Device for detecting thickness of polishing clamp

Abstract

The utility model discloses a device for detecting the thickness of a polishing clamp. The device comprises a placing platform, a measuring mechanism and a supporting mechanism. Height and level adjusting devices are arranged on the placing platform and the measuring mechanism; a polishing clamp is horizontally placed on the placing platform, and the edge of one side of the horizontally placed polishing clamp is suspended; the measuring mechanism comprises an upper detection head and a lower detection head which are oppositely arranged; the measuring mechanism is arranged on one side of the horizontally-placed polishing clamp, and the upper detection head and the lower detection head are located above and below the suspended polishing clamp correspondingly and can detect the thickness of the polishing clamp at the position. According to the invention, the levelness and height of the placing platform and the measuring mechanism can be precisely adjusted, the stability and precision requirements of the thickness measurement of the clamp can be well ensured, and the clamp has a good practical value in semiconductor processing and manufacturing, especially in the polishing process of a polishing machine, for controlling the thickness and morphology of a wafer.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing technology, and specifically relates to a device for detecting the thickness of polishing fixtures. Background Technology

[0002] The principle of wafer polishing is to remove surface defects through polishing and chemical etching processes, achieving a smooth and clean wafer surface. This process is crucial for semiconductor manufacturing because the surface quality of the wafer directly affects the subsequent printing of circuit patterns and the performance of the chip.

[0003] The main purpose of wafer polishing is to remove minute imperfections and uneven areas from the wafer surface to achieve a smooth and delicate finish. The wafer passes through a rotating polishing disc in a polishing machine. Polishing slurry is evenly sprayed onto the disc through a supply system. The wafer is held in place by a clamping device and gently contacts the disc. The polishing slurry reacts chemically with the wafer surface, forming a thin film. As the disc rotates, the wafer surface is finely ground, removing uneven areas and resulting in a smoother surface.

[0004] Therefore, the thickness of the fixture has a significant impact on the product removal amount and morphology control. Accurate measurement of the fixture thickness is of great technical value for improving product yield. Utility Model Content

[0005] The purpose of this invention is to provide a device for detecting the thickness of polishing fixtures in order to overcome the shortcomings of the prior art.

[0006] The objective of this utility model is achieved through the following technical solution:

[0007] An apparatus for detecting the thickness of a polishing fixture includes a placement platform, a measuring mechanism, and a support mechanism for supporting the placement platform and the measuring mechanism.

[0008] Both the placement platform and the measuring mechanism are equipped with height and level adjustment devices, which are used to adjust the height and level of the placement platform and the measuring mechanism, respectively.

[0009] The placement platform is used to place the polishing fixture horizontally, and one edge of the polishing fixture is suspended after being placed horizontally;

[0010] The measuring mechanism includes an upper measuring head and a lower measuring head arranged opposite to each other; the measuring mechanism is located on one side of the horizontally placed polishing fixture, and the upper measuring head and the lower measuring head are respectively located above and below the suspended polishing fixture, and can detect the thickness of the polishing fixture at that location.

[0011] Preferably, the placement platform is made of marble.

[0012] Preferably, one side of the placement platform is used to place the polishing fixture, and the other side has a through hole in the center to accommodate the measuring mechanism.

[0013] Preferably, the support mechanism includes a support frame, and a plurality of adjustable support columns are provided between the support frame and the placement platform for adjusting the height and level of the placement platform.

[0014] Preferably, the bottom of the support frame is provided with multiple feet;

[0015] The support frame is also equipped with a control cabinet.

[0016] Preferably, the measuring mechanism further includes a measuring bracket and a support base;

[0017] The measuring bracket includes a support block located on one side, an upper support beam and a lower support beam connected to the support block; the upper detection head is located below one end of the upper support beam, and the lower detection head is located above one end of the lower support beam.

[0018] The support base includes a horizontal base plate and a vertical base plate fixedly connected to one side of the horizontal base plate; the vertical base plate is used to be fixedly connected to the support mechanism; the horizontal base plate has a plurality of adjustment holes on one side of the support block, which are used to pass through a plurality of set screws and be connected and fixed to the support block, and the height and level of the support block are adjusted by adjusting the passing height of the set screws, thereby adjusting the height and level of the measuring mechanism.

[0019] Preferably, the other side of the horizontal base plate is provided with multiple threaded holes for passing through fixing screws and fixing them to the support mechanism.

[0020] Preferably, both the upper support beam and the lower support beam are hollowed out.

[0021] Preferably, the detection head includes a detection bracket and a detection sensor located on the detection bracket; the height of the detection sensor is adjustable.

[0022] Preferably, the detection sensor is a laser thickness sensor.

