Domain controller and vehicle thereof
By integrating the power structure into the domain controller and sharing a chip with the MCU, and optimizing the internal space layout, the problems of space waste and low chip efficiency are solved, achieving the effects of cost reduction and size reduction.
Patent Information
- Application Number
- CN202422913787.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-27
- Publication Date
- 2025-10-31
- Estimated Expiration
- 2034-11-27
AI Technical Summary
Existing all-in-one domain controllers suffer from wasted internal space and low chip utilization efficiency, leading to increased costs and performance bottlenecks.
The power supply structure is integrated into the internal space of the controller and shares the same chip with the MCU, eliminating the power supply casing. The power supply module is isolated from the controller drive module by an isolation barrier, and the MCU, high-voltage circuit unit and low-voltage circuit unit are integrated internally, optimizing space utilization and chip sharing.
It improves the overall integration of the domain controller, reduces costs, weight, and size, and enhances product competitiveness.
Smart Images

Figure CN223503157U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electric vehicle drive technology, specifically to a domain controller and its vehicle. Background Technology
[0002] With the continuous development of new energy vehicle technology, its electric drive system is not only meeting performance requirements but also constantly optimizing its technology and processes to reduce product costs.
[0003] In electric vehicles, the domain controller plays a crucial role in the design and functionality of the vehicle. By integrating multiple sensors, actuators, and communication interfaces, it enables efficient control of systems such as the powertrain, chassis, and body. As electric vehicle technology continues to advance, the capabilities and functions of the domain controller are constantly expanding.
[0004] Currently, most common multi-domain controller architectures on the market are structural integrated designs. While this design simplifies wiring harness layout, it also results in wasted internal space and low chip utilization efficiency, leading to increased costs and performance bottlenecks. Utility Model Content
[0005] The technical problem this invention aims to solve is how to effectively utilize the internal space of a domain controller and improve chip utilization.
[0006] In a first aspect, to solve the above-mentioned technical problems, this utility model provides a domain controller, including a housing with a receiving chamber, wherein the receiving chamber is provided with:
[0007] Controller driver module, including control driver board;
[0008] The power module is physically isolated from the controller drive module. The power module integrates a power board and a high-voltage power circuit unit and a low-voltage power circuit unit that are electrically connected to the power board, respectively. The power board is signal-connected to the control drive board to share the control drive chip of the control drive board.
[0009] Furthermore, an isolation barrier is provided between the power module and the controller drive module, and the power board and the control drive board are interconnected via connecting wire harnesses.
[0010] Furthermore, the controller driver module also integrates an MCU high-voltage circuit unit and an MCU low-voltage circuit unit.
[0011] Furthermore, the MCU high-voltage circuit unit includes a DC high-voltage bus and a three-phase mounting base, and a primary filter assembly, a secondary filter assembly, a thin-film capacitor, and an IGBT are sequentially arranged on the plane from the DC high-voltage bus to the three-phase mounting base, wherein:
[0012] The three-phase mounting bracket is disposed at the end of the controller drive module;
[0013] The DC high-voltage bus is located at the end of the controller drive module away from the three-phase fixed base;
[0014] The positive and negative copper busbars of the first-stage filter component are electrically connected to the positive and negative copper busbars of the second-stage filter component, respectively.
[0015] The positive and negative copper busbars of the secondary filter component are electrically connected to the positive and negative copper busbars of the thin film capacitor, respectively. An isolation plate for EMC isolation is provided directly above the secondary filter component and the thin film capacitor. The control drive board is provided directly above the isolation plate.
[0016] The IGBT is electrically connected to the thin-film capacitor;
[0017] The three-phase mounting bracket is electrically connected to the IGBT.
[0018] Furthermore, the MCU low-voltage circuit unit includes a low-voltage wiring harness and a resolver wiring harness, wherein:
[0019] The low-voltage wiring harness is located at one end of the controller drive module;
[0020] The resolver harness is located at the end of the controller drive module away from the low-voltage harness and near the power supply module;
[0021] The low-voltage wiring harness and the resolver wiring harness are respectively connected to the control drive board via connectors.
[0022] Furthermore, the PDU high-voltage circuit unit includes a fuse, a PTC connector, a PTC wiring harness, and a PTC filter assembly, wherein:
[0023] The fuse is fixed to the primary filter assembly by bolts;
[0024] The PTC plug-in and the PTC filter assembly are fixed to the housing by screws;
[0025] The PTC harness passes through the PTC filter assembly and connects to the positive and negative terminals of the MCU and the PTC plug-in, respectively.
