Sensor position adjusting device and semiconductor device

By using a gear transmission mechanism to drive the sensor position adjustment device in semiconductor equipment, the problem of inaccurate sensor position adjustment is solved, precise sensor position adjustment is achieved, and the stability and accuracy of the process are improved.

CN223496603UActive Publication Date: 2025-10-31MICROPOLARIS EQUIPMENT TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202422926084.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-28
Publication Date
2025-10-31
Estimated Expiration
2034-11-28

AI Technical Summary

Technical Problem

Existing sensor position adjustment methods are not accurate enough in semiconductor equipment, resulting in large errors in the detection of the masking disk position, which affects the stability and accuracy of the process.

Method used

A gear transmission mechanism is used to drive the adjustment block to move on the guide unit. The precise adjustment of the sensor is achieved through gear meshing, preventing accidental displacement. The design of the guide unit and the adjustment block ensures the stability and accuracy of the sensor position.

Benefits of technology

It improves the accuracy and stability of sensor position adjustment, reduces the risk of errors during operation, ensures precise adjustment of sensor position, and adapts to complex application requirements.

✦ Generated by Eureka AI based on patent content.

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Abstract

According to the sensor position adjusting device and the semiconductor device, when the sensor position adjusting device works, a gear transmission mechanism in a driving unit drives an adjusting block to move on a guiding unit in the first direction through gear meshing transmission, so that a sensor arranged on the adjusting block moves in the first direction. When the gear transmission mechanism carries out transmission, accidental displacement in the adjusting process can be effectively prevented, so that the position of the sensor arranged on the adjusting block is not prone to deviation, the stability and accuracy of sensor position adjustment are guaranteed, the risk of introducing errors in the operation process is reduced, and accurate adjustment of the position of the sensor can be achieved.
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Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment, and more particularly to a sensor position adjustment device and a semiconductor device. Background Technology

[0002] In semiconductor manufacturing, many process steps need to be performed in a vacuum environment. Physical vapor deposition (PVD) is one of the commonly used methods for thin film preparation. PVD processes are typically carried out in a sealed chamber equipped with a substrate to support the wafer.

[0003] In physical vapor deposition (PVD) processes, there are certain specific steps, such as target pre-firing or coating processes. In these steps, the target material tends to deposit on the substrate, leading to various problems, including particle generation, substrate damage, and deterioration of process performance. To address this issue, a shielding disk is introduced. During the aforementioned specific processes, the shielding disk is placed above the substrate to prevent direct deposition of the target material. During normal deposition processes, the shielding disk needs to be rotated to an empty position within the chamber to avoid interfering with the deposition process.

[0004] However, the use of the shielding disc introduces new technical challenges. First, precise control of the disc's position is required to ensure it correctly covers the substrate in specific processes without interfering with the deposition process in normal processes. Second, because the disc rotates within a sealed chamber, its position cannot be directly observed by the operator; therefore, sensors are used to detect the disc's location.

[0005] Considering the machining and assembly tolerances of the chamber, the position of the sensor needs to be adjusted when the sensor is used to actually detect the position of the shielding disk. However, the accuracy of the existing position adjustment method needs to be further improved. Utility Model Content

[0006] The present invention addresses the problem of providing a sensor position adjustment device and a semiconductor device, which reduces the risk of introducing errors during operation and enables precise adjustment of the sensor position.

[0007] To address the aforementioned problems, this utility model provides a sensor position adjustment device, comprising: a base unit; a guide unit disposed on the base unit and extending along a first direction; an adjustment block slidably disposed on the guide unit along the first direction and used to position a sensor; and a drive unit connected to the adjustment block, the drive unit including a gear transmission mechanism for driving the adjustment block to move along the first direction on the guide unit.

[0008] Optionally, the adjusting block includes a threaded hole extending along a first direction; the gear transmission mechanism includes: an adjusting screw, including an adjusting end and an adjusting screw rod connected to the adjusting end; a first gear, fixedly mounted on the adjusting screw rod; an adjusting shaft, including a smooth shaft portion and a threaded portion, wherein the threaded portion and the threaded hole are threadedly engaged; and a second gear, fixedly mounted on the smooth shaft portion, wherein the second gear meshes with the first gear.

