Wafer bearing tool

Abstract

The utility model discloses a wafer bearing tool, which comprises a fixed seat, an adjusting seat, a vacuum adsorption component, a material supporting component, a lifting driving mechanism, an elastic connecting mechanism and a plurality of adjusting screws, wherein the vacuum adsorption part is connected to the adjusting seat and used for adsorbing and fixing a wafer placed on the vacuum adsorption part, and the material supporting part is connected to the adjusting seat in a sliding mode in the vertical direction and has a rising position and a falling position in the sliding process. And the lifting driving mechanism is connected to the adjusting seat and is connected with the material supporting part, and the lifting driving mechanism is used for driving the material supporting part to slide upwards to a lifting position so as to enable the material supporting part to support the wafer on the vacuum adsorption part. According to the utility model, the wafer can be borne and adjusted to be in a horizontal state, the requirement of horizontal adjustment during wafer detection can be met, and the wafer can be vertical to an optical detection lens.

Description

Technical Field

[0001] This utility model relates to a wafer carrier tooling. Background Technology

[0002] Currently, in the wafer fabrication process, wafers need to be placed in tooling and then sent to inspection equipment for defect detection. For example, Chinese patent CN221668781U discloses a wafer defect detection and marking tooling, in which the wafer is placed in a wafer stage for defect detection. In some inspection projects, the wafer needs to be adjusted to a horizontal position so that it is perpendicular to the optical inspection lens. However, some existing tooling cannot perform horizontal adjustment of the wafer, thus failing to meet the horizontal adjustment requirements during wafer inspection. Summary of the Invention

[0003] The technical problem to be solved by this utility model is to overcome the defects of the prior art and provide a wafer carrier fixture that can carry the wafer and adjust the wafer to a horizontal state, which can meet the horizontal adjustment requirements during wafer inspection and thus make the wafer perpendicular to the optical inspection lens.

[0004] To solve the above-mentioned technical problems, the technical solution of this utility model is: a wafer carrier fixture, including a fixed base, an adjusting base, a vacuum adsorption component, a material support component, a lifting drive mechanism, an elastic connection mechanism, and multiple adjusting screws;

[0005] The vacuum adsorption component is connected to the adjustment base and is used to adsorb and fix the wafer placed on the vacuum adsorption component;

[0006] The material support component is slidably connected to the adjusting seat in the vertical direction and has a raised position and a lowered position during the sliding process;

[0007] The lifting drive mechanism is connected to the adjusting seat and connected to the material support component. The lifting drive mechanism is used to drive the material support component to slide upward to the raised position so that the material support component lifts the wafer on the vacuum adsorption component. The lifting drive mechanism is also used to drive the material support component to slide downward to the lowered position so that the wafer on the material support component falls onto the vacuum adsorption component.

[0008] The adjusting seat is elastically pressed and connected to the fixed seat through the elastic connecting mechanism;

[0009] The adjusting screw is threaded onto either the fixed seat or the adjusting seat and abuts against the other of the fixed seat and the adjusting seat. The adjusting screw is used to raise or lower the corresponding end of the adjusting seat relative to the fixed seat during the tightening process, thereby adjusting the horizontal state of the adjusting seat.

[0010] Furthermore, there are three adjusting screws, which are threaded onto the adjusting seat and abut against the fixed seat.

[0011] Further, a specific structure of the elastic connection mechanism is provided, wherein the elastic connection mechanism includes at least one elastic connection component, and the elastic connection component includes a connecting rod component and an elastic component;

[0012] The connecting rod component has a rod portion and a stepped portion;

[0013] The stepped portion is connected to one end of the rod and protrudes radially outward, while the other end of the rod passes through the adjusting seat and is connected to the fixed seat;

[0014] The elastic component is disposed between the stepped portion and the adjusting seat. The elastic component abuts against the stepped portion and the adjusting seat respectively and is used to drive the adjusting seat to press against the fixed seat through elastic force, thereby making the adjusting seat and the fixed seat elastically pressed together.

