Improved ground wire chemical gold skip plating structure

Abstract

The utility model relates to the technical field of circuit boards, and discloses an improved ground wire chemical gold skip plating structure which comprises a fixed bottom plate, a chemical gold bonding pad is arranged on the inner wall of the fixed bottom plate, a fixed top plate is fixedly connected to the upper surface of the fixed bottom plate, and a second sliding plate is slidably connected to the outer wall of the fixed top plate. A second sliding plate is arranged in the fixed bottom plate, a limiting assembly is arranged in the second sliding plate and used for limiting the circuit board, a first sliding plate is slidably connected to the inner wall of the fixed bottom plate, and a fixing assembly is arranged on the outer wall of the first sliding plate and used for fixing the circuit board; the fixing assembly comprises a supporting base. According to the utility model, the ground wire area can be reduced, the occupied area is reduced, the contact resistance is reduced, a stable fixing structure is adopted, the gold plating and skip plating bonding pad can be connected with a circuit board more firmly, and the electrical performance, the mechanical stability and the overall reliability are greatly improved.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to an improved grounding gold plating structure. Background Technology

[0002] The circuit board ground is a critical component, primarily used to provide signal reference voltage, reduce electromagnetic interference, and ensure stable electrical connections between electronic components. The design of the ground directly affects the circuit's performance and reliability, therefore it must possess good conductivity and low impedance. In this process, the use of electroless gold plating is crucial because it provides high-quality electrical connections through the gold plating layer, reduces contact resistance, enhances oxidation resistance, and prevents signal attenuation and distortion. Electroless gold plating not only improves the reliability of electrical connections but also optimizes the overall performance of the ground, enabling the circuit board to maintain stability in high-frequency and high-current applications, thereby ensuring the normal operation of equipment under various working conditions.

[0003] In traditional electroless gold plating grounding structures, the electroless gold pads are typically placed in critical locations on the circuit board, with a pad area to ground area ratio of 1:1500, providing connection points for electronic components. The smaller pad area helps reduce material costs, while the relatively larger ground area ensures good electrical grounding and heat dissipation. This structure allows for multiple ground connections, reducing contact resistance and improving signal integrity. The small pad area effectively saves space on the circuit board, while the extensive distribution of ground lines effectively suppresses noise and interference, enhancing the stability and reliability of the entire circuit. In practical applications, the successful implementation of this design relies on accurate layout and good soldering processes to ensure optimal electrical performance and mechanical strength.

[0004] In traditional ground wire electroplating structures, the ratio of pad area to ground wire area is 1:1500. This can lead to ground wire finger skipping (missed plating) during electroplating. At the same time, it is difficult to provide stable mechanical fixation for the circuit board, making the circuit board more prone to loosening or falling off under external impact or vibration. Utility Model Content

[0005] To overcome the above shortcomings, this utility model provides an improved ground wire gold plating skip structure, which aims to improve the problem of ground wire finger skipping (missed plating) during gold plating in the traditional ground wire gold plating skip structure due to the limited ground wire area, as well as the problem of the circuit board loosening or falling off under external impact or vibration.

[0006] To achieve the above objectives, this utility model provides the following technical solution: an improved grounding gold plating structure, comprising a fixed base plate, wherein the inner wall of the fixed base plate is provided with gold plating pads, a fixed top plate is fixedly connected to the upper surface of the fixed base plate, a sliding plate two is slidably connected to the outer wall of the fixed top plate, a limiting component is provided inside the sliding plate two, the limiting component is used to limit the circuit board, a sliding plate one is slidably connected to the inner wall of the fixed base plate, and a fixing component is provided on the outer wall of the sliding plate one, the fixing component is used to fix the circuit board;

[0007] The fixing component includes a support base, one side of the outer wall of the support base is fixedly connected to the outer wall of the sliding plate, the inner thread of the sliding plate is connected to a screw rod, the bottom of the screw rod is rotatably connected to an L-shaped pressure plate, and the upper surface of the L-shaped pressure plate is fixedly connected to a guide rod.

[0008] Furthermore, the limiting assembly includes a screw rod, the outer wall of which is threadedly connected to the interior of the sliding plate, a limiting plate is rotatably connected to the bottom of the screw rod, and a guide rod is fixedly connected to the upper surface of the limiting plate.

