] Figure 5 This is an enlarged view of Part A of this utility model.

[0018] As shown in the figure: 1. Grinding carrier plate; 2. Limiting hole seat; 3. Support leg; 4. Base plate; 5. Vacuum adsorption pump; 6. Adsorption tank; 7. Bracket; 8. Motor; 9. Grinding disc; 10. Cylinder; 11. Dust collection block; 12. Electric push rod one; 13. Dust collection port; 14. Chip discharge hole; 15. Electric push rod two; 16. Lifting plate; 17. Slide groove; 18. Handle; 19. Connecting plate. Detailed Implementation

[0019] The present invention will now be described in further detail with reference to the accompanying drawings.

[0020] Combined with appendix Figure 1 Appendix Figure 2 Appendix Figure 3 A planar grinding apparatus for semiconductor silicon components includes a grinding carrier plate 1. A recessed groove is provided above the grinding carrier plate 1, and chip removal holes 14 communicating with the recessed groove are provided on the side wall of the grinding carrier plate 1 to facilitate timely removal of chips generated during the grinding process, preventing chip accumulation from affecting the grinding effect and subsequent operations. A plurality of limiting hole seats 2 are fixedly provided within the recessed groove. The limiting hole seats 2 are evenly spaced and neatly arranged within the recessed groove, facilitating the limiting and fixing of semiconductor silicon components of different shapes and specifications, offering flexibility and practicality.

[0021] Combined with appendix Figure 2 Appendix Figure 3 Appendix Figure 4 A base plate 4 is connected to the grinding carrier plate 1 via several support legs 3. Several synchronously lifting vacuum adsorption pumps 5 are mounted on the base plate 4 directly below the grinding carrier plate 1. The grinding carrier plate 1 has adsorption grooves 6 for the vacuum adsorption pumps 5 to pass through. An electric push rod 2 15 is fixed above the base plate 4, and a lifting plate 16 is fixed above the electric push rod 2 15. The vacuum adsorption pumps 5 are fixed on the lifting plate 16. The electric push rod 2 15 drives the lifting plate 16 to rise and fall, enabling the synchronous lifting of multiple vacuum adsorption pumps 5, allowing them to quickly approach and fix the semiconductor silicon component. Furthermore, the vacuum adsorption pumps 5 are arranged in a square around the center directly below the grinding carrier plate 1, ensuring the stability and uniformity of adsorption, thereby achieving stable fixation of the semiconductor silicon component.

[0022] Combined with appendix Figure 1 Appendix Figure 3 The base plate 4 is movably provided with a bracket 7, which is inverted U-shaped. The lower end of the bracket 7 is provided with a slide bar, and the upper sides of the base plate 4 are provided with slide grooves 17 that cooperate with the slide bar. The upper sides of the bracket 7 are fixedly provided with handles 18. The bracket adopts an inverted U-shape and the slide bar at the lower end cooperates with the slide groove 17 of the base plate 4 to achieve movement. The movement is smooth and stable. The handles 18 at the upper end facilitate the operation of the bracket 7 to move, thereby quickly and accurately adjusting the grinding position.

[0023] Combined with appendix Figure 1 Appendix Figure 5 A motor 8 is provided on the bracket 7 above the grinding plate 1. A grinding disc 9 is detachably provided at the output end of the motor 8. The motor 8 is driven to lift and lower by a cylinder 10 fixed on the bracket 7. A connecting plate 19 is fixedly provided at the output end of the motor 8. The grinding disc 9 is connected and fixed to the connecting plate 19 by several screws, which makes the disassembly and replacement of the grinding disc 9 simple and facilitates the quick replacement of the appropriate grinding disc 9 according to different grinding needs.

[0024] Combined with appendix Figure 1 Appendix Figure 2 The grinding carrier plate 1 is symmetrically provided with dust collection blocks 11 on both sides of the grinding disc 9. The dust collection blocks 11 are driven to rise and fall by an electric push rod 12 fixed on the bracket 7. The dust collection block 11 has a dust collection port 13 on the side closer to the grinding disc 9. The dust collection port 13 is an arc shape that bulges from the middle away from the grinding disc 9, which can adsorb dust generated during grinding over a large area, improve dust collection efficiency, and keep the grinding area clean.

[0025] The specific implementation method of this utility model is as follows: First, connect the device to an external power source, place the semiconductor silicon component to be processed in the recessed groove of the grinding carrier plate 1, and set it on the limiting hole seat 2. According to the shape and specifications of the component, use the limiting rod to insert into the limiting hole seat 2 that fits the edge of the semiconductor silicon component to achieve the limiting and fixing of the semiconductor silicon component.