[0015] Furthermore, the vacuum adsorption component is connected to the adjusting base via at least one column, with the lower end of the column connected to the adjusting base and the vacuum adsorption component connected to the upper end of the column;

[0016] And / or the vacuum adsorption component is a ceramic suction cup.

[0017] Further, a specific structure of the material support component is provided, the material support component including a base plate and a plurality of material support shafts;

[0018] The substrate is located below the vacuum adsorption component;

[0019] The base plate is slidably connected to the adjustment seat in the vertical direction and has a raised position and a lowered position during the sliding process;

[0020] The material support shaft is connected to the substrate, and the vacuum adsorption component is provided with a through hole corresponding to the material support shaft;

[0021] The lifting drive mechanism is connected to the adjustment seat and to the substrate. The lifting drive mechanism is used to drive the substrate to slide upward to the raised position, thereby driving the top of the material support shaft to rise through the through hole and lift the wafer on the vacuum adsorption component. The lifting drive mechanism is also used to drive the substrate to slide downward to the lowered position, thereby driving the top of the material support shaft to descend into the through hole so that the wafer on the material support shaft falls onto the vacuum adsorption component.

[0022] Furthermore, the material support shaft is provided in three parts, and the material support component also includes a height adjustment mechanism corresponding to each of the material support shafts. The material support shaft is connected to the base plate through the corresponding height adjustment mechanism.

[0023] The height adjustment mechanism includes a height adjustment bolt and a set screw;

[0024] The material support shaft is connected to the height adjustment bolt, and the material support shaft is arranged in the vertical direction;

[0025] The height adjustment bolt is threaded onto the substrate. The height adjustment bolt is used to raise or lower the material support shaft relative to the substrate when screwed on, thereby driving the corresponding material support shaft to rise or fall to adjust the height of the material support shaft relative to the substrate.

[0026] The set screw is threaded onto the base plate and is used to press against the height adjustment bolt to lock the position of the height adjustment bolt.

[0027] Further, a specific structure of the lifting drive mechanism is provided, the lifting drive mechanism including an upper wedge block, a lower wedge block and a drive component;

[0028] The lower wedge block is slidably connected to the adjusting seat;

[0029] The upper wedge-shaped block is connected to the base plate;

[0030] The upper wedge block is slidably connected to the lower wedge block along the inclined direction;

[0031] The driving component is connected to the adjusting seat and connected to the lower wedge block. The driving component is used to drive the lower wedge block to move, thereby causing the upper wedge block and the base plate to slide up and down relative to the adjusting seat.

[0032] Furthermore, the vacuum adsorption component is provided with a sensing hole, and an in-situ sensor is connected to the adjustment seat. The in-situ sensor is located below the vacuum adsorption component and aligned with the sensing hole, and is used to detect whether a wafer is placed on the vacuum adsorption component.

[0033] Furthermore, the wafer carrier fixture also includes external components, which include a support, an electrical connector, and a gas supply connector;

[0034] The bracket is connected to the fixed base;

[0035] The gas supply connector is connected to the bracket and is connected to the vacuum adsorption component;

[0036] The electrical connector is connected to the bracket and to the lifting drive mechanism.

[0037] Furthermore, the wafer carrier fixture also includes a cover covering the outside of the adjustment base and the vacuum adsorption component. The cover has an adsorption through hole, and the vacuum adsorption component has a central adsorption plane that protrudes from the adsorption through hole into the cover.