[0009] Furthermore, a connecting plate is fixedly connected to one end of both sliding plate one and sliding plate two. A guide plate is fixedly connected to the upper surface of the connecting plate. A sliding block is fixedly connected to the upper surface of the guide plate. A lead screw is threaded into the sliding block. A bearing is fixedly connected to the bottom of the lead screw. A C-shaped anti-slip fixing seat is fixedly connected to the outer wall of the bearing. An auxiliary component is provided at one end of both sliding plate one and sliding plate two. The auxiliary component is used to assist sliding plate one and sliding plate two in moving.

[0010] Furthermore, the auxiliary component includes a sliding seat, the outer wall of which is fixedly connected to one end of the first sliding plate and the second sliding plate, and a guide rail is slidably connected inside the sliding seat.

[0011] Furthermore, the outer wall of the guide rod is slidably connected to the inside of the sliding plate, and the guide rod is used to guide the movement of the L-shaped pressure plate.

[0012] Furthermore, the outer wall of the guide rod is slidably connected to the inside of the sliding plate two, and the guide rod is used to guide the movement of the limiting plate.

[0013] Furthermore, the outer wall of the guide rail is fixedly connected to the outer walls of the fixed base plate and the fixed top plate, and the guide rail is used to guide the sliding seat.

[0014] Furthermore, the bottom of the C-shaped anti-slip fixing seat is attached to the upper surface of the fixed base plate and the fixed top plate, and the C-shaped anti-slip fixing seat is used to fix the sliding plate one and the sliding plate two.

[0015] This utility model has the following beneficial effects:

[0016] 1. In this utility model, the blind holes and buried holes inside the electroless gold plating pads allow the ground wires to be arranged in a network pattern, reducing the ground wire area ratio to less than 1:1500. In addition, the drive screw two, together with the screw one, guide rod, support base, and drive L-shaped pressure plate and limiting plate, fix the circuit board. This solves the problem of ground wire finger skipping (missed plating) during electroless gold plating due to limited ground wire area, and the problem of the circuit board loosening or falling off under external impact or vibration. It achieves the goal of reducing the ground wire area while reducing the footprint, reducing contact resistance, and providing a stable fixing structure. The electroless gold plating pads can be more firmly connected to the circuit board, greatly improving electrical performance, mechanical stability, and overall reliability.

[0017] 2. In this utility model, firstly, guided by the sliding seat and the guide rail, the sliding plate one and the sliding plate two are driven to slide on the inner walls of the fixed base plate and the fixed top plate in conjunction with the connecting plate. Then, the driving screw rotates inside the sliding block, and then, in conjunction with the bearing and the guide plate, the C-shaped anti-slip fixing seat slides inside the sliding block, so that the C-shaped anti-slip fixing seat fits against the upper surface of the fixed base plate and the fixed top plate to achieve fixation. This allows for adjustment according to the size of the circuit board, reduces the need for changes in welding and connection processes during production, and improves overall productivity. Attached Figure Description

[0018] Figure 1 This is a three-dimensional structural diagram of the improved grounding gold plating structure proposed in this utility model.

[0019] Figure 2 This is a schematic diagram of one side of the fixed base plate structure of the improved grounding gold plating structure proposed in this utility model.

[0020] Figure 3 This is a schematic diagram of the internal structure of the sliding plate of the improved grounding gold plating structure proposed in this utility model.

[0021] Figure 4 This is a schematic diagram of the internal structure of the fixed base plate of the improved grounding gold plating structure proposed in this utility model.

[0022] Legend:

[0023] 1. Fixed base plate; 2. Electroplating pad; 3. Fixed top plate; 4. Screw 1; 5. Limiting plate; 6. Guide rod; 7. Sliding plate 1; 8. Support base; 9. Screw 2; 10. L-shaped pressure plate; 11. Guide rod; 12. Connecting plate; 13. Guide plate; 14. Sliding block; 15. Lead screw; 16. Bearing; 17. C-shaped anti-slip fixing seat; 18. Sliding seat; 19. Guide rail; 20. Sliding plate 2. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] Reference Figure 1 - Figure 3 An embodiment of this utility model provides an improved grounding gold plating structure, including a fixed base plate 1, a gold plating pad 2 provided on the inner wall of the fixed base plate 1, a fixed top plate 3 fixedly connected to the upper surface of the fixed base plate 1, a sliding plate 20 slidably connected to the outer wall of the fixed top plate 3, a limiting component provided inside the sliding plate 20 for limiting the circuit board, a sliding plate 7 slidably connected to the inner wall of the fixed base plate 1, and a fixing component provided on the outer wall of the sliding plate 7 for fixing the circuit board;