[0009] Optionally, the drive unit further includes: a support block, fixedly mounted on the base unit; an adjusting screw passing through the support block, the adjusting end being located at the top of the support block, and the adjusting screw being located at the bottom of the support block.

[0010] Optionally, the drive unit further includes a bushing located between the support block and the first gear, and the bushing is penetrated by the adjusting screw.

[0011] Optionally, the guide unit includes: a front support plate disposed on the base unit; a rear support plate disposed on the base unit; a plurality of support columns disposed between the front support plate and the rear support plate, and the support columns extending along the first direction; the adjustment block includes a plurality of through holes, and the through holes extending along the first direction, the through holes slidingly engaging with the support columns.

[0012] Optionally, the rear support plate is provided with a through hole; the optical axis portion passes through the through hole of the rear support plate; the second gear is located on the optical axis portion on the side of the rear support plate opposite to the adjusting block.

[0013] Optionally, the front support plate is provided with a groove; the adjustment shaft further includes a recess located on the side of the threaded portion away from the optical axis portion, the recess being disposed in the groove.

[0014] Optionally, the adjustment block includes: a guide portion for cooperating with the guide unit; a threaded drive portion connected to the guide portion, wherein the threaded drive portion is provided with the threaded hole; and a mounting portion connected to the threaded drive portion for mounting the sensor.

[0015] Optionally, the base unit has a symmetrical structure, and the guide unit, adjustment block, sensor and drive unit constitute a sensing unit. The sensor position adjustment device includes two sensing units, which are located on both sides of the base unit respectively.

[0016] This utility model embodiment also provides a semiconductor device, including: a chamber; a base located at the bottom of the chamber, the base being used to support a wafer; a cavity located on the side wall of the chamber and communicating with the chamber; a shielding disk located in the cavity or the chamber, the shielding disk being movable between the cavity and the chamber, for moving from the cavity to above the base during the process; a sensor position adjustment device disposed outside the cavity; and a sensor disposed on the sensor position adjustment device for detecting the position of the shielding disk.

[0017] Optionally, a transparent window is provided on the cavity; the sensor position adjustment device is used to align the sensor with the transparent window, and the sensor detects the position of the shielding plate through the transparent window.

[0018] Compared with the prior art, the technical solution of this utility model embodiment has the following advantages:

[0019] The sensor position adjustment device provided in this embodiment of the present invention includes: a base unit; a guide unit disposed on the base unit and extending along a first direction; an adjustment block slidably disposed on the guide unit along the first direction, the adjustment block being used to mount a sensor; and a drive unit connected to the adjustment block, the drive unit including a gear transmission mechanism for driving the adjustment block to move along the first direction on the guide unit. When the sensor position adjustment device provided in this embodiment of the present invention is in operation, the gear transmission mechanism in the drive unit drives the adjustment block to move along the first direction on the guide unit through gear meshing, thereby causing the sensor mounted on the adjustment block to move along the first direction. When the gear transmission mechanism is in operation, it can effectively prevent accidental displacement during the adjustment process, thus preventing the sensor position mounted on the adjustment block from easily shifting, ensuring the stability and accuracy of the sensor position adjustment, reducing the risk of introducing errors during operation, and enabling precise adjustment of the sensor position. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the sensor position adjustment device from one perspective according to an embodiment of the present invention;

[0021] Figure 2 This is a schematic diagram of the sensor position adjustment device from another perspective of an embodiment of this utility model;

[0022] Figure 3 This is a schematic diagram of the structure of the base unit in an embodiment of the present invention;

[0023] Figure 4 This is a schematic diagram of the structure in an embodiment of the present invention, showing the guide unit disposed on the base unit;

[0024] Figure 5 This is a schematic diagram of the structure of the front support plate according to an embodiment of the present invention;

[0025] Figure 6 This is a schematic diagram of the structure of the supporting rear plate according to an embodiment of the present utility model;

[0026] Figure 7 This is a schematic diagram of the structure of the adjusting block according to an embodiment of the present invention;

[0027] Figure 8 This is a schematic diagram of the structure of the adjusting shaft according to an embodiment of the present invention;

[0028] Figure 9 This is a schematic diagram of the semiconductor device according to an embodiment of the present invention from one perspective;

[0029] Figure 10 This is a schematic diagram of the semiconductor device from another perspective of an embodiment of the present invention. Detailed Implementation

[0030] As can be seen from the background technology, considering the machining and assembly tolerances of the chamber, when using sensors to actually detect the position of the shielding disk, the position of the sensors needs to be adjusted. However, the accuracy of the existing position adjustment methods needs to be further improved.