[0038] After adopting the above technical solution, firstly, the lifting drive mechanism drives the material support component to slide upward to the raised position, and the robot arm transports and places the wafer on the material support component. Then, the lifting drive mechanism drives the material support component to slide downward to the lowered position, so that the wafer placed on the material support component falls onto the vacuum adsorption component. Then, the vacuum adsorption component connects to a negative pressure source to adsorb and fix the wafer placed on the vacuum adsorption component, and then the wafer can be inspected for defects. After the inspection is completed, the vacuum adsorption component disconnects the negative pressure source to release the adsorption of the wafer. Then, the lifting drive mechanism drives the material support component to slide upward to the raised position so that the material support component lifts the wafer on the vacuum adsorption component. Then, the robot arm removes the wafer lifted by the material support component, and then the robot arm transports the next wafer and places it on the material support component. Then, the above process is repeated to perform defect inspection on all wafers. The adjusting screws can raise or lower the corresponding end of the adjusting seat relative to the fixed seat by turning them. If the wafer adsorbed and fixed on the vacuum adsorption component is not horizontal, the horizontal state of the adjusting seat can be adjusted by adjusting some or all of the adjusting screws, which in turn can adjust the horizontal state of the vacuum adsorption component, and then adjust the horizontal state of the wafer placed on the vacuum adsorption component, so that the wafer is adjusted to be horizontal and perpendicular to the optical inspection lens, thus meeting the horizontal adjustment requirements during wafer inspection. Attached Figure Description

[0039] Figure 1 This is a schematic diagram of the external structure of the wafer carrier fixture of this utility model;

[0040] Figure 2 This is a schematic diagram of the internal structure of the wafer carrier tooling of this utility model;

[0041] Figure 3 This is an exploded view of the wafer carrier fixture of this utility model.

[0042] Figure 4 This is a schematic diagram of the structure of the fixed base, adjusting base, material support component and lifting drive mechanism of this utility model;

[0043] Figure 5 This is a cross-sectional view of the elastic connection component and adjusting screw of this utility model.

[0044] Figure 6This is a schematic diagram of the structure of the fixing base of this utility model;

[0045] Figure 7 This is a schematic diagram of the structure of the adjusting seat, the material support component, and the lifting drive mechanism of this utility model;

[0046] Figure 8 This is an exploded view of the assembly of the adjusting seat, the material support component, and the lifting drive mechanism of this utility model;

[0047] Figure 9 This is a cross-sectional view of the material support component of this utility model;

[0048] Figure 10 This is a schematic diagram of the structure of the lower wedge block of this utility model;

[0049] Figure 11 This is a schematic diagram of the upper wedge block of this utility model. Detailed Implementation

[0050] To make the contents of this utility model easier to understand, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0051] like Figures 1-11 As shown, a wafer carrier fixture includes a fixed base 1, an adjusting base 2, a vacuum adsorption component 3, a material support component 4, a lifting drive mechanism 5, an elastic connection mechanism, and multiple adjusting screws 6.

[0052] The vacuum adsorption component 3 is connected to the adjustment base 2 and is used to adsorb and fix the wafer placed on the vacuum adsorption component 3;

[0053] The material support component 4 is slidably connected to the adjusting seat 2 in the vertical direction and has a raised position and a lowered position during the sliding process;

[0054] The lifting drive mechanism 5 is connected to the adjusting seat 2 and connected to the material support component 4. The lifting drive mechanism 5 is used to drive the material support component 4 to slide upward to the raised position so that the material support component 4 lifts the wafer on the vacuum adsorption component 3. The lifting drive mechanism 5 is also used to drive the material support component 4 to slide downward to the lowered position so that the wafer on the material support component 4 falls onto the vacuum adsorption component 3.

[0055] The adjusting seat 2 is elastically pressed and connected to the fixed seat 1 through the elastic connecting mechanism;

[0056] The adjusting screw 6 is threaded onto either the fixed seat 1 or the adjusting seat 2 and abuts against the other of the fixed seat 1 and the adjusting seat 2. The adjusting screw 6 is used to raise or lower the corresponding end of the adjusting seat 2 relative to the fixed seat 1 during the screwing process, thereby adjusting the horizontal state of the adjusting seat 2.