[0026] The fixing assembly includes a support base 8, one side of which is fixedly connected to the outer wall of a sliding plate 7. A screw 9 is threadedly connected inside the sliding plate 7. An L-shaped pressure plate 10 is rotatably connected to the bottom of the screw 9. A guide rod 11 is fixedly connected to the upper surface of the L-shaped pressure plate 10. Pulling the sliding plate 7 along the inner wall of the fixed base plate 1 moves the support base 8 below the circuit board, supporting the circuit board. Then, the screw 9 is driven to rotate inside the sliding plate 7. The engagement between the screw 9 and the sliding plate 7 causes the L-shaped pressure plate 10 to slide inside the sliding plate 7 as it rotates. During the process, the L-shaped pressure plate 10 is guided by the guide rod 11 to prevent it from shifting during movement. The limiting component includes a screw 4, the outer wall of which is threadedly connected to the inside of the sliding plate 20. The bottom of the screw 4 is rotatably connected to a limiting plate 5. The upper surface of the limiting plate 5 is fixedly connected to a guide rod 6, which drives the screw 4 to rotate inside the sliding plate 20. The screw 4 and the sliding plate 20 are threaded together, so that when the screw 4 rotates, it drives the limiting plate 5 to move up and down, so that the limiting plate 5 moves to one side of the circuit board. Thus, the limiting plate 5 limits the two sides of the circuit board. During this process, the movement of the limiting plate 5 is guided by the guide rod 6.

[0027] Reference Figure 1 and Figure 4Both sliding plate 7 and sliding plate 20 have a connecting plate 12 fixedly connected to one end. A guide plate 13 is fixedly connected to the upper surface of the connecting plate 12, and a sliding block 14 is fixedly connected to the upper surface of the guide plate 13. A lead screw 15 is threaded into the sliding block 14, and a bearing 16 is fixedly connected to the bottom of the lead screw 15. A C-shaped anti-slip fixing seat 17 is fixedly connected to the outer wall of the bearing 16. When sliding plate 7 and sliding plate 20 move, they will drive the sliding block 14 to move between the fixed base plate 1 and the fixed top plate through the connecting plate 12 and the guide plate 13. The upper surface of plate 3 slides, and then the lead screw 15 is driven to rotate inside the sliding block 14. Due to the threaded relationship between the sliding block 14 and the lead screw 15, when the lead screw 15 rotates, the bearing 16 assists in driving the C-shaped anti-slip fixing seat 17 to slide inside the sliding block 14. This causes the C-shaped anti-slip fixing seat 17 to adhere to the upper surfaces of the fixed base plate 1 and the fixed top plate 3, thereby fixing the moved sliding plate 1 7 and sliding plate 20. Each end of sliding plate 1 7 and sliding plate 20 is equipped with an auxiliary component. The component assists in the movement of sliding plate 7 and sliding plate 20. The auxiliary component includes a sliding seat 18, the outer wall of which is fixedly connected to one end of sliding plate 7 and sliding plate 20. A guide rail 19 is slidably connected inside the sliding seat 18. When sliding plate 7 and sliding plate 20 move, the sliding seat 18 slides along the outer wall of the guide rail 19. During this process, the guide rail 19 guides the sliding seat 18, thereby guiding sliding plate 7 and sliding plate 20. The outer wall of the guide rod 11 is slidably connected to the outer wall of sliding plate 7. Inside 7, guide rod 11 is used to guide the movement of L-shaped pressure plate 10; the outer wall of guide rod 6 is slidably connected to the inside of sliding plate 20; guide rod 6 is used to guide the movement of limiting plate 5; the outer wall of guide rail 19 is fixedly connected to the outer walls of fixed base plate 1 and fixed top plate 3; guide rail 19 is used to guide sliding seat 18; the bottom of C-shaped anti-slip fixing seat 17 is attached to the upper surface of fixed base plate 1 and fixed top plate 3; C-shaped anti-slip fixing seat 17 is used to fix sliding plate 7 and sliding plate 20.

