Bonding conveying device for chip packaging

Abstract

The utility model relates to the technical field of conveying devices, and discloses a bonding conveying device for chip packaging, which comprises a working table, a conveying belt is arranged on the surface of the working table, clamping mechanisms are fixedly connected to two sides of the surface of the working table, two supporting plates are fixedly connected to the edge of one side of the surface of the working table, and the supporting plates are fixedly connected to the edge of the other side of the surface of the working table. And the surface of the supporting plate is fixedly connected with a positioning plate. According to the bonding conveying device for chip packaging, through the arrangement of the cleaning mechanism, when the surface of a bonded chip body is cleaned, a carrier sheet is moved to the position under a banister brush, a driving motor on one side is started, the driving motor drives a lead screw on one side to rotate, and then the carrier sheet is conveyed to the banister brush; and a brush plate in threaded connection with the surface of the screw rod moves left and right on the surface of the screw rod, so that a plurality of banister brushes at the bottom of the brush plate are driven to clean chips and broken lines of a chip main body on a carrier sheet, the later manual removal step is reduced, and the production efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of conveying device technology, and in particular to a bonding conveying device for chip packaging. Background Technology

[0002] Currently, the term "chip" in a broad sense actually refers to packaged chips, which are formed after packaging. Packaged chips mainly consist of a chip base, a chip body, and a chip cover. The chip body is bonded to the chip base with adhesive and then the chip cover is placed on the chip base and finally soldered to form a packaged chip. The main method currently is to use a carrier plate, place the chip base in the slot of the carrier plate, send the carrier plate for bonding, and after bonding, take it back to place the chip cover and then perform the soldering operation.

[0003] Existing bonding and conveying devices for chip packaging may leave debris and broken wires on the chip surface after bonding. In order not to affect subsequent processing, these need to be manually removed, resulting in a waste of human resources. Therefore, a bonding and conveying device for chip packaging is proposed.

[0004] A bonding conveying device for chip packaging, disclosed in publication number CN216597533U, includes a frame, a bonding device, a substrate feeding device, a substrate, and carrier sheets. The substrate feeding device is mounted on the frame for intermittently conveying substrates one by one. The bonding device spans the substrate feeding device. A chip bonding station is provided below the bonding device on the substrate feeding device. A substrate loading station and a substrate unloading station are respectively provided upstream and downstream of the bonding device on the substrate feeding device. Several carrier sheets are mounted on the substrate, and each carrier sheet has several chip substrate placement holes for placing chip substrates. This conveying device can accurately convey carrier sheets containing chip substrates to the bonding area. After bonding is completed, the carrier sheet is unloaded and then proceeds to the next process, automating the bonding production, improving bonding efficiency, saving manpower, and facilitating subsequent soldering.

[0005] While the aforementioned patent achieves the ability to accurately transport the carrier wafer with the chip base to the bonding area, and then unload it after bonding is completed, thus automating the bonding production, improving bonding efficiency, saving manpower, and facilitating subsequent welding, the device is not easy to clamp and fix carrier wafers of different sizes, and uses a pin-type connection, making installation and disassembly cumbersome.

[0006] Therefore, it is necessary to invent a bonding and delivery device for chip packaging to solve the above problems. Utility Model Content

[0007] (a) Technical problems to be solved

[0008] The purpose of this invention is to provide a bonding and conveying device for chip packaging, which solves the problem mentioned in the background art that chip surfaces may have residual debris and broken wires, which need to be manually removed in order not to affect subsequent processing, resulting in a waste of human resources.

[0009] (II) Technical Solution

[0010] To achieve the above objectives, this utility model provides the following technical solution: a bonding and conveying device for chip packaging, comprising a worktable, a conveyor belt mounted on the surface of the worktable, clamping mechanisms fixedly connected to both sides of the worktable surface, two support plates fixedly connected to one edge of the worktable surface, a positioning plate fixedly connected to the surface of the support plates, a motor housing fixedly connected to one side of one of the positioning plates, a cleaning mechanism fixedly connected inside the motor housing, the clamping mechanism comprising hydraulic rods fixedly connected to both sides of the worktable surface, a clamping plate fixedly connected to the end of the hydraulic rods, and a plurality of rotating rollers rotatably connected to the inner wall of the clamping plate; the cleaning mechanism comprising a drive motor fixedly connected inside the motor housing, a lead screw fixedly connected to the output end of the drive motor, a brush plate threadedly connected to the surface of the lead screw, and a plurality of soft brushes fixedly connected to the bottom of the brush plate.

[0011] As a further embodiment of this utility model, a limiting hole is provided on one side of the brush plate, and a limiting rod is slidably connected inside the limiting hole. The limiting rod serves to limit the movement of the brush plate.

[0012] As a further embodiment of this utility model, the lead screw is rotatably connected to the surface of the positioning plate, and a motor box is fixedly connected to one side of the transmission belt. The motor box serves to store the motor.