[0057] Specifically, firstly, the lifting drive mechanism 5 drives the material support component 4 to slide upward to the raised position, and the robotic arm transports and places the wafer onto the material support component 4. Then, the lifting drive mechanism 5 drives the material support component 4 to slide downward to the lowered position, so that the wafer placed on the material support component 4 falls onto the vacuum adsorption component 3. Then, the vacuum adsorption component 3 connects to a negative pressure source to adsorb and fix the wafer placed on the vacuum adsorption component 3, and then the wafer can be inspected for defects. After the inspection is completed, the vacuum adsorption component 3 disconnects the negative pressure source to release the adsorption of the wafer. Then, the lifting drive mechanism 5 drives the material support component 4 to slide upward to the raised position so that the material support component 4 lifts the wafer on the vacuum adsorption component 3. Then, the robotic arm removes the wafer lifted by the material support component 4, and then the robotic arm transports the next wafer and places it on the material support component 4. Then, the above process is repeated to perform defect inspection on all wafers. More specifically, by turning the adjusting screw 6, the corresponding end of the adjusting seat 2 can be raised or lowered relative to the fixed seat 1. If the wafer adsorbed and fixed on the vacuum adsorption component 3 is not horizontal, by adjusting some or all of the adjusting screws 6, the horizontal state of the adjusting seat 2 can be adjusted, which in turn can adjust the horizontal state of the vacuum adsorption component 3, and thus the horizontal state of the wafer placed on the vacuum adsorption component 3, so that the wafer is adjusted to be horizontal and perpendicular to the optical inspection lens, thus meeting the horizontal adjustment requirements during wafer inspection.

[0058] like Figure 4 , 5 As shown in Figures 7 and 8, there are three adjusting screws 6. The adjusting screws 6 are threadedly connected to the adjusting seat 2 and abut against the fixed seat 1. In this embodiment, the adjusting seat 2 is located above the fixed seat 1. The adjusting seat 2 includes a seat body 7 and a threaded sleeve 8 connected to the seat body 7. The adjusting screws 6 are threadedly connected to the threaded sleeve 8 and abut against the upper surface of the fixed seat 1.

[0059] like Figure 2 , 4 As shown in Figure 5, the elastic connection mechanism includes at least one elastic connection component 9, and the elastic connection component 9 includes a connecting rod portion 11 and an elastic component 10;

[0060] The connecting rod 11 has a rod 11 and a stepped part 12;

[0061] The stepped portion 12 is connected to one end of the rod portion 11 and protrudes radially outward, while the other end of the rod portion 11 passes through the adjusting seat 2 and is connected to the fixed seat 1;

[0062] The elastic component 10 is disposed between the stepped portion 12 and the adjusting seat 2. The elastic component 10 abuts against the stepped portion 12 and the adjusting seat 2 respectively, and is used to drive the adjusting seat 2 to press against the fixed seat 1 through elastic force, thereby making the adjusting seat 2 and the fixed seat 1 elastically pressed together. In this embodiment, the connecting rod portion 11 can be a connecting bolt, the rod portion 11 is the screw of the connecting bolt, the stepped portion 12 is the nut of the connecting bolt, and the elastic component 10 can be a butterfly spring. The butterfly spring is sleeved on the screw, one end of the butterfly spring abuts against the nut, and the other end of the butterfly spring abuts against the adjusting seat 2. In this embodiment, there are 3 elastic connecting components 9. Of course, in some embodiments, there may be 4 or more elastic connecting components 9.

[0063] like Figure 2 , 3 As shown in Figures 4 and 7, the vacuum adsorption component 3 is connected to the adjusting base 2 via at least one column 13. The lower end of the column 13 is connected to the adjusting base 2, and the vacuum adsorption component 3 is connected to the upper end of the column 13. In this embodiment, there are 3 columns 13.

[0064] The vacuum adsorption component 3 is a ceramic suction cup; specifically, the ceramic suction cup is also called a ceramic microporous suction cup or a microporous ceramic vacuum suction cup, and its specific structure is a prior art well known to those skilled in the art.