[0026] Furthermore, the high-voltage power circuit unit includes a slow-charging plug, a slow-charging harness, a terminal block, an OBC harness, and the power board, wherein:
[0027] The slow charging plug and the terminal block are disposed on one side of the power board, and the slow charging plug is electrically connected to the power board through the slow charging cable harness;
[0028] The OBC harness is electrically connected to the output interface of the power board and the positive and negative interfaces of the secondary filter component, respectively.
[0029] Furthermore, the low-voltage power supply circuit unit includes the low-voltage wiring harness, the DC-DC connector, the DC-DC filter assembly, the connecting wiring harness, the control drive board, and the power supply board, wherein:
[0030] The DC-DC plug-in and the DC-DC filter assembly are both located on the same side of the power board.
[0031] The DC-DC filter component is electrically connected to the low-voltage output interface of the power board and the output copper busbar of the DC-DC plug-in, respectively.
[0032] Furthermore, it also includes a top cover and a junction box cover that fit together and are spliced together, wherein:
[0033] The upper cover plate has a notch of the same area as the junction box cover plate at the corner near the DC high voltage bus.
[0034] The junction box cover can be spliced with the notch of the upper cover;
[0035] The assembled top cover and junction box cover can be sealed and fixed to the side wall of the housing to form a sealed space.
[0036] In a second aspect, a vehicle includes a controller system, the controller system including the aforementioned domain controller.
[0037] Compared with the prior art, the present invention has the following beneficial effects:
[0038] This invention improves overall integration by integrating PDU, DC-DC, OBC and other structures into the internal space of the motor controller; at the same time, the control drive board and the power supply share a chip, reducing costs and increasing product competitiveness; in addition, the elimination of the power supply casing reduces overall weight and size. Attached Figure Description
[0039] Figure 1 This is a schematic diagram of the internal layout of the housing disclosed in an embodiment of the present utility model, showing the layout of the power module;
[0040] Figure 2 This is a schematic diagram of the internal layout of the housing disclosed in an embodiment of the present utility model, showing the layout of the controller drive module;
[0041] Figure 3 This is a top view of the overall structure disclosed in the embodiment of the present utility model, showing the upper cover plate and the junction box cover plate that are fitted together.
[0042] In the picture:
[0043] 001. Housing; 002. Top cover; 003. Junction box cover;
[0044] 100. Controller driver module;
[0045] 110. Control drive board;
[0046] 121. DC high-voltage busbar; 122. Primary filter assembly; 123. Secondary filter assembly; 124. Film capacitor; 125. IGBT; 126. Three-phase mounting bracket;
[0047] 131. Low-voltage wiring harness; 132. Resolver wiring harness;
[0048] 141. Fuse; 142. PTC plug-in; 143. PTC wiring harness; 144. PTC filter assembly;
[0049] 200. Power supply module;
[0050] 210. Power supply board;
[0051] 221. Slow charging connector; 222. Slow charging harness; 223. Connector; 224. OBC harness;
[0052] 231. DC-DC converter plug-in; 232. DC-DC filter component; 233. Connecting harness;
[0053] 300. Isolation wall; 301. Isolation board; 302. First retaining wall; 303. Second retaining wall; 304. Third retaining wall. Detailed Implementation
[0054] To make the technical solutions and effects of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments. Obviously, the described embodiments are some embodiments of this utility model, but not all embodiments.
[0055] The first aspect of this utility model aims to provide a domain controller for use in electric vehicles. This domain controller can integrate the power supply structure into the internal space of the controller and share the same chip with the MCU, thereby achieving the purpose of reducing weight, lowering costs, and reducing size to improve product competitiveness.
[0056] First, the external structure of this embodiment will be described.
[0057] Please see Figure 3The domain controller provided by this utility model includes a housing 001 with a accommodating chamber; it also includes an upper cover 002 and a junction box cover 003 that are fitted together. The housing 001, the upper cover 002, and the junction box cover 003 constitute the external frame and protective layer of the domain controller.
[0058] In a further embodiment, a notch of the same area as the junction box cover 003 is provided at one corner of the upper cover 002. When the upper cover 002 and the junction box cover 003 are sealed together, they can be regarded as a whole top cover.
[0059] In a further embodiment, the assembled upper cover plate 002 and junction box cover plate 003 can be sealed and fixed to the side wall of the housing 001 to form a sealed space.
[0060] Next, the internal structure of this embodiment will be described.
[0061] Please see Figure 1-2 The space of the housing 001 is divided into two areas by the isolation barrier 300, namely the controller drive module 100 and the power module 200.
[0062] It should be noted that the power module 200 in this embodiment eliminates the existing housing, which is beneficial for overall weight reduction and size reduction.
[0063] Those skilled in the art will understand that a physical isolation is provided between the controller drive module 100 and the power module 200 to isolate them as an independent electrical area. This physical isolation can be the isolation barrier 300 shown in this embodiment.
