Three-tower radiator capable of efficiently dissipating heat

Abstract

The utility model discloses an efficient heat dissipation three-tower radiator which comprises a radiator assembly and a heat conduction plate, the radiator assembly comprises a first radiator, a second radiator and a third radiator which are arranged at intervals, and the first radiator, the second radiator and the third radiator are of a parallel structure. Gaps between the first radiator and the second radiator and between the second radiator and the third radiator respectively form radiating air channels, screw holes are formed in two ends of the heat conducting plate, screws are embedded in the screw holes, the heat conducting plate is in threaded connection with the mounting mechanism through the screws, the mounting mechanism is used for fixing the radiator assembly on a mainboard, and the lower end face of the heat conducting plate is tightly attached to a CPU. According to the utility model, through the first radiator, the second radiator and the third radiator which are arranged in parallel as well as the radiating air channels formed among the first radiator, the second radiator and the third radiator which are arranged at intervals, air flow can smoothly pass through the radiators, so that heat is effectively taken away from the radiators.

Description

Technical Field

[0001] This utility model relates to the field of computer heat dissipation technology, specifically a high-efficiency three-tower heat sink. Background Technology

[0002] Tower coolers are highly efficient cooling devices designed specifically for high-performance computing components, aiming to provide superior thermal management. This type of cooler typically contains one or more large arrays of aluminum or copper fins. These fins expand the heat dissipation surface area, thereby improving heat exchange efficiency with the surrounding air and accelerating heat dissipation. To further enhance cooling performance, most tower coolers also feature one or more built-in fans to force airflow, ensuring that components remain at low operating temperatures even under high system loads. In this way, tower coolers effectively protect high-performance hardware from overheating damage, ensuring its stability and long-term performance.

[0003] There is a type of heatsink that improves CPU cooling by using a three-tower structure. For example, Chinese patent document "CN221261622U, A High-Efficiency Heatsink with Three Towers" includes three heatsinks: a first heatsink, a second heatsink, and a third heatsink. The first and second heatsinks are parallel, while the second and third heatsinks are "L"-shaped. This heatsink structure improves airflow inside the chassis through side-blowing and rear-blowing modes, thereby improving the overall cooling effect. However, this "L"-shaped heatsink structure makes the airflow path more complex, especially at corners where the airflow needs to change direction. When high-speed airflow encounters such a sudden change in direction, airflow separation is likely to occur at the corner, forming vortices and eddies. This makes the airflow increasingly irregular, thus affecting the overall cooling efficiency and noise level. Utility Model Content

[0004] The purpose of this invention is to provide a three-tower radiator with high-efficiency heat dissipation to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A high-efficiency heat dissipation three-tower heat sink includes a heat sink assembly and a heat conduction plate. The heat sink assembly includes a first heat sink, a second heat sink, and a third heat sink arranged at intervals. The first, second, and third heat sinks are parallel in structure. The gaps between the first and second heat sinks and between the second and third heat sinks respectively form heat dissipation air channels. The heat conduction plate has screw holes at both ends, and screws are embedded in the screw holes and threadedly connected to a mounting mechanism through the screws. The mounting mechanism is used to fix the heat sink assembly to the motherboard. The lower end face of the heat conduction plate is in close contact with the CPU.

[0007] Furthermore, the first, second, and third radiators are provided with slots on both sides, which are used to engage cooling fans.

[0008] Furthermore, the cooling fans are respectively attached to the outward side of the first and third heat sinks.

[0009] Furthermore, the cooling fans are respectively attached to the cooling air ducts between the first radiator and the second radiator, and between the second radiator and the third radiator.

[0010] Furthermore, a spring is fitted around the outer periphery of the screw, with one end of the spring abutting against the top of the screw and the other end abutting against the upper surface of the heat-conducting plate.