[0065] like Figure 3 , 4 As shown in 7, 8, and 9, the material support component 4 may include a base plate 14 and a plurality of material support shafts 15;

[0066] The substrate 14 is disposed below the vacuum adsorption component 3;

[0067] The base plate 14 is slidably connected to the adjusting seat 2 in the vertical direction and has a raised position and a lowered position during the sliding process;

[0068] The material support shaft 15 is connected to the substrate 14, and the vacuum adsorption component 3 is provided with a through hole 16 corresponding to the material support shaft 15.

[0069] The lifting drive mechanism 5 is connected to the adjusting base 2 and to the substrate 14. The lifting drive mechanism 5 is used to drive the substrate 14 to slide upward to the raised position, thereby driving the top of the material support shaft 15 to rise through the through hole 16 and lift the wafer on the vacuum adsorption component 3. The lifting drive mechanism 5 is also used to drive the substrate 14 to slide downward to the lowered position, thereby driving the top of the material support shaft 15 to descend into the through hole 16 so that the wafer on the material support shaft 15 falls onto the vacuum adsorption component 3. In this embodiment, the substrate 14 can be slidably connected to the adjusting base 2 in the vertical direction via guide posts and guide sleeves 17.

[0070] like Figure 3 , 4 As shown in Figures 7, 8, and 9, there are three material support shafts 15. The material support component 4 also includes a height adjustment mechanism that corresponds to each of the material support shafts 15. The material support shafts 15 are connected to the base plate 14 through the corresponding height adjustment mechanism.

[0071] The height adjustment mechanism may include a height adjustment bolt 18 and a set screw 19;

[0072] The material support shaft 15 is connected to the height adjustment bolt 18, and the material support shaft 15 is arranged in a vertical direction;

[0073] The height adjustment bolt 18 is threaded onto the base plate 14. The height adjustment bolt 18 is used to raise or lower relative to the base plate 14 when screwed, thereby driving the corresponding material support shaft 15 to rise and fall to adjust the height of the material support shaft 15 relative to the base plate 14.

[0074] The set screw 19 is threaded onto the substrate 14 and is used to abut against the height adjustment bolt 18 to lock the position of the height adjustment bolt 18. Specifically, in this embodiment, the wafer on the vacuum adsorption component 3 is lifted by the top of the support shaft 15. The tops of the three support shafts 15 can form a plane. By adjusting the height of each support shaft 15 relative to the substrate 14, the plane formed by the tops of the three support shafts 15 can be adjusted to a horizontal state. Thus, when the top of the support shaft 15 lifts the wafer, the wafer is also in a horizontal state. Therefore, when the substrate 14 and the support shaft 15 move up and down, the wafer on the support shaft 15 can always remain in a horizontal state, preventing the wafer from shifting during the lifting and lowering process.

[0075] like Figure 7 , 8 As shown in Figures 10 and 11, the lifting drive mechanism 5 may include an upper wedge block 20, a lower wedge block 21, and a drive component 22;

[0076] The lower wedge block 21 is slidably connected to the adjusting seat 2;

[0077] The upper wedge block 20 is connected to the base plate 14;

[0078] The upper wedge block 20 is slidably connected to the lower wedge block 21 along the inclined direction;

[0079] The driving component 22 is connected to the adjusting seat 2 and to the lower wedge block 21. The driving component 22 is used to drive the lower wedge block 21 to move, thereby causing the upper wedge block 20 and the base plate 14 to slide up and down relative to the adjusting seat 2. In this embodiment, the lower wedge block 21 is slidably connected to the adjusting seat 2 in the horizontal direction via a first guide rail 23, and the upper wedge block 20 is slidably connected to the lower wedge block 21 in the inclined direction via a second guide rail 24. Both the first guide rail 23 and the second guide rail 24 can be cross ball bearing guide rails. When the lower wedge block 21 is driven to move in the horizontal direction, it can drive the upper wedge block 20 to move up and down, thereby driving the base plate 14 to move up and down. In this embodiment, the driving component 22 can be a through-type lead screw motor. Of course, in some embodiments, the driving component 22 can also be an electric push rod or a cylinder.