[0028] Working principle: When the grounding gold plating structure is required, first place the circuit board above the gold plating pad 2 at the designated position. Then, pull the sliding plate 7 and the sliding plate 20 to slide on the inner wall of the fixed base plate 1 and the fixed top plate 3. During this process, the sliding plate 7 and the sliding plate 20 are guided by the sliding seat 18 and the guide rail 19, so that the support base 8 moves to the bottom of the circuit board. The support base 8 supports the circuit board. Then, drive the screw 15 to rotate inside the sliding block 14, thereby cooperating with the bearing 16 to drive the C-shaped anti-slip fixing seat 17 to slide inside the sliding block 14, thereby driving the bearing 16 to fit against the upper surface of the fixed base plate 1, thus fixing the sliding plate 7. Then, drive the screw 9 to rotate inside the sliding plate 7, and cooperate with the guide rod 11 to press down and fix the outer edge of the circuit board with the L-shaped pressure plate 10.

[0029] In addition, the drive screw 4 rotates inside the sliding plate 20, thereby adjusting the height of the limiting plate 5 in conjunction with the guide rod 6. This process, in conjunction with the movement of the sliding plate 20, causes the limiting plate 5 to fit against the outer wall of the circuit board, thereby limiting the position and preventing the circuit board from shifting during soldering.

[0030] Finally, due to the pre-set blind and buried vias inside the metallized pad 2, the ratio of pad area to ground area is less than 1:1500. At the same time, the ground line can be networked, further reducing the ground line area and the footprint.

[0031] Finally, it should be noted that the above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An improved grounding gold plating structure, comprising a fixed base plate (1), characterized in that: The inner wall of the fixed base plate (1) is provided with a gold-plating pad (2), the upper surface of the fixed base plate (1) is fixedly connected to a fixed top plate (3), the outer wall of the fixed top plate (3) is slidably connected to a sliding plate two (20), the sliding plate two (20) is provided with a limiting component inside, the limiting component is used to limit the circuit board, the inner wall of the fixed base plate (1) is slidably connected to a sliding plate one (7), the outer wall of the sliding plate one (7) is provided with a fixing component, the fixing component is used to fix the circuit board; The fixing component includes a support base (8), one side of the outer wall of the support base (8) is fixedly connected to the outer wall of the sliding plate (7), the inner thread of the sliding plate (7) is connected to a screw (9), the bottom of the screw (9) is rotatably connected to an L-shaped pressure plate (10), and the upper surface of the L-shaped pressure plate (10) is fixedly connected to a guide rod (11).

2. The improved grounding gold plating structure according to claim 1, characterized in that: The limiting assembly includes a screw (4), the outer wall of which is threadedly connected to the inside of the sliding plate (20), the bottom of which is rotatably connected to a limiting plate (5), and a guide rod (6) is fixedly connected to the upper surface of the limiting plate (5).

3. The improved grounding gold plating structure according to claim 2, characterized in that: One end of each of the sliding plate 1 (7) and the sliding plate 2 (20) is fixedly connected to a connecting plate (12). A guide plate (13) is fixedly connected to the upper surface of the connecting plate (12). A sliding block (14) is fixedly connected to the upper surface of the guide plate (13). A lead screw (15) is threaded into the sliding block (14). A bearing (16) is fixedly connected to the bottom of the lead screw (15). A C-shaped anti-slip fixing seat (17) is fixedly connected to the outer wall of the bearing (16). An auxiliary component is provided at one end of each of the sliding plate 1 (7) and the sliding plate 2 (20). The auxiliary component is used to assist the sliding plate 1 (7) and the sliding plate 2 (20) in moving.

4. The improved grounding gold plating structure according to claim 3, characterized in that: The auxiliary component includes a sliding seat (18), the outer wall of which is fixedly connected to one end of the sliding plate one (7) and the sliding plate two (20), and a guide rail (19) is slidably connected inside the sliding seat (18).

5. The improved grounding gold plating structure according to claim 1, characterized in that: The outer wall of the guide rod (11) is slidably connected to the inside of the sliding plate (7), and the guide rod (11) is used to guide the movement of the L-shaped pressure plate (10).

6. The improved grounding gold plating structure according to claim 4, characterized in that: The outer wall of the guide rod (6) is slidably connected to the inside of the sliding plate (20), and the guide rod (6) is used to guide the movement of the limiting plate (5).

7. The improved grounding gold plating structure according to claim 4, characterized in that: The outer wall of the guide rail (19) is fixedly connected to the outer walls of the fixed base plate (1) and the fixed top plate (3), and the guide rail (19) is used to guide the sliding seat (18).

8. The improved grounding gold plating structure according to claim 4, characterized in that: The bottom of the C-shaped anti-slip fixing seat (17) is attached to the upper surface of the fixed base plate (1) and the fixed top plate (3). The C-shaped anti-slip fixing seat (17) is used to fix the sliding plate one (7) and the sliding plate two (20).

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