[0064] In a further embodiment, the purpose of setting up the first barrier 302, the second barrier 303, the third barrier 304, and the isolation plate 301 is to isolate the power supply board 210 from the control drive board 110, which can form a filter control structure.
[0065] In a further embodiment, the controller driver module 100 includes an integrated control driver board 110, a PDU high-voltage circuit unit, an MCU high-voltage circuit unit, and an MCU low-voltage circuit unit.
[0066] In a further embodiment, the power module 200 includes an integrated power board 210, a high-voltage power circuit unit, and a low-voltage power circuit unit.
[0067] In a further embodiment, the power supply board 210 is signal-connected to the control driver board 110 to share the control driver chip of the control driver board 110. This design can reduce costs, thereby increasing the product's market competitiveness.
[0068] In this embodiment, the power board 210 and the control drive board 110 are interconnected by a connecting wire harness 233.
[0069] Next, the controller driver module 100 of this embodiment will be described:
[0070] In a further embodiment, the MCU high-voltage circuit unit includes a DC high-voltage bus 121, a primary filter assembly 122, a secondary filter assembly 123, a thin-film capacitor 124, an IGBT 125, and a three-phase mounting base 126; wherein:
[0071] The three-phase mounting bracket 126 is located at the end of the controller drive module 100.
[0072] The DC high-voltage bus 121 is located at the end of the controller drive module 100 away from the three-phase fixed base 126.
[0073] The plane from the DC high voltage bus 121 to the three-phase fixed base 126 is arranged in sequence with a primary filter component 122, a secondary filter component 123, a film capacitor 124, and an IGBT 125.
[0074] The positive and negative copper busbars of the first-stage filter component 122 are electrically connected to the positive and negative copper busbars of the second-stage filter component 123, respectively.
[0075] The positive and negative copper busbars of the secondary filter component 123 are electrically connected to the positive and negative copper busbars of the film capacitor 124, respectively. An isolation plate 301 for EMC isolation is provided directly above the secondary filter component 123 and the film capacitor 124. A control drive board 110 is provided directly above the isolation plate 301.
[0076] IGBT125 is electrically connected to film capacitor 124.
[0077] The three-phase mounting bracket 126 is electrically connected to the IGBT 125.
[0078] In a further embodiment, the MCU low-voltage circuit unit includes a low-voltage wiring harness 131 and a resolver wiring harness 132.
[0079] The low-voltage wiring harness 131 is located at one end of the controller drive module 100.
[0080] The resolver harness 132 is located at the end of the controller drive module 100 away from the low-voltage harness 131 and near the power module 200.
[0081] The low-voltage wiring harness 131 and the resolver wiring harness 132 are respectively connected to the control drive board 110 via connectors.
[0082] In a further embodiment, the PDU high-voltage circuit unit includes a fuse 141, a PTC plug-in 142, a PTC wiring harness 143, and a PTC filter assembly 144.
[0083] Fuse 141 is fixed to primary filter assembly 122 by bolts for circuit protection.
[0084] PTC plug-in 142 and PTC filter assembly 144 are fixed to housing 001 by screws.
[0085] PTC harness 143 passes through PTC filter assembly 144 and connects to the positive and negative terminals of MCU and PTC plug-in 142 respectively.
[0086] Next, the power module 200 of this embodiment will be described:
[0087] In a further embodiment, the high-voltage power circuit unit includes a slow charging plug 221, a slow charging harness 222, a terminal block 223, an OBC harness 224, and a power board 210.
[0088] The slow charging plug 221 and the terminal block 223 are located on one side of the power board 210. The slow charging plug 221 is electrically connected to the power board 210 through the slow charging harness 222 to form a power input circuit. The slow charging plug 221 is partially exposed on the outer surface of the housing 001.
[0089] OBC harness 224 is electrically connected to the output interface of power board 210 and the positive and negative interfaces of secondary filter component 123, respectively.
[0090] In a further embodiment, the low-voltage power supply circuit unit includes a low-voltage wiring harness 131, a DC-DC plug-in 231, a DC-DC filter component 232, a connecting wiring harness 233, a control drive board 110, and a power supply board 210, for outputting low-voltage signals.
[0091] Both the DC-DC converter 231 and the DC-DC filter assembly 232 are located on the same side of the power board 210. The DC-DC converter 231 is partially exposed on the outer surface of the housing 001.
[0092] The DC-DC filter component 232 is electrically connected to the low-voltage output interface of the power board 210 and the output copper busbar of the DC-DC plug-in 231, respectively.
[0093] Those skilled in the art will understand that the internal space of the domain controller in this embodiment integrates structures such as MCU, PDU, DCDC, and OBC, which improves the overall integration and reduces the domain controller's footprint on the vehicle's overall volume.