[0023] The device provided in this application can precisely adjust the level and height of the placement platform and the measuring mechanism, which can well ensure the stability and accuracy requirements of the fixture thickness measurement. It has good practical value in controlling the thickness and morphology of wafers, especially in the process of semiconductor processing and manufacturing, especially in the polishing process of polishing machines. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the device structure provided in this application;

[0025] Figure 2 This is a schematic diagram of the measuring mechanism;

[0026] Figure 3 This is a three-dimensional structural diagram of the measuring mechanism;

[0027] Explanation of reference numerals in the attached figures:

[0028] 10-Placement platform; 11-Through hole; 12-Adjustable support column;

[0029] 20-Measuring mechanism; 21-Upper detection head; 211-Detection bracket; 212-Detection sensor; 22-Lower detection head; 23-Measuring bracket; 231-Support block; 232-Upper support beam; 233-Lower support beam; 234-Fixing screw; 24-Support base; 241-Horizontal base plate; 242-Vertical base plate; 243-Adjustment hole; 244-Threaded hole;

[0030] 30-Support mechanism; 31-Support frame; 32-Foot; 33-Control cabinet;

[0031] 40 - Polishing fixture. Detailed Implementation

[0032] A preferred embodiment of this application provides a device for detecting the thickness of a polishing fixture, such as... Figures 1-3 As shown, it includes a placement platform 10, a measurement mechanism 20, and a support mechanism 30 for supporting the placement platform and the measurement mechanism.

[0033] Both the placement platform 10 and the measuring mechanism 20 are equipped with height and level adjustment devices, which are used to adjust the height and level of the placement platform and the measuring mechanism respectively, to ensure measurement stability and accuracy.

[0034] The polishing fixture 40 is placed horizontally on the placement platform 10, and one edge of the polishing fixture is suspended after being placed horizontally, so that the measuring mechanism 20 can be aligned with the upper and lower sides to measure its thickness.

[0035] The measuring mechanism 20 includes an upper measuring head 21 and a lower measuring head 22 arranged opposite to each other. The measuring mechanism is located on one side of the horizontally placed polishing fixture 40, and the upper measuring head 21 and the lower measuring head 22 are located above and below the suspended polishing fixture, respectively, and can detect the thickness of the polishing fixture at that location.

[0036] Preferably, the placement platform 10 is made of marble. The size of the marble placement platform is larger than that of the polishing fixture, and the length of the measuring mechanism is greater than the radius of the polishing fixture. The polishing fixture can be manually rotated, moved forward, and backward, thus allowing measurement of the entire plane of the polishing fixture. Marble has a uniform texture, good stability, high strength, high hardness, and is extremely wear-resistant, acid-resistant, alkali-resistant, and has high corrosion resistance. Even prolonged contact of the fixture with the slurry will not corrode the marble platform. The marble platform has a levelness of 5µm per square meter, and the platform accuracy can well meet the measurement requirements of the fixture.

[0037] Preferably, one side of the placement platform 10 is used to place the polishing fixture 40, and the center of the other side has a through hole 11 to accommodate the measuring mechanism 20, so as to prevent interference between the placement platform and the measuring mechanism and enable the detection head to be aligned with the upper and lower parts of the polishing fixture to detect its thickness.

[0038] Preferably, the support mechanism 30 includes a support frame 31, and a plurality of adjustable support columns 12 are provided between the support frame 31 and the placement platform 10, preferably six. Through these six support columns, the level and height of the marble placement platform can be precisely adjusted, ensuring the level and height requirements during fixture measurement, and also approximately positioning the upper surface of the marble placement platform at the center of the measuring mechanism.

[0039] Preferably, the bottom of the support frame 31 is provided with multiple feet 32 ​​to ensure the stability of the overall device. A control cabinet 33 is also provided on the support frame 31. The control cabinet 33 is used to store the controller and power supply of the measuring sensors, and is separated from the platform to effectively avoid the safety risk of accidental human contact.

[0040] Preferably, the support frame 31 is made entirely of carbon steel, and the surface of the carbon steel is provided with an anti-corrosion coating, which can extend its service life.

[0041] Preferably, the measuring mechanism 20 further includes a measuring bracket 23 and a support base 24; the measuring bracket 23 is preferably made of SUS304 stainless steel and is used to support the detection head, and the support base 24 is used to support and fix the measuring bracket.

[0042] The measuring bracket 23 includes a support block 231 on one side, an upper support beam 232 connected to the support block, and a lower support beam 233. An upper detection head 21 is located below one end of the upper support beam 232, and a lower detection head 22 is located above one end of the lower support beam 233. Both the upper and lower support beams 232 and 233 are hollowed out, which reduces the weight of the entire measuring bracket. The support block 231 is fixed to both the upper and lower support beams 232 and 233 by stainless steel fixing screws 234 on both sides (eight screws on each side), ensuring the stability of the measuring bracket connection.

[0043] The support base 24 includes a horizontal base plate 241 and a vertical base plate 242 fixedly connected to one side of the horizontal base plate; the vertical base plate 242 is used to fix the support mechanism, thereby fixing the entire measuring mechanism vertically to the support frame 31 (4 screw fixing holes).

[0044] The horizontal base plate 241 has multiple adjustment holes 243 on one side of the support block, which are used to pass through multiple set screws and connect and fix to the support block. By adjusting the height of the set screws, the height and level of the support block can be adjusted, thereby adjusting the height and level of the measuring mechanism, which can further meet the measurement requirements of the detection head for the thickness of the polishing fixture.