[0031] Existing sensor position adjustment devices include a fixing component and a sensor fixing screw. The sensor is mounted on a quartz window in the chamber wall via the fixing component, allowing it to transmit signals into the chamber through the quartz window. Specifically, the sensor is fixed to the fixing component by a fixing screw, which is positioned in an elongated hole. When the screw is loosened, it slides within the elongated hole, thereby moving the sensor. Once the sensor is moved to the desired position, the fixing screw is tightened to complete the adjustment.

[0032] However, the aforementioned sensor adjustment device requires loosening or tightening screws when adjusting the sensor position. This adjustment method is cumbersome, and tightening the screws after the position is determined will cause the sensor to shift, thus deviating from the predetermined position.

[0033] To address the aforementioned technical problem, the sensor position adjustment device provided in this embodiment of the present invention includes: a base unit; a guide unit disposed on the base unit and extending along a first direction; an adjustment block slidably disposed on the guide unit along the first direction, the adjustment block being used to mount a sensor; and a drive unit connected to the adjustment block, the drive unit including a gear transmission mechanism for driving the adjustment block to move along the first direction on the guide unit. When the sensor position adjustment device provided in this embodiment of the present invention is in operation, the gear transmission mechanism in the drive unit operates, driving the adjustment block to move along the first direction on the guide unit through precise gear meshing and transmission, and correspondingly, the sensor mounted on the adjustment block moves along the first direction. Firstly, the transmission via the gear transmission mechanism effectively prevents accidental displacement during the adjustment process, ensuring the stability and accuracy of the adjustment. This prevents the sensor position mounted on the adjustment block from easily shifting, enabling precise adjustment of the sensor position and reducing the risk of introducing errors during operation.

[0034] To make the above-mentioned objectives, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0035] refer to Figure 1 and Figure 2 The present invention provides a sensor position adjustment device comprising: a base unit 1; a guide unit disposed on the base unit 1 and extending along a first direction; an adjustment block 2 slidably disposed on the guide unit along the first direction and used to set a sensor 3; and a drive unit connected to the adjustment block 2, the drive unit including a gear transmission mechanism for driving the adjustment block 2 to move along the first direction on the guide unit.

[0036] When the sensor position adjustment device provided in this embodiment of the present invention is working, the gear transmission mechanism in the drive unit drives the adjustment block 2 to move along the first direction on the guide unit through gear meshing, so that the sensor 3 set on the adjustment block 2 moves along the first direction. When the gear transmission mechanism is in operation, it can effectively prevent accidental displacement during the adjustment process, so that the position of the sensor 3 set on the adjustment block 2 is not easily shifted, ensuring the stability and accuracy of the sensor position adjustment, improving the adjustment efficiency, reducing the risk of introducing errors during operation, and enabling precise adjustment of the sensor 3 position.

[0037] The base unit 1 serves as an installation platform, enabling the guide unit, adjustment block 2, drive unit, and sensor 3 installed on it to operate accurately.

[0038] In this embodiment, as Figure 3As shown, the base unit 1 includes: a first sidewall structure 11 and a second sidewall structure 12 arranged at relative intervals; a top structure 13 located on top of the first sidewall structure 11 and the second sidewall structure 12, and simultaneously connected to the top of the first sidewall structure 11 and the second sidewall structure 12; and two bottom structures 14 respectively disposed at the bottom of the first sidewall structure 11 and the second sidewall structure 12, with the two bottom structures 14 facing away from the space between the first sidewall structure 11 and the second sidewall structure 12.