[0080] like Figure 1 , 2 As shown in Figures 3, 4, and 7, the vacuum adsorption component 3 is provided with a sensing hole 25, and the adjustment base 2 is connected to an in-situ sensor 26. The in-situ sensor 26 is located below the vacuum adsorption component 3 and aligned with the sensing hole 25, and is used to detect whether a wafer is placed on the vacuum adsorption component 3. In this embodiment, the in-situ sensor 26 can be a laser diffuse reflection sensor, and the in-situ sensor 26 is connected to the adjustment base 2 through a mounting block.

[0081] Specifically, firstly, the lifting drive mechanism 5 drives the substrate 14 to slide upward to the raised position, thereby causing the top of the material support shaft 15 to rise and pass through the through hole 16. At this time, the top of the material support shaft 15 is higher than the upper surface of the vacuum adsorption component 3. Then, the robot arm transports the wafer and places it on the top of the material support shaft 15. Then, the lifting drive mechanism 5 drives the substrate 14 to slide downward to the lowered position, thereby causing the top of the material support shaft 15 to descend and retract into the through hole 16 so that the wafer on the material support shaft 15 falls onto the vacuum adsorption component 3. At this time, the in-situ sensor 26 detects that a wafer is placed on the vacuum adsorption component 3 and sends a signal. Then, the vacuum adsorption component 3 connects to a negative pressure source to adsorb and fix the wafer placed on the vacuum adsorption component 3. Then, defect detection can be performed on the wafer. After the inspection is completed, the vacuum adsorption component 3 disconnects the negative pressure source to release the adsorption of the wafer. Then, the lifting drive mechanism 5 drives the substrate 14 to slide upward to the raised position, thereby driving the top of the material support shaft 15 to rise through the through hole 16 and lift the wafer on the vacuum adsorption component 3. Then, the robot arm takes away the wafer lifted by the material support shaft 15 and moves the next wafer to the material support component 4. The above process is repeated to perform defect inspection on all wafers. In this embodiment, the wafer on the vacuum adsorption component 3 can be adjusted to a horizontal state, and the height of each material support shaft 15 can be adjusted individually. The overall structure is simple, lightweight, small in size, space-saving, easy to maintain, and low in maintenance cost. Therefore, the motion load of the motion platform used to carry the wafer support fixture of this embodiment is small, so the size of the motion platform can be designed to be smaller, and the economic cost of the selection of motors and other accessories used in the motion platform is lower.

[0082] like Figures 2-6 As shown, the wafer carrier fixture may also include external components, which may include a bracket, an electrical connector 27, and an air supply connector 28.

[0083] The bracket is connected to the fixed base 1;

[0084] The gas supply connector 28 is connected to the bracket and to the vacuum adsorption component 3, so that the vacuum adsorption component 3 can be connected to an external negative pressure source through the gas supply connector 28.

[0085] The electrical connector 27 is connected to the bracket and to the lifting drive mechanism 5 so as to supply power and transmit signals to the through-type lead screw motor in the lifting drive mechanism 5 through the electrical connector 27. The electrical connector 27 is also connected to the in-situ sensor 26 so that the in-situ sensor 26 can transmit signals through the electrical connector 27.

[0086] like Figures 1-3 As shown, the wafer carrier fixture may further include a cover 29 covering the outside of the adjusting base 2 and the vacuum adsorption component 3. The cover 29 is provided with an adsorption through hole 30, and the vacuum adsorption component 3 is provided with a central adsorption plane 31, which protrudes from the adsorption through hole 30 into the cover 29. In this embodiment, the vacuum adsorption component 3 is also provided with an edge support portion 32, and the cover 29 is supported on the edge support portion 32.