[0011] Furthermore, the mounting mechanism includes a back plate and symmetrically arranged support frames. Each of the four corners of the back plate has an elliptical hole, and each elliptical hole is movably connected to a threaded fitting. The back plate has a second through hole at its center, through which the CPU passes. Each of the two support frames has a first through hole corresponding to the elliptical hole on both sides, and a screw is placed in each first through hole. The screw passes through the first through hole and is threadedly connected to the corresponding threaded fitting. Each of the four corners of the back plate has at least two snap-fit ​​slots on each side. Abutment members for fixing the threaded fittings are installed at the four corners of the back plate. The abutment members have buckles on both sides, which snap into the corresponding snap-fit ​​slots.

[0012] Furthermore, the first radiator, the second radiator, and the third radiator each include a plurality of horizontally arranged heat dissipation fins, and a plurality of heat pipes are threaded through the plurality of heat dissipation fins. The number of heat pipes in the third radiator is equal to the sum of the number of heat pipes in the first radiator and the second radiator. The heat pipes in the third radiator are respectively connected to the heat pipes in the first radiator and the second radiator.

[0013] Furthermore, the width of the third radiator is equal to the sum of the widths of the first radiator and the second radiator.

[0014] Furthermore, the heat-conducting plate includes an upper top plate, and a lower bottom plate that fits against the lower end of the upper top plate. Several corresponding semi-circular holes are provided at the connection between the upper top plate and the lower bottom plate. The several corresponding semi-circular holes are used for heat pipes to pass through, and the heat pipes are tightly fitted with the semi-circular holes.

[0015] Furthermore, a number of heat dissipation fins are evenly distributed on the upper surface of the top plate.

[0016] The beneficial effects of this utility model are:

[0017] This invention, through the parallel arrangement of a first, second, and third radiator and the heat dissipation duct formed by the spacing between them, ensures that airflow can pass smoothly through the radiator, thereby effectively removing heat from the radiator.

[0018] The heatsink quickly absorbs and conducts heat to the radiator, which then dissipates the heat rapidly into the surrounding environment, ensuring that the computer remains at a low and stable temperature even under high load, thus improving the lifespan and performance of the CPU.

[0019] Other features and advantages of this invention will be described in detail in the following detailed description section. Attached Figure Description

[0020] Figure 1 : Overall structural diagram of this utility model.

[0021] Figure 2 : Exploded view of this utility model.

[0022] Figure 3 : Figure 2 Enlarged view of the structure of part A.

[0023] Figure 4 : Figure 2 Enlarged view of the structure of part B.

[0024] Figure 5 : Figure 2 Enlarged view of the structure of part C.

[0025] Figure 6 : Exploded view of the heat-conducting plate of this utility model.

[0026] Figure 7 : Structural diagram of the method of this utility model.

[0027] Figure 8 : Structural diagram of Method 2 of this utility model.

[0028] Figure 9 Top view of this utility model.

[0029] Reference numerals: 1. Heat sink assembly; 2. Heat conduction plate; 3. Mounting mechanism; 4. Screw hole; 5. Screw; 6. Spring; 7. Cooling fan; 8. Heat dissipation duct; 11. First heat sink; 12. Second heat sink; 13. Third heat sink; 14. Slot; 15. Heat dissipation fins; 16. Heat pipe; 21. Top plate; 22. Bottom plate; 23. Semicircular hole; 24. Heat sink fin; 31. Support frame; 32. Back plate; 33. Oval hole; 34. Threaded fitting; 35. Through hole two; 36. Screw; 37. Clip groove; 38. Abutment; 39. Undercut; 40. Through hole one. Detailed Implementation

[0030] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0031] Please refer to Figure 1-9 ;