[0045] Furthermore, one side of the horizontal base plate 241 is provided with 6 threaded holes 244 for passing through fixing screws to fix it to the support frame in the horizontal direction, further ensuring the firmness of the connection between the measuring mechanism and the support frame.

[0046] When adjusting the level and height of the support block, first loosen the fixing screws, then adjust the six set screws to coordinate with each other to adjust the height and level of the support block and measuring bracket. After adjustment, tighten the six fixing screws again. The detection head includes a detection bracket 211 and a detection sensor 212 located on the detection bracket 211. The height of the detection sensor is adjustable to further meet the needs of measuring the thickness of the polishing fixture. Preferably, the detection bracket is provided with a U-shaped hole, and the detection sensor is fixed to the detection bracket by a fixing screw passing through the U-shaped hole. Loosening the fixing screw allows the detection sensor to move up and down to adjust its height. Once adjusted to the appropriate position, tighten the fixing screw to fix the detection sensor, preventing further movement.

[0047] Preferably, the detection sensor 212 is a laser thickness sensor, and more preferably a Keyence CL series thickness sensor.

[0048] When using this application, first place the standard piece on the marble placement platform and manually push it between the upper and lower detection sensors to measure a standard value. Then remove the standard piece, place the polishing fixture on the marble placement platform, and manually push it between the upper and lower detection sensors to measure the thickness of the polishing fixture radius. Manually rotating the polishing fixture allows for the measurement of the thickness of the entire polishing fixture.

[0049] The device provided in this application can precisely adjust the level and height of the placement platform and the measuring mechanism, which can well ensure the stability and accuracy requirements of the fixture thickness measurement. It has good practical value in controlling the thickness and morphology of wafers, especially in the process of semiconductor processing and manufacturing, especially in the polishing process of polishing machines.

[0050] Although preferred embodiments of the present invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including both the preferred embodiments and all changes and modifications falling within the scope of the present invention. Clearly, those skilled in the art can make various alterations and modifications to the present invention without departing from its spirit and scope. Thus, if such modifications and modifications fall within the scope of the claims of the present invention and their equivalents, the present invention also intends to include such modifications and modifications.

Claims

1. A device for detecting the thickness of a polishing fixture, characterized in that, It includes a placement platform, a measuring mechanism, and a support mechanism for supporting the placement platform and the measuring mechanism; Both the placement platform and the measuring mechanism are equipped with height and level adjustment devices, which are used to adjust the height and level of the placement platform and the measuring mechanism, respectively. The placement platform is used to place the polishing fixture horizontally, and one edge of the polishing fixture is suspended after being placed horizontally; The measuring mechanism includes an upper measuring head and a lower measuring head arranged opposite to each other; the measuring mechanism is located on one side of the horizontally placed polishing fixture, and the upper measuring head and the lower measuring head are respectively located above and below the suspended polishing fixture, and can detect the thickness of the polishing fixture at that location.

2. The apparatus for detecting the thickness of a polishing fixture as described in claim 1, characterized in that, The placement platform is made of marble.

3. The apparatus for detecting the thickness of a polishing fixture as described in claim 1, characterized in that, One side of the placement platform is used to place the polishing fixture, and the other side has a through hole in the center to accommodate the measuring mechanism.

4. The apparatus for detecting the thickness of a polishing fixture as described in claim 1, characterized in that, The support mechanism includes a support frame, and multiple adjustable support columns are provided between the support frame and the placement platform for adjusting the height and level of the placement platform.

5. The apparatus for detecting the thickness of a polishing fixture as described in claim 4, characterized in that, The bottom of the support frame is provided with multiple feet; The support frame is also equipped with a control cabinet.

6. The apparatus for detecting the thickness of a polishing fixture as described in claim 1, characterized in that, The measurement mechanism also includes a measurement bracket and a support base; The measuring bracket includes a support block located on one side, an upper support beam and a lower support beam connected to the support block; the upper detection head is located below one end of the upper support beam, and the lower detection head is located above one end of the lower support beam. The support base includes a horizontal base plate and a vertical base plate fixedly connected to one side of the horizontal base plate; the vertical base plate is used to be fixedly connected to the support mechanism; the horizontal base plate has a plurality of adjustment holes on one side of the support block, which are used to pass through a plurality of set screws and be connected and fixed to the support block, and the height and level of the support block are adjusted by adjusting the passing height of the set screws, thereby adjusting the height and level of the measuring mechanism.

7. The apparatus for detecting the thickness of a polishing fixture as described in claim 6, characterized in that, The other side of the horizontal base plate is provided with multiple threaded holes for passing through fixing screws and fixing them to the support mechanism.

8. The apparatus for detecting the thickness of a polishing fixture as described in claim 6, characterized in that, Both the upper support beam and the lower support beam are hollowed out.

9. The apparatus for detecting the thickness of a polishing fixture as described in claim 1, characterized in that, The detection head includes a detection bracket and a detection sensor located on the detection bracket; the height of the detection sensor is adjustable.

10. The apparatus for detecting the thickness of a polishing fixture as described in claim 9, characterized in that, The detection sensor is a laser thickness sensor.

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