[0087] In summary, firstly, the lifting drive mechanism 5 drives the material support component 4 to slide upwards to the raised position, where a robotic arm transports and places the wafer onto the material support component 4. Then, the lifting drive mechanism 5 drives the material support component 4 to slide downwards to the lowered position, allowing the wafer placed on the material support component 4 to fall onto the vacuum adsorption component 3. The vacuum adsorption component 3 then connects to a negative pressure source to adsorb and fix the wafer placed on it, allowing for defect detection. After the detection is completed, the vacuum adsorption component 3 disconnects the negative pressure source to release the wafer from adsorption. Then, the lifting drive mechanism 5 drives the material support component 4 to slide upwards to the raised position, lifting the wafer from the vacuum adsorption component 3. The robotic arm then removes the wafer lifted by the material support component 4, and the robotic arm transports the next wafer and places it on the material support component 4. This process is repeated to perform defect detection on all wafers. The adjusting screw 6 can raise or lower the corresponding end of the adjusting seat 2 relative to the fixed seat 1 by turning it. If the wafer adsorbed and fixed on the vacuum adsorption component 3 is not horizontal, the horizontal state of the adjusting seat 2 can be adjusted by adjusting some or all of the adjusting screws 6, which in turn can adjust the horizontal state of the vacuum adsorption component 3, and thus adjust the horizontal state of the wafer placed on the vacuum adsorption component 3, so that the wafer is adjusted to be horizontal and perpendicular to the optical inspection lens, thus meeting the horizontal adjustment requirements during wafer inspection.

[0088] The specific embodiments described above further illustrate the technical problems, technical solutions, and beneficial effects of this utility model. It should be understood that the above descriptions are merely specific embodiments of this utility model and are not intended to limit this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A wafer carrier fixture, characterized in that, It includes a fixed base (1), an adjusting base (2), a vacuum adsorption component (3), a material support component (4), a lifting drive mechanism (5), an elastic connection mechanism, and multiple adjusting screws (6); The vacuum adsorption component (3) is connected to the adjustment seat (2) and is used to adsorb and fix the wafer placed on the vacuum adsorption component (3); The material support component (4) is slidably connected to the adjusting seat (2) in the vertical direction and has a raised position and a lowered position during the sliding process; The lifting drive mechanism (5) is connected to the adjusting seat (2) and connected to the material support component (4). The lifting drive mechanism (5) is used to drive the material support component (4) to slide upward to the raised position so that the material support component (4) lifts the wafer on the vacuum adsorption component (3). The lifting drive mechanism (5) is also used to drive the material support component (4) to slide downward to the lowered position so that the wafer on the material support component (4) falls onto the vacuum adsorption component (3). The adjusting seat (2) is elastically pressed and connected to the fixed seat (1) through the elastic connecting mechanism; The adjusting screw (6) is threaded onto either the fixed seat (1) or the adjusting seat (2) and abuts against the other of the fixed seat (1) and the adjusting seat (2). The adjusting screw (6) is used to drive the corresponding end of the adjusting seat (2) to rise or fall relative to the fixed seat (1) during the screwing process, thereby adjusting the horizontal state of the adjusting seat (2).

2. The wafer carrier fixture according to claim 1, characterized in that, There are three adjusting screws (6), which are threaded onto the adjusting seat (2) and abut against the fixed seat (1).

3. The wafer carrier fixture according to claim 1, characterized in that, The elastic connection mechanism includes at least one elastic connection component (9), which includes a connecting rod (11) and an elastic component (10). The connecting rod (11) has a rod (11) and a step (12). The stepped portion (12) is connected to one end of the rod portion (11) and protrudes outward in the radial direction. The other end of the rod portion (11) passes through the adjusting seat (2) and is connected to the fixed seat (1). The elastic component (10) is disposed between the step portion (12) and the adjusting seat (2). The elastic component (10) abuts against the step portion (12) and the adjusting seat (2) respectively and is used to drive the adjusting seat (2) to press against the fixed seat (1) by elastic force, thereby making the adjusting seat (2) and the fixed seat (1) elastically pressed together.