[0039] The base unit 1, through the relatively spaced first sidewall structure 11 and second sidewall structure 12, and the top structure 13 connecting them, forms a stable frame, which enhances the stability of the base unit 1 itself and provides a reliable mounting base for the guide unit, adjustment block 2, and sensor 3. Furthermore, the two bottom structures 14 are positioned away from the space between the first sidewall structure 11 and second sidewall structure 12, allowing other structures to be installed in the space between the first sidewall structure 11 and second sidewall structure 12, thus improving space utilization.

[0040] Specifically, screw holes for fixing are provided on the first side wall structure 11, the second side wall structure 12, the top structure 13 and the bottom structure 14.

[0041] A guide unit is disposed on the base unit 1, and the guide unit extends along a first direction.

[0042] By restricting the movement of the guide unit along the first direction, a stable and precise moving track is provided for the adjustment block 2, resulting in high position adjustment accuracy of the sensor 3. Although the guide unit does not directly contact the sensor 3, it can indirectly improve the position adjustment accuracy of the sensor 3 by controlling the movement of the adjustment block 2.

[0043] like Figure 4 As shown, the guide unit includes: a front support plate 4, disposed on the base unit 1; a rear support plate 5, disposed on the base unit 1; and a plurality of support columns 6, disposed between the front support plate 4 and the rear support plate 5.

[0044] The front support plate 4 and the rear support plate 5 are fixed on the base unit 1 to form a stable support for the support column 6, ensuring the rigidity and stability of the guide unit; multiple support columns 6 are arranged between the front support plate 4 and the rear support plate 5 to act as guide rails.

[0045] As an example, the front support plate 4 is L-shaped, and the rear support plate 5 is also L-shaped. In other embodiments, the front and rear support plates can be other shapes.

[0046] like Figure 5 and Figure 6As shown, the front support plate 4 and the rear support plate 5 are respectively fixed to the first side wall structure 11 and the second side wall structure 12. Specifically, the front support plate 4 is fixed to the first side wall structure 11 of the base unit 1 by screws, and the rear support plate 5 is fixed to the second side wall structure 12 of the base unit 1 by screws.

[0047] It should be noted that the extension of the guide unit along the first direction refers to the extension of the support column 6 along the first direction.

[0048] like Figure 7 As shown, the adjustment block 2 is slidably disposed on the guide unit along the first direction, and the adjustment block 2 is used to set the sensor 3.

[0049] Adjustment block 2 provides a mounting platform for sensor 3. When the sensor position adjustment device is working, the adjustment block 2 slides on the guide unit, and sensor 3 moves with adjustment block 2.

[0050] In this embodiment, the adjustment block 2 includes a plurality of through holes 21, and the through holes 21 extend along a first direction, and the through holes 21 slide in cooperation with the support column 6.

[0051] The through holes 21 of the adjusting block 2 serve as guides and supports. The multiple through holes 21 not only enhance the stability of the structure but also improve the accuracy of adjustment. They help to distribute the stress points, reduce possible shaking or offset during adjustment, and ensure the accuracy and reliability of the sensor 3 position adjustment. In addition, the through holes 21 extend along the first direction, consistent with the movement direction of the adjusting block, reducing interference from other directions.

[0052] In this embodiment, the adjustment block 2 includes a guide portion 22, which is used to cooperate with the guide unit.

[0053] The guide portion 22 of the adjusting block 2 is used to move the adjusting block 2 along the first direction under the drive of the guide unit, reducing the offset and shaking of the sensor 3 and improving the position adjustment accuracy of the sensor 3. The threaded hole 24 of the threaded transmission portion 23, through its threaded engagement with the drive unit, converts the rotational motion into precise linear motion, enabling micron-level position adjustment.

[0054] In this embodiment, the adjusting block 2 further includes a threaded transmission part 23 connected to the guide part 22, wherein the threaded transmission part 23 is provided with a threaded hole 24 extending along a first direction.

[0055] In this embodiment, the threaded hole 24 is a T-shaped thread. Compared with ordinary threads, T-shaped threads provide a larger contact area, which helps to improve load capacity and motion stability; moreover, due to the increased contact area, the pressure distribution is more uniform, which can reduce thread wear and extend service life; in addition, the special shape of T-shaped threads helps to reduce gaps and backlashes, thereby improving the accuracy of sensor 3 position adjustment.