[0094] A second aspect of this invention aims to provide a vehicle that includes a controller system comprising the aforementioned domain controller.
[0095] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A domain controller, characterized in that, Includes a housing (001) having a receiving chamber, wherein the receiving chamber is provided with: The controller drive module (100) includes a control drive board (110); The power module (200) is physically isolated from the controller drive module (100). The power module (200) integrates a power board (210) and a high-voltage power circuit unit and a low-voltage power circuit unit that are electrically connected to the power board (210). The power board (210) is signal connected to the control drive board (110) to share the control drive chip of the control drive board (110).
2. The domain controller according to claim 1, characterized in that, An isolation barrier (300) is provided between the power module (200) and the controller drive module (100), and the power board (210) and the control drive board (110) are interconnected by a connecting harness (233).
3. The domain controller according to claim 2, characterized in that, The controller driver module (100) also integrates an MCU high-voltage circuit unit, an MCU low-voltage circuit unit, and a PDU high-voltage circuit unit.
4. The domain controller according to claim 3, characterized in that, The MCU high-voltage circuit unit includes a DC high-voltage bus (121) and a three-phase mounting base (126). A primary filter assembly (122), a secondary filter assembly (123), a thin-film capacitor (124), and an IGBT (125) are sequentially arranged on the plane from the DC high-voltage bus (121) to the three-phase mounting base (126). The three-phase mounting bracket (126) is disposed at the end of the controller drive module (100); The DC high-voltage bus (121) is located at the end of the controller drive module (100) away from the three-phase fixed base (126); The positive and negative copper busbars of the first-stage filter component (122) are electrically connected to the positive and negative copper busbars of the second-stage filter component (123), respectively. The positive and negative copper busbars of the secondary filter component (123) are electrically connected to the positive and negative copper busbars of the thin film capacitor (124), and an isolation plate (301) for EMC isolation is provided directly above the secondary filter component (123) and the thin film capacitor (124), and the control drive board (110) is provided directly above the isolation plate (301). The IGBT (125) is electrically connected to the thin-film capacitor (124); The three-phase mounting bracket (126) is electrically connected to the IGBT (125).
5. The domain controller according to claim 4, characterized in that, The MCU low-voltage circuit unit includes a low-voltage wiring harness (131) and a resolver wiring harness (132), wherein: The low-voltage wiring harness (131) is disposed at one end of the controller drive module (100); The resolver harness (132) is located at the end of the controller drive module (100) away from the low-voltage harness (131) and near the power module (200); The low-voltage wiring harness (131) and the resolver wiring harness (132) are respectively connected to the control drive board (110) via connectors.
6. The domain controller according to claim 4, characterized in that, The PDU high-voltage circuit unit includes a fuse (141), a PTC plug-in (142), a PTC wiring harness (143), and a PTC filter assembly (144), wherein: The fuse (141) is fixed to the primary filter assembly (122) by bolts; The PTC plug-in (142) and the PTC filter assembly (144) are fixed to the housing (001) by screws; The PTC harness (143) passes through the PTC filter assembly (144) and is connected to the positive and negative terminals of the MCU and the PTC plug-in (142) respectively.
7. The domain controller according to claim 4, characterized in that, The high-voltage power circuit unit includes a slow charging plug (221), a slow charging harness (222), a terminal block (223), an OBC harness (224), and the power board (210), wherein: The slow charging plug (221) and the terminal block (223) are disposed on one side of the power board (210), and the slow charging plug (221) is electrically connected to the power board (210) through the slow charging harness (222); The OBC harness (224) is electrically connected to the output interface of the power board (210) and the positive and negative interfaces of the secondary filter component (123), respectively.
8. The domain controller according to claim 5, characterized in that, The low-voltage power supply circuit unit includes the low-voltage wiring harness (131), a DC-DC connector (231), a DC-DC filter assembly (232), the connecting wiring harness (233), the control drive board (110), and the power board (210), wherein: The DC-DC plug-in (231) and the DC-DC filter component (232) are both located on the same side of the power board (210); The DC-DC filter component (232) is electrically connected to the low-voltage output interface of the power board (210) and the output copper busbar of the DC-DC plug-in (231), respectively.
9. The domain controller according to claim 4, characterized in that, It also includes a top cover plate (002) and a junction box cover plate (003) that fit together and are spliced together, wherein: The upper cover plate (002) has a notch of the same area as the junction box cover plate (003) at the corner near the DC high voltage bus (121); The junction box cover (003) can be sealed and spliced with the notch of the upper cover (002); The assembled upper cover plate (002) and junction box cover plate (003) can be sealed and fixed to the side wall of the housing (001) to form a sealed space.
10. A vehicle, comprising a controller system, characterized in that, The controller system includes a domain controller as described in any one of claims 1-9.