4. The wafer carrier fixture according to claim 1, characterized in that, The vacuum adsorption component (3) is connected to the adjustment seat (2) by at least one column (13), the lower end of the column (13) is connected to the adjustment seat (2), and the vacuum adsorption component (3) is connected to the upper end of the column (13). And / or the vacuum adsorption component (3) is a ceramic suction cup.

5. The wafer carrier fixture according to claim 1, characterized in that, The material support component (4) includes a base plate (14) and multiple material support shafts (15). The substrate (14) is located below the vacuum adsorption component (3); The base plate (14) is slidably connected to the adjusting seat (2) in the vertical direction and has a raised position and a lowered position during the sliding process; The material support shaft (15) is connected to the substrate (14), and the vacuum adsorption component (3) is provided with a through hole (16) corresponding to the material support shaft (15). The lifting drive mechanism (5) is connected to the adjustment seat (2) and connected to the substrate (14). The lifting drive mechanism (5) is used to drive the substrate (14) to slide upward to the raised position, thereby driving the top of the material support shaft (15) to rise through the through hole (16) and lift the wafer on the vacuum adsorption component (3). The lifting drive mechanism (5) is also used to drive the substrate (14) to slide downward to the lowered position, thereby driving the top of the material support shaft (15) to descend into the through hole (16) so that the wafer on the material support shaft (15) falls onto the vacuum adsorption component (3).

6. The wafer carrier fixture according to claim 5, characterized in that, The material support shaft (15) is provided in three parts. The material support component (4) also includes a height adjustment mechanism corresponding to the material support shaft (15). The material support shaft (15) is connected to the base plate (14) through the corresponding height adjustment mechanism. The height adjustment mechanism includes a height adjustment bolt (18) and a set screw (19). The material support shaft (15) is connected to the height adjustment bolt (18), and the material support shaft (15) is arranged in the vertical direction; The height adjustment bolt (18) is threaded onto the base plate (14). The height adjustment bolt (18) is used to raise or lower relative to the base plate (14) when screwed, thereby driving the corresponding material support shaft (15) to rise or fall to adjust the height of the material support shaft (15) relative to the base plate (14). The set screw (19) is threaded onto the base plate (14) and is used to abut against the height adjustment bolt (18) to lock the position of the height adjustment bolt (18).

7. The wafer carrier fixture according to claim 5, characterized in that, The lifting drive mechanism (5) includes an upper wedge block (20), a lower wedge block (21), and a drive component (22). The lower wedge block (21) is slidably connected to the adjusting seat (2); The upper wedge block (20) is connected to the base plate (14); The upper wedge block (20) is slidably connected to the lower wedge block (21) along the inclined direction; The driving component (22) is connected to the adjusting seat (2) and connected to the lower wedge block (21). The driving component (22) is used to drive the lower wedge block (21) to move, thereby causing the upper wedge block (20) and the base plate (14) to slide up and down relative to the adjusting seat (2).

8. The wafer carrier fixture according to claim 1, characterized in that, The vacuum adsorption component (3) is provided with a sensing hole (25), and the adjustment seat (2) is connected to an in-situ sensor (26). The in-situ sensor (26) is located below the vacuum adsorption component (3) and aligned with the sensing hole (25) and is used to detect whether a wafer is placed on the vacuum adsorption component (3).

9. The wafer carrier fixture according to claim 1, characterized in that, It also includes external components, which include a bracket, an electrical connector (27), and a gas supply connector (28). The bracket is connected to the fixed base (1); The gas supply connector (28) is connected to the bracket and connected to the vacuum adsorption component (3); The electrical connector (27) is connected to the bracket and to the lifting drive mechanism (5).

10. The wafer carrier fixture according to claim 1, characterized in that, It also includes a cover (29) covering the outside of the adjustment seat (2) and the vacuum adsorption component (3), the cover (29) having an adsorption through hole (30), the vacuum adsorption component (3) having a central adsorption plane (31), the central adsorption plane (31) being exposed from the adsorption through hole (30) in the cover (29).

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