[0056] In this embodiment, the adjustment block 2 further includes a mounting part 25, which is connected to the threaded transmission part 23 and is used to mount the sensor 3.

[0057] In this embodiment, one sensor 3 is installed on each side of the mounting part 25, and one of the sensors 3 is located between the guide part 22 and the mounting part 25.

[0058] The mounting section 25 provides mounting positions for multiple sensors 3. By mounting sensors 3 on both sides of the mounting section 25 and placing one of the sensors 3 between the guide section 22 and the mounting section 25, the space utilization is improved. In addition, by having multiple sensors 3 work simultaneously in different positions, the data acquisition capability and accuracy are enhanced.

[0059] It should be noted that the mounting part 25, the guide part 22, and the threaded transmission part 23 are an integral structure. This integral structure improves assembly efficiency, achieves more compact space utilization, reduces connection points between parts, and lowers potential movement errors. In other embodiments, the mounting part, guide part, and threaded transmission part can also be individual components, assembled to form an adjustment block.

[0060] The drive unit is disposed on the base unit and connected to the adjustment block 2. The drive unit includes a gear transmission mechanism for driving the adjustment block 2 to move along the first direction on the guide unit.

[0061] The drive unit achieves precise movement of the adjustment block 2 in the first direction through a gear transmission mechanism. The gear transmission mechanism is used to prevent accidental displacement during the sensor adjustment process. Both ensure the stability and accuracy of the sensor 3 position adjustment.

[0062] In this embodiment, the drive unit and the adjustment block 2 are driven by a threaded connection, and the adjustment block 2 is located on the side of the base unit 1.

[0063] In this embodiment, the threaded engagement between the drive unit and the adjustment block 2 can convert the rotational motion into the linear motion of the adjustment block 2.

[0064] Specifically, the adjusting block 2 includes a threaded hole 24 extending along a first direction, and the gear transmission mechanism includes: an adjusting screw 7, including an adjusting end and an adjusting rod connected to the adjusting end; a first gear 8, fixedly mounted on the adjusting rod; and an adjusting shaft 9 (e.g., Figure 8 As shown, it includes an optical shaft portion 93 and a threaded portion 91, wherein the threaded portion 91 and the threaded hole 24 are threadedly engaged; a second gear 11 is fixedly disposed on the optical shaft portion 93, and the second gear 11 meshes with the first gear 8.

[0065] The rotation of adjusting screw 7 drives the first gear 8 to rotate, which in turn drives the second gear 11 to rotate, thereby rotating the adjusting shaft 9. This causes the threaded part 91 on the adjusting shaft 9 to engage with the threaded hole 24 in the adjusting block 2. Ultimately, this threaded engagement converts the rotational motion into linear motion of the adjusting block 2. This transmission method offers high adjustment accuracy and stability. Furthermore, the threaded engagement between the threaded part 91 on the adjusting shaft 9 and the threaded hole 24 in the adjusting block 2 has a self-locking property, preventing accidental displacement of the sensor 3 during adjustment.

[0066] In this embodiment, the first gear 8 is fixed to the adjusting screw by a set screw. This fixation ensures a stable connection between the first gear 8 and the adjusting screw, providing a reliable foundation for transmission. Specifically, the first gear 8 may have a threaded hole 24 on its side for mounting the set screw. The set screw passes through the threaded hole 24 of the first gear 8, and its end is pressed against the surface of the adjusting screw or a pre-set groove.

[0067] In this embodiment, the driving unit further includes a support block 10, which is fixedly disposed on the base unit 1.

[0068] The support block 10 is fixedly mounted on the base unit 1 to ensure the structural stability of the drive unit and provide reliable support for the adjusting screw 7. Through its secure connection with the base unit 1, the support block 10 enables the adjusting screw 7 to maintain stable movement in the vertical direction, while also providing a stable working platform for other transmission components such as gear transmission structures.

[0069] In this embodiment, the support block 10 is fixedly mounted on the top structure 13 of the base unit 1 by screws. In other embodiments, the support block may be connected to the base unit in other ways.