[0032] A high-efficiency heat dissipation three-tower heat sink includes a heat sink assembly 1 and a heat conduction plate 2. The heat sink assembly 1 includes a first heat sink 11, a second heat sink 12, and a third heat sink 13 arranged at intervals. The first heat sink 11, the second heat sink 12, and the third heat sink 13 are arranged in parallel. The gaps between the first heat sink 11 and the second heat sink 12, and between the second heat sink 12 and the third heat sink 13 respectively form heat dissipation air channels 8 to ensure smooth airflow and effectively remove heat from the heat sink. The heat conduction plate 2 has screw holes 4 at both ends, and screws 5 are embedded in the screw holes 4. The screws 5 are threaded to the mounting mechanism 3. The mounting mechanism 3 is used to fix the heat sink assembly 1 to the motherboard. After the mounting mechanism 3 is installed, the lower end face of the heat conduction plate 2 is in close contact with the upper surface of the CPU. The heat conduction plate 2 quickly absorbs and guides heat to the heat sink, and the heat sink quickly dissipates the heat to the surrounding environment, ensuring that the computer maintains a low temperature and stability when running under high load, thereby improving the lifespan and performance of the CPU.

[0033] In this embodiment, the first heat sink 11, the second heat sink 12 and the third heat sink 13 are provided with slots 14 on both sides, and the slots 14 are used to attach the cooling fan 7.

[0034] Here are two methods for connecting the cooling fan 7 clip to the heatsink;

[0035] Method 1: Cooling fans 7 are respectively attached to the outward side of the first heatsink 11 and the third heatsink 13. The two fans blow air in opposite directions, both blowing outward. This installation method of cooling fans 7 will first guide the airflow to the central second heatsink 12, effectively removing the heat from it. Subsequently, under the action of the two fans, the airflow will continue to spread to both sides. During this process, the airflow will also pass through the first heatsink 11 and the third heatsink 13 respectively, carrying away the heat from the heatsinks on both sides. This method, through bidirectional airflow design, ensures that all heatsinks can receive uniform and efficient cooling, while reducing the retention of hot air between heatsinks and improving the overall heat dissipation performance.

[0036] Method Two: The cooling fans 7 are respectively attached to the cooling air duct 8 between the first heatsink 11 and the second heatsink 12, and between the second heatsink 12 and the third heatsink 13. The two fans blow air in the same direction, both blowing inward. This installation method of the cooling fans 7 establishes a linear airflow path. The fans draw in outside cold air and pass it through the first heatsink 11, the second heatsink 12, and the third heatsink 13 in sequence, and blow it out from the third heatsink 13. This ensures that the airflow can pass through each layer of heat dissipation fins 15 in an orderly and efficient manner. First, it cools the first heatsink 11, and then continues to move forward with gradually increasing heat, cooling the second heatsink 12 and the third heatsink 13 in sequence. Since the airflow starts from the outermost first heatsink 11 and gradually moves inward, it can absorb and carry away the corresponding heat at each stage, and finally exhaust the hot air from the third heatsink 13. This not only improves the heat dissipation efficiency, but also ensures uniform cooling of the entire heat dissipation system, reduces turbulence inside the chassis, and reduces operating noise, providing users with a quiet and efficient cooling solution.

[0037] In this embodiment, a spring 6 is fitted around the outer periphery of the screw 5. One end of the spring 6 abuts against the top of the screw 5, and the other end abuts against the upper surface of the heat-conducting plate 2. Through the action of the spring 6, not only is an elastic buffer provided for the entire mounting structure, but it can also ensure that the heat-conducting plate 2 and the upper surface of the CPU maintain a stable clamping force, realize the adaptive adjustment of the heat-conducting plate 2 and the CPU, and ensure that the heat-conducting plate 2 always maintains the best contact state with the CPU surface, thereby improving the heat conduction efficiency. In addition, the presence of the spring 6 can also absorb and mitigate the vibration and impact generated by the system operation, enhancing the stability and durability of the heat sink.