[0013] As a further embodiment of this utility model, a carrier plate is attached to one side of the rotating roller, and a placement groove is formed on the surface of the carrier plate. The chip body is placed inside the placement groove, and the placement groove serves to place the chip body.

[0014] As a further embodiment of this utility model, a bonding device is fixedly connected to the center of the top surface of the workbench, and a PLC controller is electrically connected to one side of the bonding device via a power line. The PLC controller controls the bonding device.

[0015] As a further embodiment of this utility model, a hydraulic cylinder is electrically connected to one side of the PLC controller via a power line, and a bonding pin is installed at the end of the hydraulic cylinder rod. The bonding pin serves to bond the chip.

[0016] As a further embodiment of this utility model, the bottom of the workbench is provided with four threaded holes, and the internal threads of the threaded holes are connected to threaded posts, which serve to fix the workbench.

[0017] (III) Beneficial Effects

[0018] This utility model provides a bonding and delivery device for chip packaging, which has the following advantages:

[0019] 1. The bonding conveyor for chip packaging, through the setting of the cleaning mechanism, moves the carrier plate directly under the soft brush when cleaning the surface of the chip body after bonding. The drive motor on one side is started, and the drive motor drives the lead screw on one side to rotate. This causes the brush plate threaded on the surface of the lead screw to move left and right on the surface of the lead screw, thereby driving several soft brushes at the bottom of the brush plate to clean the chip body on the carrier plate of debris and broken wires. This reduces the need for manual removal in the later stage and improves production efficiency.

[0020] 2. The bonding conveyor for chip packaging, through the setting of the clamping mechanism, when in use, places the carrier sheet on the conveyor belt, and then activates the hydraulic rods on both sides. The hydraulic rods extend and retract, driving the two clamping plates at the ends to clamp and fix the carrier sheet. The carrier sheet moves on the conveyor belt through several rotating rollers set on the clamping plates, which can ensure that the carrier sheet will not have positional deviation during movement, and can also clamp and fix carrier sheets of different sizes, improving the accuracy of chip body bonding. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0022] Figure 2 This is a schematic diagram of the cleaning mechanism of this utility model;

[0023] Figure 3 This is a schematic diagram of the clamping mechanism of this utility model;

[0024] Figure 4 This is a schematic diagram of the bonding device of this utility model.

[0025] In the diagram: 1. Workbench; 2. Conveyor belt; 3. Clamping mechanism; 301. Hydraulic rod; 302. Clamping plate; 303. Rotating roller; 4. Support plate; 5. Positioning plate; 6. Motor box; 7. Cleaning mechanism; 701. Drive motor; 702. Lead screw; 703. Brush plate; 704. Soft brush; 8. Limit rod; 9. Motor box; 10. Carrier plate; 11. Bonding device; 12. PLC controller; 13. Hydraulic cylinder; 14. Bonding pin; 15. Threaded post; 16. Chip body. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.

[0027] Please see Figures 1 to 4 This utility model provides a technical solution: a bonding and conveying device for chip packaging, including a worktable 1, a conveyor belt 2 mounted on the surface of the worktable 1, and clamping mechanisms 3 fixedly connected to both sides of the surface of the worktable 1. The clamping mechanisms 3 improve the accuracy of the chip body 16 during bonding. Two support plates 4 are fixedly connected to one edge of the surface of the worktable 1, and positioning plates 5 are fixedly connected to the surface of the support plates 4. A motor housing 6 is fixedly connected to one side of one of the positioning plates 5, and a cleaning mechanism 7 is fixedly connected inside the motor housing 6. The cleaning mechanism 7... The arrangement reduces the need for manual removal in the later stages, thus improving production efficiency. The clamping mechanism 3 includes hydraulic rods 301 fixedly connected to both sides of the workbench 1 surface. A clamping plate 302 is fixedly connected to the end of the hydraulic rods 301, and several rotating rollers 303 are rotatably connected to the inner wall of the clamping plate 302. The cleaning mechanism 7 includes a drive motor 701 fixedly connected to the inside of the motor housing 6. A lead screw 702 is fixedly connected to the output end of the drive motor 701. A brush plate 703 is threadedly connected to the surface of the lead screw 702, and several soft brushes 704 are fixedly connected to the bottom of the brush plate 703.

[0028] A limiting hole is provided on one side of the brush plate 703, and a limiting rod 8 is slidably connected inside the limiting hole. The limiting rod 8 serves to limit the position of the brush plate 703.

[0029] The lead screw 702 is rotatably connected to the surface of the positioning plate 5, and a motor box 9 is fixedly connected to one side of the transmission belt 2. The motor box 9 serves to store the motor.

[0030] A carrier plate 10 is attached to one side of the rotating roller 303. A placement groove is provided on the surface of the carrier plate 10. The chip body 16 is placed inside the placement groove. The placement groove serves to place the chip body 16.