[0070] In this embodiment, the adjusting screw 7 passes through the support block 10, the adjusting end is located at the top of the support block 10, and the adjusting screw is located at the bottom of the support block 10.

[0071] The adjusting screw 7 penetrates the support block 10, with the adjusting end located at the top of the support block 10 and the adjusting screw at the bottom, forming a vertically penetrating operating component. By placing the adjusting end at the top, the operator can easily perform adjustments, while the adjusting screw at the bottom can be effectively connected to other transmission components (such as gear transmission mechanisms). Moreover, the vertically penetrating structure of the adjusting screw 7 allows for a larger adjustment range, increasing the flexibility and adaptability of the sensor position adjustment device.

[0072] It should be noted that the part of the support block 10 that is fixedly connected to the top structure 13 is at a different height from the part of the support block 10 through which the adjusting screw 7 passes, so that the support block 10 can adapt to various spatial position requirements.

[0073] As an example, the adjustment end is shaped for manual operation, such as hexagonal or with a handle.

[0074] It should be noted that the first gear 8 is disposed between the support block 10 and the support rear plate 5. The first gear 8 is disposed between the support block 10 and the support rear plate 5, so that the first gear 8 is close to the adjustment shaft 9, making it easy for the first gear 8 to mesh with the second gear 11 on the adjustment shaft 9, which helps to prevent accidental displacement during the sensor adjustment process.

[0075] In this embodiment, the front support plate 4 is provided with a groove 41; the adjustment shaft 9 further includes a recess 92, located on the side of the threaded portion 91 away from the optical axis portion 93, and the recess 92 is disposed in the groove 41.

[0076] The groove 41 on the front support plate 4 and the recess 92 on the adjusting shaft 9 are used to position and limit the adjusting shaft 9, which is beneficial to the stability of the gear transmission structure. Specifically, the cooperation between the groove 41 and the recess 92 not only provides a support point when the adjusting shaft 9 rotates, but also effectively prevents the adjusting shaft 9 from axially displacing during operation. By limiting unnecessary movement of the adjusting shaft 9, the accuracy and repeatability of the adjustment process are ensured.

[0077] It should be noted that the fit between the groove 41 and the recess 92 must ensure that the adjusting shaft 9 can rotate smoothly in the groove 41 while maintaining sufficient stability.

[0078] It should also be noted that the adjustment shaft 9 is horizontally positioned. The horizontal positioning of the adjustment shaft 9 provides a stable basis for the precise position adjustment of the sensor 3, which is beneficial to the accuracy and convenience of the sensor 3's position adjustment.

[0079] In this embodiment, the optical axis portion 93 is located outside the adjustment block 2. The location of the optical axis portion 93 outside the adjustment block 2 provides space for the installation of the second gear 11 and reduces the complexity inside the adjustment block 2.

[0080] In this embodiment, a through hole 51 is provided on the supporting rear plate 5; the optical axis portion 93 passes through the through hole 51 of the supporting rear plate 5.

[0081] In this embodiment, the second gear 11 is located on the optical shaft portion 93 on the side of the supporting rear plate 5 opposite to the adjusting block 2. By setting the second gear 11 on the optical shaft portion 93 on the side of the supporting rear plate 5 opposite to the adjusting block 2, it is convenient to assemble and maintain the second gear 11.

[0082] As an example, the second gear 11 is fixed to the optical shaft portion 93 by a set screw. This fixation ensures a secure connection between the second gear 11 and the optical shaft portion 93, providing a reliable foundation for transmission. Specifically, the second gear 11 may have a threaded hole 24 on its side for mounting the set screw. The set screw passes through the threaded hole 24, and its end is pressed against the surface of the optical shaft portion 93 or a pre-set groove.

[0083] It should be noted that the drive unit also includes a bushing 12, located between the support block 10 and the first gear 8, and the bushing 12 is penetrated by the adjusting screw.

[0084] The bushing 12 is located between the support block 10 and the first gear 8 and is penetrated by the adjusting screw. The bushing 12 restricts the axial movement of the first gear 8, so that the rotational movement of the adjusting screw can be transmitted to the first gear 8 more smoothly and accurately during the transmission process, and then drive the adjusting block 2 to move through the gear transmission mechanism.