[0038] In this embodiment, the mounting mechanism 3 includes a back plate 32 and symmetrically arranged support frames 31. Each of the four corners of the back plate 32 has an elliptical hole 33, on which a threaded fitting 34 is movably connected. The center of the back plate 32 has a second through hole 35 for the CPU to pass through. Both sides of the two support frames 31 have first through holes 40 corresponding to the elliptical holes 33, on which screws 36 are placed. The screws 36 pass through the first through holes 40 and are threadedly connected to the corresponding threaded fittings 34. Each of the four corners of the back plate 32 has at least two retaining grooves 37, on which screws for fixing are installed. The threaded assembly 34 has abutment 38 with buckles 39 on both sides. The buckles 39 are respectively engaged in the corresponding slots 37 to restrict the movement of the threaded assembly 34 and fix the threaded assembly 34. Preferably, after the screw 36 is screwed into the threaded assembly 34, the screw 36 will pass through the threaded assembly 34 and connect with the heatsink bracket on the motherboard. Since the position of the threaded hole of the heatsink bracket is different for different motherboard models, and the screw 36 and the threaded assembly 34 of this utility model can be adjusted, the installation flexibility is improved, adapting to motherboards of different sizes and layouts, and ensuring the stability and accuracy of the installation.

[0039] In this embodiment, the first heat sink 11, the second heat sink 12, and the third heat sink 13 each include a plurality of horizontally arranged heat dissipation fins 15, and a plurality of heat pipes 16 are threaded through each of the plurality of heat dissipation fins 15 to enhance heat conduction and heat dissipation efficiency. The number of heat pipes 16 in the third heat sink 13 is equal to the sum of the number of heat pipes 16 in the first heat sink 11 and the second heat sink 12. The heat pipes 16 in the third heat sink 13 are connected to the heat pipes 16 in the first heat sink 11 and the second heat sink 12, respectively, to ensure that heat can be quickly transferred from the CPU to all heat sinks, and to achieve uniform distribution and efficient diffusion of heat among the three heat sinks.

[0040] In this embodiment, the width of the third heat sink 13 is equal to the sum of the widths of the first heat sink 11 and the second heat sink 12 (e.g., ...). Figure 9 As shown, a+b=c), enhances the heat exchange capacity between the first radiator 11 and the second radiator 12 and the third radiator 13, improves the heat dissipation effect, and avoids heat accumulation in the first radiator 11 and the second radiator 12.

[0041] In this embodiment, the heat-conducting plate 2 includes an upper top plate 21, and a lower bottom plate 22 that fits against the lower end of the upper top plate 21. The lower end surface of the lower bottom plate 22 is tightly fitted with the upper surface of the CPU, so that the heat from the CPU can be transferred to the lower bottom plate 22. Several corresponding semi-circular holes 23 are provided at the connection between the upper top plate 21 and the lower bottom plate 22. Specifically, the semi-circular holes 23 of the upper top plate 21 and the semi-circular holes 23 of the lower bottom plate 22 are aligned vertically. The corresponding semi-circular holes 23 are used for the passage of the heat pipe 16, and the heat pipe 16 fits tightly against the semi-circular holes 23. The heat from the lower bottom plate 22 can be transferred to the heat pipe 16 and then to the heat dissipation fins 15, which dissipate heat through the heat dissipation fins 15.

[0042] In addition, the heat from the lower base plate 22 is also transferred to the upper top plate 21. Several heat sinks 24 are evenly distributed on the upper surface of the upper top plate 21. These heat sinks 24 further expand the heat dissipation area, effectively dissipating heat from the upper top plate 21, improving the overall heat dissipation efficiency, and ensuring that heat can be dissipated through multiple paths. This avoids excessive heat accumulation on the lower base plate 22 and the upper top plate 21, which would make it difficult for the CPU to dissipate heat, ensuring stability and performance under high load and extending the lifespan of the hardware.

[0043] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0044] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style of the specification is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other implementations that can be understood by those skilled in the art.