[0031] A bonding device 11 is fixedly connected to the center of the top surface of the workbench 1. A PLC controller 12 is electrically connected to one side of the bonding device 11 via a power line. The PLC controller 12 controls the bonding device 11.

[0032] A hydraulic cylinder 13 is electrically connected to one side of the PLC controller 12 via a power line. A bonding pin 14 is installed at the end of the hydraulic cylinder 13. The bonding pin 14 is used to bond the chip.

[0033] The bottom of the worktable 1 has four threaded holes, and the internal threads of the threaded holes are connected to threaded posts 15. The threaded posts 15 serve to fix the worktable 1.

[0034] In this invention, the working steps of the device are as follows:

[0035] First step: When cleaning the surface of the bonded chip body 16, move the carrier plate 10 directly under the soft brush 704, start the drive motor 701 on one side, drive the lead screw 702 on one side to rotate, thereby causing the brush plate 703 threadedly connected to the surface of the lead screw 702 to move left and right on the surface of the lead screw 702, thereby driving several soft brushes 704 at the bottom of the brush plate 703 to clean the chip body 16 on the carrier plate 10 of debris and broken wires;

[0036] The second step: When in use, place the carrier piece 10 on the conveyor belt 2, and then activate the hydraulic rods 301 on both sides. The hydraulic rods 301 extend and retract, driving the two clamping plates 302 at the ends to clamp and fix the carrier piece 10. The carrier piece 10 moves on the conveyor belt 2 through several rotating rollers 303 set on the clamping plates 302. This can ensure that the carrier piece 10 will not have positional deviation during movement, and can also clamp and fix carrier pieces 10 of different sizes.

[0037] It should be noted that the device structure and accompanying drawings of this utility model mainly describe the principle of this utility model. In terms of the technical aspects of this design principle, the setting of the power mechanism, power supply system and control system of the device is not fully described. However, under the premise that those skilled in the art understand the principle of the above utility model, the specific details of its power mechanism, power supply system and control system can be clearly understood. The control method in the application document is automatic control through a controller. The control circuit of the controller can be implemented by those skilled in the art through simple programming.

[0038] All standard parts used can be purchased from the market, and can be customized according to the instructions and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the existing technology. The machinery, parts and equipment adopt conventional models in the existing technology, and the structure and principle of the components known to those skilled in the art can be known by those skilled in the art through technical manuals or conventional experimental methods.

[0039] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A bonding and conveying device for chip packaging, comprising a worktable (1), characterized in that: A conveyor belt (2) is installed on the surface of the workbench (1). Clamping mechanisms (3) are fixedly connected to both sides of the surface of the workbench (1). Two support plates (4) are fixedly connected to one edge of the surface of the workbench (1). A positioning plate (5) is fixedly connected to the surface of the support plate (4). A motor housing (6) is fixedly connected to one side of one of the positioning plates (5). A cleaning mechanism (7) is fixedly connected inside the motor housing (6). The clamping mechanism (3) includes hydraulic rods (301) fixedly connected to both sides of the surface of the workbench (1), and a clamping plate (302) is fixedly connected to the end of the hydraulic rods (301). A plurality of rotating rollers (303) are rotatably connected to the inner wall of the clamping plate (302). The cleaning mechanism (7) includes a drive motor (701) fixedly connected inside the motor housing (6). The output end of the drive motor (701) is fixedly connected to a lead screw (702). A brush plate (703) is threadedly connected to the surface of the lead screw (702). Several soft brushes (704) are fixedly connected to the bottom of the brush plate (703).

2. The bonding and conveying device for chip packaging according to claim 1, characterized in that: A limiting hole is provided on one side of the brush plate (703), and a limiting rod (8) is slidably connected inside the limiting hole.

3. The bonding and conveying device for chip packaging according to claim 1, characterized in that: The lead screw (702) is rotatably connected to the surface of the positioning plate (5), and a motor box (9) is fixedly connected to one side of the transmission belt (2).

4. The bonding and conveying device for chip packaging according to claim 1, characterized in that: A carrier plate (10) is attached to one side of the rotating roller (303). A placement groove is provided on the surface of the carrier plate (10), and a chip body (16) is placed inside the placement groove.

5. The bonding and conveying device for chip packaging according to claim 1, characterized in that: A bonding device (11) is fixedly connected to the center of the top surface of the workbench (1), and a PLC controller (12) is electrically connected to one side of the bonding device (11) via a power line.

6. The bonding and conveying device for chip packaging according to claim 5, characterized in that: A hydraulic cylinder (13) is electrically connected to one side of the PLC controller (12) via a power line, and a bonding pin (14) is installed at the end of the hydraulic cylinder (13).

7. The bonding and conveying device for chip packaging according to claim 1, characterized in that: The bottom of the workbench (1) has four threaded holes, and the threaded holes are internally connected to threaded columns (15).

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