[0085] In this embodiment, the bushing 12 is installed on the support block 10 by interference fit or other fixing methods, with its upper end in contact with the lower surface of the support block 10 and its lower end in contact with the upper surface of the first gear 8.

[0086] When the sensor position adjustment device is working, the operator rotates the adjusting screw 7 in the drive unit. The rotational movement of the adjusting screw 7 is transmitted to the first gear 8 through the adjusting screw. During this process, the bushing 12 provides support and guidance in the axial direction of the adjusting screw 7, which helps to ensure smooth and accurate transmission of movement. Because the first gear 8 meshes with the second gear 11 fixed on the optical shaft 93 of the adjusting shaft 9, when the first gear 8 rotates, it drives the second gear 11 to rotate, thereby driving the adjusting shaft 9 to rotate. The threaded part 91 of the adjusting shaft 9 is threadedly engaged with the threaded hole 24 on the adjusting block 2. As the adjusting shaft 9 rotates, the threaded transmission converts the rotational motion into the linear motion of the adjusting block 2, effectively preventing accidental displacement during the adjustment process. Under the action of the threaded transmission, the adjusting block 2 slides precisely and controllably along the guide unit (such as the support column 6) in the first direction. The accuracy of the sliding is guaranteed by the accuracy of the gear transmission mechanism. Since the sensor 3 is fixed on the adjusting block 2, the position of the sensor 3 is also precisely adjusted as the adjusting block 2 moves. By controlling the rotation angle of the adjusting screw 7, the position of the sensor 3 can be finely adjusted. The gear transmission mechanism and threaded engagement improve the high precision and stability of the adjustment. Once the sensor 3 reaches the desired position, stopping the rotation of the adjusting screw 7 will keep the sensor 3 in the adjusted position, preventing it from easily shifting.

[0087] Furthermore, in this embodiment, the base unit 1 has a symmetrical structure, and the guide unit, adjustment block 2, sensor 3 and drive unit constitute a sensing unit. The sensor position adjustment device includes two sensing units, which are located on both sides of the base unit 1 respectively.

[0088] The symmetrical structure of the base unit 1 facilitates a uniform force distribution on the sensor position adjustment device, improving its balance. Furthermore, the sensors 3 on both sides can be adjusted independently without mutual interference, allowing for individual maintenance or upgrades and enhancing the accuracy and flexibility of sensor 3 position adjustment. By matching different types or specifications of sensors 3 to different sensor units, complex application requirements can also be met.

[0089] refer to Figure 9 and Figure 10 This utility model embodiment also provides a semiconductor device, including: a chamber 100; a base 200 located at the bottom of the chamber 100, the base 200 being used to support a wafer; a cavity 300 located on the side wall of the chamber 100 and communicating with the chamber 100; a shielding disk 400 disposed in the cavity 300, used to move from the cavity 300 to above the base 200 during the process; a sensor position adjustment device 500 disposed outside the cavity 300; and a sensor 3 disposed on the sensor position adjustment device 500, used to detect the position of the shielding disk 400.

[0090] When the semiconductor device provided in this embodiment of the present invention performs a physical vapor deposition process, the shielding disk 400 moves from the cavity 300 to above the base 200, shielding the base 200 and preventing the target material from depositing on the base 200 during the physical vapor deposition process. When it is necessary to detect the position of the shielding disk 400, the sensor position adjustment device 500 provided in this embodiment of the present invention is used to precisely adjust the position of the sensor 3. Through the gear transmission mechanism in the drive unit, the adjustment block 2 can be driven to move precisely along the first direction on the guide unit, thereby driving the sensor 3 to move precisely in the first direction, realizing high-precision adjustment of the sensor 3 position, effectively preventing accidental displacement during the adjustment process, and ensuring the stability and accuracy of the adjustment.

[0091] In this embodiment, a transparent window (not shown in the figure) is provided on the cavity 300; the sensor position adjustment device 500 makes the sensor 3 correspond to the transparent window, and the sensor 3 detects the position of the shielding disk 400 through the transparent window.