[0026] Next, the electric push rod 15 on the base plate 4 is activated. The electric push rod 15 pushes the lifting plate 16 above to rise. Several vacuum adsorption pumps 5 fixed on the lifting plate 16 are raised synchronously. The vacuum adsorption pumps 5 pass through the adsorption groove 6 to approach and tightly adsorb the semiconductor silicon component. The semiconductor silicon component is firmly placed on the grinding carrier plate 1 to avoid shaking during subsequent grinding.

[0027] Then, grasp the handles 18 on both sides of the upper end of the bracket 7 and move the inverted U-shaped bracket 7 along the slide grooves 17 on both sides of the upper part of the base plate 4. Adjust the grinding position quickly and accurately according to the grinding requirements, and then control the motor 8 and the grinding disc 9 to descend through the cylinder 10 until the grinding disc 9 contacts the position of the semiconductor silicon component to be ground.

[0028] Subsequently, depending on the specific polishing requirements, if the polishing disc 9 needs to be replaced, the polishing disc 9 can be disassembled and replaced by unscrewing the screws on the connecting plate 19.

[0029] During the polishing process, the motor 8 is started to drive the polishing disc 9 to rotate for polishing. At the same time, the electric push rod 12 fixed on the bracket 7 can be started to drive the dust collection block 11 to descend to both sides of the polishing position, connect the dust collection block 11 to the external dust collection equipment, and use the arc-shaped dust collection port 13 to absorb the dust generated during polishing over a large area, keeping the polishing area clean and ensuring the polishing effect.

[0030] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly, for example, it can be a fixed connection, a detachable connection, or an integral connection; for those skilled in the art, the specific meaning of the above term in this utility model can be understood according to the specific circumstances.

[0031] The present invention and its embodiments have been described above. This description is not restrictive, and the accompanying drawings are only one embodiment of the present invention; the actual structure is not limited thereto. In conclusion, if those skilled in the art are inspired by this description and design similar structures and embodiments without departing from the inventive spirit of the present invention, such designs should fall within the protection scope of the present invention.

Claims

1. A planar processing and polishing apparatus for semiconductor silicon components, comprising a polishing carrier plate (1), characterized in that: A recessed groove is provided above the grinding carrier plate (1), and several limiting hole seats (2) are fixedly provided in the recessed groove. A base plate (4) is connected to the grinding carrier plate (1) below by several support legs (3). Several vacuum adsorption pumps (5) that can be raised and lowered synchronously are provided on the base plate (4) directly below the grinding carrier plate (1). An adsorption groove (6) for the vacuum adsorption pumps (5) to pass through is provided on the grinding carrier plate (1). A bracket (7) is movably provided on the base plate (4). A motor (8) is provided above the grinding carrier plate (1). The output end of the motor (8) is detachably provided with a grinding disc (9). The motor (8) is driven to lift by a cylinder (10) fixed on the bracket (7). Dust collection blocks (11) are symmetrically provided on both sides of the grinding disc (9) above the grinding carrier plate (1). The dust collection blocks (11) are driven to lift by an electric push rod (12) fixed on the bracket (7). The dust collection blocks (11) have a dust collection port (13) on the side of the dust collection block (11) near the grinding disc (9).

2. The semiconductor silicon component planar processing and polishing apparatus according to claim 1, characterized in that: The grinding carrier plate (1) has a chip removal hole (14) on its side wall that connects to the sinking groove.

3. The semiconductor silicon component planar processing and polishing apparatus according to claim 1, characterized in that: The limiting hole seats (2) are evenly spaced and neatly arranged in the sinking groove.

4. The semiconductor silicon component planar processing and polishing apparatus according to claim 1, characterized in that: An electric push rod two (15) is fixedly installed above the base plate (4), and a lifting plate (16) is fixedly installed above the electric push rod two (15). The vacuum adsorption pump (5) is fixedly installed on the lifting plate (16), and each vacuum adsorption pump (5) is arranged in a square around the center of the grinding carrier plate (1).

5. The semiconductor silicon component planar processing and polishing apparatus according to claim 1, characterized in that: The bracket (7) is inverted U-shaped. The lower end of the bracket (7) is provided with a slide bar. The upper sides of the base plate (4) are provided with slide grooves (17) that match the slide bar. The upper sides of the bracket (7) are fixedly provided with handles (18).

6. The semiconductor silicon component planar processing and polishing apparatus according to claim 1, characterized in that: The output end of the motor (8) is fixedly provided with a connecting plate (19), and the grinding disc (9) is connected and fixed to the connecting plate (19) by several screws.

7. The semiconductor silicon component planar processing and polishing apparatus according to claim 1, characterized in that: The suction port (13) is an arc shape that protrudes from the middle to the side away from the grinding disc (9).

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