Claims

1. A high-efficiency heat dissipation three-tower radiator, comprising a radiator assembly (1) and a heat-conducting plate (2), wherein the radiator assembly (1) comprises a first radiator (11), a second radiator (12), and a third radiator (13) arranged at intervals, characterized in that, The first heat sink (11), the second heat sink (12) and the third heat sink (13) are parallel structures. The gaps between the first heat sink (11) and the second heat sink (12) and the second heat sink (12) and the third heat sink (13) respectively form heat dissipation air channels (8). The heat conduction plate (2) has screw holes (4) at both ends. Screws (5) are embedded in the screw holes (4) and are threadedly connected to the mounting mechanism (3) through the screws (5). The mounting mechanism (3) is used to fix the heat sink assembly (1) on the motherboard. The lower end face of the heat conduction plate (2) is in close contact with the CPU.

2. The high-efficiency heat dissipation three-tower radiator according to claim 1, characterized in that, The first radiator (11), the second radiator (12) and the third radiator (13) are provided with slots (14) on both sides, and the slots (14) are used to attach cooling fans (7).

3. A high-efficiency heat dissipation three-tower radiator according to claim 2, characterized in that, The cooling fan (7) is respectively attached to the outward side of the first radiator (11) and the third radiator (13).

4. A high-efficiency heat dissipation three-tower radiator according to claim 2, characterized in that, The cooling fan (7) is respectively attached to the cooling air duct (8) between the first radiator (11) and the second radiator (12) and between the second radiator (12) and the third radiator (13).

5. A high-efficiency heat dissipation three-tower radiator according to claim 1, characterized in that, A spring (6) is fitted around the outer periphery of the screw (5). One end of the spring (6) abuts against the top of the screw (5), and the other end abuts against the upper surface of the heat-conducting plate (2).

6. A high-efficiency heat dissipation three-tower radiator according to claim 1, characterized in that, The mounting mechanism (3) includes a back plate (32) and symmetrically arranged support frames (31). Each of the four corners of the back plate (32) has an elliptical hole (33), and each elliptical hole (33) is movably connected to a threaded fitting (34). The back plate (32) has a through hole (35) at its center, through which the CPU passes. Each of the two support frames (31) has a through hole (40) on both sides corresponding to the elliptical holes (33). Each of the four corners of the back plate (32) is provided with at least two snap-fit ​​slots (37). Each of the four corners of the back plate (32) is provided with abutment members (38) for fixing the threaded kit (34). The abutment members (38) are provided with buckles (39) on both sides, and the buckles (39) are snapped into the corresponding snap-fit ​​slots (37).

7. A high-efficiency heat dissipation three-tower radiator according to claim 1, characterized in that, The first radiator (11), the second radiator (12) and the third radiator (13) each include a number of horizontally arranged heat dissipation fins (15), and a number of heat pipes (16) are passed through each of the heat dissipation fins (15). The number of heat pipes (16) of the third radiator (13) is equal to the sum of the number of heat pipes (16) of the first radiator (11) and the second radiator (12). The heat pipes (16) of the third radiator (13) are connected to the heat pipes (16) of the first radiator (11) and the second radiator (12) respectively.

8. A high-efficiency heat dissipation three-tower radiator according to claim 7, characterized in that, The width of the third radiator (13) is equal to the sum of the widths of the first radiator (11) and the second radiator (12).

9. A high-efficiency heat dissipation three-tower radiator according to claim 1, characterized in that, The heat-conducting plate (2) includes an upper top plate (21), and a lower bottom plate (22) is provided at the lower end of the upper top plate (21) to fit with it. Several corresponding semi-circular holes (23) are provided at the connection between the upper top plate (21) and the lower bottom plate (22). The several corresponding semi-circular holes (23) are used for the heat pipe (16) to pass through. The heat pipe (16) is tightly fitted with the semi-circular holes (23).

10. A high-efficiency heat dissipation three-tower radiator according to claim 9, characterized in that, Several heat sinks (24) are evenly distributed on the upper surface of the top plate (21).

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