[0092] A transparent window is provided on the cavity 300, and the sensor position adjustment device 500 is located outside the cavity 300, aligning the sensor 3 with the transparent window. The sensor detects the position of the shielding disk 400 through the transparent window. This not only enables accurate detection of the shielding disk 400 position by the sensor 3, but also avoids direct exposure of the sensor 3 to potentially corrosive gases or high-temperature environments present within the cavity 100, thereby extending the service life of the sensor 3. By placing the sensor position adjustment device 500 outside the cavity 300 and using the transparent window, precise adjustment of the sensor 3's position is achieved, thus improving the accuracy and reliability of the semiconductor device.

[0093] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the present invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A sensor position adjustment device, characterized in that, include: Base unit; A guide unit is disposed on the base unit, and the guide unit extends along a first direction; An adjustment block is slidably disposed on the guide unit along the first direction, and the adjustment block is used to set the sensor; A drive unit is disposed on the base unit and connected to the adjustment block. The drive unit includes a gear transmission mechanism for driving the adjustment block to move along the first direction on the guide unit.

2. The sensor position adjustment device as described in claim 1, characterized in that, The adjustment block includes a threaded hole extending in a first direction; The gear transmission mechanism includes: an adjusting screw, comprising an adjusting end and an adjusting screw rod connected to the adjusting end; The first gear is fixedly mounted on the adjusting screw; The adjusting shaft includes a smooth shaft portion and a threaded portion, wherein the threaded portion and the threaded hole are threadedly engaged. The second gear is fixedly mounted on the optical shaft and meshes with the first gear.

3. The sensor position adjustment device as described in claim 2, characterized in that, The drive unit further includes a support block, which is fixedly mounted on the base unit; The adjusting screw passes through the support block, with the adjusting end located at the top of the support block and the adjusting screw located at the bottom of the support block.

4. The sensor position adjustment device as described in claim 3, characterized in that, The drive unit further includes: A bushing is located between the support block and the first gear, and the bushing is penetrated by the adjusting screw.

5. The sensor position adjustment device as described in claim 2, characterized in that, The guide unit includes: a supporting front plate, disposed on the base unit; The rear support plate is mounted on the base unit. Multiple support columns are disposed between the front support plate and the rear support plate, and the support columns extend along the first direction; The adjustment block includes multiple through holes, which extend along a first direction and slide in conjunction with the support column.

6. The sensor position adjustment device as described in claim 5, characterized in that, The rear support plate is provided with a through hole; the optical axis portion passes through the through hole of the rear support plate; the second gear is located on the optical axis portion on the side of the rear support plate opposite to the adjusting block.

7. The sensor position adjustment device as described in claim 5, characterized in that, The front support plate is provided with a groove; The adjusting shaft further includes a recess located on the side of the threaded portion away from the optical axis portion, the recess being disposed in the groove.

8. The sensor position adjustment device as described in claim 2, characterized in that, The adjustment block includes a guide portion for cooperating with the guide unit; A threaded drive part is connected to the guide part, and the threaded drive part is provided with the threaded hole; The mounting part is connected to the threaded drive part and is used to mount the sensor.

9. The sensor position adjustment device as described in claim 1, characterized in that, The base unit has a symmetrical structure. The guide unit, adjustment block, sensor and drive unit constitute a sensing unit. The sensor position adjustment device includes two sensing units, which are located on both sides of the base unit respectively.

10. A semiconductor device, characterized in that, include: Chamber; A base, located at the bottom of the chamber, is used to support the wafer; A cavity is located on the side wall of the chamber and communicates with the chamber; A shielding plate, disposed in the cavity, is used to move from the cavity to above the base during the process; The sensor position adjustment device as described in any one of claims 1 to 9 is disposed outside the cavity; A sensor, mounted on the sensor position adjustment device, is used to detect the position of the shielding disc.

11. The semiconductor device as claimed in claim 10, characterized in that, A transparent window is provided on the cavity; The sensor position adjustment device aligns the sensor with the transparent window, and the sensor detects the position of the shielding plate through the transparent window.